An optical module package structure and method

Abstract

An optical module packaging structure comprises an upper shell and a lower shell, the upper shell and the lower shell form a closed cavity, a plurality of devices are packaged in the cavity, the devices comprise a circuit board, an optical emission assembly, an optical-electricity conversion assembly and an optical fiber constraint clamp, the circuit board is arranged on the lower shell, the optical emission assembly, the optical-electricity conversion assembly and the optical fiber constraint clamp are all arranged on the circuit board; there is a space for optical fiber disc fiber between the optical emission assembly and the optical-electricity conversion assembly, the optical fiber constraint clamp is arranged in the space, the optical emission assembly comprises two light source assemblies, an optical combining assembly and an optical splitting assembly, the optical-electricity conversion assembly comprises two optical modulators, a heat sink and a signal processor, the two optical modulators and the signal processor are sequentially arranged at the far ends of the two light source assemblies. An optical module packaging method is also proposed. The present application optimizes the layout of the light source assembly and the optical modulator through independent light sources, and optimizes the layout of the fusion fiber joint and the optical fiber after fusion, reasonably arranges the positions of the devices and the optical fiber, and realizes the optical module for long-distance and high-speed transmission.

Description

Technical Field

[0001] This invention relates to the field of optical modules, and specifically to an optical module packaging structure and method. Background Technology

[0002] Currently, coherently packaged coherent optical modules are becoming increasingly widely used due to their high-speed transmission characteristics. Coherent modules generally employ silicon photonics modulation schemes, which, due to limitations in light source power and linewidth, typically limit their ability to transmit over long distances. Furthermore, current miniaturized, high-speed, highly integrated coherent optical modules face challenges such as crowded device placement, severe thermal interference, and insufficient space for fiber optic connectors when integrating two high-power narrow-linelight sources and two sets of integrated silicon photonics modulators.

[0003] In current coherent optical modules, the light source and optical modulator are mostly integrated into one unit. This results in low optical power, which prevents transmission over long distances. Furthermore, since the wavelength changes with temperature, the wavelength of the integrated light source and optical modulator cannot be individually controlled.

[0004] For long-distance, high-speed transmission, a high-power, narrow-linewidth light source is required to complement the coherent modulation chip. High-power, narrow-linewidth light sources are temperature-sensitive, requiring additional temperature control, which inevitably increases the number of packaging components. Furthermore, to achieve high speed, the module also needs to perform multiplexing and demultiplexing, adding to the complexity of the module packaging, posing a significant challenge to the limited-size module. Summary of the Invention

[0005] To address the aforementioned problems, this invention aims to propose an optical module packaging structure and method. The structure comprises a circuit board, an optical emitting component, a photoelectric conversion component, and an optical fiber constraint clamp, all housed within a housing. Utilizing an independent light source, and optimizing the light source, multiplexing, and demultiplexing structures, along with a rational layout of components and optical fiber positions, this invention enables a long-distance, high-speed optical module for transmission. This is achieved through the following technical solutions: An optical module packaging structure includes an upper shell and a lower shell, which form a closed cavity. Multiple devices are encapsulated within this cavity, including a circuit board, an optical emitting component, a photoelectric conversion component, and an optical fiber constraint clamp. The circuit board is located on the lower shell, and the optical emitting component, photoelectric conversion component, and optical fiber constraint clamp are all located on the circuit board. There is a space for optical fiber coiling between the optical emitting component and the photoelectric conversion component, and the optical fiber constraint clamp is located within this space. The optical emitting component includes two light source components, an optical multiplexer, and an optical splitter. The photoelectric conversion component includes two optical modulators, a heat sink, and a signal processor. The optical multiplexer and optical splitter are located between the two light source components. The two optical modulators and the signal processor are sequentially located at the distal ends of the two light source components. The heat sink is located above the two optical modulators and dissipates heat from them. A heat sink for heat dissipation is also provided on the upper shell.

[0006] This invention uses an independent light source to rationally arrange the light emitting components and photoelectric conversion components, saving space and solving the problems faced by miniaturized, high-speed, highly integrated coherent optical modules when integrating two high-power narrow-line light sources and two sets of integrated silicon photonic modulators, such as crowded device layout, severe thermal interference, and nowhere to place excess fiber splice joints.

[0007] Preferably, the circuit board includes an upper surface, a lower surface, and an electrical interface. An electrical connector is located on the lower surface of the circuit board. Two light source components are both located on the upper surface of the circuit board. Each light source component emits light of different wavelengths. Each light source component includes a light source body, an incident optical fiber, and a flexible circuit board. The incident optical fiber is located closer to the optical modulator, and the flexible circuit board is located further away from the optical modulator. The flexible circuit board is bent to the lower surface of the circuit board and connects to the electrical connector. This placement of the electrical connector reduces the space occupied on the upper surface of the circuit board, thus saving space.

[0008] Preferably, the light source body includes an upper housing and a lower housing, which form a sealed cavity. The laser and circuit board of the light source are placed inside the cavity, with the laser mounted on the circuit board. The housing provides support and heat dissipation for the light source components.

[0009] Preferably, the optical multiplexing assembly includes a multiplexer, a first transmitting fiber, a second transmitting fiber, a transmitting port, and a first fiber array unit. The multiplexer is positioned between two light sources, with one side connected to the first and second transmitting fibers. The first fiber array unit is mounted on one of the optical modulators, and the transmitting port is located on the other side of the multiplexer. The optical demultiplexing assembly includes a demultiplexer, a first receiving fiber, a second receiving fiber, a receiving port, and a second fiber array unit. The demultiplexer is positioned between two light sources, with one side connected to the first and second receiving fibers. The second fiber array unit is mounted on another optical modulator, and the receiving port is located on the other side of the demultiplexer. The multiplexer and demultiplexer perform multiplexing and demultiplexing of light, and multiplexing can significantly increase the transmission rate.

[0010] Preferably, the transmitting optical fibers one and two of the optical wavelength combiner and the receiving optical fibers one and two of the optical wavelength divider are interleaved and connected to fiber array unit one and fiber array unit two, respectively. Each fiber array unit one and fiber array unit two has a bare fiber that is connected to the two incident optical fibers of the light source. This performs wavelength combining and wavelength division, and wavelength combining can improve the transmission rate.

[0011] Preferably, the heat sink includes a heat dissipation surface, multiple heat dissipation support points, two strip slots, and two contact surfaces. A thermal pad is placed on top of the heat dissipation surface, which is then connected to the upper shell. The heat dissipation support points are rigidly connected to the circuit board. The contact surfaces correspond to the optical modulator, and the strip slots are used to accommodate optical fibers. The heat sink not only dissipates heat from the optical modulator, but the strip slots on the heat sink also facilitate the routing of the optical fiber during coiling.

[0012] Preferably, the fiber optic constraint clamp includes an adhesive surface, an entry region, a reversible region, and an irreversible region. The adhesive surface is connected to the circuit board. The entry region and the reversible region allow for adjustment of the fiber optic cable. Once the fiber enters the irreversible region, it is difficult to remove. The fiber optic constraint clamp can constrain coiled fiber optic cables.

[0013] A method for packaging optical modules is also proposed, including the following steps: S1. Prepare the upper shell, lower shell, circuit board, optical emission assembly, photoelectric conversion assembly and fiber optic constraint clamp; S2. The circuit board is placed on the lower shell. The optical emitting component and the photoelectric conversion component are placed on the circuit board in sequence, and there is space between them for the optical fiber coil. The optical fiber is constrained and clamped in the space. The optical emitting component includes two light source components, a multiplexer component and a demultiplexer component. The two light source components, the multiplexer component and the demultiplexer component are arranged side by side. The photoelectric conversion component includes two optical modulators, a heat sink and a signal processor. The two optical modulators and the signal processor are arranged in sequence. The two optical modulators are arranged side by side and the heat sink is placed above the two optical modulators. S3. Connect the light emitting component and the photoelectric conversion component via optical fiber; S4. The optical wavelength division multiplexing (WDM) component receives optical signals and converts them into electrical signals through an optical modulator and signal processor. The electrical signals received by the circuit board are converted into optical signals through a signal processor and optical modulator, thus realizing optical-electrical-optical conversion.

[0014] By rationally arranging the components within the optical module to achieve optical-to-electrical-to-optical conversion, and by rationally arranging and coiling the fiber optic connectors and fibers, the optical module can achieve long-distance and high-speed transmission.

[0015] Preferably, in step S3, the incident optical fibers of the two light source components are connected to the bare fibers of the fiber array unit. The two optical fibers of the multiplexer and the demultiplexer are interlaced and connected to fiber array unit one and fiber array unit two respectively. The optical fibers pass through the fiber constraint clamp, then through the heat sink, so that the fusion splice is located on the right side of the optical modulator. After bending 180 degrees, it passes through the heat sink again and is connected to the fiber array unit. This allows the optical fibers to stretch freely and is less prone to breakage.

[0016] Preferably, in step S3, the length of the incident fiber after fusion splicing is uncontrollable. The fiber can be first coiled on the left side of the optical modulator, passed through the slot of the heat sink, so that the fusion splice is located on the right side of the optical modulator, bent 180 degrees, passed through another slot of the heat sink, and then the remaining length is coiled before finally connecting to the fiber array unit. This fiber coiling allows the fiber to stretch freely and is less prone to breakage.

[0017] The beneficial effects of this invention compared to the prior art are: The technical solution of this invention allows for the independent control of light emitting different wavelengths through an independent light source. The layout of the light source component and the optical modulator allows for space between them for fiber optic cable coiling, optimizing the layout of the optical multiplexing and optical demultiplexing components to perform wave multiplication and demultiplexing of the light. It can transmit the optical signal received at the receiving port to the optical modulator, converting the optical signal into an electrical signal. Then, through an electrical interface, it interacts with external devices, transmitting the electrical signal back to the optical modulator, converting the electrical signal into an optical signal, and finally transmitting the optical signal through the transmitting port, completing the optical-electrical-optical signal transmission. Simultaneously, after the incident light from the light source component is fused to the fiber, the layout of the fusion splice joints and optical fibers, as well as the space arrangement for excess fiber coiling, and the heat dissipation device, conduct the heat generated by the optical modulator to the outside. This solution rationally arranges the positions of the components and optical fibers, realizing a long-distance, high-speed optical module. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the optical module of the present invention; Figure 2 This is a schematic diagram of the optical module of the present invention with the top shell removed; Figure 3 This is a schematic diagram of the optical module of the present invention with the top shell and heat sink removed; Figure 4 This is a schematic diagram of the optical module of the present invention with the lower shell removed; Figure 5 This is an exploded view of the structure of the first light source assembly in this invention; Figure 6 This is an exploded view of the structure of the second light source component in this invention; Figure 7 This is a system schematic diagram of the optical module in this invention; Figure 8 This is a schematic diagram of the heat sink structure of the optical module in this invention; Figure 9 This is a schematic diagram of the fiber constraint clamp in the optical module of the present invention; Reference numerals: 11 Upper shell, 12 Lower shell, 121 Upper shell heat sink, 13 Circuit board, 131 Upper surface of circuit board, 132 Lower surface of circuit board, 133 Electrical interface, 14 Signal processor, 151 Heat sink, 1510 Heat dissipation surface, 1511 Heat dissipation support point, 1512 Strip groove, 1513 Contact surface, 152 First optical modulator, 152 Second optical modulator, 16 Optical multiplexer assembly, 160 Multiplexer, 161 Transmitting fiber 1, 162 Transmitting fiber 2, 163 Transmitting optical port, 169 Fiber array unit 1, 17 Optical splitter assembly, 170 Splitter, 171 Receiving fiber 1, 172 Receiving fiber 2, 173 Receiving optical port, 179 Fiber array unit 2, 18 First light source assembly; 180 First light source body, 181 First light source incident fiber, 182 First light source flexible circuit board, 1801 First light source 1802 First light source upper shell, 1803 First temperature control module, 1804 First substrate, 1805 First circuit board, 1806 First laser, 1807 First lens, 1808 First isolator, 1809 First light source fiber array unit, 19 Second light source assembly; 190 Second light source body, 191 Second light source incident fiber, 192 Second light source flexible circuit board, 1901 Second light source lower shell, 1902 Second light source upper shell, 1903 Second temperature control module, 1904 Second substrate, 1905 Second circuit board, 1906 Second laser, 1907 Second lens, 1908 Second isolator, 1909 Second light source fiber array unit, 20 Fiber optic constraint clip, 200 Adhesive surface, 201 Entrance area, 202 Reversible area, 203 Irreversible area, 21 Fiber fusion splice, 22 Electrical connector. Detailed Implementation

[0019] The following will be combined with the present invention. Figures 1 to 9 The technical solutions in the embodiments of the present invention will be described in detail below.

[0020] like Figure 1 The diagram shown is a structural schematic of an optical module; as shown Figure 2 The diagram shown is a structural schematic of an optical module without its top shell; as shown... Figure 3 The diagram shown is a structural schematic of an optical module without its top casing and heat sink. Figure 4 The image shown is a schematic diagram of the optical module without its lower shell; combined with Figures 1-4 As shown, this application utilizes an independent light source component, and is equipped with an optical modulator, signal processor, optical wavelength division multiplexing component, optical wavelength division multiplexing component, and optical fiber, to spatially arrange multiple devices and determine the direction of the optical fiber, thereby realizing a long-distance and high-speed optical module system.

[0021] Specifically, an optical module packaging structure, such as Figure 1 and 2As shown, the optical module includes a lower shell 11 and an upper shell 12, which together form a cavity for encapsulating the optical module device. The upper shell 12 is the main heat sink, and it has a heat sink 121 that contacts external heat dissipation equipment and carries away heat from the cavity. The device includes a circuit board 13, an optical emitting component, a photoelectric conversion component, and an optical fiber clamp. The circuit board 13 is mounted on the lower shell 11. The upper shell 12 and lower shell 11 are assembled using existing optical module assembly methods. The heat sink 121 uses an existing structure to achieve contact with external heat dissipation equipment and carry away heat from the cavity.

[0022] The optical emission component, optical fiber constraint clamp, and photoelectric conversion component are all mounted on the upper surface 131 of the circuit board, which facilitates the device's dispensing, fiber coiling, testing, and other inspection operations. The circuit board 13 includes an upper surface 131, a lower surface 132, and an electrical interface 133. The electrical interface 133 is used to connect to the outside world, and the lower surface 132 of the circuit board is also connected to an electrical connector 22.

[0023] like Figure 2 and 3 As shown, the optical emission assembly includes two light source assemblies, a demultiplexer assembly 16, and a multiplexer assembly 17. The two light source assemblies are located on the left side of the circuit board 13 and are arranged side by side with intervals. The demultiplexer assembly 16 and the multiplexer assembly 17 are located between the two light source assemblies.

[0024] The photoelectric conversion component includes two optical modulators 15, a heat sink 151, and a signal processor 14. The two light source components, the two optical modulators 15, and the signal processor 14 are sequentially arranged on the upper surface 131 of the circuit board. There is a space for fiber coiling between the two light source components and the two optical modulators 15. The signal processor 14 is on the circuit board. There is a space on the right side of the signal processor 14 that can accommodate the bending of the optical fiber, so that the optical fiber is bent but not easily broken. The heat sink 151 is arranged above the two optical modulators. The heat generated by the optical modulators 15 is dissipated through the heat sink 151 and the upper shell 12.

[0025] There is a space between the light source component and the optical modulator where the fiber is coiled. This space can prevent the heat between the two from interfering with each other and affecting the wavelength of the light source component. At the same time, the fiber is coiled in this space.

[0026] Two light source components are arranged side by side on one side of the upper surface 131 of the circuit board, with a gap between the two light source components. The two light source components are defined as the first light source component 18 and the second light source component 19.

[0027] The first light source assembly 18 includes a first light source body 180, a first light source incident optical fiber 181, and a first light source flexible circuit board 182. The first light source flexible circuit board 182 is bent to connect to the electrical connector 22 on the lower surface 132 of the circuit board, which reduces the space occupied on the upper surface 131 of the circuit board and saves space.

[0028] like Figure 5 As shown, the first light source body 180 includes a lower housing 1801, an upper housing 1802, a first temperature control module 1803, a first substrate 1804, a first circuit board 1805, a first laser 1806, a first lens 1807, a first isolator 1808, and a first light source fiber array unit 1809. The lower housing 1801 and the upper housing 1802 form a cavity, which provides support and heat dissipation for the light source components. The cavity houses the first temperature control module 1803, the first substrate 1804, the first circuit board 1805, the first laser 1806, the first lens 1807, and the first isolator 1808. Along with the first light source fiber array unit 1809, the first temperature control module 1803 is disposed on the upper shell 1802 of the first light source. The first temperature control module 1803 is used to control the temperature of the overall first light source body 180. The first temperature control module 1803 is provided with a first substrate 1804. The first light source circuit board 1805, the first lens 1807, the first isolator 1808, and the first light source fiber array unit 1809 are sequentially disposed on the first substrate 1804. The first laser 1806 is disposed on the first light source circuit board 1805. The first light source circuit board 1805 has micro-circuits and is connected to the first laser 1806 through gold wires.

[0029] One end of the first light source flexible circuit board 182 is located inside the first light source upper shell 1802 and is glued and fixed, while the other end is bent to connect to the electrical connector 22 on the lower surface 132 of the circuit board. The first circuit board 1805 is connected to the first light source flexible circuit board 182 through gold wire, thereby connecting the first laser 1806 to the circuit board 13. The light emitted by the first laser 1806 is connected to the first light source incident fiber 181 through the first lens 1806, the first isolator 1808 and the first light source fiber array unit 1809.

[0030] like Figure 6 As shown, the second light source assembly 19 includes a second light source body 190, a second light source incident optical fiber 191, and a second light source flexible circuit board 192. The second light source flexible circuit board 192 is bent to connect to the electrical connector 22 on the lower surface 132 of the circuit board, which reduces the space occupied on the upper surface 131 of the circuit board and saves space.

[0031] The second light source body 190 includes a second light source lower shell 1901, a second light source upper shell 1902, a second temperature control module 1903, a second substrate 1904, a second circuit board 1905, a second laser 1906, a second lens 1907, a second isolator 1908, and a second light source fiber array unit 1909. The second light source lower shell 1901 and the second light source upper shell 1902 form a cavity. The light source shell provides support and heat dissipation for the light source components. The cavity houses the second temperature control module 1903, the second substrate 1904, the second circuit board 1905, the second laser 1906, the second lens 1907, the second isolator 1908, and the second light source fiber array unit 1909. The second light source fiber array unit 1909 and the second temperature control module 1903 are located on the upper shell 1902 of the second light source. The second temperature control module 1903 is used to control the temperature of the overall second light source body 190. The second temperature control module 1903 is provided with a second substrate 1904. The second light source circuit board 1905, the second lens 1907, the second isolator 1908, and the second light source fiber array unit 1909 are sequentially arranged on the second substrate 1904. The second laser 1906 is located on the second light source circuit board 1905. The second light source circuit board 1905 has micro-circuits and is connected to the second laser 1906 through gold wires.

[0032] One end of the flexible circuit board 192 of the second light source is located inside the upper shell 1902 of the second light source and is glued and fixed. The other end is bent to the electrical connector 22 on the lower surface 132 of the circuit board. The second circuit board 1905 is connected to the flexible circuit board 192 of the second light source through gold wire, thereby connecting the second laser 1906 to the circuit board 13. The light emitted by the second laser 1906 is connected to the incident optical fiber 191 of the second light source through the second lens 1906, the second isolator 1908 and the second light source fiber array unit 1909.

[0033] The difference between the first light source body 180 and the second light source body 190 lies in their temperature control modules. These modules control different temperatures. Since wavelength changes with temperature, different temperatures will produce wavelengths with different linewidths. Linewidth refers to the range of light wavelengths. For example, the wavelengths of the two light sources could be 1301nm and 1311nm respectively. Wavelength is a range; for example, a wavelength of 1311nm has a range of 1310-1312nm. A narrower linewidth range is much smaller; the smaller the range, the purer the light, the stronger its anti-interference ability, and the longer its transmission distance.

[0034] The light source in this invention is an independent light source, capable of individual temperature control, and can obtain high-power, wavelength-stable light, which is beneficial for long-distance transmission. The first light source body 180 and the second light source body 190 need to be coupled and fabricated first, and then the first light source incident fiber 181 and the second light source incident fiber 191 are respectively connected to other optical fibers. At this time, fiber connection requires fiber fusion.

[0035] like Figure 2 and 3 As shown, the optical wave combiner 16 and the optical wave splitter 17 are placed side by side, specifically between the first light source assembly 18 and the second light source assembly 19. The optical wave combiner 16 includes a combiner 160, a first transmitting fiber 161, a second transmitting fiber 162, a transmitting port 163, and a fiber array unit 169. The combiner 160 is located between the first light source body 180 and the second light source body 190. One end of the first transmitting fiber 161 and the second transmitting fiber 162 is connected to the receiving port of the combiner 160. The fiber array unit 169 is located on one of the optical modulators. The transmitting port 163 is located on the left side of the combiner 160.

[0036] The optical wavelength division multiplexing (WDM) assembly 17 includes a wavelength division multiplexer 170, a receiving fiber 171, a receiving fiber 172, a receiving port 173, and a fiber array unit 179. The wavelength division multiplexer 170 is located between the first light source body 180 and the second light source body 190. The wavelength division multiplexer 170 and the multiplexer 160 are arranged side by side. One end of the receiving fiber 171 and the receiving fiber 172 is connected to the transmitting port of the wavelength division multiplexer 170. The fiber array unit 179 is located on another optical modulator. The receiving port 173 is located on the left side of the wavelength division multiplexer 170 and is arranged side by side with the transmitting port 163.

[0037] Two optical modulators are located on the right side of the light source assembly. The two optical modulators are arranged side by side on the circuit board 13 with a gap between them. The two optical modulators are defined as the first optical modulator 152 and the second optical modulator 153.

[0038] Fiber optic array unit 169 is mounted on the first optical modulator 152, and fiber optic array unit 179 is mounted on the second optical modulator 153. The transmitting fiber optic cable 161 and the transmitting fiber optic cable 162 at the receiving port of the multiplexer 160 are interleaved with the receiving fiber optic cable 171 and the receiving fiber optic cable 172 at the transmitting port of the splitter 170. The transmitting fiber optic cable 161 and the receiving fiber optic cable 171 are connected to the fiber optic array unit 169, and the transmitting fiber optic cable 162 and the receiving fiber optic cable 172 are connected to the fiber optic array unit 179.

[0039] Each of the fiber array unit 169 and fiber array unit 2 179 has a bare fiber. In the industry, a bare fiber refers to an optical fiber without an outer sheath. The bare fiber on fiber array unit 169 is connected to the first light source incident fiber 181. The connection of the two fibers requires splicing. After splicing, the two fibers form a splice connector 21. Fiber array unit 2 179 is connected to the second light source incident fiber 191. The connection of the two fibers is also spliced, and a splice connector 21 is also formed.

[0040] The fusion splice 21 produced after fiber splicing is rod-shaped. Since the fiber length is uncontrollable, especially for the larger fusion splice 21, a heat sink 151 is set up to dissipate heat from the optical modulator and control the fiber direction. The heat sink 151 is located above the two optical modulators.

[0041] like Figure 8 As shown, the heat sink 151 includes a heat dissipation surface 1510, multiple heat dissipation support points 1511, two strip grooves 1512, and two contact surfaces 1513; in this embodiment, four heat dissipation support points 1511 are used, and the four heat dissipation support points 1511 are rigidly connected to the circuit board 13, such as by spot welding or other fixing methods.

[0042] The two contact surfaces 1513 are lower than the heat dissipation support point 1511. The two contact surfaces 1513 correspond to the first optical modulator 152 and the second optical modulator 153 respectively. A gap of 0.1-0.3mm is maintained between the contact surfaces 1513 and the first optical modulator 152 and the second optical modulator 153. This gap is used to fill the thermally conductive medium, such as thermal pads, thermal grease, etc., so that the contact surfaces 1513 have good thermal contact and heat transfer with the chip.

[0043] Two slots 1512 are used to place the fused optical fiber, allowing the optical fiber to pass through the heat sink 151. A thermal pad is installed on the heat dissipation surface 1510 and contacts the upper shell 12, thereby dissipating heat.

[0044] After the first light source incident fiber 181 is spliced ​​with the bare fiber on the fiber array unit 169, due to the uncontrollable size, the fiber is coiled on the left side of the optical modulator. After the fiber passes through the strip groove 1512 of the heat sink, the larger splice connector 21 can be placed on the right side of the optical modulator by adjusting the coiling. Then, the fiber is bent 180° around the signal processor 14, then passes through another strip groove 1512 of the heat sink, and the remaining length of the fiber is coiled. Finally, it is connected to the fiber array unit 169.

[0045] After the incident fiber 191 of the second light source is spliced ​​with the bare fiber on the fiber array unit 2 179, due to the uncontrollable size, the fiber is coiled on the left side of the optical modulator. After the fiber passes through the strip groove 1512 of the heat sink, the larger splice connector 21 can be placed on the right side of the optical modulator by adjusting the coiling. Then, the fiber is bent 180° around the signal processor 14, passes through another strip groove 1512 of the heat sink, and the remaining length of the fiber is coiled. Finally, it is connected to the fiber array unit 2 179.

[0046] like Figure 2 and 9 As shown, after fiber fusion, a fiber constraint clamp 20 is provided for better fixation, allowing the fiber to stretch freely and preventing breakage. The fiber constraint clamp 20 is located between two light source components and two optical modulators. The fiber constraint clamp 20 includes an adhesive surface 200, an entrance region 201, a reversible region 202, and an irreversible region 203. The adhesive surface 200 is bonded and fixed to the circuit board 13. The fiber enters the reversible region 202 from the entrance region 201, where the fiber can be withdrawn and adjusted. After entering the irreversible region 203 from the reversible region 202, the fiber cannot be withdrawn. The reversible region 202 and the irreversible region 203 increase the flexibility of fiber operation and facilitate timely adjustment and fixation of the fiber.

[0047] like Figure 7 As shown, the optical module receives external optical signals through the receiving optical port 173. The receiving optical port 173 and the demultiplexer 170 are connected through an optical fiber. The optical signal is transmitted through the optical fiber to the demultiplexer 170, which splits it into two optical waves with different wavelengths. These waves are then transmitted to the first optical fiber unit 169 and the second optical fiber unit 179 via receiving optical fiber 171 and receiving optical fiber 172, respectively. The first optical fiber unit 169 and the second optical fiber unit 179 are coupled to the first optical modulator 152 and the second optical modulator 153, respectively. The first optical modulator 152 and the second optical modulator 153 convert the optical signal into an electrical signal, which is then transmitted to the signal processor 14 for integration. Finally, the electrical signal is emitted from the electrical interface 133 of the circuit board to connect with the external device, realizing optical-to-electrical conversion. The signal processor 14 integrates the electrical signals through the electrical interface 133 to connect and interact with external devices, and then transmits the electrical signals to the first optical modulator 152 and the second optical modulator 153. The optical modulator converts the electrical signals into optical signals, which are emitted by the light source component and enter the optical modulator. The signals then pass through the first transmitting fiber 161 and the second transmitting fiber 162 to the multiplexer 160. The multiplexer combines two different wavelengths of light into one wavelength. Another optical fiber connects the multiplexer 160 and the transmission outlet 163, and the signal is emitted through the transmission outlet 163, thus realizing the electro-optical conversion and completing the optical-electrical-optical signal transmission.

[0048] An optical module packaging method includes the following steps: S1. Prepare the upper shell, lower shell, circuit board, optical emission assembly, photoelectric conversion assembly and fiber optic constraint clamp; S2. Place the circuit board on the lower shell, and then place the light emitting component and the photoelectric conversion component on the circuit board in sequence, leaving space between them for the optical fiber coil. The optical fiber is constrained and clamped within this space. The optical emission assembly includes two light source assemblies, a multiplexer assembly, and a demultiplexer assembly. The two light source assemblies, the multiplexer assembly, and the demultiplexer assembly are arranged side by side, with the two light source assemblies spaced apart. The multiplexer assembly and the demultiplexer assembly are located between the two light source assemblies. The photoelectric conversion component includes two optical modulators, a heat sink, and a signal processor. The two optical modulators and the signal processor are arranged sequentially. The two optical modulators are located to the left of the signal processor, and there is a gap between the two optical modulators and the signal processor. The two optical modulators are arranged side by side, and the heat sink is located above the two optical modulators. The fiber optic constraint clamp is located between the two light source assemblies and the two optical modulators; S3. Connect the optical transmitting component and the photoelectric conversion component through optical fiber; after the transmitting optical fiber 161 and transmitting optical fiber 2 162 of the receiving port of the multiplexer 160 are interlaced with the receiving optical fiber 171 and receiving optical fiber 2 172 of the transmitting port of the splitter 170, the transmitting optical fiber 161 and receiving optical fiber 171 are connected to the fiber array unit 169, and the transmitting optical fiber 2 162 and receiving optical fiber 2 172 are connected to the fiber array unit 2 179. Each of the fiber array unit 169 and fiber array unit 2 179 has a bare fiber. In the industry, a bare fiber refers to an optical fiber without an outer sheath. The bare fiber on fiber array unit 169 is connected to the first light source incident fiber 181. The connection of the two fibers requires splicing. After splicing, the two fibers form a splice connector 21. Fiber array unit 2 179 is connected to the second light source incident fiber 191. The connection of the two fibers is also spliced, and a splice connector 21 is also formed. Since the dimensions of the fused optical fiber are uncontrollable, it is coiled on the left side of the optical modulator. After passing through the strip slot 1512 of the heat sink, the larger fusion splice 21 can be placed on the right side of the optical modulator by adjusting the coil. Then, the optical fiber is bent 180° around the signal processor 14, passed through another strip slot 1512 of the heat sink, and the remaining length is coiled. The two fused optical fibers are respectively connected to fiber array unit 169 and fiber array unit 2 179, that is, respectively connected to the first optical modulator 152 and the second optical modulator 153. S4. The optical wavelength division multiplexing (WDM) component receives optical signals and converts them into electrical signals through an optical modulator and signal processor; the electrical signals received by the circuit board are converted into optical signals through a signal processor and optical modulator, thus realizing optical-electrical-optical conversion. The optical module receives external optical signals through the optical receiving port 173, which are then transmitted to a demultiplexer via optical fiber. The demultiplexer splits the signals into two optical signals of different wavelengths, which are then transmitted to fiber array unit 169 and fiber array unit 2 179 via receiving optical fiber 1 and receiving optical fiber 2 172, respectively. Fiber array unit 1 and fiber array unit 2 are coupled to two optical modulators, which convert the optical signals into electrical signals and transmit them to the signal processor 14 for integration. Finally, the electrical signal is emitted from the electrical interface 133 of the circuit board to connect with external devices, thus realizing optical-to-electrical conversion. The signal processor 14 integrates the electrical signals and connects with external devices via electrical interface 133. The electrical signals are then transmitted to two optical modulators, which convert the electrical signals into optical signals. The signals are emitted by the light source component and enter the optical modulator. They then pass through transmitting fiber 161 and transmitting fiber 162 to the multiplexer 160. The multiplexer combines two different wavelengths of light into one wavelength. Another optical fiber then transmits the signal through the emission outlet 163, thus realizing the electro-optical conversion and completing the optical-electrical-optical signal transmission.

[0049] The above embodiments are merely illustrative of the technical concept of the present invention and should not be construed as limiting the scope of protection of the present invention. Any modifications made to the technical solutions based on the technical concept proposed in this invention shall fall within the scope of protection of this invention.

Claims

1. An optical module package structure comprising an upper case (11) and a lower case (12) which form a closed chamber, and a plurality of devices are packaged in the chamber, characterized in that the devices include: The circuit board (13), the optical emitting component, the photoelectric conversion component and the fiber constraining clamp are all located on the circuit board (13). There is a space for fiber coiling between the optical emitting component and the photoelectric conversion component. The fiber constraining clamp is located in this space. The optical emitting component includes two light source components, an optical wave combiner (16) and an optical wave splitter (17). The photoelectric conversion component includes two optical modulators, a heat sink (151) and a signal processor (14). The optical wave combiner (16) and the optical wave splitter (17) are located between the two light source components. The two optical modulators and the signal processor (14) are located at the far ends of the two light source components. The heat sink (151) is located above the two optical modulators and dissipates heat from the optical modulators. The upper shell (12) is also provided with a heat sink (121) for heat dissipation.

2. The optical module package structure according to claim 1, wherein, The circuit board (13) includes an upper surface (131), a lower surface (132), and an electrical interface (133). The lower surface (132) of the circuit board is provided with an electrical connector (22). Both light source components are located on the upper surface (131) of the circuit board. The two light source components emit light of different wavelengths. The light source components include a light source body, a light source incident fiber, and a light source flexible circuit board. The light source incident fiber is located on the side closer to the light modulator, and the light source flexible circuit board is located on the side away from the light modulator. The light source flexible circuit board is bent to the lower surface (132) of the circuit board and connected to the electrical connector (22).

3. The optical module package structure of claim 1, wherein, The light source body includes an upper light source shell and a lower light source shell, which form a sealed cavity. The laser and circuit board of the light source are placed inside the cavity, with the laser mounted on the circuit board.

4. The optical module package structure of claim 1, wherein, The optical multiplexing assembly (16) includes a multiplexer (160), a first transmitting fiber (161), a second transmitting fiber (162), a transmitting port (163), and a first fiber array unit (169). The multiplexer (160) is located between two light source bodies. One side of the multiplexer (160) is connected to the two first transmitting fibers (161) and the second transmitting fiber (162). The first fiber array unit (169) is located on one of the optical modulators. The transmitting port (163) is located on the other side of the multiplexer (160). The optical wavelength division multiplexing (17) assembly includes a wavelength division multiplexing (170), receiving fiber 1 (171), receiving fiber 2 (172), receiving optical port (173), and fiber array unit 2 (179). The wavelength division multiplexing (170) is located between two light source bodies. One side of the wavelength division multiplexing (170) is connected to the two receiving fibers 1 (171) and receiving fiber 2 (172). The fiber array unit 2 (179) is located on another optical modulator. The receiving optical port (173) is located on the other side of the wavelength division multiplexing (160).

5. The optical module package structure according to claim 4, wherein The transmitting fiber 1 (161) and transmitting fiber 2 (162) of the optical wave combiner (16) are intertwined with the receiving fiber 1 (171) and receiving fiber 2 (172) of the optical wave splitter (17) and are respectively connected to the fiber array unit 1 (169) and the fiber array unit 2 (179). Each of the fiber array unit 1 (169) and the fiber array unit 2 (179) has a bare fiber that is connected to the incident fiber of the two light sources respectively.

6. The optical module packaging structure according to claim 1, characterized in that, The heat sink (151) includes a heat dissipation surface (1510), multiple heat dissipation support points (1511), two strip grooves (1512), and two contact surfaces (1513). The heat dissipation surface (1510) is connected to the upper shell (12) after a heat-conducting pad is provided above it. The heat dissipation support points (1511) are rigidly connected to the circuit board (13). The contact surfaces (1513) correspond to the optical modulator (15). The strip grooves (1512) are used to accommodate optical fibers.

7. The optical module packaging structure according to claim 1, characterized in that, The fiber optic constraint clamp (20) includes an adhesive surface (200), an entry region (201), a reversible region (202), and an irreversible region (203). The adhesive surface (200) is connected to the circuit board (13). The entry region (201) and the reversible region (202) can adjust the fiber. After entering the irreversible region (203), the fiber is not easy to remove.

8. A method for packaging an optical module, characterized in that, To obtain an optical module packaging structure as described in any one of claims 1 to 7, the following steps are included: S1. Prepare the upper shell, lower shell, circuit board, optical emission assembly, photoelectric conversion assembly and fiber optic constraint clamp; S2. The circuit board is placed on the lower shell. The optical emitting component and the photoelectric conversion component are placed on the circuit board in sequence, and there is space between them for the optical fiber coil. The optical fiber is constrained and clamped in the space. The optical emitting component includes two light source components, a multiplexer component and a demultiplexer component. The two light source components, the multiplexer component and the demultiplexer component are arranged side by side. The photoelectric conversion component includes two optical modulators, a heat sink and a signal processor. The two optical modulators and the signal processor are arranged in sequence. The two optical modulators are arranged side by side and the heat sink is placed above the two optical modulators. S3. Connect the light emitting component and the photoelectric conversion component via optical fiber; S4. The optical wavelength division multiplexing (WDM) component receives optical signals and converts them into electrical signals through an optical modulator and signal processor. The electrical signals received by the circuit board are converted into optical signals by the signal processor and optical modulator, thus realizing the optical-electrical-optical conversion.

9. The optical module packaging method according to claim 8, characterized in that: In step S3, the incident optical fibers of the two light source components are connected to the bare fiber of the fiber array unit. The two optical fibers of the multiplexer and the splitter are interlaced and connected to fiber array unit one and fiber array unit two respectively. The optical fibers pass through the fiber constraint clamp and then through the heat sink, so that the fusion splice is located on the right side of the optical modulator. It is bent 180 degrees and then passes through the heat sink and is connected to the fiber array unit.

10. The optical module packaging method according to claim 9, characterized in that: S3. The length of the incident fiber after splicing is uncontrollable. First, the fiber can be coiled on the left side of the optical modulator, passed through the strip groove of the heat sink, so that the splice joint is located on the right side of the optical modulator. Then, it can be bent 180 degrees and rotated through another strip groove of the heat sink. Then, the remaining length of the fiber can be coiled and finally connected to the fiber array unit.

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