Tail-out piping system for semiconductor equipment

Abstract

This utility model provides a tail gas emission piping system for semiconductor equipment. It includes a tail gas emission pipe, pipe connectors, a first pipe, a second pipe, and a heat medium control pipe. The tail gas emission pipe includes several tail gas emission branch pipes connected by pipe connectors; the first pipe has several sections, each wrapping around one of the tail gas emission branch pipes; the second pipe includes a main pipe and a connecting pipe, with the connecting pipes located at both ends of the main pipe and communicating with it. The inner diameter of the main pipe is larger than the inner diameter of the connecting pipe. The main pipe wraps around the pipe connectors, and the connecting pipes wrap around a portion of the tail gas emission branch pipes and connect to the first pipe; the heat medium control pipe includes a first heat medium control pipe and a second heat medium control pipe for supplying heat medium to the first and second pipes. This application provides more uniform heat transfer within the pipes and effectively avoids tail gas condensation at the pipe connectors, preventing pipe blockage.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to a tailpipe system for semiconductor equipment. Background Technology

[0002] Metal-organic chemical vapor deposition (MOCVD) equipment is used to grow semiconductor material layers. During the reaction process, metal-organic sources and precursors such as hydrides are used. These substances undergo chemical reactions in the reaction chamber to generate the desired thin film material. However, this process also produces exhaust gases containing unreacted raw materials and byproducts, which can accumulate in the exhaust pipes, causing blockages. Furthermore, if undecomposed precursors or toxic substances (such as arsenic and phosphorus) in the exhaust gases condense in the pipes and form deposits, they can endanger personnel safety during maintenance operations.

[0003] Therefore, in order to prevent substances in the exhaust gas from condensing in the exhaust pipe, it is necessary to keep the temperature of the exhaust pipe above the condensation point of these substances, so as to ensure that they are discharged in gaseous form to the after-treatment device for combustion and other harmless treatment.

[0004] The traditional approach involves wrapping the exhaust pipe with multiple heating jackets, each containing a TC temperature sensor and a heating resistance wire to heat the pipe. This approach has the following problems: (1) uneven heating, with some points having high temperatures and others low temperatures; (2) the connection points between pipes and pipe fittings are not easily covered by the heating jackets, leaving them exposed or requiring the use of insulation jackets. Even when insulation jackets are used, gaps remain between the insulation jackets and the connection points, resulting in lower temperatures in these areas, which can cause exhaust gas to condense in the pipes and cause blockages. Utility Model Content

[0005] The purpose of this utility model is to provide a tailpipe system for semiconductor equipment, which can fully cover the outer wall of the exhaust pipe and pipe connectors, making the heat transfer of the material inside the pipe more uniform and effectively preventing pipe blockage caused by exhaust gas condensation at the pipe connectors.

[0006] To achieve the above objectives, the tail gas exhaust pipeline system for semiconductor equipment of this utility model includes an exhaust gas exhaust pipeline, a pipeline connector, a first pipeline, a second pipeline, and a heat medium control pipeline. The exhaust gas emission pipeline is connected to the semiconductor processing cavity, and the exhaust gas emission pipeline includes several sequentially connected exhaust gas emission branch pipelines; adjacent exhaust gas emission branch pipelines are connected through the pipeline connector; the first pipeline has several sections and is respectively wrapped around each of the exhaust gas emission branch pipelines; the second pipeline includes a main pipe section and a connecting pipe section, the connecting pipe section is disposed at both ends of the main pipe section and is connected to the main pipe section, the inner diameter of the main pipe section is larger than the inner diameter of the connecting pipe section, the main pipe section is wrapped around the pipeline connector, and the connecting pipe section is wrapped around a portion of the exhaust gas emission branch pipelines and connected to the first pipeline; the heat medium control pipeline includes a first heat medium control pipeline and a second heat medium control pipeline, the first heat medium control pipeline is connected to the first pipeline to deliver heat medium to the first pipeline, and the second heat medium control pipeline is connected to the second pipeline to deliver heat medium to the second pipeline.

[0007] Preferably, the first pipeline includes several outer casings, each outer casing having a cylindrical structure and both ends sealed or fitted to the respective casings it encloses. The several outer casings are sequentially connected along the axial direction of the exhaust gas emission branch pipeline and are wrapped around the exhaust gas emission branch pipeline. The first heat medium control pipeline is provided with several sets and is connected to each of the several outer casings in a one-to-one correspondence.

[0008] Preferably, the ends of the connecting pipe, the first pipe, and the outer casing pipe are each provided with a plurality of first snap-fit ​​protrusions that extend axially and are spaced apart. A first snap-fit ​​groove is formed between adjacent first snap-fit ​​protrusions, and the first snap-fit ​​groove and the first snap-fit ​​protrusion are adapted to each other in a concave-convex fit manner. The inner wall of the first snap-fit ​​protrusion is provided with a first magnetic suction member, and the outer wall of the exhaust gas branch pipe is provided with a second magnetic suction member that is adapted to the first magnetic suction member.

[0009] Preferably, the connecting pipe and the first pipe, adjacent outer pipes, or the connecting pipe and the outer pipe are connected by a connector, the connector comprising a cylindrical body and a fixing member; the inner wall of the cylindrical body is provided with an elastic member, the inner wall of the elastic member forming a receiving cavity for accommodating the pipe, and an annular groove is provided between the elastic member and the inner wall of the cylindrical body, the width of the annular groove along the radial direction of the cylindrical body decreasing away from the open end of the cylindrical body; the inner wall of the cylindrical body is provided with a plurality of guide grooves arranged along the axial direction of the cylindrical body; the side wall of the fixing member facing the inner wall of the cylindrical body is provided with a guide strip adapted to the guide groove, and the thickness of the fixing member decreases along the extension direction of the guide strip, the fixing member being slidably disposed in the annular groove.

[0010] Preferably, the outer casing includes two outer sub-casings, each of which has a semi-enclosed structure and is closed at both ends. The two outer casings are connected circumferentially and wrap around the exhaust gas emission branch pipe. The outer casing has a plurality of spaced second snap-fit ​​protrusions on its two symmetrical sidewalls along the axial direction. A second snap-fit ​​groove is formed between adjacent second snap-fit ​​protrusions, and the second snap-fit ​​protrusions and the second snap-fit ​​grooves are adapted to each other in a concave-convex fit. The inner wall of the second snap-fit ​​protrusion is provided with a first magnetic attractor, and the outer wall of the exhaust gas emission branch pipe is provided with a second magnetic attractor that is adapted to the first magnetic attractor along the axial direction.

[0011] Preferably, the second pipeline includes two sub-pipelines, each of which has a semi-enclosed structure and is closed at both ends. The two sub-pipelines are connected circumferentially and wrapped around the pipeline connector and part of the exhaust gas emission branch pipeline. The two symmetrical sidewalls of the sub-pipelines along the axial direction are provided with a plurality of spaced second snap-fit ​​protrusions, and a second snap-fit ​​groove is formed between adjacent second snap-fit ​​protrusions. The second snap-fit ​​protrusions and the second snap-fit ​​grooves are adapted to each other in a concave-convex fit. The inner wall of the second snap-fit ​​protrusion is provided with a first magnetic attractor, and the outer wall of the exhaust gas emission branch pipeline is provided with a second magnetic attractor adapted to the first magnetic attractor in the axial direction.

[0012] Preferably, the cylindrical body is provided with a flow guiding cavity, and the inner wall of the cylindrical body is provided with a partition ring that divides the inner cavity of the cylindrical body into two receiving cavities. The elastic element is respectively provided at both ends of the partition ring facing the opening end of the cylindrical body. An annular flow guiding cavity is provided inside the partition ring and communicates with the flow guiding cavity. The flow guiding cavity is connected to the heat medium control pipeline to deliver heat medium to the flow guiding cavity and the annular flow guiding cavity.

[0013] Preferably, the inner wall of the elastic element is provided with an electric heating element.

[0014] Preferably, the first conduit is fitted to the semiconductor processing cavity, and an outer cover is fitted to the end of the first conduit near the semiconductor processing cavity, forming a sealed cavity between the outer cover and the first conduit. The outer cover is provided with a vacuum nozzle communicating with the sealed cavity, and the vacuum nozzle is connected to a vacuum suction device to evacuate the sealed cavity. The end of the outer cover facing the semiconductor processing cavity is adapted to the outer wall of the semiconductor processing cavity and is provided with a third magnetic attraction element. The outer wall of the semiconductor processing cavity is provided with a fourth magnetic attraction element adapted to the third magnetic attraction element.

[0015] Preferably, the first pipe is fitted to the semiconductor processing cavity, and the distance between the outer wall of the first pipe near the semiconductor processing cavity and the exhaust pipe increases in the direction close to the semiconductor processing cavity; a third magnetic attractor is provided at the end of the first pipe facing the semiconductor processing cavity, and a fourth magnetic attractor adapted to the third magnetic attractor is provided on the outer wall of the semiconductor processing cavity.

[0016] Preferably, the tailpipe system further includes a control module, a third pipe, and a vacuum control pipe and a cooling medium control pipe respectively connected to the third pipe. The third pipe is sleeved outside the first pipe and the second pipe. The control module is connected to the cooling medium control pipe and the vacuum control pipe respectively. The control module is used to control the third pipe to connect with the vacuum control pipe or the cooling medium control pipe, so as to evacuate the third pipe or deliver cooling medium to the third pipe.

[0017] The beneficial effects of the tailpipe system for semiconductor equipment described in this utility model are as follows:

[0018] (1) By supplying heat medium to the first pipeline and the second pipeline, heat can be transferred to the exhaust gas in the exhaust gas discharge pipeline and the pipeline connector, so that the temperature of the exhaust gas in the exhaust gas discharge pipeline and the pipeline connector is higher than the condensation point of substances that are easy to condense and form deposits in the exhaust gas discharge pipeline. That is, the first pipeline and the second pipeline can effectively prevent substances in the exhaust gas from condensing in the exhaust gas discharge pipeline and the pipeline connector, and ensure that they are discharged in gaseous form from the exhaust gas discharge pipeline and the pipeline connector into the exhaust gas treatment device at the rear end.

[0019] (2) Compared with the traditional method of transferring heat to the exhaust gas in the exhaust gas discharge pipeline by setting a heating jacket outside the exhaust gas discharge pipeline, the method of transferring heat to the exhaust gas in the exhaust gas discharge pipeline and the pipeline connector by the heat medium transported in the first pipeline and the second pipeline is more uniform in heat transfer to the material in the pipeline and will not cause the problem of temperature difference at individual points.

[0020] (3) This application not only provides a heat transfer medium pipeline at the pipe connection, but also enables the exhaust gas in the pipe connection position, which was originally exposed or could only be insulated, to be effectively heated. This effectively avoids the exhaust gas in the pipe connection position from condensing and causing pipe blockage. Moreover, the exhaust gas emission pipeline and the pipe connection can be fully wrapped and covered by the first pipeline and the second pipeline, avoiding the problem that the exhaust gas is easy to condense because the exposed surface of the exhaust gas emission pipeline and the pipe connection is not covered by the first pipeline and the second pipeline.

[0021] (4) The heat medium can be replaced as needed, with low safety risk and convenient operation. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the tailpipe system for semiconductor equipment according to some embodiments of the present invention;

[0023] Figure 2 This is a structural block diagram of a tailpipe system for semiconductor equipment according to some embodiments of the present invention;

[0024] Figure 3 This is a schematic diagram of the structure of the second pipeline in the tail drain pipeline system for semiconductor equipment according to some embodiments of the present invention;

[0025] Figure 4 This is a schematic diagram showing the structural connection between the outer casing and the exhaust gas discharge pipe in a tailpipe system for semiconductor equipment according to some embodiments of the present invention.

[0026] Figure 5 This is a schematic diagram of the outer casing of a tailpipe system for semiconductor equipment according to some embodiments of the present invention;

[0027] Figure 6 This is a schematic diagram of the outer casing of a tailpipe system for semiconductor devices according to other embodiments of the present invention;

[0028] Figure 7 This is a schematic diagram of the sub-pipeline in the tailpipeline system of a semiconductor device according to some embodiments of the present invention;

[0029] Figure 8 This is a schematic diagram of the structural connection between the connector and the outer casing in a tailpipe system for semiconductor equipment according to some embodiments of the present invention;

[0030] Figure 9 This is a schematic diagram showing the structural connection of the outer casing, the second pipeline, and the semiconductor processing cavity in a tailpipe system for a semiconductor device according to some embodiments of the present invention.

[0031] Figure 10 for Figure 9 The diagram shows the structural connection between the outer casing and the second pipeline in the tailpipe system for semiconductor equipment.

[0032] Figure 11 This is a schematic diagram showing the structural connection of the outer casing, the second pipeline, and the semiconductor processing cavity in a tailpipe system for a semiconductor device according to some other embodiments of the present invention.

[0033] Figure 12 This is a schematic diagram of the tailpipe system for semiconductor equipment according to other embodiments of the present invention;

[0034] Figures 1 to 12 The reference numerals in the attached figures are as follows:

[0035] 100. Semiconductor processing chamber; 200. Exhaust gas treatment device;

[0036] 1. Exhaust gas emission pipeline; 11. First exhaust gas emission branch pipeline; 12. Second exhaust gas emission branch pipeline;

[0037] 2. Pipeline connectors;

[0038] 3. First pipe; 30. Outer pipe; 301. First outer pipe; 302. Second outer pipe; 303. Sub-outer pipe; 31. Outer cover; 32. Sealed cavity; 33. Vacuum nozzle; 34. Outer wall;

[0039] 4. Second pipeline; 41. Main pipeline; 42. Connecting pipeline; 43. Sub-pipeline; 431. First sub-pipeline; 432. Second sub-pipeline;

[0040] 5. Heat medium control pipeline; 511. First heat medium sub-control pipeline; 512. Second heat medium sub-control pipeline; 52. Second heat medium control pipeline; 501. Heat medium supply end; 502. Heat medium input pipeline; 503. Heat medium output pipeline; 504. Heat medium flow control component; 505. Heat medium input control valve; 506. Heat medium output control valve;

[0041] 61. First snap-fit ​​boss; 62. First snap-fit ​​groove; 63. Second magnetic component; 64. First magnetic component; 65. Second snap-fit ​​boss; 66. Second snap-fit ​​groove;

[0042] 7. Connecting component; 71. Cylindrical body; 711. Elastic component; 712. Annular groove; 72. Fixing component; 73. Flow guiding cavity; 74. Separating ring;

[0043] 8. Control module;

[0044] 9. Third pipeline; 91. Vacuum control pipeline; 911. Vacuum pump; 912. Suction pipeline; 913. Switch valve; 92. Cooling medium control pipeline; 921. Cooling medium supply end; 922. Cooling medium input pipeline; 923. Cooling medium output pipeline; 924. Cooling medium flow control device; 925. Cooling medium input switch valve; 926. Cooling medium output switch valve. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but does not exclude other elements or objects.

[0046] To overcome the problems existing in the prior art, this utility model provides a tailpipe system for semiconductor devices, which can fully cover the outer wall of the exhaust pipe and pipe connectors, making the heat transfer of the material inside the pipe more uniform and effectively preventing pipe blockage caused by exhaust gas condensation at the pipe connectors.

[0047] In some embodiments of this utility model, the tailpipe system for semiconductor devices is described with reference to... Figures 1 to 12 It includes an exhaust gas emission pipe 1, a pipe connector 2, a first pipe 3, a second pipe 4, and a heat medium control pipe 5. The exhaust gas emission pipe 1 is connected to the semiconductor processing cavity 100, and the exhaust gas emission pipe 1 includes several sequentially connected exhaust gas emission branch pipes, for example... Figure 1The diagram shows a first exhaust gas emission branch pipe 11 and a second exhaust gas emission branch pipe 12; adjacent exhaust gas emission branch pipes are connected by the pipe connector 2; the first pipe 3 has several sections, each wrapped around one of the exhaust gas emission branch pipes; the second pipe 4 includes a main pipe section 41 and a connecting pipe section 42, the connecting pipe section 42 is located at both ends of the main pipe section 41 and communicates with the main pipe section 41, the inner diameter of the main pipe section 41 is larger than the inner diameter of the connecting pipe section 42, the main pipe section 41 is wrapped around the pipe connector 2, and the connecting pipe section 42 is wrapped around a portion of the exhaust gas emission branch pipe and connected to the first pipe 3; the heat medium control pipe 5 includes a first heat medium control pipe (not shown in the figure) and a second heat medium control pipe 52, the first heat medium control pipe (not shown in the figure) is connected to the first pipe 3 to supply heat medium to the first pipe 3, and the second heat medium control pipe 52 is connected to the second pipe 4 to supply heat medium to the second pipe 4.

[0048] In this application, the first pipeline 3 has several sections, each wrapped around the exhaust gas branch pipeline; the second pipeline 4 includes a main pipe section 41 and a connecting pipe section 42, the connecting pipe section 42 being disposed at both ends of the main pipe section 41 and communicating with the main pipe section 41, the inner diameter of the main pipe section 41 being larger than the inner diameter of the connecting pipe section 42, the main pipe section 41 being wrapped around the pipeline connector 2, and the connecting pipe section 42 being wrapped around a portion of the exhaust gas branch pipeline and connected to the first pipeline 3; the heat medium control pipeline 5 includes a first heat medium control pipeline (not shown in the figure) and a second heat medium control pipeline 52, the first heat medium control pipeline (not shown in the figure) being connected to the first pipeline 3 to supply the exhaust gas branch pipeline with the exhaust gas branch pipeline. The first pipeline 3 delivers a heat medium, and the second heat medium control pipeline 52 is connected to the second pipeline 4 to deliver a heat medium to the second pipeline 4. This allows the heat medium delivered to the first pipeline 3 and the second pipeline 4 to transfer heat to the exhaust gas in the exhaust gas emission pipeline 1 and the pipeline connector 2. As a result, the temperature of the exhaust gas in the exhaust gas emission pipeline 1 and the pipeline connector 2 is higher than the condensation point of substances that are prone to condensation and deposit formation. In other words, the first pipeline 3 and the second pipeline 4 effectively prevent substances in the exhaust gas from condensing in the exhaust gas emission pipeline 1 and the pipeline connector 2, ensuring that they are discharged in gaseous form from the exhaust gas emission pipeline 1 and the pipeline connector 2 into the exhaust gas treatment device 200 at the rear end.

[0049] Furthermore, this application provides several sections of the first pipeline 3 that are respectively wrapped around each of the exhaust gas emission branch pipelines. The main pipeline 41 is wrapped around the pipeline connector 2, and the connecting pipeline 42 is wrapped around a portion of the exhaust gas emission branch pipeline and connected to the first pipeline 3. This means that a heat transfer pipeline is also provided at the pipeline connector 2, so that the exhaust gas in the pipeline connector 2, which was originally exposed or could only be covered by an insulation jacket, can also be effectively heated. This effectively avoids the pipeline blockage caused by the condensation of exhaust gas in the pipeline connector 2. Moreover, the exhaust gas emission pipeline 1 and the pipeline connector 2 can be completely wrapped and covered by the first pipeline 3 and the second pipeline 4, avoiding the problem of exhaust gas condensation caused by the exposed surfaces of the exhaust gas emission pipeline 1 and the pipeline connector 2 not being covered by the first pipeline 3 and the second pipeline 4.

[0050] Furthermore, in related technologies, the use of a heating jacket outside the exhaust gas emission pipe 1 to transfer heat to the exhaust gas within the pipe 1 can cause temperature differences at individual points. Excessive temperature can pose a safety hazard to the heating jacket. This application utilizes a heat transfer medium transported within the first pipe 3 and the second pipe 4 to transfer heat to the exhaust gas within the exhaust gas emission pipe 1 and the pipe connector 2. This method provides more uniform heat transfer within the pipes, avoids temperature differences at individual points, and allows for easy replacement of the heat transfer medium as needed, resulting in lower safety risks and convenient operation.

[0051] In some embodiments of this utility model, reference is made to Figure 2 The tailpipe system of the semiconductor device also includes a control module 8 connected to the heat medium control pipeline 5. The tail gas emission pipeline 1, the first pipeline 3, and the second pipeline 4 are equipped with temperature detection devices connected to the control module to automatically control the first heat medium control pipeline (not shown in the figure) and the second heat medium control pipeline 52 based on the detected temperature information, so as to control and adjust the parameters of the heat medium transported in the first pipeline 3 and the second pipeline 4.

[0052] In some embodiments of this utility model, the pipe connector 2 is a clamp, flange, etc. The structure of the connecting pipe section 42 is adapted to the pipe connector 2, and the inner diameter of the main pipe section is larger than the maximum outer diameter of the pipe connector to enclose the pipe connector. Specifically, the structure of the connecting pipe section 42 includes, for example... Figure 1 The cubic structure, spherical structure, or such shown Figure 3 The illustrated structure is an oval shape, etc. The structure of the pipe connector 2 is conventional technology in this field and will not be described in detail here.

[0053] In some embodiments of this utility model, reference is made to Figure 1 and Figure 12The exhaust gas emission pipeline 1 includes a first exhaust gas emission branch pipeline 11 and a second exhaust gas emission branch pipeline 12, which are connected by the pipeline connector 2.

[0054] In some specific embodiments, the first exhaust gas emission branch pipe 11 is connected to the first end of the pipe connector 2, the second exhaust gas emission branch pipe 12 is connected to the second end of the pipe connector 2, and the first pipe 3 is wrapped around the first exhaust gas emission branch pipe 11 and the second exhaust gas emission branch pipe 12 respectively.

[0055] In some embodiments of this utility model, the first heat medium control pipeline is provided with two sets, as shown in the reference. Figure 1 These are a first heat medium sub-control pipeline 511 and a second heat medium sub-control pipeline 512, respectively. The first heat medium sub-control pipeline 511 is connected to the first pipeline 3, which is wrapped around the first exhaust gas sub-pipeline 11, and the second heat medium sub-control pipeline 512 is connected to the first pipeline 3, which is wrapped around the second exhaust gas sub-pipeline 12.

[0056] In some embodiments of this utility model, reference is made to Figure 1 and Figure 2 Both the first heat medium control pipeline (not shown in the figure) and the second heat medium control pipeline 52 include a heat medium input pipeline 502, a heat medium output pipeline 503, and a heat medium flow control component 504, a heat medium input control switch valve 505, and a heat medium output control switch valve 506, which are respectively connected to the control module 8. One end of each heat medium input pipeline 502 is connected to the heat medium supply end 501. The first heat medium control pipeline is as follows: Figure 1 The other end of the heat medium input pipe 502 of the first heat medium sub-control pipe 511 and the second heat medium sub-control pipe 512 shown is connected to the first pipe 3, and the other end of the heat medium input pipe 502 of the second heat medium control pipe 52 is connected to the second pipe 4. The heat medium flow control element 504 and the heat medium input control switch valve 505 are disposed on the heat medium input pipe 502. One end of each heat medium output pipe 503 is connected to the heat medium supply end 501. The first heat medium control pipe is as follows: Figure 1The other end of the heat medium output pipe 503 of the first heat medium sub-control pipe 511 and the second heat medium sub-control pipe 512 shown is connected to the first pipe 3. The other end of the heat medium output pipe 503 of the second heat medium control pipe 52 is connected to the second pipe 4. The heat medium flows into the first pipe 3 and / or the second pipe 4 through each of the heat medium input pipes 502 and then flows back to the heat medium supply end 501 through the corresponding heat medium output pipe 503. In this way, the heat medium can be recycled. The heat medium output control switch valve 506 is provided in the heat medium output pipe 503. When the exhaust gas emission pipe 1 is operating normally, the control module 8 controls the opening of the heat medium input control switch valve 505 and the heat medium output control switch valve 506 to deliver heat medium to the first pipe 3 and / or the second pipe 4 and ensure the continuous flow of heat medium in the circulation loop. Furthermore, the control module 8 can control the flow rate of heat medium in the first pipe 3 and / or the second pipe 4 by controlling the heat medium flow control component 504. This allows the exhaust gas temperature in the exhaust gas emission pipe 1 and / or pipe connection 2 to be adjusted by regulating the flow rate of heat medium in the first pipe 3 and / or the second pipe 4. In practical use, when the exhaust gas emission pipe 1 and / or pipe connection 2... When the exhaust gas temperature exceeds the preset range, the flow rate of the heat medium in the first pipeline 3 and / or the second pipeline 4 is reduced by controlling the heat medium flow control component 504, so that the temperature of the exhaust gas in the exhaust gas discharge pipeline 1 and / or pipeline connection 2 can be restored to the preset temperature range; when the exhaust gas temperature in the exhaust gas discharge pipeline 1 and / or pipeline connection 2 is lower than the preset range, the flow rate of the heat medium in the first pipeline 3 and / or the second pipeline 4 is increased by controlling the heat medium flow control component 504, so that the temperature of the exhaust gas in the exhaust gas discharge pipeline 1 and / or pipeline connection 2 can be raised to the preset range. The preset range of exhaust gas temperature can be adjusted and set according to the actual process and the type of substances in the exhaust gas. When the first pipeline 3, the second pipeline 4, the exhaust gas emission pipeline 1 and / or the pipeline connector 2 require maintenance, the control module 8 can control the closure of the heat medium input control switch valve 505 and the heat medium output control switch valve 506 to stop the supply of heat medium to the first pipeline 3 and / or the second pipeline 4, so that the first pipeline 3, the second pipeline 4, the exhaust gas emission pipeline 1 and / or the pipeline connector 2 can be quickly cooled down.In addition, this application can also control the first heat medium control pipeline (not shown in the figure) and the second heat medium control pipeline 52 respectively, so that the parameters of the heat medium transported in the first pipeline 3 and the second pipeline 4 can be flexibly controlled and adjusted according to the actual situation of the exhaust gas discharge pipeline 1 and the pipeline connector 2. For example, the flow rate of the heat medium in the second pipeline 4 can be increased by controlling the heat medium flow control component 504 in the second heat medium control pipeline 52, so that the heat medium in the second pipeline 4 can circulate quickly, which is beneficial to compensate for the heat transfer loss caused by the gap between the main pipe 41 and the heated part inside it.

[0057] In this application, the heat medium supply end 501 includes a heat medium, a heating device that can maintain the heat medium at a preset temperature, and a temperature detection device, etc. The specific structure of the heat medium supply end 501 and the necessary adaptation structure are conventional settings in the art and will not be described in detail here. The preset temperature of the heat medium can be set according to the exhaust gas temperature at the exhaust gas emission end and the temperature range that the exhaust gas needs to be maintained in the exhaust gas emission pipeline 1 and the pipeline connector 2.

[0058] In some embodiments of this utility model, the heat medium supply end 501 connected to the first heat medium control pipeline (not shown in the figure) and the heat medium supply end 501 connected to the second heat medium control pipeline 52 may be the same or different.

[0059] In some specific embodiments of this utility model, when the structure of the pipe connector 2 is large or the main pipe 41 cannot be well fitted to the pipe connector 2 due to the structural limitations of the pipe connector 2, the heat medium supply end 501 connected to the first heat medium control pipe and the heat medium supply end 501 connected to the second heat medium control pipe 52 can be set to be different. The temperature of the heat medium in the heat medium supply end 501 connected to the second heat medium control pipe 52 is controlled to be higher than the temperature of the heat medium in the heat medium supply end 501 connected to the first heat medium control pipe. This is to compensate for the heat transfer loss caused by the gap between the main pipe 41 and its internal heated part, and to help avoid the condensation of exhaust gas at the pipe connector 2 due to the low temperature at that location.

[0060] In some embodiments of this invention, the heat medium is high-temperature water or high-temperature steam, etc.

[0061] In some embodiments of this invention, the temperature of the heat transfer medium is 130℃~150℃. In some embodiments of this invention, reference is made to... Figure 1 , Figure 4 and Figure 8The first pipeline 3 includes several outer sleeves 30. Each outer sleeve 30 has a cylindrical structure and its two ends are sealed or fitted to the pipeline it encloses. The several outer sleeves 30 are connected sequentially along the axial direction of the exhaust gas emission branch pipeline and are wrapped around the exhaust gas emission branch pipeline. The first heat medium control pipeline (not shown in the figure) has several groups and is connected to each of the several outer sleeves 30 in a one-to-one correspondence. It is suitable for installing the first pipeline 3 outside the long exhaust gas emission pipeline 1. Moreover, the first pipeline 3 is designed as multiple segments of independent outer sleeves 30, so that heat medium can be independently delivered to each outer sleeve 30. In this way, the parameters of the heat medium delivered in each outer sleeve 30, such as delivery speed or temperature, can be independently controlled. This allows the parameters of the heat medium in the corresponding outer sleeve 30 to be adjusted in a timely manner according to the different conditions of each segment of the exhaust gas emission pipeline 1, thereby ensuring that the pipeline is not blocked due to exhaust gas condensation at various locations in the exhaust gas emission pipeline 1. If the temperature of the portion of the exhaust gas discharge pipe 1 furthest from the semiconductor processing chamber 100 is low due to factors such as heat dissipation caused by the long pipeline, the temperature or delivery speed of the heat medium in the outer casing 30 corresponding to that portion of the exhaust gas discharge pipe 1 furthest from the semiconductor processing chamber 100 can be adjusted to increase the temperature of the exhaust gas in that section of the exhaust gas discharge pipe 1. Furthermore, compared to the integrated first pipe 3, which requires downtime for repairs and affects the normal operation of the semiconductor equipment when damaged, this application allows for timely adjustment of the parameters (e.g., flow rate, temperature) of the heat medium in the adjacent outer casing 30 when a portion of the outer casing 30 or the heat medium control pipe 5 is damaged. This provides temperature compensation for the damaged portion of the exhaust gas discharge pipe 1, minimizing condensation of the exhaust gas caused by the temperature drop in the damaged outer casing 30. Moreover, repairing or replacing the damaged outer casing 30 or the corresponding heat medium control pipe 5 will not affect the normal operation of the exhaust gas discharge pipe 1.

[0062] In this application, the axial direction is the direction along the pipeline, that is, the direction perpendicular to the diameter direction of the pipeline.

[0063] In some embodiments of this utility model, one, several, or all of the first pipes 3 in the tailpipe system may be configured as several independent outer casing pipes 30. In some embodiments of this utility model, refer to... Figure 1 The first pipe 3, which is wrapped around the first exhaust gas branch pipe 11, and the first pipe 3, which is wrapped around the second exhaust gas branch pipe 12, both include a plurality of outer pipes 30. In other embodiments of this utility model, reference is made to... Figure 1 The first pipe 3, which is wrapped around the first exhaust gas branch pipe 11, is an integral structure. The first pipe 3, which is wrapped around the second exhaust gas branch pipe 12, includes several outer pipes 30.

[0064] In some embodiments of this utility model, several outer casing pipes 30 are connected to heat medium supply terminals 501 with different temperatures through their respective corresponding heat medium control pipes 5, so that the temperature or delivery speed of the heat medium in each outer casing pipe 30 can be flexibly adjusted according to the actual problems or other needs of the exhaust gas in the exhaust gas emission pipe 1, thereby adjusting the temperature of the exhaust gas in the corresponding covered section of the exhaust gas emission pipe 1.

[0065] In other embodiments of this utility model, several outer casing pipes 30 are connected to the same heat medium supply end 501 through their respective corresponding heat medium control pipes 5. The structure is relatively simple. The temperature of the exhaust gas in the exhaust gas emission pipe 1 of the corresponding covered section can also be adjusted by adjusting the conveying speed of the heat medium parameters in each outer casing pipe 30.

[0066] In some embodiments of this utility model, the heat medium input pipe 502 and the heat medium output pipe 503 connecting each of the outer pipes 30 are respectively provided with temperature sensors. In this way, the temperature difference between the input temperature and the output temperature of the heat medium can be used to determine whether each of the outer pipes 30 is working properly, and whether the temperature of the exhaust gas in the exhaust gas emission pipe 1 is uniform.

[0067] In some embodiments of this utility model, reference is made to Figure 1 , Figure 4 and Figure 12 The ends of the connecting pipe section 42, the first pipe 1, and the outer casing pipe 30 are each provided with a plurality of axially extending and spaced first snap-fit ​​protrusions 61. A first snap-fit ​​groove 62 is formed between adjacent first snap-fit ​​protrusions 61, and the first snap-fit ​​groove 62 and the first snap-fit ​​protrusion 61 are fitted together in a concave-convex manner, so that adjacent outer casing pipes 30, the connecting pipe section 42 and the outer casing pipe 30, and the connecting pipe section 42 and the first pipe 30 are connected by the first snap-fit ​​protrusions 61 and the first snap-fit ​​groove 62. The snap-fit ​​groove 62 achieves a convex-concave engagement, enabling the connection of the first pipe 3 and the second pipe 4 while preventing exhaust gas from easily condensing due to exposed surfaces of the exhaust pipe 1 and pipe connector 2 not being covered by the first pipe 3 and the second pipe 4. Furthermore, the convex-concave engagement of the first snap-fit ​​boss 61 and the first snap-fit ​​groove 62 facilitates easy disassembly and installation, eliminates any additional protruding parts on the outer wall of the pipes, and ensures that the first pipe 3 and the second pipe 4 do not occupy extra space or affect the installation of a third pipe 9, etc., on the outer casing of the first pipe 3 and the second pipe 4. (See some specific embodiments of this utility model for reference.) Figure 1The first pipe 3, which is wrapped around the first exhaust gas branch pipe 11, connects to the connecting pipe 42 at its end; the first pipe 3, which is wrapped around the second exhaust gas branch pipe 12, connects to the connecting pipe 42 at its end; and both ends of the connecting pipe 42 are provided with a first snap-fit ​​protrusion 61 and a first snap-fit ​​groove 62. Because the first snap-fit ​​protrusion 61 and the first snap-fit ​​groove 62 are fitted together in a concave-convex manner, the connecting pipe 42 and the two first pipes 3 at both ends can be connected through the concave-convex fit between the first snap-fit ​​protrusion 61 and the first snap-fit ​​groove 62. Specifically, the first snap-fit ​​protrusion 61 of the first pipe 3 wrapped around the first exhaust gas branch pipe 11 and the first snap-fit ​​groove 62 of the connecting pipe 42 are snap-fitted together, and the first snap-fit ​​groove 62 of the first pipe 3 wrapped around the first exhaust gas branch pipe 11 and the first snap-fit ​​protrusion 61 of the connecting pipe 42 are snap-fitted together, thus minimizing the exposure of the outer wall surface of the exhaust gas emission pipe 1.

[0068] In some embodiments of this utility model, one or both ends of the outer casing 30 are provided with the first snap-fit ​​protrusion 61 and the first snap-fit ​​groove 62.

[0069] In some specific embodiments of this utility model, the first pipeline 3 includes three outer outer pipelines 30, namely a first outer outer pipeline, a second outer outer pipeline, and a third outer outer pipeline. The first outer outer pipeline, the second outer outer pipeline, and the third outer outer pipeline are connected sequentially and wrapped around the outer wall of the first exhaust gas discharge branch pipeline 11. Three sets of first heat medium control pipelines (not shown in the figure) are provided, and are respectively connected to the first outer outer pipeline, the second outer outer pipeline, and the third outer outer pipeline. The ends where the first outer outer pipeline connects to the second outer outer pipeline, the two ends of the second outer outer pipeline, and the end where the third outer outer pipeline connects to the second outer outer pipeline are all provided with the first snap-fit ​​protrusion 61 and the first snap-fit ​​groove 62.

[0070] In some embodiments of this utility model, reference is made to Figure 4 The inner wall of the first snap-fit ​​protrusion 61 is provided with a first magnetic attractor (not shown in the figure), and the outer wall of the exhaust gas outlet branch pipe is provided with a second magnetic attractor 63 adapted to the first magnetic attractor. This makes the sealed connection between the exhaust gas outlet branch pipe and the outer sleeve pipe 30 more secure through the mutual magnetic attraction between the first and second magnetic attractors. This prevents the first snap-fit ​​protrusion 61 from sliding out of the first snap-fit ​​groove 62 due to external forces or other factors, thus avoiding the problem of exhaust gas easily condensing due to exposed surfaces not being covered by the first pipe 3 and the second pipe 4. In some specific embodiments of this utility model, refer to... Figure 4The inner wall of the first snap-fit ​​protrusion 61 is provided with a plurality of first magnetic suction members (not shown in the figure) arranged circumferentially along the outer sleeve pipe 30, and the outer wall of the exhaust gas branch pipe is provided with a plurality of second magnetic suction members 63 adapted to the first magnetic suction members (not shown in the figure).

[0071] In some embodiments of this utility model, reference is made to Figure 5 and Figure 6 The outer casing 30 includes two outer sub-casings 303, each of which has a semi-enclosed structure and is closed at both ends. The two outer casings 303 are connected circumferentially and wrap around the exhaust gas emission branch pipe (not shown in the figure). That is, the two outer casings 303 respectively wrap around the two symmetrical outer walls of the same circumferential segment of the exhaust gas emission branch pipe (not shown in the figure) and are connected to form a cylindrical outer casing 30. This makes it simpler and more convenient to install the first pipe 3 on the exhaust gas emission pipe 1. It is suitable for installing the outer casing 30 on the outside of a long exhaust gas emission pipe 1, solving the problem of cumbersome and time-consuming installation caused by the need to sequentially install the outer casings 30 from the end of the exhaust gas emission pipe 1 due to the long exhaust gas emission pipe 1. In some embodiments of this utility model, refer to Figure 1 , Figure 5 , Figure 6 and Figure 12 The outer casing pipe 303 has several spaced second snap-fit ​​protrusions 65 on its two symmetrical sidewalls along the axial direction. A second snap-fit ​​groove 66 is formed between adjacent second snap-fit ​​protrusions 65, and the second snap-fit ​​protrusions 65 and the second snap-fit ​​grooves 66 are fitted together in a convex-concave fit. The two outer casing pipes 303 are connected by the convex-concave fit of the second snap-fit ​​protrusions 65 and the second snap-fit ​​grooves 66, ensuring uninterrupted connection of the outer casing pipes 30. This avoids the problem of exhaust gas condensation caused by exposed surfaces not covered by the first pipe 3. Furthermore, the convex-concave fit of the second snap-fit ​​protrusions 65 and the second snap-fit ​​grooves 66 facilitates easy disassembly and installation, eliminates any additional protruding parts on the outer wall of the pipe, and the entire first pipe 3 does not occupy extra space or affect the installation of a third pipe 9, etc., on the outer casing of the first pipe 3.

[0072] In some embodiments of this utility model, reference is made to Figure 5 and Figure 6The inner wall of the second snap-fit ​​protrusion 65 is provided with a first magnetic suction member 64, and the outer wall of the exhaust gas discharge branch pipe is provided with a second magnetic suction member that is adapted to the first magnetic suction member 64. This makes the sealing connection between the exhaust gas discharge branch pipe and the outer sleeve pipe 30 more secure through the mutual magnetic attraction between the first magnetic suction member and the second magnetic suction member. This prevents the second snap-fit ​​protrusion 65 from sliding out of the second snap-fit ​​groove 66 due to external force or other factors, thereby avoiding the problem of exhaust gas easily condensing due to the exposed surface of the exhaust gas discharge branch pipe not being covered by the first pipe 3.

[0073] In some specific embodiments of this utility model, reference is made to Figure 5 and Figure 6 The inner wall of the second snap-fit ​​protrusion 65 is provided with a plurality of first magnetic suction members 64 arranged axially along the outer sleeve pipe 303, and the outer wall of the exhaust gas discharge branch pipe is provided with a plurality of second magnetic suction members adapted to the first magnetic suction members 64.

[0074] In some embodiments of this utility model, the structures of the two symmetrical sidewalls of the outer sleeve pipe 303 constituting the outer sleeve pipe 30 along the axial direction are the same, that is, both are the second snap-fit ​​boss 65 or the second snap-fit ​​groove 66, such as Figure 5 As shown. In other embodiments of this utility model, the structures of the two symmetrical sidewalls of the outer sleeve pipe 303 constituting the outer sleeve pipe 30 along the axial direction are not the same, that is, the two symmetrical sidewalls of the outer sleeve pipe 303 along the axial direction are respectively provided with the second snap-fit ​​protrusion 65 and the second snap-fit ​​groove 66, as shown. Figure 6 As shown.

[0075] In some embodiments of this utility model, reference is made to Figure 1 , Figure 7 and Figure 12 The second pipeline 4 includes two sub-pipelines 43, each of which has a semi-enclosed structure and is closed at both ends. The two sub-pipelines 43 are connected circumferentially and wrap around the pipeline connector 2 and part of the exhaust gas emission branch pipeline. That is, the two sub-pipelines 43 respectively wrap around the outer walls of the pipeline connector 2 and part of the exhaust gas emission branch pipeline on two symmetrical sides along the circumference, and are connected to form the second pipeline 4. This makes it simpler and more convenient to install the second pipeline 4 on the pipeline connector 2 and the part of the exhaust gas emission branch pipeline connected to the pipeline connector 2, and solves the problem that it is difficult to install the pipeline 4 by means of a one-end sleeve method because the volume of the pipeline connector 2 is relatively large compared to the volume of the exhaust gas emission branch pipeline.

[0076] In some embodiments of this utility model, reference is made to Figure 1 , Figure 7 and Figure 12The sub-pipe 43 has several spaced second snap-fit ​​protrusions 65 on its two symmetrical sidewalls along the axial direction. A second snap-fit ​​groove 66 is formed between adjacent second snap-fit ​​protrusions 65, and the second snap-fit ​​protrusions 65 and the second snap-fit ​​grooves 66 are fitted together in a convex-concave manner. The two sub-pipes 43 are connected by the convex-concave engagement of the circumferentially opposite second snap-fit ​​protrusions 65 and second snap-fit ​​grooves 66, thus achieving uninterrupted connection of the second pipe 4. This avoids the problem of exhaust gas easily condensing due to exposed surfaces not being covered by the second pipe 4 at the positions of the pipe connector 2 and the exhaust gas emission pipe 1 connected to the pipe connector 2. Moreover, the convex-concave engagement of the second snap-fit ​​protrusions 65 and the second snap-fit ​​grooves 66 makes disassembly and installation easy, and there are no additional protruding parts on the outer wall of the pipe. The entire second pipe 4 does not occupy extra space and does not affect the installation of a third pipe 9, etc., on the outer sleeve of the second pipe 4.

[0077] In some embodiments of this utility model, the structures of the two symmetrical sidewalls of the sub-pipe 43 constituting the second pipe 4 are identical along the axial direction, that is, both are provided with the second snap-fit ​​boss 65 or the second snap-fit ​​groove 66, such as Figure 7 As shown. In some other embodiments of this utility model, the structures of the two symmetrical sidewalls of the sub-pipe 43 constituting the second pipe 4 are not the same along the axial direction, that is, the two symmetrical sidewalls of the sub-pipe 43 along the axial direction are respectively provided with the second snap-fit ​​boss 65 and the second snap-fit ​​groove 66.

[0078] In some specific embodiments of this utility model, reference is made to Figure 7 The sub-pipe 43 includes a first sub-pipe 431 and a second sub-pipe 432 connected to each other. Each of the first sub-pipe 431 and the second sub-pipe 432 has a second engaging boss 65 and a second engaging groove 66 on its two symmetrical sidewalls along the axial direction. The symmetrical positions of the two symmetrical sidewalls of the first sub-pipe 431 and the second sub-pipe 432 along the axial direction are identical. The two first sub-pipes 431 are circumferentially engaged by the second engaging boss 65 and the second engaging groove 66 to form the connecting pipe section 42, which is wrapped around the exhaust gas emission branch pipe. The two second sub-pipes 432 are circumferentially engaged by the second engaging boss 65 and the second engaging groove 66 to form the main pipe section 41, which is wrapped around the pipe connector 2.

[0079] In some embodiments of this utility model, reference is made to Figure 7The inner wall of the second snap-fit ​​protrusion 65 is provided with a first magnetic suction member 64, and the outer wall of the exhaust gas discharge branch pipe is provided with a second magnetic suction member (not shown in the figure) that is adapted to the first magnetic suction member 64. This makes the sealing connection between the exhaust gas discharge branch pipe and the connecting pipe 42 of the second pipe 4 more secure through the mutual magnetic attraction between the first magnetic suction member and the second magnetic suction member. This prevents the second snap-fit ​​protrusion 65 from sliding out of the second snap-fit ​​groove 66 due to external force or other factors, thereby avoiding the problem of exhaust gas easily condensing due to the exposed surface of the exhaust gas discharge branch pipe not being covered by the first pipe 3 and the second pipe 4.

[0080] In some embodiments of this invention, the outer wall of the pipe connector 2 is fitted to the main pipe 41, and the outer wall of the pipe connector 2 is provided with a second magnetic attractor adapted to the first magnetic attractor 64. In other embodiments of this invention, the outer wall of the pipe connector 2 is not fitted to the main pipe 41, and a second magnetic attractor adapted to the first magnetic attractor 64 can also be provided on the outer wall of the pipe connector 2, which facilitates the improvement of the connection firmness between the second pipe 4 and the pipe connector 2 through the mutual magnetic attraction between the first magnetic attractor 64 and the second magnetic attractor.

[0081] In some specific embodiments of this utility model, reference is made to Figure 7 The inner wall of the second snap-fit ​​boss 65 is provided with a plurality of first magnetic suction members 64 arranged axially along the sub-pipe 43, and the outer wall of the exhaust gas discharge branch pipe is provided with a plurality of second magnetic suction members adapted to the first magnetic suction members 64.

[0082] In this application, the second magnetic component adapted to the first magnetic component refers to the first magnetic component having the same material, magnetism, and structure as the second magnetic component, so that the first and second magnetic components can be connected by magnetic attraction to improve the connection strength. Specifically, the materials, magnetism, etc. required to connect the first and second magnetic components by magnetic attraction are conventional methods in the art and will not be elaborated here.

[0083] In some embodiments of this utility model, reference is made to Figure 1 , Figure 8 and Figure 12The connecting pipe section 42 and the first pipe 3, adjacent outer pipe sections 30, and connecting pipe section 42 and outer pipe section 30 are connected by a connector 7. The connector 7 includes a cylindrical body 71 and a fixing member 72; the inner wall of the cylindrical body 71 is provided with an elastic member 711, the inner wall of the elastic member 711 forms a receiving cavity for accommodating the pipe, and an annular groove 712 is provided between the elastic member 711 and the inner wall of the cylindrical body 71. The width of the annular groove 712 along the radial direction of the cylindrical body 71 decreases in the direction away from the opening end of the cylindrical body 71; the inner wall of the cylindrical body 71 is provided with a plurality of guide grooves arranged along the axial direction of the cylindrical body 71; the fixing member 72 is provided with a guide strip on the side wall facing the inner wall of the cylindrical body 71 that is adapted to the guide groove, and the fixing member 72... The thickness of 2 decreases along the extension direction of the guide strip. The fixing member 72 is slidably disposed in the annular groove 712. There is no need to modify the ends of the connecting pipe 42, the first pipe 3 and the outer sleeve pipe 30. Only the connecting member 7 needs to be set at the connection of the two pipes. The connection is more secure and easy to disassemble and install. The connecting pipe 42 and the first pipe 3, as well as the adjacent outer sleeve pipe 30 are connected by the connecting member 7 to achieve uninterrupted connection between the first pipe 3 and the second pipe 4. This avoids the problem of exhaust gas easily condensing due to the exposed surface of the exhaust gas branch pipe not being covered by the first pipe 3 and the second pipe 4.

[0084] In this embodiment, as the fastener 72 is inserted, the fastener 72 will squeeze the elastic member 711, thereby causing the elastic member 711 to clamp the connecting pipe 42, the first pipe 3, or the outer pipe 30, so as to lock and fix the connecting pipe 42, the first pipe 3, or the outer pipe 30.

[0085] In some embodiments of this utility model, reference is made to Figure 8 The fastener 72 is provided in plurality of parts, and the structure of the fastener 72 includes C-shaped structure, conical structure, etc., to facilitate insertion of the fastener 72 and avoid the cumbersome installation and difficulty in adjusting the insertion depth caused by the overall ring structure of the fastener 72. In some embodiments of this utility model, reference is made to... Figure 8 The cylindrical body 71 is provided with a flow guiding cavity 73, which is connected to the heat medium control pipeline 5 to deliver heat medium to the flow guiding cavity 73 to compensate for the heat loss caused by the large space of the connector 7, and to compensate for the heat loss due to heat transfer to the connector 7. This helps to avoid the low temperature at the connector 7 and the resulting condensation of exhaust gas in the exhaust gas emission pipeline at that location.

[0086] In some embodiments of this utility model, reference is made to Figure 3 , Figure 4 and Figure 8 The inner wall of the cylindrical body 71 is provided with a partition ring 74 that divides the inner cavity of the cylindrical body 71 into two receiving cavities. The two ends of the partition ring 74 facing the opening end of the cylindrical body 71 are respectively provided with elastic elements 711. The partition ring 74 is provided with an annular flow guiding cavity that connects to the flow guiding cavity 73. That is, the two receiving cavities are respectively used to accommodate the end of the connecting pipe 42 and the first pipe 3, the end of the connecting pipe 42 and the outer pipe 30, or the end of the adjacent outer pipe 30, making the connection between the connecting pipe 42 and the first pipe 3, between the connecting pipe 42 and the outer pipe 30, and / or between the adjacent outer pipe 30 simpler and more convenient, and the connection more secure. Furthermore, the annular guide cavity connected to the guide cavity 73 is provided in the partition ring 74, so that the annular guide cavity in which the heat medium circulates can be fitted to the exhaust gas emission pipe 1, thus avoiding the occurrence of gaps in the connection between the connecting pipe 42 and the first pipe 3, and / or between the adjacent outer sleeve pipe 30, which would result in a lower temperature at that point in the exhaust gas emission pipe 1.

[0087] In some embodiments, the cylindrical body 71, the elastic element 711, and the partition ring 74 are an integrated structure.

[0088] In other embodiments of this utility model, when the inner wall of the cylindrical body 71 is not provided with the partition ring 74, it is equivalent to Figure 8 The two elastic elements 711 are abutting each other, that is, the elastic elements 711 and the cylindrical body 71 are an integral structure.

[0089] In some embodiments of this utility model, reference is made to Figure 8The adjacent outer sleeves 30 include a first outer sleeve 301 and a second outer sleeve 302, which are connected by a connector 7. Specifically, the cylindrical body 71, one of the elastic elements 711, and the partition ring 74 form a receiving cavity to accommodate the first outer sleeve 301, and the cylindrical body 71, the other elastic element 711, and the partition ring 74 form a receiving cavity to accommodate the second outer sleeve 302. During installation, the ends of the first outer sleeve 301 and the second outer sleeve 302 are first inserted into the two receiving cavities of the cylindrical body 71 from both ends. The inner wall of the elastic member 711 is in contact with or slightly gapped with the outer wall of the first outer sleeve 301 and the outer wall of the second outer sleeve 302. Then, the fixing member 72 is inserted into the annular groove 712. As the fixing member 72 is inserted, it will squeeze the elastic member 711, so that the elastic member 711 exerts a squeezing effect on the first outer sleeve 301 and the second outer sleeve 302, thereby clamping the first outer sleeve 301 and the second outer sleeve 302 to achieve locking and fixing of the first outer sleeve 301 and the second outer sleeve 302.

[0090] In some other embodiments of this utility model, the inner wall of the elastic member 711 is provided with an electric heating element to compensate for the heat loss caused by the large space of the connector 7, and to compensate for the heat lost due to heat transfer to the connector 7. This helps to avoid the low temperature at the connector 7, which would cause the exhaust gas in the exhaust gas discharge branch pipe at that location to condense.

[0091] In some embodiments of this utility model, reference is made to Figure 9 and Figure 10 The first pipe 3 is fitted into the semiconductor processing cavity 100, and an outer cover 31 is fitted onto the end of the first pipe 3 near the semiconductor processing cavity 100. A sealed cavity 32 is formed between the outer cover 31 and the first pipe 3. The outer cover 31 is provided with a vacuum nozzle 33 communicating with the sealed cavity 32. The vacuum nozzle 33 is connected to a vacuum suction device to evacuate the sealed cavity 32. This is equivalent to setting a vacuum insulation cover 31 outside the first pipe 3 connected to the semiconductor processing cavity 100 to insulate the heat medium inside the first pipe 3, thereby reducing heat loss of the heat medium inside the first pipe 3. This ensures that the first pipe 3 system can effectively prevent substances in the exhaust gas from condensing in the exhaust gas discharge pipe 1, reducing or avoiding pipe blockage. This solves the problem that the connection between the first pipe 3 and the semiconductor processing cavity 100 cannot be wrapped with a heating jacket, and can only be exposed or use an insulation jacket, leading to easy blockage at this point in the exhaust gas discharge pipe 1.

[0092] In some embodiments of this utility model, reference is made to Figure 9 and Figure 10 The end of the outer cover 31 facing the semiconductor processing cavity 100 is adapted to the outer wall of the semiconductor processing cavity 100 and is provided with a third magnetic attraction member. The outer wall of the semiconductor processing cavity 100 is provided with a fourth magnetic attraction member adapted to the third magnetic attraction member. This helps to improve the firmness of the connection between the first pipeline 3 and the semiconductor processing cavity 100 and avoids gaps between the first pipeline 3 and the semiconductor processing cavity 100 due to external factors.

[0093] In other embodiments of this utility model, the outer cover 31 includes a horn structure (such as...). Figure 11 (As shown), box structure, hemispherical structure or semi-oval structure.

[0094] In other embodiments of this utility model, reference is made to Figure 11 The first pipe 3 is fitted to the semiconductor processing cavity 100, and the distance between the outer wall 35 of the first pipe 3 near the semiconductor processing cavity 100 and the exhaust pipe 1 increases in the direction close to the semiconductor processing cavity 100. That is, the end of the first pipe 3 near the semiconductor processing cavity 100 has a funnel-shaped structure, which increases the contact area between the first pipe 3 and the semiconductor processing cavity 100 and improves the heat transfer radiation range at the connection between the first pipe 3 and the semiconductor processing cavity 100. This solves the problem that the exhaust pipe 1 is easily blocked at this point because the connection between the first pipe 3 and the semiconductor processing cavity 100 cannot be wrapped with a heating jacket and can only be exposed or use an insulation jacket. The end of the first conduit 3 facing the semiconductor processing cavity 100 is provided with a third magnetic attraction member, and the outer wall of the semiconductor processing cavity 100 is provided with a fourth magnetic attraction member that is compatible with the third magnetic attraction member. This helps to improve the firmness of the connection between the first conduit 3 and the semiconductor processing cavity 100 and avoids gaps between the first conduit 3 and the semiconductor processing cavity 100 due to external factors.

[0095] In some embodiments of this invention, the temperature of the heat medium supply end 501 connected to the outer casing 30 that is connected to the semiconductor processing cavity 100 is higher than the temperature of the heat medium supply ends 501 connected to other outer casing 30s that are far from the semiconductor processing cavity 100. This is to compensate for the heat lost due to heat transfer to the semiconductor processing cavity 100 through connection with it, and helps to avoid condensation of exhaust gas in the exhaust gas discharge branch pipe at the connection point due to a lower temperature.

[0096] In some embodiments of this utility model, reference is made to Figure 12The tailpipe system further includes a control module 8, a third pipe 9, and a vacuum control pipe 91 and a cooling medium control pipe 92 respectively connected to the third pipe 9. The third pipe 9 is sleeved outside the first pipe 3 and the second pipe 4. The control module 8 is connected to the cooling medium control pipe 92 and the vacuum control pipe 91 respectively. The control module 8 is used to control the third pipe 9 to connect with the vacuum control pipe 91 or the cooling medium control pipe 92, so as to evacuate the third pipe 9 or deliver cooling medium to the third pipe 9. When the exhaust pipe 1 is operating normally, the control module 8 controls the outer wall of the vacuum control pipe 91 to create a vacuum in the third pipe 9, thereby insulating the heat medium in the first pipe 3 and the second pipe 4, reducing heat loss of the heat medium in the first pipe 3 and the second pipe 4, and ensuring that the first pipe 3 and the second pipe 4 system can effectively prevent substances in the exhaust gas from condensing in the exhaust pipe 1; and when the first pipe 3, the second pipe 4 system and / or the exhaust pipe 1 require maintenance, the control module 8 controls the flow of heat to the first pipe 3 and the third pipe 9. The second pipe 4 stops supplying a hot medium with a temperature higher than the exhaust gas temperature in the exhaust gas emission pipe 1, and supplies a cooling medium in the third pipe 9 to cool the hot medium in the first pipe 3 and the second pipe 4. This allows the first pipe 3, the second pipe 4, and the exhaust gas emission pipe 1 to cool down quickly, thereby shortening the waiting time for cooling, enabling rapid maintenance, saving maintenance time, and ensuring the normal operation time of semiconductor equipment. At the same time, this application achieves multiple uses for one pipe, reduces the number of pipes, overcomes the problem of limited installation space, and reduces cost investment.

[0097] In other embodiments of this utility model, when the temperature of the heat medium in the first pipe 3 and / or the second pipe 4 is higher than the preset temperature, the control module 8 can control the third pipe 9 to connect with the cooling medium control pipe 92, so that the third pipe 9 delivers cooling medium to the third pipe 9, thereby facilitating the rapid cooling of the heat medium in the first pipe 3 and / or the second pipe 4 to the preset temperature range.

[0098] In some embodiments of this utility model, reference is made to Figure 12The cooling medium control pipeline 92 includes a cooling medium input pipeline 922, a cooling medium output pipeline 923, and a cooling medium flow control component 924, a cooling medium input switch valve 925, and a cooling medium output switch valve 926, all connected to the control module 8. The two ends of the cooling medium input pipeline 922 are connected to the cooling medium supply end 921 and the third pipeline 9, respectively. The cooling medium flow control component 924 and the cooling medium input switch valve 925 are located in the cooling medium input pipeline 922. The two ends of the cooling medium output pipeline 923 are connected to the cooling medium supply end 921 and the third pipeline 9, respectively. The cooling medium output switch valve 926 is located in the cooling medium output pipeline 923. When maintenance is required in the first pipeline 3 and the second pipeline 4 system and / or the exhaust gas emission pipeline 1, the control module 8 can control the opening of the cooling medium input switch valve 925 and the cooling medium output switch valve 926 to supply cooling medium to the third pipeline 9, enabling rapid cooling of the first pipeline 3, the second pipeline 4, and the exhaust gas emission pipeline 1. When the exhaust gas emission pipeline 1 is operating normally, the control module 8 can control the closing of the cooling medium input switch valve 925 and the cooling medium output switch valve 926 to stop the supply of cooling medium to the third pipeline 9; furthermore, it can also... The flow rate of the cooling medium in the third pipe 9 is controlled by the cooling medium flow control component 924 via the control module 8. This allows the heat from the heat medium in the first pipe 3 and the second pipe 4 to be quickly removed by adjusting the flow rate of the cooling medium in the third pipe 9. In other words, the cooling rate of the heat medium in the first pipe 3 and the second pipe 4 is regulated and controlled, thereby shortening the waiting time for cooling down, enabling rapid maintenance, saving maintenance time, and ensuring the normal operation time of semiconductor equipment. At the same time, this application achieves multiple uses for one pipe, reduces the number of pipes, overcomes the problem of limited installation space, and reduces cost investment.

[0099] In this application, the cooling medium supply end includes a cooling medium, a refrigeration device that can maintain the cooling medium at a preset temperature, and a temperature detection device, etc. The specific structure and necessary adaptation structure of the cooling medium supply end are conventional settings in the art and will not be described in detail here. The preset temperature of the cooling medium can be set according to the exhaust gas temperature, the temperature of the heat medium, and the preset cooling time, etc.

[0100] In some embodiments of this invention, the cooling medium is a water-based medium, an air-based medium, or a liquid refrigerant. In some embodiments, the cooling medium is a water-based medium. Water is the most common cooling medium, inexpensive, and readily available. Furthermore, water has a high specific heat capacity and heat transfer coefficient, enabling it to effectively absorb and dissipate heat.

[0101] In some embodiments of this utility model, reference is made to Figure 12 The vacuum control pipeline 91 includes a vacuum pump 911 and a suction pipeline 912. The two ends of the suction pipeline 912 are respectively connected to the vacuum pump 911 and the third pipeline 9. The vacuum pump 911 is connected to the control module 8. This allows the control module 8 to control the vacuum pump 911 to create a vacuum in the third pipeline during normal operation of the exhaust gas emission pipeline 1, thereby insulating the heat medium in the first pipeline 3 and the second pipeline 4. This reduces heat loss in the first pipeline 3 and the second pipeline 4, ensuring that the first pipeline 3 and the second pipeline 4 system effectively prevents substances in the exhaust gas from condensing in the exhaust gas emission pipeline 1.

[0102] In some embodiments of this utility model, reference is made to Figure 12 The vacuum control line 91 further includes a switching valve 913, which is located in the suction line 912 and connected to the control module 8. After the air in the third line 9 is extracted by the vacuum pump, the switching valve 913 is closed by the control module 8 to maintain a vacuum in the third line 9 and prevent the vacuum pump from operating for an extended period of time.

[0103] In some embodiments of this invention, the switching valve may also be a one-way valve.

[0104] Although the embodiments of this utility model have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of this utility model as described in the claims. Moreover, the utility model described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. A tailpipe system for semiconductor devices, characterized in that, include: The exhaust gas emission pipeline is connected to the semiconductor processing cavity, and the exhaust gas emission pipeline includes several exhaust gas emission branch pipelines connected in sequence. Pipeline connector, adjacent exhaust gas branch pipelines are connected through the pipeline connector; The first pipeline has several sections, each of which is wrapped around the exhaust gas branch pipeline. The second pipeline includes a main pipe section and a connecting pipe section. The connecting pipe section is disposed at both ends of the main pipe section and communicates with the main pipe section. The inner diameter of the main pipe section is larger than the inner diameter of the connecting pipe section. The main pipe section is wrapped around the pipeline connector. The connecting pipe section is wrapped around a portion of the exhaust gas emission branch pipeline and is connected to the first pipeline. The heat medium control pipeline includes a first heat medium control pipeline and a second heat medium control pipeline, wherein the first heat medium control pipeline is connected to the first pipeline to deliver heat medium to the first pipeline, and the second heat medium control pipeline is connected to the second pipeline to deliver heat medium to the second pipeline.

2. The exhaust line system for a semiconductor apparatus according to claim 1, characterized by, The first pipeline includes several outer casings, each outer casing having a cylindrical structure and both ends sealed or fitted to the respective casings it encloses. The several outer casings are sequentially connected along the axial direction of the exhaust gas emission branch pipeline and are wrapped around the exhaust gas emission branch pipeline. The first heat medium control pipeline has several sets and is connected to the several outer casings one by one.

3. The exhaust line system for a semiconductor apparatus according to claim 2, characterized by, The ends of the connecting pipe, the first pipe, and the outer sleeve pipe are each provided with a plurality of first snap-fit ​​protrusions that extend axially and are spaced apart. A first snap-fit ​​groove is formed between adjacent first snap-fit ​​protrusions, and the first snap-fit ​​groove and the first snap-fit ​​protrusion are adapted to each other in a concave-convex fit manner. The inner wall of the first snap-fit ​​boss is provided with a first magnetic suction element, and the outer wall of the exhaust gas discharge branch pipe is provided with a second magnetic suction element that is compatible with the first magnetic suction element.

4. The exhaust line system for a semiconductor apparatus according to claim 2, wherein The connecting pipe and the first pipe, the adjacent outer pipe, or the connecting pipe and the outer pipe are connected by a connector; The connector includes a cylindrical body and a fixing member; the inner wall of the cylindrical body is provided with an elastic element, and the inner wall of the elastic element forms a receiving cavity for accommodating the pipeline. An annular groove is provided between the elastic element and the inner wall of the cylindrical body. The width of the annular groove along the radial direction of the cylindrical body decreases in the direction away from the open end of the cylindrical body. The inner wall of the cylindrical body is provided with a plurality of guide grooves arranged along the axial direction of the cylindrical body. The fixing member has a guide strip on its side wall facing the inner wall of the cylindrical body that is adapted to the guide groove, and the thickness of the fixing member decreases along the extension direction of the guide strip. The fixing member is slidably disposed in the annular groove.

5. The exhaust line system for a semiconductor apparatus according to claim 3 or 4, characterized by, The outer casing includes two outer sub-casings, each of which has a semi-enclosed structure and is closed at both ends. The two outer casings are connected circumferentially and wrapped around the exhaust gas discharge branch pipe. The outer casing pipe has a number of spaced second snap-fit ​​protrusions on its two symmetrical sidewalls along the axial direction, and a second snap-fit ​​groove is formed between adjacent second snap-fit ​​protrusions. The second snap-fit ​​protrusions and the second snap-fit ​​grooves are adapted to each other in a concave-convex fit manner. The inner wall of the second snap-fit ​​boss is provided with a first magnetic suction element, and the outer wall of the exhaust gas discharge branch pipe is provided with a second magnetic suction element that is adapted to the first magnetic suction element.

6. The exhaust line system for a semiconductor apparatus according to claim 3 or 4, characterized by, The second pipeline includes two sub-pipelines, each of which has a semi-enclosed structure and is closed at both ends. The two sub-pipelines are connected circumferentially and wrapped around the pipeline connector and part of the exhaust gas emission branch pipeline. The sub-pipeline has a number of spaced second snap-fit ​​protrusions on its two symmetrical sidewalls along the axial direction, and a second snap-fit ​​groove is formed between adjacent second snap-fit ​​protrusions. The second snap-fit ​​protrusions and the second snap-fit ​​grooves are adapted to each other in a concave-convex fit manner. The inner wall of the second snap-fit ​​boss is provided with a first magnetic suction element, and the outer wall of the exhaust gas discharge branch pipe is provided with a second magnetic suction element that is adapted to the first magnetic suction element.

7. The tailpipe system for semiconductor devices according to claim 4, characterized in that, The cylindrical body is provided with a flow guiding cavity. The inner wall of the cylindrical body is provided with a partition ring that divides the inner cavity of the cylindrical body into two receiving cavities. The elastic element is respectively provided at both ends of the partition ring facing the opening end of the cylindrical body. An annular flow guiding cavity is provided inside the partition ring and communicates with the flow guiding cavity. The flow guiding cavity is connected to the heat medium control pipeline to deliver heat medium to the flow guiding cavity and the annular flow guiding cavity. Alternatively, the inner wall of the elastic element may be provided with an electric heating element.

8. The exhaust piping system for a semiconductor apparatus according to claim 1, wherein The first pipeline is fitted to the semiconductor processing cavity, and an outer cover is fitted to the end of the first pipeline near the semiconductor processing cavity. A sealed cavity is formed between the outer cover and the first pipeline. The outer cover is provided with a vacuum nozzle that communicates with the sealed cavity. The vacuum nozzle is connected to a vacuum suction device to evacuate the sealed cavity. The end of the outer cover facing the semiconductor processing cavity is adapted to the outer wall of the semiconductor processing cavity and is provided with a third magnetic attraction element. The outer wall of the semiconductor processing cavity is provided with a fourth magnetic attraction element adapted to the third magnetic attraction element.

9. The tailpipe system for semiconductor devices according to claim 1, characterized in that, The first pipeline is fitted to the semiconductor processing cavity, and the distance between the outer wall of the first pipeline near the semiconductor processing cavity and the exhaust gas emission pipeline increases in the direction closer to the semiconductor processing cavity; The end of the first conduit facing the semiconductor processing cavity is provided with a third magnetic attractor, and the outer wall of the semiconductor processing cavity is provided with a fourth magnetic attractor that is adapted to the third magnetic attractor.

10. The exhaust piping system for a semiconductor apparatus according to Claim 1, characterized by, It also includes a control module, a third pipeline, and a vacuum control pipeline and a cooling medium control pipeline respectively connected to the third pipeline, wherein the third pipeline is sleeved outside the first pipeline and the second pipeline; The control module is connected with the cooling medium control pipeline and the vacuum control pipeline respectively, and is used for controlling the third pipeline to communicate with the vacuum control pipeline or the cooling medium control pipeline, so as to vacuumize the third pipeline or deliver cooling medium to the third pipeline.

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