Optical module and optical transmitting assembly thereof based on flip chip process

Abstract

The application relates to a light emitting assembly based on a flip chip process, which comprises a PCB board, a laser, a silicon light chip and a DSP chip, the silicon light chip and the DSP chip are arranged on one side of the PCB board, the laser is arranged on the other side of the PCB board, and the laser emitted by the laser is coupled into the silicon light chip; a hollow window is arranged on the PCB board, a heat dissipation block is arranged in the hollow window, and the laser is arranged on the heat dissipation block. The application further provides a light module based on the flip chip process. According to the application, the silicon light chip and the DSP chip are arranged on one side of the PCB board, and the laser is arranged on the other side of the PCB board, so that the heat generated by the laser is guided to the side of the DSP chip through the heat dissipation block, the laser and the DSP chip are cooled in the same plane, the two are cooled in the main heat dissipation direction of the light module, the heat balance of the light module is improved, the high-temperature power consumption of the light module is reduced, the junction temperature of the laser under high-temperature working is reduced, and the output power is increased.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology, specifically to an optical module and its optical emitting component based on flip-chip technology. Background Technology

[0002] Most existing optical emitting components based on flip chip technology place the laser, silicon photonics chip, and DSP chip on the same side of the PCB board. The laser will transfer heat through the heat sink on which it is placed, that is, heat is transferred towards the PCB board, while the DSP chip will transfer heat away from the PCB board. The two heat transfers in different directions will cause uneven heat distribution within the optical module, which will increase the high-temperature power consumption of the optical module and reduce the stability of the laser's output power. Summary of the Invention

[0003] The purpose of this invention is to provide an optical module and its optical emitting component based on flip-chip technology, which can at least solve some of the defects in the prior art.

[0004] To achieve the above objectives, the present invention provides the following technical solution: a light emitting component based on flip-chip technology, comprising a PCB board, a laser, a silicon photonics chip, and a DSP chip, wherein the silicon photonics chip and the DSP chip are both disposed on one side of the PCB board, the laser is located on the other side of the PCB board, and the laser emitted by the laser is coupled to the silicon photonics chip; a cutout window is provided on the PCB board, a heat sink is provided in the cutout window, and the laser is disposed on the heat sink.

[0005] Furthermore, the heat sink has a notch on the side near the silicon photonic chip, and the notch communicates with the cutout window.

[0006] Furthermore, the waveguide end of the silicon photonics chip extends to the notch.

[0007] Furthermore, the laser is mounted on the heat sink via a heat sink.

[0008] Furthermore, it also includes a collimating lens, a first folding prism, an isolator, a second folding prism, and a converging lens arranged sequentially along the optical path. The laser emitted by the laser passes sequentially through the collimating lens, the first folding prism, the isolator, the second folding prism, and the converging lens and is directed to the waveguide end of the silicon photonic chip.

[0009] Furthermore, the collimating lens, the first folding prism, the isolator, the second folding prism, and the converging lens are all disposed on the heat sink.

[0010] Furthermore, the isolator is embedded in the heat sink.

[0011] Furthermore, the silicon photonics chip is connected to the PCB board via solder balls.

[0012] Furthermore, the DSP chip is located on the side of the silicon photonics chip away from the heat sink.

[0013] This invention provides another technical solution: an optical module based on flip-chip technology, including a heat dissipation channel and the aforementioned light emitting component, wherein the heat dissipation channel is located on the side of the PCB board where the DSP chip is located.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] 1. By placing both the silicon photonics chip and the DSP chip on one side of the PCB board and the laser on the other side, the heat generated by the laser will be directed to the DSP chip side through the heat sink, achieving coplanar heat dissipation for the laser and the DSP chip. This allows both to dissipate heat in the direction of the main heat dissipation surface of the optical module, which helps to balance the heat of the optical module, thereby reducing the high-temperature power consumption of the optical module, reducing the junction temperature of the laser when operating at high temperatures, and thus increasing the output power.

[0016] 2. The laser housing structure has been eliminated, and a PCB structure with an embedded aluminum nitride substrate is used to carry the optical path, making the assembly process of optical devices simpler. Attached Figure Description

[0017] Figure 1 A three-dimensional structural schematic diagram of a light emitting component based on flip-chip technology provided for an embodiment of the present invention;

[0018] Figure 2 A schematic diagram of the structure of a light-emitting component based on flip-chip technology provided in an embodiment of the present invention (from a low angle). Figure 1 (Based on the upward view perspective)

[0019] Figure 3 A top-view structural diagram of a light-emitting component based on flip-chip technology provided for an embodiment of the present invention (in... Figure 1 (Based on a top-down perspective)

[0020] Figure 4 for Figure 3 A schematic diagram of the cross-sectional structure at the dashed line;

[0021] In the attached diagram, the following labels are used: 1-PCB board; 2-laser; 3-silicon photonics chip; 4-DSP chip; 5-cutout window; 6-heat sink; 7-notch; 8-waveguide end; 9-heat sink; 10-collimating lens; 11-first prism; 12-isolator; 13-second prism; 14-converging lens; 15-solder ball. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Please see Figures 1 to 4 This invention provides a light emitting component based on flip-chip technology, including a PCB board 1, a laser 2, a silicon photonic chip 3, and a DSP chip 4. The silicon photonic chip 3 and the DSP chip 4 are both located on one side of the PCB board 1, and the laser 2 is located on the other side of the PCB board 1, with the laser emitted by the laser 2 coupled to the silicon photonic chip 3. A cutout window 5 is provided on the PCB board 1, and a heat sink 6 is provided within the cutout window 5. The laser 2 is mounted on the heat sink 6. In this embodiment, in a conventional flip-chip optical module, the laser 2, silicon photonic chip 3, and DSP are all designed on the same side, i.e., the component in this embodiment... Figure 4 The laser 2 is positioned on the upper side of the PCB board 1, but since the heat of the laser 2 is conducted downwards, if the laser 2 is designed on the upper side of the PCB board 1, the heat will be conducted downwards, while the heat of the DSP chip 4 dissipates upwards. This will lead to uneven heat distribution within the optical module housing, causing a series of problems. This embodiment cleverly uses a periscope-like technique to design the laser 2 on the upper side of the PCB board 1. Figure 4Below the PCB board 1 shown, the light from the laser 2 is then sent to the silicon photonic chip 3 via a periscope-like optical path. This allows the heat from the laser 2 to be conducted upwards on the PCB board 1, ultimately sharing the same heat dissipation channel with the DSP chip 4, thus overcoming the shortcomings of traditional flip-chip technology. Specifically, a cutout window 5 can be created on the PCB board 1, and a heat sink 6 can be embedded in this cutout window 5. This cutout window 5 is a through-hole, allowing the heat generated by the laser 2 to be directed to the upper side of the PCB board 1 via the heat sink 6. Finally, the heat generated by the laser 2 and the DSP chip 4 can be uniformly dissipated through the heat dissipation channel on the main heat dissipation surface, greatly improving heat dissipation efficiency. This significantly improves the laser's heat dissipation performance, reduces junction temperature, improves the stability of laser output power, achieves internal thermal equilibrium of the optical module, improves optical path coupling accuracy and efficiency, simplifies manufacturing processes, and increases production efficiency. Preferably, the heat sink 6 can be made of an aluminum nitride ceramic substrate. The laser 2 is a CW laser. The DSP chip 4 is located on the side of the silicon photonic chip 3 away from the heat sink 6.

[0024] Please see Figures 1 to 4 The heat sink 6 has a notch 7 on the side near the silicon photonic chip 3, and the notch 7 communicates with the cutout window 5. In this embodiment, the notch 7 is designed on one side of the heat sink 6, or the size of the heat sink 6 is smaller than the size of the cutout window 5. In this way, the heat sink 6 is fixed in the cutout window 5 of the PCB board 1 on three sides. There are various fixing methods, such as hot pressing, glue bonding, etc., and this embodiment does not limit this. The notch 7 allows the position of the waveguide end 8 of the silicon photonic chip 3 to be observed during coupling. Since the light is deflected to the upper side of the PCB board 1 through the deflection prism, the waveguide of the silicon photonic chip 3 will be blocked and cannot be seen when coupling. Existing technology usually uses external imaging equipment for indirect observation, which is very troublesome. This embodiment cleverly uses the notch 7 on the heat sink 6 to directly observe the waveguide, which greatly improves the coupling efficiency. Preferably, the waveguide end 8 of the silicon photonic chip 3 extends to the notch 7, and the waveguide end 8 is directly above the notch 7, which facilitates observation. The observation direction is as follows. Figure 4 As shown, this is viewed from below PCB 1 towards above PCB 1.

[0025] Please see Figures 1 to 4 The laser 2 is mounted on the heat sink 6 via a heat sink 9. In this embodiment, the heat from the laser 2 is first conducted away through the heat sink 9, and then transferred to the heat sink 6 via the heat sink 9.

[0026] Please see Figures 1 to 4The system also includes a collimating lens 10, a first bending prism 11, an isolator 12, a second bending prism 13, and a converging lens 14 arranged sequentially along the optical path. The laser emitted by the laser 2 passes sequentially through the collimating lens 10, the first bending prism 11, the isolator 12, the second bending prism 13, and the converging lens 14 before reaching the waveguide end 8 of the silicon photonic chip 3. In this embodiment, the laser emitted by the laser 2 is first collimated by the collimating lens 10, then the first bending prism 11 bends the optical path upwards, then passes through the isolator 12, then the second bending prism 13 changes the optical path horizontally, and finally couples into the silicon photonic chip 3 through the converging lens 14. The collimating lens 10 and the converging lens 14 are actively coupled, while the first bending prism 11, the isolator 12, and the second bending prism 13 are passively coupled. The first bending prism 11, the isolator 12, and the second bending prism 13 are all bonded and fixed to the aluminum nitride ceramic substrate using adhesive.

[0027] Please see Figures 1 to 4 The collimating lens 10, the first folding prism 11, the isolator 12, the second folding prism 13, and the converging lens 14 are all disposed on the heat sink 6. Preferably, the isolator 12 is embedded in the heat sink 6. These devices can all be installed using the heat sink 6.

[0028] Please see Figures 1 to 4 The silicon photonic chip 3 is connected to the PCB board 1 via solder balls 15. In this embodiment, the silicon photonic chip 3 is soldered to the PCB board 1 using a flip-chip process. Solder balls 15 are used to connect the silicon photonic chip 3 to the PCB board 1, and can raise the silicon photonic chip 3 so that the waveguide end 8 of the silicon photonic chip 3 is aligned with the center of the converging lens 14. Figure 4 As shown by the dashed line.

[0029] Therefore, the specific assembly of this invention is as follows: first, a PCB board with an embedded aluminum nitride ceramic substrate is prepared; a silicon photonic chip is soldered on one side of the PCB board using the Flip Chip process; a CW laser is bonded on the other side of the PCB board using thermally conductive silver paste; an optical path system is assembled, including a collimating lens, a deflecting prism, an isolator, etc.; optical path alignment and coupling optimization are performed; and the overall packaging and testing are completed.

[0030] Please see Figures 1 to 4This invention provides an optical module based on flip-chip technology, including a heat dissipation channel and the aforementioned light emitting component. The heat dissipation channel is located on the side of the PCB board 1 where the DSP chip 4 is located. In this embodiment, the aforementioned light emitting component is used in the flip-chip optical module. By placing both the silicon photonics chip 3 and the DSP chip 4 on one side of the PCB board 1, and arranging the laser 2 on the other side of the PCB board 1, the heat generated by the laser 2 is guided to the side of the DSP chip 4 through the heat sink 6, achieving coplanar heat dissipation for both the laser 2 and the DSP chip 4. This ensures that both dissipate heat in the direction of the main heat dissipation surface of the optical module, contributing to thermal balance of the optical module, thereby reducing the high-temperature power consumption of the optical module, reducing the junction temperature of the laser 2 when operating at high temperatures, and thus increasing the output power. The heat dissipation channel can carry away the heat generated by the DSP chip 4 and the laser 2 together.

[0031] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A light-emitting component based on flip-chip technology, comprising a PCB board, a laser, a silicon photonics chip, and a DSP chip, characterized in that: The silicon photonics chip and the DSP chip are both located on one side of the PCB board, and the laser is located on the other side of the PCB board. The laser emitted by the laser is coupled to the silicon photonics chip. A cutout window is provided on the PCB board, and a heat sink is provided in the cutout window. The laser is located on the heat sink. The side of the heat sink near the silicon photonics chip has a notch, which is connected to the cutout window. The waveguide end of the silicon photonics chip extends to the notch. The heat sink is fixed to the cutout window on the PCB board on three sides by hot pressing or adhesive bonding. The notch on the heat sink allows direct observation of the waveguide, improving coupling efficiency.

2. The optical emitting component based on flip-chip technology as described in claim 1, characterized in that: The laser is mounted on the heat sink via a heat sink.

3. The optical emitting component based on flip-chip technology as described in claim 1, characterized in that: It also includes a collimating lens, a first folding prism, an isolator, a second folding prism, and a converging lens arranged sequentially along the optical path. The laser emitted by the laser passes sequentially through the collimating lens, the first folding prism, the isolator, the second folding prism, and the converging lens and is directed to the waveguide end of the silicon photonic chip.

4. The optical emitting component based on flip-chip technology as described in claim 3, characterized in that: The collimating lens, the first folding prism, the isolator, the second folding prism, and the converging lens are all disposed on the heat sink.

5. The optical emitting component based on flip-chip technology as described in claim 3, characterized in that: The isolator is embedded in the heat sink.

6. The optical emitting component based on flip-chip technology as described in claim 1, characterized in that: The silicon photonics chip is connected to the PCB board via solder balls.

7. The optical emitting component based on flip-chip technology as described in claim 1, characterized in that: The DSP chip is located on the side of the silicon photonics chip away from the heat sink.

8. An optical module based on flip-chip technology, characterized in that: It includes a heat dissipation channel and a light emitting component as described in any one of claims 1-7, wherein the heat dissipation channel is located on the side of the PCB board where the DSP chip is located.

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