Chip testing device

Abstract

This utility model discloses a chip testing device, relating to the field of chip testing technology. The chip testing device includes a body and a pressure head assembly, with an air cavity disposed within the body. The pressure head assembly is located within the body and includes a thermally conductive mounting rod, a thermally conductive base, and a pressure head. The thermally conductive mounting rod and the pressure head are respectively located at opposite ends of the thermally conductive base. The end of the pressure head furthest from the thermally conductive base is designated as a pressing surface for pressing the chip. The thermally conductive mounting rod is mounted on the body and at least partially located within the air cavity. A heat dissipation structure is provided on the thermally conductive base. This chip testing device improves the heat exchange efficiency of the pressure head assembly by exchanging heat between the thermally conductive mounting rod and the low-temperature air within the air cavity, and by incorporating a pressing surface and a heat dissipation structure, thereby enhancing the heat dissipation effect of the chip. This meets the heat dissipation requirements during high-power chip testing and ensures the uniformity of the chip junction temperature.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to a chip testing device. Background Technology

[0002] During the manufacturing process, chips need to be tested for performance. During testing, the chips generate a lot of heat. Increased temperature can affect test results and may damage the chips.

[0003] Currently, the chip testing device has two air ducts inside, one above the other. The chips are fixed on the pressure head assembly inside the device for testing. Each air duct uses two fans to dissipate heat from 128 chips within it. This cooling method can ensure that the heat generated by a single chip is within 1W, guaranteeing the uniformity of the chip junction temperature. However, for high-power chips, when the heat generated by a single chip is 10W-15W, it is impossible to meet the requirement of a junction temperature uniformity of ≤±5℃ under high / low temperature production conditions. Utility Model Content

[0004] The purpose of this invention is to provide a chip testing device that can achieve heat dissipation to ensure the uniformity of junction temperature during testing of high-power chips with high heat generation.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] Chip testing apparatus, comprising:

[0007] The body, wherein an air cavity is provided inside the body;

[0008] A pressure head assembly is disposed within the body of the machine. The pressure head assembly includes a heat-conducting mounting rod, a heat-conducting base, and a pressure head. The heat-conducting mounting rod and the pressure head are respectively disposed at both ends of the heat-conducting base. The end of the pressure head away from the heat-conducting base is configured as a pressing surface, which is used to press the chip. The heat-conducting mounting rod is mounted on the body and is at least partially disposed within the air cavity. The heat-conducting base is provided with a heat dissipation structure.

[0009] As an optional solution for the chip testing device, the heat dissipation structure includes heat dissipation fins, which are at least located on one side of the thermally conductive base.

[0010] As an optional solution for the chip testing device, the heat dissipation structure further includes a heat dissipation channel, and a ventilation hole is provided inside the thermally conductive mounting rod. One end of the ventilation hole is connected to the air cavity, and the other end is connected to the heat dissipation channel.

[0011] As an optional solution for the chip testing device, the heat dissipation channel includes a main channel and multiple branch channels. The main channel is connected to the ventilation hole, and the multiple branch channels are all connected to the main channel. The branch channels extend along a first direction and / or a second direction perpendicular to the extension direction of the main channel.

[0012] As an optional embodiment of the chip testing device, the heat dissipation channel further includes a branch channel, which is connected to the shunt channel extending along the first direction, and the branch channel extends along the second direction.

[0013] As an optional embodiment of the chip testing device, the heat dissipation fins are located at the end of the heat-conducting base away from the pressure head;

[0014] And / or, the heat dissipation fins are located at one end of the heat-conducting base near the pressure head.

[0015] As an optional solution for the chip testing device, the heat dissipation fins are arranged to extend through both ends of the heat-conducting base in the height direction.

[0016] As an optional solution for the chip testing device, the thermally conductive base has a mounting hole in the middle, and the thermally conductive mounting rod is connected to the mounting hole.

[0017] As an optional solution for the chip testing device, the thermal base and the pressure head are configured as an integrated structure.

[0018] As an optional solution for the chip testing device, the chip is supported on the top of the insertion socket, and after the insertion socket is inserted and fixed to the pressure head, the chip is pressed against the pressure surface.

[0019] The beneficial effects of this utility model are:

[0020] This invention provides a chip testing device, comprising a body and a pressure head assembly. The pressure head assembly, housed within the body, is used to press the chip for testing. To improve heat dissipation when the chip generates significant heat during testing, the chip is placed on the pressing surface of the pressure head, increasing the contact area between the chip and the pressing surface and improving heat exchange efficiency. A thermally conductive base supports the pressure head and is connected to an air cavity within the body via a thermally conductive mounting rod. This allows the pressure head assembly to exchange heat with the low-temperature air in the air cavity through the thermally conductive mounting rod, thereby dissipating heat from the chip. The large amount of heat generated by the chip is conducted to the thermally conductive base through the pressure head. The heat dissipation structure on the thermally conductive base improves the heat exchange efficiency of the pressure head assembly and reduces thermal resistance. This chip testing device, by exchanging heat with the low-temperature air in the air cavity through the thermally conductive mounting rod and by incorporating a pressing surface and heat dissipation structure to improve the heat exchange efficiency of the pressure head assembly, enhances the chip's heat dissipation, meets the heat dissipation requirements of high-power chip testing, and ensures the uniformity of the chip junction temperature. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the chip testing device provided by this utility model;

[0022] Figure 2 This is a schematic diagram of the structure of the pressure head assembly for pressing the chip provided in Embodiment 1 of this utility model;

[0023] Figure 3 This is a front view of the pressing head assembly pressing the chip provided in Embodiment 1 of this utility model;

[0024] Figure 4 yes Figure 3 Sectional view along line AA;

[0025] Figure 5 yes Figure 3 Sectional view along the BB direction;

[0026] Figure 6 This is a schematic diagram of the structure of the pressure head assembly for pressing the chip provided in Embodiment 2 of this utility model;

[0027] Figure 7 This is a schematic diagram of the structure of the chip pressed against the pressure head assembly by the insertion socket according to Embodiment 2 of this utility model;

[0028] Figure 8 This is a cross-sectional view of the chip provided in Embodiment 2 of this utility model, which is pressed against the pressure head assembly by the insertion socket.

[0029] In the picture:

[0030] 100. Chips;

[0031] 1. Heat-conducting mounting rod; 11. Ventilation hole;

[0032] 2. Thermal base; 21. Mounting hole; 22. Heat dissipation fins; 23. Heat dissipation channel; 231. Main channel; 232. Branch channel; 2321. First branch channel; 2322. Second branch channel; 233. Sub-channel;

[0033] 3. Pressure head;

[0034] 4. Insert socket;

[0035] 5. Body; 51. Air chamber; 52. Air duct;

[0036] 6. Pushing mechanism. Detailed Implementation

[0037] To make the technical problem solved by this utility model, the technical solution adopted, and the technical effect achieved clearer, the technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0038] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0039] like Figure 1 As shown, this utility model provides a chip testing device, including a body 5, a pressure head assembly and a fan (not shown in the figure). The body 5 is provided with an air cavity 51, and an air duct 52 communicating with the air cavity 51 is also provided on one side of the body 5. A fan is provided at the end of the air duct 52 away from the air cavity 51. The fan introduces external air into the air cavity 51 through the air duct 52. A pushing mechanism 6 for driving the pressure head assembly is also fixed in the air cavity 51. The pushing mechanism 6 is preferably a cylinder.

[0040] The pressure head assembly is located inside the body 5 and is used to press the chip 100. During the test, the chip 100 generates a large amount of heat, which is conducted to the pressure head assembly. The fan is connected to the air cavity 51 and is used to introduce low-temperature external air into the air cavity 51 to exchange heat with the pressure head assembly, thereby dissipating heat from the chip 100.

[0041] The pressure head assembly includes a heat-conducting mounting rod 1, a heat-conducting base 2, and a pressure head 3. The heat-conducting mounting rod 1 and the pressure head 3 are respectively located at both ends of the heat-conducting base 2. The end of the pressure head 3 away from the heat-conducting base 2 is designated as a pressing surface for pressing the chip 100. The heat-conducting mounting rod 1 is mounted on the body 5 and is at least partially located within the air cavity 51. Specifically, the heat-conducting mounting rod 1 is connected to the pushing mechanism 6 and at least partially extends into the air cavity 51. The heat-conducting base 2 is provided with a heat dissipation structure.

[0042] The chip 100 is placed on the pressing surface of the pressure head 3, increasing the contact area between the chip 100 and the pressing surface and improving heat exchange efficiency. The heat-conducting base 2 supports the pressure head 3 and is connected to the air cavity 51 inside the body 5 through the heat-conducting mounting rod 1, allowing the pressure head assembly to exchange heat with the low-temperature air in the air cavity 51 through the heat-conducting mounting rod 1, thereby dissipating heat for the chip 100. The large amount of heat generated by the chip 100 is conducted to the heat-conducting base 2 through the pressure head 3. The heat dissipation structure on the heat-conducting base 2 can improve the heat exchange efficiency of the pressure head assembly and reduce the thermal resistance. This chip testing device improves the heat exchange efficiency of the pressure head assembly by exchanging heat with the low-temperature air in the air cavity 51 through the heat-conducting mounting rod 1 and by setting the pressing surface and heat dissipation structure, thereby improving the heat dissipation effect of the chip 100, meeting the heat dissipation requirements during the testing of high-power chip 100, and ensuring the uniformity of the junction temperature of the chip 100.

[0043] like Figures 2-4 As shown, the chip 100 is supported on the top of the insertion seat 4. After the insertion seat 4 is inserted and fixed to the pressure head 3, the chip 100 is pressed against the pressure surface, so that the chip 100 is in close contact with the pressure surface, thereby further improving the heat exchange efficiency.

[0044] Furthermore, the heat-conducting base 2 and the pressure head 3 are designed as an integrated structure, which, compared to a separate structure, eliminates or reduces the air layer between the heat-conducting base 2 and the pressure head 3, thereby further reducing the thermal resistance of heat transfer.

[0045] Specifically, the heat-conducting base 2 has a mounting hole 21 in the middle, and the heat-conducting mounting rod 1 is connected to the mounting hole 21. The mounting hole 21 is located at the end of the heat-conducting base 2 away from the pressure head 3. One end of the heat-conducting mounting rod 1 is fixed in the air cavity 51, and the other end extends out of the air cavity 51 and connects to the mounting hole 21 on the heat-conducting base 2. The heat-conducting mounting rod 1 is used to realize the heat exchange between the low-temperature air and the chip 100.

[0046] The heat dissipation structure includes heat dissipation fins 22, which are provided on at least one side of the heat-conducting base 2. By providing heat dissipation fins 22, the heat exchange capacity of the heat-conducting base 2 is increased and the heat exchange thermal resistance is reduced, so that the heat conducted from the chip 100 to the heat-conducting base 2 through the pressure head 3 can quickly exchange heat with the low-temperature air.

[0047] There are various methods for heat dissipation structures. This utility model provides two pressure head assemblies with different heat dissipation structures, and the specific structures are detailed in Embodiment 1 and Embodiment 2, respectively.

[0048] Example 1:

[0049] like Figures 2-5As shown, the chip testing device provided in this embodiment includes a heat dissipation channel 23 on the pressure head assembly. A ventilation hole 11 is provided inside the thermally conductive mounting rod 1. One end of the ventilation hole 11 is connected to the air cavity 51, and the other end is connected to the heat dissipation channel 23. The ventilation hole 11 extends through both ends of the thermally conductive mounting rod 1. Low-temperature air in the air cavity 51 enters the thermally conductive mounting rod 1 from one end of the ventilation hole 11, flows along the extension direction of the thermally conductive mounting rod 1, and exits from the other end of the thermally conductive mounting rod 1. The other end of the thermally conductive mounting rod 1 is connected to the heat dissipation channel 23, allowing the low-temperature air to enter the thermally conductive base 2. The heat from the chip 100 is conducted to the thermally conductive base 2 through the pressure head 3. The heat on the thermally conductive base 2 exchanges heat with the low-temperature air in the heat dissipation channel 23, thereby achieving rapid heat dissipation.

[0050] Specifically, the heat dissipation channel 23 includes a main channel 231 and multiple branch channels 232. The main channel 231 is connected to the ventilation hole 11, and the multiple branch channels 232 are all connected to the main channel 231. The branch channels 232 extend along a first direction and / or a second direction perpendicular to the extension direction of the main channel 231.

[0051] In this embodiment, the first direction is the length direction of the heat-conducting base 2, and the second direction is the width direction of the heat-conducting base 2. The main channel 231 is a central hole connected to the mounting hole 21 in the heat-conducting base 2. The diversion channels 232 are spaced apart along the peripheral wall of the central hole. The diversion channels 232 extending along the first direction of the heat-conducting base 2 guide the low-temperature air autonomous channel 231 to flow along the length direction of the heat-conducting base 2, so as to exchange heat with various positions along the length direction of the heat-conducting base 2. The diversion channels 232 extending along the width direction of the heat-conducting base 2 guide the low-temperature air autonomous channel 231 to flow along the width direction of the heat-conducting base 2, so as to exchange heat with various positions along the width direction of the heat-conducting base 2, thereby realizing rapid heat dissipation of the chip 100.

[0052] The number of diversion channels 232 arranged along the length and width of the heat-conducting base 2 is specifically set according to the height, length, and width of the heat-conducting base 2. For example, two diversion channels 232 are arranged in each of the four directions of the peripheral wall of the main channel 231, and the two diversion channels 232 are spaced apart along the height direction of the heat-conducting base 2. Of course, if the height of the heat-conducting base 2 is high, three or four other numbers of diversion channels 232 can also be arranged in each direction of the peripheral wall of the main channel 231.

[0053] Furthermore, the heat dissipation channel 23 also includes a branch channel 233, which is connected to the diversion channel 232 extending along the first direction, and the branch channel 233 extends along the second direction. Since the diversion channel 232 extending along the length direction of the heat-conducting base 2 has a large area on both sides, in order to further improve the heat exchange efficiency, multiple branch channels 233 extending along the width direction of the heat-conducting base 2 are provided at intervals on both sides of the diversion channel 232 extending along the length direction of the heat-conducting base 2, so that the low-temperature air flowing through the diversion channel 232 extending along the length direction of the heat-conducting base 2 can enter the branch channel 233, accelerate the heat exchange speed between the low-temperature air and the heat-conducting base 2, and thus improve the heat dissipation efficiency of the chip 100.

[0054] In this embodiment, the diversion channel 232 extending along the length direction of the heat-conducting base 2 is designated as the first diversion channel 2321, and the diversion channel 232 extending along the width direction of the heat-conducting base 2 is designated as the second diversion channel 2322. Since the length of the first diversion channel 2321 is greater than the length of the second diversion channel 2322, and the low-temperature air in the first diversion channel 2321 is also diverted to multiple branch channels 233, the cross-sectional area of ​​the first diversion channel 2321 is set to be greater than the cross-sectional area of ​​the second diversion channel 2322 to increase the flow rate of the low-temperature air entering the first diversion channel 2321.

[0055] The heat dissipation fins 22 are located at the end of the heat dissipation channel 23 away from the pressure head 3; and / or, the heat dissipation fins 22 are located at the end of the heat dissipation channel 23 close to the pressure head 3. In this embodiment, since the heat dissipation channel 23 is provided in the middle of the heat-conducting base 2, the heat dissipation fins 22 are arranged to avoid the heat dissipation channel 23. Depending on the height of the heat-conducting base 2, the heat dissipation fins 22 can be located at the end of the heat dissipation channel 23 away from the pressure head 3, that is, the end close to the heat-conducting mounting rod 1; or they can be located at the end of the heat dissipation channel 23 close to the pressure head 3; of course, heat dissipation fins 22 can also be provided at both ends of the heat-conducting base 2.

[0056] Example 2:

[0057] like Figures 6-8 As shown, the heat dissipation structure on the pressure head assembly of the chip testing device provided in this embodiment differs from the heat dissipation structure provided in Embodiment 1, as detailed below:

[0058] In this embodiment, the heat-conducting mounting rod 1 is a solid rod. The low-temperature airflow in the air cavity 51 is no longer guided to the heat-conducting base 2 through the heat-conducting mounting rod 1 to exchange heat with the chip 100. Instead, the heat-conducting mounting rod 1 is designed as a solid rod made of a material with high thermal conductivity. The large amount of heat generated by the chip 100 is conducted to the heat-conducting base 2 through the pressure head 3, and then quickly transferred to the air cavity 51 through the heat-conducting mounting rod 1 to exchange heat with the low-temperature air in the air cavity 51, thereby achieving rapid heat dissipation of the chip 100.

[0059] For example, the heat-conducting mounting rod 1 in this embodiment is made of copper. The heat-conducting mounting rod 1 provided in Embodiment 1 is made of steel.

[0060] Furthermore, the heat dissipation fins 22 are arranged through both ends of the heat-conducting base 2 in the height direction. Since the heat dissipation base 2 does not have a heat dissipation channel 23, the heat exchange area is increased by increasing the area of ​​the heat dissipation fins 22, thereby enhancing the heat exchange capacity of the heat-conducting base 2 and further improving the heat dissipation speed of the chip 100.

[0061] The chip testing device provided by this utility model, through the design of the structure of the pressure head assembly, enables rapid heat dissipation of the large amount of heat generated by the high-power chip 100 on the pressure head assembly; at the same time, it ensures the uniformity of heat dissipation of the chip 100 on each pressure head assembly, thereby achieving the requirement that the junction temperature uniformity of multiple chips 100 in the chip testing device is ≤±5℃.

[0062] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A chip testing apparatus, characterized by, include: The body (5) has an air chamber (51) inside it; The pressure head assembly is located inside the body (5). The pressure head assembly includes a heat-conducting mounting rod (1), a heat-conducting base (2), and a pressure head (3). The heat-conducting mounting rod (1) and the pressure head (3) are respectively located at both ends of the heat-conducting base (2). The end of the pressure head (3) away from the heat-conducting base (2) is set as a pressing surface. The pressing surface is used to press the chip (100). The heat-conducting mounting rod (1) is installed on the body (5) and is at least partially located in the air cavity (51). The heat-conducting base (2) is provided with a heat dissipation structure.

2. The chip testing apparatus according to claim 1, wherein The heat dissipation structure includes heat dissipation fins (22), which are provided on at least one side of the heat-conducting base (2).

3. The chip testing apparatus according to claim 2, characterized in that, The heat dissipation structure also includes a heat dissipation channel (23), and a ventilation hole (11) is provided in the heat-conducting mounting rod (1). One end of the ventilation hole (11) is connected to the air cavity (51), and the other end is connected to the heat dissipation channel (23).

4. The chip testing apparatus according to claim 3, wherein The heat dissipation channel (23) includes a main channel (231) and multiple branch channels (232). The main channel (231) is connected to the ventilation hole (11), and the multiple branch channels (232) are all connected to the main channel (231). The branch channels (232) extend along a first direction and / or a second direction perpendicular to the extension direction of the main channel (231).

5. The chip testing apparatus according to claim 4, wherein The heat dissipation channel (23) further includes a branch channel (233), which is connected to the diversion channel (232) extending along the first direction, and the branch channel (233) extends along the second direction.

6. The chip testing apparatus according to claim 2, wherein The heat dissipation fins (22) are located at the end of the heat-conducting base (2) away from the pressure head (3); And / or, the heat dissipation fins (22) are located at one end of the heat-conducting base (2) near the pressure head (3).

7. The chip testing apparatus according to claim 2, wherein The heat dissipation fins (22) are arranged through both ends of the heat-conducting base (2) in the height direction.

8. The chip testing apparatus according to claim 1, wherein The heat-conducting base (2) has a mounting hole (21) in the middle, and the heat-conducting mounting rod (1) is connected to the mounting hole (21).

9. The chip testing apparatus according to any one of claims 1-8, characterized in that, The heat-conducting base (2) and the pressure head (3) are configured as an integral structure.

10. The chip testing apparatus according to any one of claims 1 to 8, wherein The chip (100) is supported on the top of the insert (4). After the insert (4) is inserted and fixed to the pressure head (3), the chip (100) is pressed against the pressure surface.

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