A rapid cooling device for a semiconductor heating platform

Abstract

This utility model relates to a rapid cooling device for a semiconductor heating platform applied in the field of semiconductor manufacturing. It includes a protective cover located above the heating platform. A telescopic tube and two electric push rods are fixedly connected to the upper end of the protective cover. An air blowing assembly is fixedly connected to the inner top wall of the protective cover, and an air outlet ring is fixedly connected to the lower end of the protective cover. A positioning ring is fixedly fitted onto the outer surface of the air outlet ring. The air blowing assembly includes a distribution box one fixedly connected to the inner top wall of the protective cover. When cooling the semiconductor, the protective cover shields the semiconductor, and gas enters the distribution box one and distribution box two through the telescopic tube. Then, it is blown upwards through the air blowing tube one and air blowing tube two towards the inner cavity of the protective cover, and is discharged through the air outlet ring by natural downward flow. During the discharge process, the gas is evenly blown onto the surface of the semiconductor, reducing the difference in cooling rate between different areas, improving cooling uniformity, and effectively preventing the semiconductor from arching or denting.

Description

Technical Field

[0001] This utility model relates to a cooling device, and more particularly to a rapid cooling device for a semiconductor heating platform used in the field of semiconductor manufacturing. Background Technology

[0002] During the photolithography process of semiconductors, the semiconductors need to be cooled multiple times. Generally, the cooling process is divided into two stages: air cooling and forced cooling by a cooling plate. However, in the air cooling stage, since the initial temperature of the semiconductor is high, natural cooling takes a lot of time, so a semiconductor cooling device is needed to accelerate the cooling.

[0003] The specification of Chinese Patent Publication No. CN222190640U discloses a wafer cooling device. This utility model uses a connected guide groove, air hole and guide hole to guide the cold air emitted by the cooling stage through the guide hole to the outside and top of the wafer when the cooling fan is running. This allows the cold air to cool the wafer from all directions, improves the cooling efficiency and achieves the effect of rapid cooling of the wafer.

[0004] During the cooling process of the semiconductor using the aforementioned cooling device, the guide hole is located at the center above the cooling platform. Gas enters the guide shell through the guide hole and blows directly onto the top of the semiconductor. This results in a higher airflow velocity in the area of ​​the semiconductor facing the guide hole, while the airflow velocity around the semiconductor is lower. This causes uneven cooling rates in different areas of the semiconductor, making the semiconductor prone to arching or concave phenomena, which can damage the semiconductor. Utility Model Content

[0005] The technical problem to be solved by this utility model in view of the above-mentioned prior art is that when cooling semiconductors by air cooling, the gas is usually blown directly onto the semiconductor, which makes the airflow velocity in the area of ​​the semiconductor facing the gas too high, resulting in inconsistent cooling rates in different areas of the semiconductor, causing the semiconductor to be prone to arching or concave phenomena.

[0006] To address the aforementioned problems, this utility model provides a rapid cooling device for a semiconductor heating platform, comprising a protective cover located above the heating platform. A telescopic tube and two electric push rods are fixedly connected to the upper end of the protective cover. An air blowing assembly is fixedly connected to the inner top wall of the protective cover, and an air outlet ring is fixedly connected to the lower end of the protective cover. A positioning ring is fixedly fitted onto the outer surface of the air outlet ring. The air blowing assembly includes a flow distribution box one fixedly connected to the inner top wall of the protective cover. A flow distribution box two is fixedly connected to the lower end of the flow distribution box one. Flow equalization rings are fixedly connected to the inner cavities of both flow distribution box one and flow distribution box two. Multiple flow equalization holes are drilled on the surface of the flow equalization rings. Multiple air blowing pipes one are fixedly connected to the surface of flow distribution box one, and multiple air blowing pipes two are fixedly connected to the outer surface of flow distribution box two.

[0007] In the rapid cooling device of the semiconductor heating platform, when cooling the semiconductor, the semiconductor is shielded by a protective cover. Gas enters into the first and second distribution boxes through the telescopic tube, and is then blown upwards into the inner cavity of the protective cover through the first and second air blowing pipes. The gas flows downwards naturally and is discharged through the air outlet ring. During the discharge process, the gas is evenly blown onto the surface of the semiconductor, reducing the difference in cooling rate between different areas, improving cooling uniformity, and thus effectively preventing the semiconductor from arching or denting.

[0008] As a further improvement of this application, the vent ring has a mesh structure, and the lower end of the vent ring is in contact with the heating table. A sealing ring is fixedly embedded on the inner wall of the positioning ring, and the inner ring surface of the sealing ring is in contact with the outer ring surface of the heating table.

[0009] As a further improvement of this application, the cross-sections of both the first and second shunt boxes are regular hexagons, and the cross-sectional area of ​​the second shunt box is smaller than that of the first shunt box.

[0010] As a further improvement of this application, multiple flow equalization holes, air blowing pipe one, and air blowing pipe two are all arranged in a ring array around the flow equalization ring, and multiple air blowing pipe one and air blowing pipe two are arranged alternately.

[0011] As another improvement of this application, the end of the air blowing pipe away from the first diversion box is inclined toward the inner top wall of the protective cover, the longitudinal section of the second air blowing pipe is L-shaped, and the end of the second air blowing pipe away from the second diversion box is toward the inner top wall of the protective cover.

[0012] As another improvement of this application, the surface of the heating platform is chiseled with multiple receiving grooves, the inner bottom wall of the receiving groove is fixedly connected to a miniature cylinder, the upper end of the miniature cylinder is fixedly connected to a heat insulation plate, and the outer surface of the telescopic tube is fixedly connected to multiple U-shaped air blowing pipes. The lower end of the air blowing pipes contacts the heating platform, and the multiple air blowing pipes are arranged in a ring array around the telescopic tube.

[0013] In summary, in practical applications, when cooling the semiconductor on the heating stage, the electric push rod can be activated to extend downwards, causing the protective cover to move downwards until the exhaust ring contacts the heating stage. The cold air enters the distribution box one and distribution box two through the telescopic tube, and then passes through the equalization hole to enter multiple air blowing pipes one and two evenly. The air is blown upwards through air blowing pipes one and two towards the inner cavity of the protective cover, while the gas flows downwards and exits through the exhaust ring below. During the downward flow, the gas is evenly blown onto the surface of the semiconductor, preventing the airflow from directly blowing onto certain areas of the semiconductor. This reduces the difference in cooling rate between different areas, improves cooling uniformity, and effectively avoids the semiconductor from arching or denting. Attached Figure Description

[0014] Figure 1This is a three-dimensional structural diagram of the first embodiment of this application;

[0015] Figure 2 This is a structural cross-sectional view of the first embodiment of this application;

[0016] Figure 3 This is a schematic diagram of the protective cover structure according to the first embodiment of this application;

[0017] Figure 4 This is a schematic diagram of the air blowing assembly structure according to the first embodiment of this application;

[0018] Figure 5 This is a bottom view of the air blowing assembly structure according to the first embodiment of this application;

[0019] Figure 6 This is a schematic diagram of the flow equalization ring structure according to the first embodiment of this application;

[0020] Figure 7 This is a cross-sectional view of the structure of the second embodiment of this application.

[0021] Explanation of the labels in the diagram:

[0022] 1 Protective cover, 2 Telescopic tube, 3 Electric push rod, 4 Air outlet ring, 5 Positioning ring, 6 Diverter box one, 7 Diverter box two, 8 Flow equalization ring, 9 Flow equalization hole, 10 Air blowing pipe one, 11 Air blowing pipe two, 12 Sealing ring, 13 Heating platform, 14 Miniature cylinder, 15 Heat insulation plate, 16 Air blowing pipe three. Detailed Implementation

[0023] The two embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0024] First implementation method:

[0025] Figure 1 and Figure 2The diagram illustrates a rapid cooling device for a semiconductor heating platform, comprising a protective cover 1 located above a heating stage 13. This cover encloses the semiconductor and blocks gas blown into the cover 1. A telescopic tube 2 and two electric push rods 3 are fixedly connected to the upper end of the protective cover 1. Those skilled in the art can select a suitable model of electric push rod 3, such as DYTZ, according to actual needs. When not cooling, the semiconductor is located above the heating stage 13. When cooling is required, the electric push rods 3 are activated to move the protective cover 1 downwards until the exhaust ring 4 contacts the heating stage 13. The inner surface of the protective cover 1... An air blowing assembly is fixedly connected to the top wall, and an air outlet ring 4 is fixedly connected to the lower end of the protective cover 1. The air outlet ring 4 is located below the protective cover 1. When the gas inside the protective cover 1 is discharged, it needs to flow downward through the air outlet ring 4 to be discharged. A positioning ring 5 is fixedly sleeved on the outer surface of the air outlet ring 4. The air outlet ring 4 has a mesh structure, and the lower end of the air outlet ring 4 is in contact with the heating platform 13. A sealing ring 12 is fixedly embedded on the annular inner wall of the positioning ring 5. The inner ring surface of the sealing ring 12 is in contact with the outer ring surface of the heating platform 13. The sealing ring 12 effectively improves the stability between the air outlet ring 4 and the heating platform 13. Point A in the figure is a semiconductor.

[0026] Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 The blowing assembly includes a diversion box 6 fixedly connected to the top wall inside the protective cover 1. A diversion box 7 is fixedly connected to the lower end of the diversion box 6. Both the diversion box 6 and the diversion box 7 have regular hexagonal cross-sections, with the cross-sectional area of ​​the diversion box 7 being smaller than that of the diversion box 6. A blowing pipe 10 and a blowing pipe 11 are fixedly connected to each longitudinal surface of the diversion box 6 and the diversion box 7, respectively, allowing the blowing pipes 10 and 11 to blow air into different areas inside the protective cover 1. A flow equalization ring 8 is fixedly connected to the inner cavity of both the diversion box 6 and the diversion box 7. Multiple flow equalization holes 9 are drilled on the surface of the flow equalization ring 8, allowing the gas inside the diversion box 6 and the diversion box 7 to flow evenly to the multiple blowing pipes 10 and 11. Multiple air-blowing pipes 10 are fixedly connected to the surface of the air-blowing pipe 11 and the outer surface of the air-blowing pipe 7. Multiple flow equalization holes 9, air-blowing pipes 10 and air-blowing pipes 11 are arranged in a ring array around the flow equalization ring 8. Multiple air-blowing pipes 10 and air-blowing pipes 11 are staggered. The end of air-blowing pipe 10 away from the air-blowing pipe 6 is inclined toward the inner top wall of the protective cover 1. The longitudinal section of air-blowing pipe 11 is L-shaped, and the end of air-blowing pipe 11 away from the air-blowing pipe 7 is inclined toward the inner top wall of the protective cover 1. This allows the gas blown out by air-blowing pipes 10 and air-blowing pipe 11 to blow to different positions inside the protective cover 1. When the gas flows downward, it can be evenly blown to different positions on the semiconductor surface.

[0027] When cooling the semiconductor on the heating stage 13, the electric push rod 3 can be activated to extend downwards, causing the protective cover 1 to move downwards until the exhaust ring 4 contacts the heating stage 13. The cold air enters the distribution box 6 and the distribution box 7 through the telescopic tube 2, and then passes through the equalization hole 9 to enter multiple air blowing pipes 10 and 11 evenly. The air is blown upwards through the air blowing pipes 10 and 11 towards the upper part of the inner cavity of the protective cover 1, effectively preventing the cold air from blowing directly onto the semiconductor surface. The air blown upwards through the air blowing pipes 10 and 11 is blocked by the top wall inside the protective cover 1, causing the airflow to flow downwards. The downward flow of the air passes through the exhaust ring 4 below and is evenly blown onto the surface of the semiconductor, preventing the airflow from blowing directly onto certain areas of the semiconductor, thereby reducing the difference in cooling rate between different areas, improving cooling uniformity, and effectively preventing the semiconductor from arching or sinking.

[0028] Second implementation method:

[0029] This embodiment adds a miniature cylinder 14, a heat insulation plate 15, and an air blowing pipe 16 to the first embodiment, while the rest remains the same as the first embodiment.

[0030] Figure 7 As shown: The surface of the heating stage 13 is chiseled with multiple receiving grooves. A miniature cylinder 14 is fixedly connected to the inner bottom wall of the receiving groove. Those skilled in the art can select a suitable model of miniature cylinder 14 according to actual needs, such as MI10-25SCA. A heat insulation plate 15 is fixedly connected to the upper end of the miniature cylinder 14. The heat insulation plate 15 can protect the miniature cylinder 14 and effectively prevent the miniature cylinder 14 from being pushed out and damaging the semiconductor. Multiple U-shaped air blowing pipes 16 are fixedly connected to the outer surface of the telescopic tube 2. The lower end of the air blowing pipes 16 is in contact with the heating stage 13. The multiple air blowing pipes 16 are arranged in a ring array around the telescopic tube 2. The multiple air blowing pipes 16 blow towards different positions below the semiconductor, thereby cooling the lower part of the semiconductor.

[0031] During the cooling process of the semiconductor, multiple miniature cylinders 14 can be activated to extend and push the semiconductor upward, creating a gap between the semiconductor and the heating platform 13. Gas is blown towards the bottom of the semiconductor through the air blowing pipe 16, thereby cooling the bottom of the semiconductor and effectively avoiding a large temperature difference between the upper and lower ends of the semiconductor.

[0032] In light of current practical needs, the above-described embodiments adopted in this application are not limited to these. Any changes made within the scope of knowledge possessed by those skilled in the art without departing from the concept of this application still fall within the protection scope of this utility model.

Claims

1. A rapid cooling device for a semiconductor heating platform, comprising a protective cover (1) located above a heating table (13), characterized in that: The upper end of the protective cover (1) is fixedly connected to a telescopic tube (2) and two electric push rods (3). The inner top wall of the protective cover (1) is fixedly connected to an air blowing assembly, and the lower end of the protective cover (1) is fixedly connected to an air outlet ring (4). The outer surface of the air outlet ring (4) is fixedly fitted with a positioning ring (5). The air blowing assembly includes a flow distribution box one (6) fixedly connected to the inner top wall of the protective cover (1), a flow distribution box two (7) fixedly connected to the lower end of the flow distribution box one (6), a flow equalization ring (8) fixedly connected to the inner cavity of both the flow distribution box one (6) and the flow equalization ring two (7), a plurality of flow equalization holes (9) are drilled on the surface of the flow equalization ring (8), a plurality of air blowing pipes one (10) fixedly connected to the surface of the flow distribution box one (6), and a plurality of air blowing pipes two (11) fixedly connected to the outer surface of the flow distribution box two (7).

2. A rapid cooling device for a semiconductor heating platform according to claim 1, characterized in that: The venting ring (4) has a mesh structure, and the lower end of the venting ring (4) is in contact with the heating table (13). A sealing ring (12) is fixedly embedded on the inner wall of the positioning ring (5), and the inner ring surface of the sealing ring (12) is in contact with the outer ring surface of the heating table (13).

3. The rapid cooling device of a semiconductor heating platform according to claim 1, wherein: Both the first (6) and the second (7) of the diversion box have regular hexagonal cross-sections, and the cross-sectional area of ​​the second (7) of the diversion box is smaller than that of the first (6).

4. The rapid cooling device of a semiconductor heating platform according to claim 1, wherein: Multiple flow equalization holes (9), air blowing pipe one (10) and air blowing pipe two (11) are arranged in a ring array around the flow equalization ring (8), and multiple air blowing pipe one (10) and air blowing pipe two (11) are arranged in an alternating pattern.

5. The rapid cooling device for a semiconductor heating platform according to claim 4, characterized in that: The end of the first air pipe (10) away from the first diversion box (6) is inclined toward the inner top wall of the protective cover (1), and the longitudinal section of the second air pipe (11) is L-shaped, with the end of the second air pipe (11) away from the second diversion box (7) facing toward the inner top wall of the protective cover (1).

6. The rapid cooling device of a semiconductor heating platform according to claim 1, wherein: The surface of the heating platform (13) is chiseled with multiple receiving grooves. A miniature cylinder (14) is fixedly connected to the inner bottom wall of the receiving groove. A heat insulation plate (15) is fixedly connected to the upper end of the miniature cylinder (14). Multiple U-shaped air blowing pipes (16) are fixedly connected to the outer surface of the telescopic tube (2). The lower end of the air blowing pipes (16) is in contact with the heating platform (13). The multiple air blowing pipes (16) are arranged in a ring array around the telescopic tube (2).

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