A heat sink for a high-power GPU

Abstract

This utility model relates to a heatsink for high-power GPUs, comprising: a cover plate, a flow divider, a heat sink, and a GPU motherboard. The cover plate has a pair of working fluid flow ports on one side, serving as the working fluid inlet and outlet of the heatsink, respectively. The flow divider has a flow divider cavity communicating with the working fluid inlet, a flow collector cavity communicating with the working fluid outlet, and a heat exchange cavity connecting the flow divider cavity and the flow collector cavity. The heat exchange cavity has a flow divider channel opening towards the flow divider cavity and a flow collector channel opening towards the flow collector cavity. The heat sink has microstructure fins arranged corresponding to the flow divider cavity, the heat exchange cavity, and the flow collector cavity to enhance heat exchange. The GPU motherboard has GPU cores corresponding to the microstructure fins. The GPU motherboard and the heat sink are tightly bonded by applying a thermally conductive material. This utility model helps improve the flow stability of microchannel heatsinks under high pressure differential conditions and reduces chip junction temperature fluctuations.

Description

Technical Field

[0001] This utility model relates to the field of chip heat dissipation technology, and in particular to a heat sink for high-power GPUs. Background Technology

[0002] Microchannel liquid cooling technology is currently an effective solution for heat dissipation problems involving high heat flux densities. However, existing microchannel heat sinks have inherent defects such as uneven flow distribution and excessive pressure drop, which limit their heat dissipation performance. Especially under high-power conditions, the cooling medium is prone to local boiling within the channels, causing flow instability and severely affecting the reliability of the heat dissipation system. Although traditional parallel straight-channel structures are easy to manufacture, they are prone to significant uneven flow distribution, leading to insufficient cooling in some areas and the formation of hot spots. In addition, the unidirectional flow channel design limits the contact time between the working medium and the heat source, making it difficult to further improve heat exchange efficiency.

[0003] CN202420472681.0 discloses a CPU / GPU phase-change liquid cooling radiator, including an upper cover plate, a baffle plate, a lower cover plate, and a base plate. The baffle plate is pressed between the upper cover plate and the lower cover plate. The upper cover plate is provided with a pair of working fluid flow ports, which serve as the working fluid inlet and outlet of the radiator, respectively. A pair of connecting grooves are opened on the surface of the upper cover plate facing the baffle plate, which are respectively connected to the working fluid flow ports. A pair of through holes are opened on the baffle plate corresponding to the positions of the connecting grooves. A through opening is opened in the middle of the lower cover plate, the baffle plate is disposed at one end of the through opening, and the base plate is connected to the other end of the through opening. The inner wall of the base plate is provided with several protruding microstructures, but the heat exchange efficiency is low and cannot meet the heat dissipation requirements of higher performance chips.

[0004] Existing studies have attempted to improve the system by introducing multi-stage splitting and staggered fins, but these structures often lead to a significant increase in pressure drop, which in turn reduces the overall energy efficiency ratio of the system. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the existing technology and provide a heat sink for high-power GPUs.

[0006] The objective of this utility model can be achieved through the following technical solutions:

[0007] The technical solution of this utility model is to provide a heat sink for a high-power GPU, comprising: a cover plate, a heatsink, a cooling plate, and a GPU motherboard.

[0008] The cover plate and the heat dissipation plate together form a heat dissipation space, and a diversion plate is provided in the heat dissipation space;

[0009] A pair of working fluid flow ports are provided on one side of the cover plate, which serve as the working fluid inlet and working fluid outlet of the radiator, respectively.

[0010] The flow divider plate is provided with a flow divider cavity communicating with the working fluid inlet, a flow collector cavity communicating with the working fluid outlet, and a heat exchange cavity connecting the flow divider cavity and the flow collector cavity. The heat exchange cavity is provided with a flow divider channel with its opening direction facing the flow divider cavity and a flow collector channel with its opening direction facing the flow collector cavity. After the working fluid flows into the flow divider cavity through the working fluid inlet, it flows into the heat exchange cavity through the flow divider channel to exchange heat, then flows into the flow collector cavity through the flow collector channel, and finally flows out through the working fluid outlet.

[0011] The heat dissipation plate is provided with microstructure fins that correspond to the diversion cavity, heat exchange cavity and collection cavity and are used to enhance heat exchange.

[0012] The GPU motherboard has a GPU core corresponding to the microstructure ribs, and the GPU motherboard and the heat sink are tightly bonded by applying thermally conductive material.

[0013] In some specific embodiments, the diversion channel is composed of several baffles arranged in parallel at intervals and connected to the flow collection cavity, and the spatial opening formed by two adjacent baffles faces the diversion channel;

[0014] The flow collection channel is composed of several baffles arranged in parallel at intervals and connected to the flow diversion cavity, and the spatial opening formed by two adjacent baffles faces the flow collection channel.

[0015] In some specific embodiments, the structure of the baffle includes a multi-segment structure, a tangent structure, a cotangent structure, a sine structure, and a cosine structure;

[0016] When the baffle is a multi-segment structure, the baffle includes three segments, each with lengths L1, L3, and L2, respectively, and at least one of L1, L2, and L3 is not zero. Half the width of the flow channel opening is defined as W1, and half the width of the closed end of the flow channel is defined as W2. The included angles between two adjacent segments are θ1 and θ2, respectively.

[0017] When W1 and W2 are equal, L3 is 0, and the flow channel is a uniform rectangular structure.

[0018] When W1 and W2 are not equal and are not zero, and L1 and L2 are both zero, the flow channel is a trapezoidal structure.

[0019] When W2 is 0, the flow channel has a pointed nozzle shape.

[0020] When W2 is 0, and L1 and L2 are both 0, the flow channel has a triangular structure.

[0021] When all parameters are not zero and the included angles θ1 and θ2 are right angles, the flow channel has a convex-like structure.

[0022] When the strip structure is a tangential or cotangential structure, the distance from the center line of the strip to the center line of the flow channel is defined as E, the total length of the flow channel is L4, and the amplitude of the tangential or cotangential structure is A.

[0023] When the block structure is a sine or cosine structure, the distance from the center line of the block to the center line of the flow channel is defined as F, the total length of the flow channel is L5, the amplitude of the sine / cosine is value B, and the wavelength of the sine or cosine is λ.

[0024] In some specific embodiments, a second gasket for sealing is also provided between the diverter plate and the cover plate.

[0025] In some specific embodiments, a first shim for adjusting the assembly gap is provided between the heat exchange cavity of the flow divider plate and the heat dissipation plate.

[0026] In some specific embodiments, the thickness ratio of the capillary structure in the microstructure rib is ≥0;

[0027] When the thickness of the capillary structure in the microstructure rib is 0%, the microstructure rib is a completely solid rib.

[0028] When the thickness of the capillary structure in the microstructure rib is 100%, the microstructure rib is composed of a completely porous capillary structure.

[0029] In some specific embodiments, the heat dissipation plate has a multi-layer capillary structure on the side surface where the microstructure ribs are provided, and the number of layers of the capillary structure on the bottom surface of the ribs is ≥0.

[0030] When the number of capillary layers on the bottom surface of the rib is 0, the surface of the heat dissipation plate on the side with the microstructure rib is a smooth surface.

[0031] In some specific embodiments, the connection between the heat dissipation plate, the diversion plate, and the cover plate is by threaded connection, snap-fit, riveting, or welding.

[0032] In some specific embodiments, the radiator further includes a pair of radiator connectors, each connected to a pair of working fluid flow ports.

[0033] In some specific embodiments, the GPU motherboard is also provided with a base plate at the bottom.

[0034] Compared with the prior art, the present invention has the following beneficial effects:

[0035] (1) The heat dissipation cold plate of this application adopts a planar raised rib structure, and the heat exchange cavity is opened inside the cover plate. This design reduces the complexity of processing the heat dissipation cold plate.

[0036] (2) The flow divider in this application can guide the fluid to achieve laminar flow transition, effectively reducing the risk of flow separation. By optimizing the channel structure design, the fluid kinetic energy is converted smoothly; this design helps to improve the flow stability of the microchannel heat sink under high pressure differential conditions and reduce chip junction temperature fluctuations.

[0037] (3) The baffle structure of the flow divider can be selected in various forms such as folded, tangential, cotangential, sine or cosine according to actual needs, to adapt to the heat dissipation requirements under different operating conditions. It can be optimized for specific flow rate and pressure drop requirements.

[0038] (4) The porous capillary structure of this application increases the area and path of liquid flow on the surface of the cold plate and the liquid supply, making the phase change heat dissipation technology more efficient and improving the overall performance of the heat sink. Attached Figure Description

[0039] Figure 1 This is an exploded view of the overall structure of the heat sink threaded method according to an embodiment of this application.

[0040] Figure 2 This is a heat sink package diagram of an embodiment of this application.

[0041] Figure 3 This is a schematic diagram of the top surface of the heat dissipation plate in an embodiment of this application.

[0042] Figure 4 This is a schematic diagram of the bottom surface of the heat dissipation plate in an embodiment of this application.

[0043] Figure 5 This is a schematic diagram of the top surface of the diverter in an embodiment of this application.

[0044] Figure 6 This is a schematic diagram of the structure of the bottom surface of the diverter plate in an embodiment of this application.

[0045] Figure 7 This is a schematic diagram of the bottom structure of the cover plate according to an embodiment of this application.

[0046] Figure 8 This is a schematic diagram of the top surface structure of the cover plate according to an embodiment of this application.

[0047] Figure 9 This is a schematic diagram of the top surface structure of the GPU motherboard in an embodiment of this application.

[0048] Figure 10 This is a schematic diagram of the bottom structure of the GPU motherboard in an embodiment of this application.

[0049] Figure 11 This is a schematic diagram of the top surface structure of the base plate in an embodiment of this application.

[0050] Figure 12 This is a schematic diagram of the bottom surface structure of the base plate in an embodiment of this application.

[0051] Figure 13 This is a schematic diagram of the top surface of the first gasket in an embodiment of this application.

[0052] Figure 14 This is a schematic diagram of the structure of the bottom surface of the first gasket in an embodiment of this application.

[0053] Figure 15 This is a schematic diagram of the top surface of the second gasket in an embodiment of this application.

[0054] Figure 16 This is a schematic diagram of the structure of the bottom surface of the second gasket in an embodiment of this application.

[0055] Figure 17 This is a schematic diagram of the structure of the heat sink connector according to an embodiment of this application.

[0056] Figure 18 This is a schematic diagram of the splitting / collecting structure in an embodiment of this application.

[0057] Figure 19 This is a schematic diagram of the capillary structure of the heat dissipation plate of this application.

[0058] Figure 20 This is a cross-sectional view of the overall structure of the heat sink according to an embodiment of this application.

[0059] Figure 21 This is a structural diagram of the radiator connector welding method according to an embodiment of this application.

[0060] The diagram is labeled as follows:

[0061] 1-Cooling plate; 101-Top surface of cooling plate; 102-Bottom surface of cooling plate; 103-Microstructure rib; 15-First countersunk through hole of cooling plate; 16-Second countersunk through hole of cooling plate; 111-Capillary structure of rib; 112-Capillary structure of bottom surface of rib.

[0062] 2-Diverter plate; 21-Diverter cavity; 22-Collector cavity; 23-Diverter channel; 24-Collector channel; 25-Transition zone; 26-Diverter plate countersunk through hole; 27-Diverter plate threaded hole; 28-Diverter plate sealing groove; 29-Heat exchange cavity; 201-Diverter plate top surface; 202-Diverter plate bottom surface.

[0063] 3-Cover plate; 32-Cover plate cavity; 33-Cover plate first screw hole; 34-Cover plate second screw hole; 35-Cover plate sealing groove; 36-Cover plate third threaded hole; 37-Cover plate groove; 38-Rib plate; 39-Ventilation slot; 301-Cover plate top surface; 302-Cover plate bottom surface; 303-Cover plate side surface; 312-Working fluid flow port.

[0064] 4-Radiator connector; 41-Connector structure; 42-Bottom structure.

[0065] 5-First washer.

[0066] 6-Second washer.

[0067] 7-First gasket; 71-Gasket fluid channel; 701-Top surface of first gasket; 702-Bottom surface of first gasket.

[0068] 8-Second gasket; 81-Second gasket through hole; 82-Second gasket threaded through hole; 801-Second gasket top surface; 802-Second gasket bottom surface.

[0069] 9 - First screw.

[0070] 10 - Second screw.

[0071] 11 - Third screw.

[0072] 12-GPU motherboard; 121-Motherboard threaded through hole; 122-Connector card; 123-Peripheral module; 124-GPU core; 1200-Motherboard top surface; 1201-Motherboard bottom surface.

[0073] 13-Base plate; 131-Cylindrical countersunk through hole; 1300-Top surface of base plate; 1301-Bottom surface of base plate.

[0074] 14 - Fourth screw.

[0075] 100 - Heat exchange chamber.

[0076] 230 - shunt cavity.

[0077] 240 - manifold. Detailed Implementation

[0078] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. This embodiment is based on the technical solution of the present invention and provides detailed implementation methods and specific operating procedures; however, the scope of protection of the present invention is not limited to the following embodiments.

[0079] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0080] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0081] In the following embodiments, unless otherwise specified, the functional components or structures are conventional components or structures used in the art to achieve the corresponding functions.

[0082] Example 1

[0083] like Figures 1-2 As shown in Figure 20, a heat sink for a high-power GPU includes: a cover plate 3, a heatsink 2, a heat sink 1, a GPU motherboard 12, a base plate 13, and a heat sink connector 4.

[0084] The cover plate 3 and the heat sink 1 together form a heat dissipation space, within which a heat dissipation plate 2 is installed. The GPU core 124 on the top surface 1200 of the GPU motherboard 12 and the bottom surface 102 of the heat sink are tightly bonded by applying some thermally conductive material. The base plate 13 is located at the bottom of the GPU motherboard 12.

[0085] A pair of working fluid flow ports are provided on one side of the cover plate 3 and connected to the radiator connector 4, which serve as the working fluid inlet and working fluid outlet of the radiator, respectively.

[0086] like Figures 5-6 As shown, the top surface 201 of the flow divider plate is provided with a flow divider cavity 21 communicating with the working fluid inlet, a flow collector cavity 22 communicating with the working fluid outlet, and a heat exchange cavity 29 connecting the flow divider cavity 21 and the flow collector cavity 22. The flow divider cavity 21 is connected to the bottom surface 302 of the cover plate by screws to form a flow divider cavity 230, the flow collector cavity 22 is connected to the bottom surface 302 of the cover plate by screws to form a flow collector cavity 240, and the heat exchange cavity 29 is connected to the top surface 101 of the heat dissipation plate by screws to form a heat exchange cavity 100.

[0087] The heat exchange cavity 29 is provided with a flow distribution channel 23 with its opening direction facing the flow distribution cavity 21 and a flow collection channel 24 with its opening direction facing the flow collection cavity 22. The cooling working fluid flows into the flow distribution cavity 21 through the working fluid inlet, then flows into the heat exchange cavity 29 through the flow distribution channel 23 to exchange heat, then flows into the flow collection cavity 22 through the flow collection channel 24, and finally flows out through the working fluid outlet.

[0088] The cooling medium is selected from one or more mixtures of water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oil, transformer oil, or fluorinated liquids.

[0089] like Figures 3-4 As shown, the heat dissipation plate 1 is provided with microstructure fins 103 that correspond to the flow diversion cavity 21, the heat exchange cavity 29 and the flow collection cavity 22 and are used to enhance heat exchange.

[0090] like Figure 1 , 5As shown in Figures 8, 15, and 17, in one embodiment of this utility model, the bottom surface 302 of the cover plate is provided with a cover plate mounting groove 37 for placing the heat dissipation plate 1 so that the bottom surface 302 of the cover plate and the bottom surface 102 of the heat dissipation plate are on the same plane. The inside of the cover plate mounting groove 37 is provided with a cover plate cavity 32 for supporting the diverter plate 2 and the heat dissipation plate 1.

[0091] The cover plate 3 and the diverter plate 2 are connected by screws. The diverter plate 2 has a countersunk through hole 26, which corresponds to the second threaded hole 35 of the cover plate 3, and is fixedly connected by a third screw 11. A second gasket 8 for sealing is also provided between the diverter plate 2 and the cover plate 3.

[0092] The cover plate 3 and the heat dissipation plate 1 are connected by screws. The bottom surface 302 of the cover plate 3 is provided with a cover plate sealing groove 35 for installing and fixing the first washer 5. The cover plate 3 and the heat dissipation plate 1 are sealed by the first washer 5. The bottom surface 302 of the cover plate is provided with a cover plate first threaded hole 33, which corresponds to the first countersunk through hole 15 of the heat dissipation plate 1. The cover plate 3 and the heat dissipation plate 1 are tightly fixed and connected by the first screw 9.

[0093] The cover plate 3 is connected to the GPU motherboard 12 and the base plate 13 by screws. The third threaded hole 36 on the bottom surface 302 of the cover plate corresponds one-to-one with the threaded through hole 121 on the motherboard and the cylindrical countersunk through hole 132 on the base plate, and is fixed by the fourth screw 14. The third threaded hole 36 on the cover plate and the cylindrical countersunk through hole 132 on the base plate are adapted to the position of the threaded through hole 121 on the motherboard corresponding to the graphics card motherboard model.

[0094] The side of the cover plate 303 is provided with a working fluid flow port 312 for connecting the radiator connector 4.

[0095] like Figure 1 , 13 As shown in Figures 1-14, in one embodiment of this utility model, the assembly between the flow divider 2 and the heat dissipation plate 1 is characterized by: a first gasket 7 for adjusting the assembly gap between the heat exchange cavity 29 and the heat dissipation plate 1, ensuring structural stability. The bottom surface 202 of the flow divider is provided with a flow divider sealing groove 28 for installing and fixing the second washer 6, and sealing is achieved through the second washer 6. The heat dissipation plate 1 is provided with a second countersunk through hole 16, corresponding to the flow divider threaded hole 27 provided on the flow divider 2, and the flow divider 2 and the heat dissipation plate 1 are fixedly connected by a second screw 10.

[0096] like Figure 17 As shown, in one embodiment of this utility model, the radiator connector 4 is provided with a connector structure 41 and a bottom structure 42 for realizing pipeline connection and connector installation respectively. The radiator connector 4 is installed in the working fluid flow port 312 on the side 303 of the cover plate 3 and connected to the cover plate 3 by means of threads. The radiator connector 4 is used to cool the input / output of the working fluid.

[0097] like Figures 9-10 As shown, in one embodiment of this utility model, the GPU motherboard 12 is provided with a motherboard threaded through hole 121, and is fixed between the cover plate 3 and the base plate 13 by a fourth screw 14. The motherboard 12 is provided with a connecting card 122 for insertion into the host's graphics card slot to obtain specific signals. The GPU core 124 on the top surface 1200 of the motherboard and the bottom surface 102 of the heat sink are tightly attached by applying some thermal conductive material. The peripheral module 123 on the top surface 1200 of the motherboard is tightly attached to the bottom surface 302 of the cover plate by applying some thermal conductive material. The GPU core 124 and the peripheral module 123 are changed according to the graphics card motherboard model.

[0098] like Figures 11-12 As shown, in one embodiment of this utility model, the top surface 1300 of the base plate is provided with a cylindrical countersunk through hole 131, which corresponds one-to-one with the motherboard threaded through hole 121 on the bottom surface 1201 of the motherboard, and is installed and fixed to the GPU motherboard 12 and the cover plate 3 by a fourth screw 14.

[0099] like Figure 18 As shown, in one embodiment of the present invention, the diversion channel 23 is composed of several baffles arranged in parallel and spaced apart and connected to the flow collection cavity 22, and the spatial opening formed by two adjacent baffles faces the diversion channel 23; the flow collection channel 24 is composed of several baffles arranged in parallel and spaced apart and connected to the diversion cavity 21, and the spatial opening formed by two adjacent baffles faces the flow collection channel 24.

[0100] The baffle structure includes multi-segment structure, tangent structure, cotangent structure, sine structure, and cosine structure.

[0101] Taking a multi-segment structure as an example, the length of the baffle is divided into L1, L2, and L3. L3 is the side length of the transition zone 25, W1 is half the opening width of the space formed by the two baffles facing the flow channel, W2 is half the closed width formed by the connection of the two baffles, θ1 and θ2 are the bending angles between the three segments of the baffle, and D1 is the width of the baffle. At least one of L1, L2, and L3 is not zero. If W1 and W2 are equal, the side length of the transition zone 25, L3, is 0, and the flow channel is a uniform rectangular structure. If W1 and W2 are not equal and not zero, L1 and L2 are both 0, and the flow channel is a trapezoidal structure. If W2 is 0, the flow channel is a pointed structure. If W2 is 0, and L1 and L2 are both 0, the flow channel is a triangular structure. If all parameters are not zero, and the included angles θ1 and θ2 are right angles, the flow channel is a quasi-convex structure.

[0102] When the baffle structure is designed as a positive / co-tangential structure, E is the distance from the defined baffle centerline (the y-axis in the figure) to the flow channel centerline, L4 is the total length of the flow channel, A is the amplitude of the positive / co-tangential structure, and D2 is the baffle width.

[0103] When the baffle structure is designed as a sine / cosine structure, F is defined as the distance from the baffle centerline (x-axis in the figure) to the flow channel centerline, L5 is the total length of the flow channel, B is the amplitude of the sine / cosine, λ is the wavelength of the sine / cosine, and D3 is the baffle width.

[0104] like Figure 19 As shown, in one embodiment of this utility model, the thickness ratio of the rib capillary structure 111 in the microstructure rib 103 is ≥0; when the thickness ratio of the rib capillary structure 111 in the microstructure rib 103 is 0%, the microstructure rib 103 is a completely solid rib; when the thickness ratio of the rib capillary structure 111 in the microstructure rib 103 is 100%, the microstructure rib 103 is composed of a completely porous capillary structure.

[0105] The heat dissipation plate 1 has a multi-layer capillary structure 112 on the side surface where the microstructure rib 103 is provided. The number of layers of the capillary structure 112 on the bottom surface of the rib is ≥0. When the number of layers of the capillary structure 112 on the bottom surface of the rib is 0, the side surface of the heat dissipation plate 1 where the microstructure rib 103 is provided is a smooth surface.

[0106] Both the rib capillary structure 111 and the rib bottom capillary structure 112 are porous capillary structures. The porous capillary structure is formed by one of the following methods: metal powder sintering, metal wire sintering, or a mixture of metal powder and metal wire sintering.

[0107] The materials of the heat dissipation plate 1, the distribution plate 2, the cover plate 3, the heat sink connector 4, and the base plate 13 are selected from one or more of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, resin, plastic, ceramic, or glass; the first gasket 5 and the second gasket 6 are selected from one or more of rubber, silicone, fluororubber, resin, or plastic; the first gasket 7 and the second gasket 8 are selected from one or more of rubber, silicone, fluororubber, resin, plastic, copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, resin, plastic, ceramic, or glass.

[0108] The basic application principle of the heat sink provided in this embodiment is as follows: the low-temperature cooling medium enters the distribution cavity 21 through the heat sink connector 4 on one side, enters the heat exchange cavity 100 along the distribution channel 23, takes away the heat conducted from the high-temperature chip to the heat sink plate 1, and enters the distribution cavity 22 along the collection channel 24, and finally is discharged to the external circulation pipeline through the heat sink connector 4 on the other side.

[0109] Example 2:

[0110] like Figure 21As shown, the difference between this embodiment and Embodiment 1 is that the radiator connector 4 and the cover plate 3 are connected by welding. All working fluid flow ports 312 are through holes. The radiator connector 4 is selected from one of the following: a standard threaded quick-connect fitting, a pagoda fitting, a quick-stop fitting, or a compression fitting. The purpose of this is that welding achieves a permanent seal, eliminates the risk of leakage, and forms an integrated structure that can withstand higher mechanical stress, improving the overall strength and long-term reliability of the heat dissipation system.

[0111] The above description of the embodiments is provided to enable those skilled in the art to understand and use the utility model. It will be apparent to those skilled in the art that various modifications can be easily made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, the present utility model is not limited to the above embodiments, and any improvements and modifications made by those skilled in the art based on the disclosure of the present utility model without departing from its scope should be within the protection scope of the present utility model.

Claims

1. A heat sink for a high power GPU, characterized by, include: Cover plate (3), splitter plate (2), heat sink (1), and GPU motherboard (12), The cover plate (3) and the heat dissipation plate (1) together form a heat dissipation space, and a diversion plate (2) is provided in the heat dissipation space; A pair of working fluid flow ports (312) are provided on one side of the cover plate (3), which serve as the working fluid inlet and working fluid outlet of the radiator, respectively; The flow divider plate (2) is provided with a flow divider cavity (21) communicating with the working fluid inlet, a flow collecting cavity (22) communicating with the working fluid outlet, and a heat exchange cavity (29) connecting the flow divider cavity (21) and the flow collecting cavity (22). The heat exchange cavity (29) is provided with a flow divider channel (23) with its opening direction facing the flow divider cavity (21) and a flow collecting channel (24) with its opening direction facing the flow collecting cavity (22). After the working fluid flows into the flow divider cavity (21) through the working fluid inlet, it flows into the heat exchange cavity (29) through the flow divider channel (23) to exchange heat, and then flows into the flow collecting cavity (22) through the flow collecting channel (24), and finally flows out through the working fluid outlet. The heat dissipation plate (1) is provided with microstructure fins (103) that correspond to the flow diversion cavity (21), heat exchange cavity (29) and flow collection cavity (22) and are used to enhance heat exchange. The GPU motherboard (12) is provided with a GPU core (124) corresponding to the microstructure rib (103), and the GPU motherboard (12) and the heat sink (1) are tightly attached by applying thermally conductive material.

2. The heat sink for high power GPUs of claim 1, wherein, The diversion channel (23) is composed of several baffles arranged in parallel and spaced apart and connected to the flow collection cavity (22), and the spatial opening formed by two adjacent baffles faces the diversion channel (23); The flow collection channel (24) is composed of several baffles arranged in parallel and spaced apart and connected to the flow diversion cavity (21), and the spatial opening formed by two adjacent baffles faces the flow collection channel (24).

3. The heat sink for high power GPUs of claim 2, wherein, The structure of the baffle includes a multi-segment structure, a tangent structure, a cotangent structure, a sine structure, and a cosine structure; When the baffle is a multi-segment structure, the baffle includes three segments, each with lengths L1, L3, and L2, respectively, and at least one of L1, L2, and L3 is not zero. Half the width of the flow channel opening is defined as W1, and half the width of the closed end of the flow channel is defined as W2. The included angles between two adjacent segments are θ1 and θ2, respectively. When W1 and W2 are equal, L3 is 0, and the flow channel is a uniform rectangular structure. When W1 and W2 are not equal and are not zero, and L1 and L2 are both zero, the flow channel is a trapezoidal structure. When W2 is 0, the flow channel has a pointed nozzle shape. When W2 is 0, and L1 and L2 are both 0, the flow channel has a triangular structure. When all parameters are not zero and the included angles θ1 and θ2 are right angles, the flow channel has a convex-like structure. When the strip structure is a tangential or cotangential structure, the distance from the center line of the strip to the center line of the flow channel is defined as E, the total length of the flow channel is L4, and the amplitude of the tangential or cotangential structure is A. When the block structure is a sine or cosine structure, the distance from the center line of the block to the center line of the flow channel is defined as F, the total length of the flow channel is L5, the amplitude of the sine / cosine is value B, and the wavelength of the sine or cosine is λ.

4. The heat sink for high power GPUs of claim 1, wherein, A second gasket (8) for sealing is also provided between the diverter plate (2) and the cover plate (3).

5. The heat sink for high power GPUs of claim 1, wherein, A first gasket (7) for adjusting the assembly gap is also provided between the heat exchange cavity (29) of the flow divider (2) and the heat dissipation plate (1).

6. The heat sink for high power GPUs of claim 1, wherein, The thickness ratio of the capillary structure (111) in the microstructure rib (103) is ≥0; When the thickness ratio of the capillary structure (111) in the microstructure rib (103) is 0%, the microstructure rib (103) is a completely solid rib. When the thickness ratio of the capillary structure (111) in the microstructure rib (103) is 100%, the microstructure rib (103) is composed of a completely porous capillary structure.

7. The heat sink for high power GPUs of claim 1, wherein, The heat dissipation plate (1) has a multi-layer rib bottom capillary structure (112) on one side surface with microstructure ribs (103), and the number of layers of the rib bottom capillary structure (112) is ≥0. When the number of layers of capillary structure (112) on the bottom surface of the rib is 0, the surface of the heat dissipation plate (1) on the side with microstructure rib (103) is a smooth surface.

8. The heat sink for high power GPUs of claim 1, wherein, The connection between the heat dissipation plate (1) and the cover plate (3) can be a threaded connection, a snap fastener, a riveting, or a welding.

9. The heat sink for high power GPUs of claim 1, wherein, The radiator also includes a pair of radiator connectors (4), which are respectively connected to a pair of working fluid flow ports (312).

10. The heat sink for high power GPUs of claim 1, wherein, The GPU motherboard (12) also has a base plate (13) at the bottom.

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