A high-temperature resistant computer room temperature detection device

Abstract

This utility model relates to the field of computer room temperature detection technology and discloses a high-temperature resistant computer room temperature detection device, including a sensor body. The sensor body includes a housing, and multiple through slots are provided on both sides of the housing. A heat dissipation plate is placed in the through slots. A heat-conducting plate is integrally formed on one side of the heat dissipation plate, and a semiconductor cooling chip fixed to the housing is provided on one side of the heat-conducting plate. By providing a semiconductor cooling chip, the cold end temperature of the semiconductor cooling chip is reduced, thereby reducing the temperature inside the housing. The hot end temperature of the semiconductor cooling chip is transferred to the heat dissipation plate through the heat-conducting plate, thereby dissipating heat from the hot end of the semiconductor cooling chip and protecting the components inside the housing, thus improving the service life of the device. By providing staggered grooves, a temperature difference is created between the heat dissipation plates, thereby accelerating airflow and improving the heat dissipation effect of the device.

Description

Technical Field

[0001] This utility model relates to the field of computer room temperature detection technology, and more specifically to a high-temperature resistant computer room temperature detection device. Background Technology

[0002] In the IT industry, a data center generally refers to a place where telecommunications, China Netcom, China Mobile, dual-line, power, government or enterprise companies store servers and provide IT services to users and employees. Data centers usually use temperature detection devices to monitor the temperature in real time.

[0003] A search revealed Chinese patent CN213844337U, which discloses a computer room temperature detection device with telephone alarm capability. This device improves heat dissipation and facilitates normal operation. However, when the temperature in the computer room is too high, the heat dissipation effect of the temperature detection device, which uses ordinary heat dissipation holes, will deteriorate, causing the internal temperature of the temperature detection device to rise rapidly, thereby affecting the service life of the internal components. Utility Model Content

[0004] In order to overcome the above-mentioned defects of the prior art, the present invention provides a high-temperature resistant computer room temperature detection device to solve the problems existing in the background art.

[0005] This utility model provides the following technical solution: a high-temperature resistant computer room temperature detection device, including a sensor body, the sensor body including a housing, multiple through slots are provided on both sides of the housing, a heat dissipation plate is placed in the through slot, a heat conduction plate is integrally formed on one side of the heat dissipation plate, a semiconductor cooling chip fixed to the housing is provided on one side of the heat conduction plate, and a ventilation component for replacing the gas inside the housing is provided on the upper and lower sides of the housing.

[0006] As a further embodiment of this utility model, the ventilation assembly includes two sets of outlet groups for discharging high-temperature gas and an inlet group for entering low-temperature gas, both set at the top of the housing. Each of the two outlet groups includes multiple outlet holes opened at the top of the housing, and the inlet group includes multiple inlet holes opened at the bottom of the housing, with the inlet holes located on the center line of the two outlet holes. The inner wall of the top of the housing is provided with a power assembly for driving airflow.

[0007] As a further embodiment of this invention, the power assembly includes two miniature fans that are bolted to the inner wall of the top of the housing, and the air outlets of the two miniature fans face the air outlets.

[0008] As a further embodiment of this utility model, a protective frame is fixed to the top outer wall of the shell by bolts, and multiple exhaust holes are provided on both sides of the protective frame, with the exhaust holes facing obliquely upward.

[0009] As a further embodiment of this utility model, a material guide frame is fixed to the top outer wall of the protective frame by bolts, and an air guide frame is adhered to the top inner wall of the protective frame.

[0010] As a further embodiment of this invention, filter paper is adhered to the bottom inner wall of the housing, and the filter paper completely covers the air inlet.

[0011] As a further embodiment of this invention, a protective shell is fixed to the bottom of the housing by threads, and the protective shell is fitted onto the detection probe of the sensor body.

[0012] As a further embodiment of this utility model, multiple grooves are provided on one side of each of the multiple heat sinks, and the grooves on the multiple heat sinks are staggered.

[0013] The technical effects and advantages of this utility model are as follows:

[0014] 1. This utility model incorporates a semiconductor cooling chip. The cold end temperature of the semiconductor cooling chip is reduced, thereby lowering the temperature inside the housing. The hot end temperature of the semiconductor cooling chip is transferred to the heat dissipation plate through the heat conduction plate, thus dissipating heat from the hot end of the semiconductor cooling chip and protecting the components inside the housing, thereby improving the service life of the device.

[0015] 2. This utility model has a ventilation component, which allows cold air to enter the housing through the air inlet and hot air inside the housing to enter the atmosphere through the air outlet. The bottom intake and top exhaust conform to the physical property of hot air moving upward, which makes the heat dissipation of the sensor body better.

[0016] 3. This utility model has staggered grooves, which create a temperature difference between the heat dissipation plates, thereby accelerating airflow and improving the heat dissipation effect of the device. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0018] Figure 2 This is a schematic diagram of the internal structure of this utility model.

[0019] Figure 3 This is a partially enlarged structural schematic diagram of the present invention.

[0020] Figure 4 This is a partial cross-sectional view of the present invention.

[0021] The attached figures are labeled as follows: 1. Sensor body; 101. Housing; 2. Protective shell; 3. Through slot; 4. Heat sink; 5. Groove; 6. Protective frame; 7. Vent; 8. Miniature fan; 9. Semiconductor cooling chip; 10. Heat-conducting plate; 11. Filter paper; 12. Air inlet; 13. Material guide; 14. Air guide frame; 15. Exhaust port. Detailed Implementation

[0022] The technical solution of this utility model will be clearly and completely described below with reference to the accompanying drawings. In addition, the forms of the various structures described in the following embodiments are merely illustrative. This utility model is not limited to the structures described in the following embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0023] Reference Figures 1-4 This utility model provides a high-temperature resistant computer room temperature detection device, including a sensor body 1, model APEM-5930. The sensor body 1 includes a housing 101, a detection probe, a circuit board, a display screen, etc. The detection probe, circuit board, and display screen are all existing electrical components, and their combination is a mature technology. Multiple through slots 3 are opened on both sides of the housing 101, and a heat dissipation plate 4 is placed in the through slots 3. A heat conduction plate 10 is integrally formed on one side of the heat dissipation plate 4. A semiconductor cooling chip 9 is fixed to the housing 101 on one side of the heat conduction plate 10, wherein the cold end of the semiconductor cooling chip 9 faces inward towards the housing 101, and the hot end contacts the heat conduction plate 10. The upper and lower sides of the housing 101 are provided with gas control devices. The replaced ventilation assembly activates the thermoelectric cooler 9 when the sensor body 1 detects a high ambient temperature. This lowers the cold end temperature of the thermoelectric cooler 9, thereby reducing the temperature inside the housing 101. The hot end temperature of the thermoelectric cooler 9 is transferred to the heat sink 4 via the heat conduction plate 10, thus dissipating heat from the hot end of the thermoelectric cooler 9 and protecting the components inside the housing 101, improving the lifespan of the device. Multiple grooves 5 are provided on one side of each heat sink 4, and the grooves 5 on the multiple heat sink 4 are staggered. The staggered distribution of the grooves 5 creates a temperature difference between the heat sink 4, thereby accelerating airflow and improving the heat dissipation effect of the device. During normal use, the thermoelectric cooler 9 will not be activated.

[0024] In this invention, the ventilation assembly includes two sets of outlet groups for discharging high-temperature gas at the top of the housing 101 and an inlet group for entering low-temperature gas at the bottom of the housing 101. Each outlet group includes multiple outlet holes 7 on the top of the housing 101, and the inlet group includes multiple inlet holes 12 on the bottom of the housing 101, with the inlet holes 12 located on the center line of the two outlet holes 7. This allows air entering the housing 101 to be discharged from both sides, facilitating contact between external air and the semiconductor cooling chip 9. The inner top wall of the housing 101 is equipped with a power assembly to drive airflow. During normal use, cold air can enter the housing 101 through the inlet holes 12, while hot air inside the housing 101 enters the atmosphere through the outlet holes 7. The bottom intake and top exhaust align with the principle of hot air rising upwards. The physical properties of the moving sensor body 1 improve heat dissipation. The power assembly includes two miniature fans 8, model RFA1504, which are bolted to the inner wall of the top of the housing 101. The air outlets of the two miniature fans 8 face the air outlet 7. When the semiconductor cooling chip 9 is running, the miniature fans 8 are activated. The miniature fans 8 assist in expelling cold air from the air outlet 7, so that the cold air is located at the top of the housing 101. Since the cold air falls downward, it cools the area around the housing 101 and improves the protection effect of the device. Filter paper 11 is adhered to the inner wall of the bottom of the housing 101. The filter paper 11 completely covers the air inlet 12 and filters the air entering the housing 101 to prevent particulate matter from entering the housing 101 and causing wear to the internal components.

[0025] Furthermore, a protective frame 6 is bolted to the top outer wall of the housing 101, and a guide frame 13 is bolted to the top outer wall of the protective frame 6 to guide the falling particles and prevent impurities from accumulating on the top of the protective frame 6. An air guide frame 14 is bonded to the top inner wall of the protective frame 6 to guide the air discharged from the air outlet 7. Multiple exhaust holes 15 are provided on both sides of the protective frame 6, and the exhaust holes 15 are oriented obliquely upward. Some air will flow from the exhaust holes 15 to both sides to dissipate heat from the heat dissipation plates 4 on both sides.

[0026] Furthermore, a protective shell 2 is fixed to the bottom of the housing 101 by threads. The protective shell 2 is fitted onto the detection probe of the sensor body 1 to protect the detection probe.

[0027] It should be further noted that the semiconductor cooling chip 9 is an existing electrical device, and will not be described in detail here.

[0028] The working principle of this utility model is as follows: During daily use, cold air can enter the housing 101 through the air inlet 12, and the hot air inside the housing 101 will enter the atmosphere through the air outlet 7, thereby dissipating heat from the sensor body 1 and reducing the energy consumption of the sensor body 1. When the detection probe of the sensor body 1 detects a high external ambient temperature, it activates the semiconductor cooling chip 9 and the micro fan 8. The cold end temperature of the semiconductor cooling chip 9 decreases, thereby reducing the temperature inside the housing 101. The hot end temperature of the semiconductor cooling chip 9 is transferred to the heat dissipation plate 4 through the heat conduction plate 10, thereby dissipating heat from the hot end of the semiconductor cooling chip 9 and protecting the components inside the housing 101. At the same time, the rotation of the micro fan 8 can help to expel the cold air from the air outlet 7, so that the cold air is located at the top of the housing 101. Since the cold air falls downward, it cools the vicinity of the housing 101, further protecting the sensor body 1 and preventing the internal temperature of the sensor body 1 from rising too quickly and damaging the components, thus improving the service life of the sensor body 1.

[0029] Finally, the following points should be noted: In the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation", "connection" and "linkage" should be interpreted broadly, and can be mechanical or electrical connection, or internal connection between two components, or direct connection. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationship. When the absolute position of the described object changes, the relative positional relationship may change.

[0030] The electronic components and modules used in this utility model can all be parts that are commonly used in the market and can achieve the specific functions in this case. The specific models and sizes can be selected and adjusted according to actual needs.

[0031] The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of this utility model can be combined with each other.

Claims

1. A high-temperature-resistant machine room temperature detection device, comprising a sensor main body (1), characterized in that: The sensor body (1) includes a housing (101). Multiple through slots (3) are provided on both sides of the housing (101). A heat sink (4) is placed in the through slot (3). A heat conduction plate (10) is integrally formed on one side of the heat sink (4). A semiconductor cooling chip (9) fixed to the housing (101) is provided on one side of the heat conduction plate (10). A ventilation assembly for replacing the gas inside the housing (101) is provided on the upper and lower sides of the housing (101).

2. The high-temperature-resistant machine room temperature detection device according to claim 1, characterized in that: The ventilation assembly includes two sets of outlet groups for discharging high-temperature gas and an inlet group for entering low-temperature gas, which are set at the top of the housing (101). Both outlet groups include multiple outlet holes (7) opened at the top of the housing (101). The inlet group includes multiple inlet holes (12) opened at the bottom of the housing (101), and the inlet holes (12) are located on the center line of the two outlet holes (7). The top inner wall of the housing (101) is provided with a power assembly for driving airflow.

3. The high-temperature-resistant machine room temperature detection device according to claim 2, characterized in that: The power assembly includes two miniature fans (8) fixedly connected to the inner wall of the top of the housing (101), and the air outlet of the two miniature fans (8) faces the air outlet (7).

4. The high-temperature-resistant machine room temperature detection device according to claim 2, characterized in that: The top outer wall of the housing (101) is fixedly connected to a protective frame (6), and multiple exhaust holes (15) are provided on both sides of the protective frame (6), and the exhaust holes (15) are oriented obliquely upward.

5. The high-temperature-resistant machine room temperature detection device according to claim 4, characterized in that: The top outer wall of the protective frame (6) is fixedly connected to a material guide frame (13), and the top inner wall of the protective frame (6) is bonded with an air guide frame (14).

6. The high-temperature-resistant machine room temperature detection device according to claim 2, characterized in that: The bottom inner wall of the housing (101) is bonded with filter paper (11), which completely covers the air inlet (12).

7. The high-temperature-resistant machine room temperature detection device according to claim 1, characterized in that: A protective shell (2) is fixedly connected to the bottom of the housing (101), and the protective shell (2) is fitted onto the detection probe of the sensor body (1).

8. The high-temperature-resistant machine room temperature detection device according to claim 1, characterized in that: Multiple grooves (5) are provided on one side of each of the multiple heat sinks (4), and the grooves (5) on the multiple heat sinks (4) are staggered.

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