An optical module based on silicon photonics chips

Abstract

This utility model provides an optical module based on a silicon photonics chip, relating to the field of optical modules. The silicon photonics chip-based optical module includes an external housing. A mounting hole, communicating with the right side, is provided on the left side of the external housing. An optical module body is inserted into the mounting hole. An interface is fixedly connected to the left side of the optical module body, and a wire connection groove is provided at the upper right corner of the optical module body. This silicon photonics chip-based optical module, through the cooperation of a mating groove, an optical module mounting pin structure, a snap-fit ​​groove, a movable groove, a telescopic structure, an optical module mounting clip structure, a through hole, a moving rod, and an auxiliary plate, achieves more convenient optical module installation. It also eliminates concerns about the traditional snap-fit ​​structure breaking and affecting the module's stability. This solves the problem that current silicon photonics chip-based optical modules, due to their snap-fit ​​method, are prone to breakage during installation and disassembly, thus affecting the module's stability.

Description

Technical Field

[0001] This utility model relates to the field of optical module technology, specifically to an optical module based on a silicon photonic chip. Background Technology

[0002] An optical module consists of optoelectronic devices, functional circuits, and optical interfaces. The optoelectronic devices include both transmitting and receiving parts. Simply put, the function of an optical module is to convert electrical signals into optical signals at the transmitting end, transmit them through optical fiber, and then convert the optical signals back into electrical signals at the receiving end. Optical modules are classified according to their packaging form; common types include SFP, SFP+, SFF, and Gigabit Ethernet Interface Converters (GBIC). The transmitting part works by: receiving an electrical signal of a certain bit rate, processing it through an internal driver chip, and then driving a semiconductor laser (LD) or light-emitting diode (LED) to emit a modulated optical signal at a corresponding rate. It also includes an internal automatic optical power control circuit to keep the output optical signal power stable.

[0003] The receiving section consists of an optical signal input module with a certain bit rate, which is then converted into an electrical signal by a photodetector diode. After passing through a preamplifier, it outputs an electrical signal with the corresponding bit rate. The main function of the optical transceiver module is to realize photoelectric / electro-optical conversion, including optical power control, modulation and transmission, signal detection, IV conversion, and limiting amplification decision regeneration functions. In addition, it also has functions such as anti-counterfeiting information query and TX-disable. Common types include SFP, SFF, SFP+, GBIC, XFP, and 1x9.

[0004] In addition to photoelectric conversion, optical repeater modules integrate numerous signal processing functions, such as MUX / DEMUX, CDR, function control, energy acquisition, and monitoring. Common optical repeater modules include 200 / 300-pin, XENPAK, and X2 / XPAK modules.

[0005] An optical transceiver module, also known as an optical module or fiber optic module, is a crucial component in fiber optic communication systems. D / T stands for datacom / telcom. Data communication primarily includes computer video and other data communication applications. Telcom mainly includes wireless voice communication.

[0006] These products are mostly used in the backbone network of fiber optic networks.

[0007] PON stands for Passive Optical Network. These products are primarily used in access networks within fiber optic network systems. Triplex products can transmit fiber optic signals as well as output analog signals. Optical modules are mainly categorized as GBIC, SFP, SFP+, XFP, SFF, and CFP, with optical interface types including SC and LC. However, SFP, SFP+, and XFP are now more commonly used than GBIC. This is because GBIC is bulky and prone to failure, while the commonly used SFP is smaller and cheaper.

[0008] Types: Single-mode optical modules are suitable for long-distance transmission; multi-mode optical modules are suitable for short-distance transmission. Function: Optical modules are used as carriers for transmission between switches and devices. Compared with transceivers, they are more efficient and secure. Optical modules can have built-in silicon photonics chips to increase their performance. Currently, when silicon photonics chip-based optical modules are installed on devices, the snap-fit ​​structure is prone to breakage during disassembly and assembly due to the snap-fit ​​method, which affects the robustness of the optical module. Utility Model Content

[0009] The purpose of this invention is to provide an optical module based on silicon photonics chips, which solves the problem that current optical modules based on silicon photonics chips are prone to breakage during installation and disassembly due to the snap-fit ​​method, thus affecting the robustness of the optical module.

[0010] Technical solution

[0011] To achieve the above objectives, this utility model provides the following technical solution: an optical module based on a silicon photonics chip, comprising an external housing, a mounting hole on the left side of the external housing communicating with the right side, an optical module body inserted into the mounting hole, an interface fixedly connected to the left side of the optical module body, a wire connection groove on the upper right corner of the optical module body, an optical module mounting clamp structure fixedly connected to the surface of the optical module body, a mating groove on the right side of the external housing, an optical module mounting pin structure inserted into the mating groove, the right end of the optical module mounting pin structure being fixedly connected to the left side of the optical module mounting clamp structure, and the optical module mounting... The upper surface of the plug-in structure has a snap-fit ​​groove, and an optical module mounting block structure snaps into the inside of the snap-fit ​​groove. The inner top wall of the docking groove has a movable groove, and the inner top wall of the movable groove is fixedly connected to a telescopic structure. The bottom end of the telescopic structure is fixedly connected to the upper surface of the optical module mounting block structure. When the auxiliary plate is pulled upward, the auxiliary plate moves the optical module mounting block structure into the movable groove via the moving rod. Then, the optical module body is snapped into the mounting hole, so that the left side of the optical module mounting fixing hoop structure contacts the right side of the outer shell of the equipment. Then, the auxiliary plate is released, and the telescopic structure pushes the optical module mounting block structure to move and snap into the snap-fit ​​groove, thereby completing the installation of the optical module body.

[0012] Furthermore, the surface of the optical module mounting block structure is movably connected to the interior of the movable slot.

[0013] Furthermore, the right side of the outer casing of the device is provided with a through hole that communicates with the interior of the movable groove, and a movable rod is movably connected inside the through hole.

[0014] Furthermore, an auxiliary plate is fixedly connected to the right end of the movable rod, and the left side of the auxiliary plate overlaps with the right side of the outer casing of the equipment.

[0015] Furthermore, the left end of the movable rod is fixedly connected to the right side of the optical module mounting block structure.

[0016] Furthermore, the optical module mounting pin structure has two components, which are symmetrically arranged about the central axis of the optical module body.

[0017] This invention provides an optical module based on a silicon photonics chip. It has the following advantages:

[0018] This silicon photonics chip-based optical module achieves more convenient installation through the cooperation of docking slots, optical module mounting pin structures, snap-fit ​​slots, movable slots, telescopic structures, optical module mounting block structures, through holes, moving rods, and auxiliary boards. At the same time, it eliminates concerns about the traditional snap-fit ​​structure breaking and affecting the optical module's robustness. This solves the problem that currently, when installing silicon photonics chip-based optical modules on equipment, the snap-fit ​​structure is prone to breakage during disassembly and assembly, thus affecting the optical module's robustness. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of this utility model;

[0020] Figure 2 This utility model Figure 1 Enlarged view of the local structure at point A in the middle.

[0021] The components include: 1. External protective shell of the equipment; 2. Mounting hole; 3. Optical module body; 4. Interface; 5. Optical module mounting and fixing hoop structure; 6. Wire connection groove; 7. Docking groove; 8. Optical module mounting plug-in structure; 9. Clip groove; 10. Movable groove; 11. Telescopic structure; 12. Optical module mounting clip structure; 13. Through hole; 14. Moving rod; 15. Auxiliary plate. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0024] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] like Figure 1-2 As shown, this utility model provides an optical module based on a silicon photonic chip, including an outer casing 1. The outer casing 1 has a mounting hole 2 on its left side that communicates with the right side. An optical module body 3 is inserted into the mounting hole 2. An interface 4 is fixedly connected to the left side of the optical module body 3. A wire connection groove 6 is provided in the upper right corner of the optical module body 3.

[0027] In the first embodiment of this utility model, an optical module mounting and fixing hoop structure 5 is fixedly connected to the surface of the optical module body 3. A docking groove 7 is provided on the right side of the outer shell 1 of the equipment. An optical module mounting plug-in structure 8 is inserted into the inside of the docking groove 7. There are two optical module mounting plug-in structures 8, which are symmetrically arranged about the central axis of the optical module body 3. The right end of the optical module mounting plug-in structure 8 is fixedly connected to the left side of the optical module mounting fixing hoop structure 5. A snap-fit ​​groove 9 is provided on the upper surface of the optical module mounting plug-in structure 8. An optical module mounting snap-fit ​​block structure 12 is snapped into the inside of the snap-fit ​​groove 9. The surface of the optical module mounting snap-fit ​​block structure 12 is movably connected to the inside of the movable groove 10. A through hole 13 communicating with the inside of the movable groove 10 is provided on the right side of the outer shell 1 of the equipment.

[0028] In the second embodiment of this utility model, a movable rod 14 is movably connected inside the through hole 13. An auxiliary plate 15 is fixedly connected to the right end of the movable rod 14. The left side of the auxiliary plate 15 overlaps with the right side of the outer shell 1 of the equipment. The left end of the movable rod 14 is fixedly connected to the right side of the optical module mounting block structure 12. A movable groove 10 is provided on the inner top wall of the docking groove 7. A telescopic structure 11 is fixedly connected to the inner top wall of the movable groove 10. The bottom end of the telescopic structure 11 is fixedly connected to the upper surface of the optical module mounting block structure 12.

[0029] Working principle: Pull the auxiliary plate 15 upward, and the auxiliary plate 15 drives the optical module mounting block structure 12 to enter the movable slot 10 via the moving rod 14. Then, the optical module body 3 is inserted into the mounting hole 2, so that the left side of the optical module mounting fixing hoop structure 5 contacts the right side of the outer shell 1 of the equipment. Then, the auxiliary plate 15 is released. At this time, the telescopic structure 11 pushes the optical module mounting block structure 12 to move and insert it into the snap-fit ​​slot 9, thereby completing the installation of the optical module body 3.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A silicon photonic chip based optical module comprising an off-device housing (1), characterized in that: The outer casing (1) of the device has a mounting hole (2) on the left side that communicates with the right side. The optical module body (3) is inserted into the mounting hole (2). An interface (4) is fixedly connected to the left side of the optical module body (3). A wire connection groove (6) is opened at the upper right corner of the optical module body (3). An optical module mounting clamp structure (5) is fixedly connected to the surface of the optical module body (3). A docking groove (7) is opened on the right side of the outer casing (1). An optical module mounting pin structure is inserted into the docking groove (7). 8) The right end of the optical module mounting plug structure (8) is fixedly connected to the left side of the optical module mounting fixing hoop structure (5). The upper surface of the optical module mounting plug structure (8) is provided with a snap-fit ​​groove (9). The optical module mounting clip structure (12) is snapped into the inside of the snap-fit ​​groove (9). The inner top wall of the docking groove (7) is provided with a movable groove (10). The inner top wall of the movable groove (10) is fixedly connected with a telescopic structure (11). The bottom end of the telescopic structure (11) is fixedly connected to the upper surface of the optical module mounting clip structure (12).

2. The silicon photonic chip based optical module of claim 1, wherein: The surface of the optical module mounting block structure (12) is movably connected to the interior of the movable slot (10).

3. The silicon photonic chip based optical module of claim 1, wherein: The outer casing (1) of the device has a through hole (13) on the right side that communicates with the interior of the movable groove (10), and a movable rod (14) is movably connected inside the through hole (13).

4. The silicon photonic chip based optical module of claim 3, wherein: An auxiliary plate (15) is fixedly connected to the right end of the moving rod (14), and the left side of the auxiliary plate (15) overlaps with the right side of the outer casing (1) of the equipment.

5. The silicon photonic chip based optical module of claim 3, wherein: The left end of the movable rod (14) is fixedly connected to the right side of the optical module mounting block structure (12).

6. The silicon photonic chip based optical module of claim 1, wherein: The number of optical module mounting pin structures (8) is two, and the two optical module mounting pin structures (8) are symmetrically arranged around the central axis of the optical module body (3).

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