Server chassis and servers

Abstract

This application discloses a server chassis and server, relating to the field of server technology. The server chassis includes: a first end and a second end disposed opposite to each other; a fan area configured to house a fan, located at the second end; an I / O component area and a computing area, the I / O component area and the computing area being located at the first end and stacked; the I / O component area being configured to house I / O components; the computing area being configured to house computing components; and a power supply configuration area configured to supply power to the fan area, the I / O component area, and the computing area; the orthographic projection of the power supply configuration area on the end face of the second end is outside the range of the orthographic projection of the fan area on the end face of the second end. This application solves the problem in related technologies where the unreasonable layout of the power supply configuration area and the fan heat dissipation area in high-density servers affects heat dissipation performance.

Description

Technical Field

[0001] This application relates to the field of server technology, and in particular to a server chassis and a server. Background Technology

[0002] Currently, in high-density server systems, the power supply module, as a critical power supply unit, directly impacts the overall thermal management efficiency, space utilization, and operational reliability through its layout and coordinated design with the cooling system. In existing technologies, the power configuration area (for installing 54V / 12V power modules, busbars, connectors, and cables) and the fan cooling area (for installing axial or centrifugal fans) are typically located at the rear of the chassis. However, their spatial arrangement often suffers from unreasonable placement, resulting in poor heat dissipation in the fan cooling area and consequently affecting the lifespan of high-density servers. Utility Model Content

[0003] This application provides a server chassis and server to at least solve the problem in the related art where the unreasonable layout of the power supply configuration area and fan heat dissipation area of ​​high-density servers affects the heat dissipation effect.

[0004] This application provides a server chassis, including: a first end and a second end disposed opposite to each other; a fan area configured to house a fan, the fan area being located at the second end; an I / O component area and a computing area, the I / O component area and the computing area being located at the first end and stacked; the I / O component area being configured to house I / O components; the computing area being configured to house computing components; and a power configuration area being configured to supply power to the fan area, the I / O component area, and the computing area; the orthographic projection of the power configuration area on the end face of the second end is located outside the range of the orthographic projection of the fan area on the end face of the second end.

[0005] Furthermore, the server chassis includes: a first sidewall and a second sidewall disposed opposite to each other, the first sidewall and the second sidewall being arranged along a first direction; a substrate, the substrate being connected to the first sidewall and the substrate being connected to the second sidewall, so as to form a U-shaped structure around the first sidewall and the second sidewall; a power supply configuration area located between the fan area and the substrate; wherein the direction from the first end to the second end is set at an angle to the first direction.

[0006] Furthermore, the power configuration area includes a first power input area, a second power input area, and a third power input area arranged sequentially along a first direction. The first power input area is configured to be electrically connected to a first power supply module that supplies power to the fan area, and the second and third power input areas are both configured to be electrically connected to a second power supply module that supplies power to the I / O component area and the computing area.

[0007] Furthermore, both the second power input area and the third power input area include multiple sub-input areas. The first power input area and the multiple sub-input areas are arranged in an array to form an array structure. The horizontal direction of the array structure is the first direction, and the vertical direction of the array structure is the second direction. The second direction is set at an angle to the first direction, and the direction from the first end to the second end is set at an angle to the second direction.

[0008] Furthermore, there is a first spacing D1 between the boundary of the second power input region near the third power input region and the boundary of the third power input region near the second power input region. In any two adjacent sub-input regions in the first direction, there is a distance d between the boundary of the first sub-input region near the second sub-input region and the boundary of the second sub-input region near the first sub-input region, and the first spacing D1 is greater than or equal to the distance d.

[0009] Furthermore, there is a first gap D1 between the boundary of the second power input region near the third power input region and the boundary of the third power input region near the second power input region, and there is a second gap D2 between the boundary of the first power input region near the second power input region and the boundary of the second power input region near the first power input region, and the second gap D2 is equal to the first gap D1.

[0010] Furthermore, the server chassis has a mounting surface located at the second end. The first power input area, the second power input area, and the third power input area are all disposed on the mounting surface. A heat dissipation part is also disposed on the mounting surface, and the heat dissipation part is located within the array structure.

[0011] Furthermore, the heat dissipation section includes at least one of a first heat dissipation section, a second heat dissipation section, and a third heat dissipation section, wherein the first heat dissipation section is located at least one of the first power input region and the second power input region, and the second power input region and the third power input region; the second heat dissipation section is located between at least two adjacent sub-input regions in a first direction; and the third heat dissipation section is located between at least two adjacent sub-input regions in a second direction.

[0012] Furthermore, the first heat dissipation part includes a plurality of first heat dissipation holes spaced apart along a first direction and / or a second direction; and / or, the second heat dissipation part includes a plurality of second heat dissipation holes spaced apart along a first direction and / or a second direction; and / or, the third heat dissipation part includes a plurality of third heat dissipation holes spaced apart along a first direction and / or a second direction.

[0013] Furthermore, the server chassis includes: a power supply module located within the power configuration area, the power supply module including a power supply chassis and a power board disposed within the power supply chassis, the power supply chassis having a mounting surface; and a backplane located between the I / O component area and the fan area, the power supply module supplying power to the fan area and the computing area through the backplane.

[0014] Furthermore, the power supply chassis includes a body and a cover plate. The body includes a base plate and a surrounding plate disposed on the base plate, and the cover plate is detachably disposed on the surrounding plate.

[0015] Furthermore, the body has a first engaging portion and a mating recess, and the cover plate includes: a cover plate body having a second engaging portion and a mounting portion; a locking structure including a locking portion, the locking portion being retractably disposed within the mounting portion; the locking structure having a locked state in which at least a portion of the locking portion extends into the mating recess, and an unlocked state in which the locking portion is withdrawn from the mating recess; wherein, one of the first engaging portion and the second engaging portion is a protrusion, and the other of the first engaging portion and the second engaging portion is a recess, the protrusion extending into the recess to limit and stop with the recess.

[0016] Furthermore, the server chassis also includes a shielding structure covering the power board. The shielding structure includes a shielding body and cable management clips. The cable management clips are disposed on the surface of the shielding body opposite to the power board for clamping cable bundles.

[0017] Furthermore, the shielding body has a plurality of fourth heat dissipation holes, which are spaced apart along the first direction and / or the second direction.

[0018] This application also provides a server, including the server chassis described above.

[0019] By applying the technical solution of this application, the fan area is arranged at the second end of the server chassis. Along the projection direction from the first end to the second end, the orthographic projection of the power configuration area on the end face of the second end is outside the range of the orthographic projection of the fan area on the end face of the second end. By physically isolating the power configuration area and the fan area in space, the power configuration area does not block the air inlet of the fan area, forming a unidirectional and undisturbed airflow channel from the first end to the second end. This achieves the purpose of avoiding the direct intake of hot exhaust gas from the power module by the fan and preventing the superposition of heat backflow and local temperature rise, thereby improving the cooling efficiency of the fan area and solving the problem of unreasonable layout of the power configuration area and fan heat dissipation area in high-density servers in related technologies, which affects the heat dissipation effect. Attached Figure Description

[0020] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 An exploded view of a server chassis provided in an embodiment of this application;

[0022] Figure 2 for Figure 1 A three-dimensional structural diagram of the server chassis cover.

[0023] Figure 3 for Figure 1 A 3D structural diagram of the power supply chassis of the server chassis;

[0024] Figure 4 for Figure 1 A three-dimensional structural diagram of the shielding structure of the server chassis;

[0025] Figure 5 for Figure 1 Rear view of the server chassis and fan module after assembly;

[0026] Figure 6 A partial three-dimensional structural diagram of the server provided in an embodiment of this application;

[0027] Figure 7 A side view of a server chassis provided in an embodiment of this application;

[0028] Figure 8 The rear view of the server chassis provided in Embodiment 1 of this application;

[0029] Figure 9 This is a rear view of the server chassis provided in Embodiment 3 of this application;

[0030] Figure 10 This is a rear view of the server chassis provided in Embodiment 4 of this application;

[0031] Figure 11 This is a rear view of the server chassis provided in Embodiment 5 of this application;

[0032] Figure 12 This is a rear view of the server chassis provided in Embodiment Six of this application;

[0033] Figure 13 This is a rear view of the server chassis provided in Embodiment 7 of this application;

[0034] Figure 14 This is a rear view of the server chassis provided in Embodiment 8 of this application;

[0035] Figure 15 This is a rear view of the server chassis provided in Embodiment 9 of this application.

[0036] The above figures include the following reference numerals:

[0037] 10. Main body; 11. Fan area; 111. First power input area; 112. Second power input area; 113. Third power input area; 114. First heat dissipation unit; 1141. First heat dissipation hole; 115. Second heat dissipation unit; 1151. Second heat dissipation hole; 116. Third heat dissipation unit; 1161. Third heat dissipation hole; 117. Exhaust unit; 12. First snap-fit ​​part; 13. Mating recess; 14. Handle; 17. Base plate;

[0038] 20. Cover plate; 21. Cover plate body; 211. Second snap-fit ​​part; 22. Locking structure; 23. Fastener; 24. Anti-slip pad;

[0039] 30. First power supply module;

[0040] 41. Sub-input area;

[0041] 50. Power supply board; 52. Busbar;

[0042] 60. Shielding structure; 61. Shielding body; 611. Fourth heat dissipation hole; 62. Cable clip; 63. Clearance hole;

[0043] 70. Back panel; 71. Power connector;

[0044] 80. Cable clips;

[0045] 90. Fan;

[0046] 100. Power supply module. Detailed Implementation

[0047] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0048] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0049] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0050] To address the problem of inefficient heat dissipation caused by the unreasonable layout of the power supply configuration area and fan cooling area in high-density servers in related technologies, this application provides a server chassis and a server.

[0051] like Figures 1 to 5As shown, the server chassis includes a first end and a second end, a fan area 11, an I / O component area, a computing area, and a power configuration area, all positioned opposite each other. The fan area 11 is configured to house a fan 90 and is located at the second end. The I / O component area and the computing area are located at the first end and stacked; the I / O component area is configured to house I / O components; the computing area is configured to house computing units. The power configuration area is configured to supply power to the fan area 11, the I / O component area, and the computing area. The orthographic projection of the power configuration area onto the end face of the second end is outside the range of the orthographic projection of the fan area 11 onto the end face of the second end.

[0052] Applying the technical solution of this embodiment, the fan area 11 is arranged at the second end of the server chassis. Along the projection direction from the first end to the second end, the orthographic projection of the power configuration area on the end face of the second end is outside the range of the orthographic projection of the fan area 11 on the end face of the second end. By physically isolating the power configuration area and the fan area 11 in space, the power configuration area does not block the air inlet of the fan area 11, forming a unidirectional and interference-free airflow channel from the first end to the second end. This achieves the purpose of avoiding the direct intake of hot exhaust gas from the power module by the fan and preventing the superposition of heat backflow and local temperature rise, thereby improving the cooling efficiency of the fan area 11 and solving the problem of unreasonable layout of the power configuration area and fan heat dissipation area in high-density servers in related technologies, which affects the heat dissipation effect.

[0053] It should be noted that the orthographic projection of the power configuration area on the end face of the second end is along the projection direction from the first end to the second end.

[0054] In this embodiment, the server chassis includes a first sidewall and a second sidewall disposed opposite to each other, and a substrate 17. The first sidewall and the second sidewall are arranged along a first direction. The substrate 17 is connected to the first sidewall and the second sidewall to form a U-shaped structure around the first sidewall and the second sidewall; the power configuration area is located between the fan area and the substrate 17; wherein the direction from the first end to the second end is set at an angle to the first direction. In this way, the first sidewall and the second sidewall of the server chassis are arranged parallel to each other along the first direction, and the substrate 17 is used to connect them at their ends to form a closed U-shaped structure, so that the power configuration area is located in the middle sandwich area between the fan area 11 and the substrate 17, and the air intake / exhaust direction (from the first end to the second end) of the server chassis is set at a non-parallel angle to the first direction, thereby realizing the coordinated guidance of heat flow path and structural geometry, achieving the purpose of avoiding the power module directly blocking the main airflow channel, reducing wind resistance, and improving airflow uniformity, thereby improving the heat dissipation efficiency of the server chassis.

[0055] In this embodiment, the substrate 17 connects the first sidewall and the second sidewall to form a U-shaped frame structure, and the power configuration area is arranged in the bottom area of ​​the U-shaped structure and located between the fan area and the substrate 17. At the same time, the main airflow direction of the server (from the first end to the second end) is at a non-zero angle with the arrangement direction of the first sidewall and the second sidewall (the first direction) to ensure that the air intake direction of the fan area and the power configuration area are arranged in an oblique penetrating layout, thereby realizing the spatial misalignment of the heat source and the cold source and the reconstruction of the airflow direction.

[0056] like Figure 1 As shown, the power configuration area includes a first power input area 111, a second power input area 112, and a third power input area 113 arranged sequentially along a first direction. The first power input area 111 is configured to be electrically connected to a first power supply module 30 that supplies power to the fan area 11. The second power input area 112 and the third power input area 113 are both configured to be electrically connected to a second power supply module that supplies power to the I / O component area and the computing area. Optionally, the supply voltage of the first power supply module 30 is lower than the supply voltage of the second power supply module. In this way, a first power input area 111, a second power input area 112, and a third power input area 113 are sequentially arranged along the first direction. The first power supply module 30 is located in the first power input area 111, supplying power to the motherboard at a lower voltage; the second power supply module is located in the second power input area 112 and the third power input area 113, supplying power to the computing devices at a higher voltage. This ensures that components with different voltage requirements can independently and stably receive the required power, improving the reliability of the entire system. It solves the problem in related technologies where server power supply designs using a single voltage output cannot meet user needs, achieving efficient space utilization and flexible configuration, and realizing the technical effect of independent high and low voltage power supply. By rationally planning the power input areas of the power supply modules, the maintenance and replacement of the power supply modules become simpler and faster, effectively improving operational efficiency and meeting the requirements of high stability and easy maintenance of power supply chassis in data centers and enterprise-level computing environments.

[0057] In this embodiment, the fan area 11 has an exhaust section 117, which includes a plurality of fans 90. The power configuration area avoids the fans 90, thereby improving the heat dissipation efficiency of the fans 90.

[0058] It should be noted that the power configuration area in this embodiment includes not only the first power input area 111, the second power input area 112 and the third power input area 113, but also a PSU (Power Supply Unit). The PSU includes a first power supply module 30 and a second power supply module. The first power supply module 30 supplies power to the motherboard and the second power supply module supplies power to the computing device.

[0059] In this embodiment, there are two second power supply modules: one second power supply module is disposed on the second power input area 112 and the other second power supply module is disposed on the third power input area 113.

[0060] In this embodiment, the first power supply module 30 is a 12V power supply module, and the second power supply module is a 54V power supply module. The power output from the 54V power supply module supplies power to devices that actually require 54VDC, such as graphics processor modules, through the power supply board 50 and the backplane 70. The 54V power connector is connected board-to-board with the DC connector on the power supply board 50. After the 54V power on the power supply board 50 is converged, it connects to the Clip connector on the backplane 70 through the busbar 52 on the power supply board 50. The busbar-clip connector between the power supply board 50 and the backplane 70 supports hot-swapping. The power output from the 12V power supply module supplies power to devices that actually require 12VDC, such as motherboards, switching circuit boards, and fan components, through the backplane 70. The 12V power supply module is connected to the backplane 70 via a direct plug-in connection.

[0061] In other embodiments not shown in the accompanying drawings, the second power supply module is only located on the second power input area 112, and the second power supply module supplies power to the computing device.

[0062] In other embodiments not shown in the accompanying drawings, the second power supply module is only located in the third power input area 113, and the second power supply module supplies power to the computing device.

[0063] Optionally, both the second power input area 112 and the third power input area 113 include multiple sub-input areas 41. The first power input area 111 and the multiple sub-input areas 41 are arranged in an array to form an array structure. The horizontal direction of the array structure is the first direction, and the vertical direction of the array structure is the second direction. The second direction forms an angle with the first direction, and the direction from the first end to the second end forms an angle with the second direction. This arrangement allows for more flexible selection of the number of sub-input areas 41 to meet different usage requirements and operating conditions.

[0064] In this embodiment, the array structure has two rows.

[0065] It should be noted that the number of columns in the array structure is defined along the horizontal direction, and the number of rows in the array structure is defined along the vertical direction.

[0066] In this embodiment, a first spacing D1 exists between the boundary of the second power input region 112 near the third power input region 113 and the boundary of the third power input region 113 near the second power input region 112. Within any two adjacent sub-input regions 41 in the first direction, a distance d exists between the boundary of the first sub-input region 41 near the second sub-input region 41 and the boundary of the second sub-input region 41 near the first sub-input region 41, and the first spacing D1 is greater than or equal to the distance d. This uniform distribution of multiple sub-input regions 41 not only helps to disperse heat and avoid localized overheating, but also provides a higher level of redundancy by increasing the number of sub-input regions 41. Even if one sub-input region 41 fails, the remaining sub-input regions 41 can continue to operate, significantly improving the service quality and operational efficiency of the data center. Simultaneously, the consistent spacing design simplifies the installation and maintenance process of the second power module, improving operational convenience and safety.

[0067] It should be noted that the boundary of the sub-input region 41 near the boundary of the second power input region 112 coincides with the boundary of the second power input region 112, and the boundary of the sub-input region 41 near the boundary of the third power input region 113 coincides with the boundary of the third power input region 113.

[0068] Optionally, the boundary of the second power input region 112 near the third power input region 113 and the boundary of the third power input region 113 near the second power input region 112 have a first spacing D1, and the boundary of the first power input region 111 near the second power input region 112 and the boundary of the second power input region 112 near the first power input region 111 have a second spacing D2, the second spacing D2 being equal to the first spacing D1. In this way, the first power input area 111, the second power input area 112, and the third power input area 113 are arranged linearly and equidistantly along the first direction, and the first spacing D1 between the second power input area 112 and the third power input area 113 is equal to the second spacing D2 between the first power input area 111 and the second power input area 112. This achieves a uniform distribution of the three sets of power input interfaces in the physical layout, eliminates the differences in cable bending radii and stress concentration caused by uneven spacing, and ensures that all power cables are connected to the chassis with the same direction, tension, and routing path. This achieves the technical effects of neat power cable wiring, no interference, no tensile stress, reduced electromagnetic crosstalk by more than 20%, and improved consistency of plugging and unplugging operations.

[0069] In this embodiment, maintaining consistent spacing between power input areas simplifies the manufacturing and maintenance process of the server chassis. This allows all power supply modules to use the same sized mounting interfaces and cooling strategies, reducing production and design costs. Simultaneously, consistent spacing optimizes airflow within the chassis, resulting in more even distribution of hot and cold air, improving heat dissipation efficiency, reducing the risk of localized overheating, effectively enhancing system reliability and ease of operation for maintenance personnel. Furthermore, it ensures optimal thermal management within the chassis, extending equipment lifespan and reducing energy consumption.

[0070] Optionally, the server chassis includes a power supply module 100 and a backplane 70. The power supply module 100 is located within the power configuration area and includes a power supply chassis and a power board 50 disposed within the chassis. The power supply chassis has a mounting surface. The backplane 70 is located between the I / O component area and the fan area 11, and the power supply module 100 supplies power to the fan area 11 and the computing area through the backplane 70. In this way, the power supply module 100 is centrally located in the power configuration area, and an electrical connection is established between its internal power board 50 and the middle backplate 70 located between the IO component area and the fan area 11. This prevents the power supply module 100 from directly connecting to the computing area or the fan area. Instead, the middle backplate 70 serves as a unified power supply hub. By distributing the power output energy to the front-end computing module and the rear-end fan module through high-current traces, busbar connectors, and backplate sockets on the middle backplate 70, the long-distance, multi-branch direct connection cables between the power supply module and each load module are eliminated, and the power supply path impedance and voltage drop are reduced. This improves the consistency of fan power supply and increases the overall power supply efficiency.

[0071] In this embodiment, by placing the backplane 70 in the middle position between the IO component area and the fan area 11 and using it as an independent power supply relay platform, the power board 50 of the power module 100 can achieve lateral blind-plug electrical connection with the backplane 70 through its mounting surface. By constructing a three-level topology structure of "power module, backplane, and load module", centralized management, electrical isolation, and module decoupling of the power supply path are achieved. This achieves the goal of allowing the power module to be independently hot-swapped without affecting the continuous operation of the computing area or fan area, the backplane uniformly undertaking the distribution of high current loads and overcurrent protection, and the independent measurability of the power supply electrical characteristics of each functional area.

[0072] like Figure 1As shown, the power supply chassis includes a body 10 and a cover 20. The body 10 includes a base plate and a surrounding plate disposed on the base plate. The cover 20 is detachably mounted on the surrounding plate. Thus, the power supply chassis structure is divided into a body 10 integrally formed from the base plate and the surrounding plate, and a detachable cover 20. The cover 20 is detachably attached to the top of the surrounding plate via mechanical fastening or screw connection. This allows for the removal of all critical components (such as the power board 50, busbar, connectors, etc.) during assembly and maintenance without disassembling the entire chassis; simply opening the cover exposes all key components. This significantly reduces the maintenance complexity and labor costs of the power supply module, and avoids cable pulling and structural deformation.

[0073] In this embodiment, a modular box structure with "three-sided fixed + top open" is constructed by using the base plate as the structural reference bearing surface, the surrounding plate as the vertical sidewall to form a closed cavity, and the cover plate 20 as the top removable protective layer. This allows the cover plate 20 to be opened and closed quickly without damaging the internal wiring or disturbing the installation and positioning of the base plate. At the same time, the rigid connection between the surrounding plate and the base plate ensures the overall structural strength and electromagnetic shielding continuity, achieving the multiple design goals of dust prevention, heat dissipation, shielding and maintainability of the equipment.

[0074] like Figure 2 and Figure 3 As shown, the body 10 has a first latching portion 12 and a mating recess 13. The cover plate 20 includes a cover plate body 21, a locking structure 22, and a fastener 23. The cover plate body 21 has a second latching portion 211 and a mounting portion. The locking structure 22 includes a locking portion that is retractably disposed within the mounting portion. The locking structure 22 has a locked state in which at least a portion of the locking portion extends into the mating recess 13, and an unlocked state in which the locking portion is withdrawn from the mating recess 13. The fastener 23 passes through the cover plate body 21 to connect the chassis body 10 and the cover plate body 21 by tightening the fastener 23 onto the chassis body 10. One of the first latching portion 12 and the second latching portion 211 is a protrusion, and the other is a recess. The protrusion extends into the recess to limit and stop the movement of the recess. In this way, the combination of quick-lock snap-fit ​​technology and elastic locking mechanism makes the connection and separation of the cover plate 20 and the chassis body 10 quick and easy, without the need for additional tools or lengthy adjustments, significantly reducing maintenance and upgrade time. At the same time, the stop design between the first snap-fit ​​part 12 and the second snap-fit ​​part 211, with a protrusion extending into the recess, ensures a secure connection between the cover plate and the chassis, maintaining stable structural integrity even under high-frequency vibration or impact environments, reducing the probability of equipment failure due to improper connection.

[0075] In this embodiment, the switching between the unlocked and locked states of the locking structure 22 is simple and can be completed with just a simple manual operation, greatly reducing the difficulty of maintenance. Thus, the cover plate 20 and the chassis body 10 are connected by a dual method of snap-fit ​​and fastener 23, further improving the stability of their connection.

[0076] like Figure 2 As shown, the cover plate 20 also includes an anti-slip pad 24. The anti-slip pad 24 is disposed on the surface of the cover plate body 21 facing the body 10.

[0077] like Figure 3 As shown, the power supply chassis also includes a handle 14. The handle 14 is rotatably mounted on the main body 10, allowing operators to operate the main body 10 via the handle 14.

[0078] like Figure 1 and Figure 4 As shown, the server chassis also includes a shielding structure 60, which covers the power board 50. The shielding structure 60 includes a shielding body 61 and cable management clips 62. The cable management clips 62 are disposed on the surface of the shielding body 61 facing away from the power board 50 for clamping cable bundles. The shielding body 61 has multiple fourth ventilation holes 611 facing the rear window, spaced apart along the length and / or height of the shielding body 61. This significantly improves cable management inside the power supply chassis, preventing tangled cable bundles, reducing signal interference and short-circuit risks caused by messy wiring, and enhancing the internal cleanliness and operational safety of the power supply chassis. Simultaneously, the clever layout of the fourth ventilation holes 611 utilizes the physical location of the shielding structure 60 to form a heat flow channel from the shielding body 61 towards the rear window, effectively promoting heat dissipation from the power board 50 while preventing direct impact of heat sources on other sensitive electronic components, achieving effective isolation of local heat sources and improving overall heat dissipation efficiency.

[0079] like Figure 4 As shown, the shielding structure 60 has a clearance hole 63 for clearing the busbar 52.

[0080] like Figure 6 As shown, the server chassis also includes cable clips 80. The cable clips 80 are located in the first power input area 111, the second power input area 112, and the third power input area 113 to limit the cable.

[0081] In this embodiment, the shielding structure 60 serves as a protective layer, not only preventing dust and other impurities from entering the power board 50 area and protecting the internal circuitry, but also preventing accidental contact with the power board during external operations, reducing the possibility of physical damage and indirectly extending the lifespan of the internal components of the power supply chassis. Simultaneously, by integrating shielding and cable management functions into the shielding body 61, the modularity of the server chassis is enhanced. The independent design and detachability of the shielding structure 60 make maintenance or replacement of the power board 50 more flexible, eliminating the need to disassemble the entire power supply chassis and further saving maintenance costs and time.

[0082] In this embodiment, through the plug-in design of the backplane 70, power board 50, and first power supply module 30, the power supply equipment possesses a high degree of modularity. This allows for easy adjustment and expansion of power configurations according to different server needs. Whether increasing power capacity or changing the type of power module, this can be achieved quickly, improving the overall system's flexibility and adaptability to diverse application scenarios. Simultaneously, the backplane 70, acting as a bridge between the server chassis and the server motherboard, can intelligently coordinate power distribution and scheduling, thereby dynamically responding to server load changes, optimizing power supply, and reducing energy waste.

[0083] Specifically, after multiple DC currents converge on the power board 50, they are connected to the Clip connector on the middle backplate 70 via the busbar 52 on the power board 50. The Clip connector is an electronic connection device that uses a spring contact or snap-lock structure. The mating connectors on the power board 50 and the middle backplate 70 support hot-plugging.

[0084] like Figure 6 As shown, a power connector 71 is provided on the back panel 70, which is used for electrical connection with at least part of the power module 100.

[0085] like Figure 7 As shown, this application also provides a server, including the server chassis described above.

[0086] In this embodiment, the server also includes a signal board (MBP), a processing device (CPU BOX), a computing device (GPU BOX), and a power distribution device (PD).

[0087] Optionally, the signal board MBP extends vertically within the server, but this embodiment is not limited to this. In some embodiments, the signal board MBP may also extend horizontally orthogonal to the vertical direction. Thus, the signal board MBP can divide the internal space of the server into a first region and a second region. The signal board MBP has a first surface and a second surface facing away from each other, and these first and second surfaces may also extend vertically. The first surface of the signal board MBP faces the first region. The second surface of the signal board MBP faces the second region. The first and second surfaces of the signal board MBP are each provided with multiple interfaces for electrical connection to other devices within the server via pins in the interfaces, such as a CPU box, a GPU box, a heat dissipation box, a power distribution device (PD), and a power supply device.

[0088] Optionally, the processing unit CPU BOX is located in the first area. The processing unit CPU BOX includes a server motherboard and a switch board. The server motherboard houses components such as a central processing unit. For example, the processing unit CPU BOX may be box-shaped to house the server motherboard and switch board. The computing unit GPU BOX may also be located in the first area. The computing unit GPU BOX includes components such as a graphics processing unit. Similarly, the computing unit GPU BOX may also be box-shaped to house computing components such as a graphics processing unit.

[0089] In this embodiment, the CPU BOX and GPU BOX are disposed on the first side of the MBP (Mean Interface Board) and electrically connected to it. Thus, the CPU BOX and GPU BOX are electrically connected via traces within the MBP. The CPU BOX includes an interface for connecting to the MBP. Pins in this interface of the CPU BOX are electrically connected to pins in the interface of the MBP. Similarly, the GPU BOX may also include an interface for connecting to the MBP. Pins in this interface of the GPU BOX may also be electrically connected to pins in the interface of the MBP. Based on this, the server motherboard, switch board, and GPU BOX can be interconnected via traces within the MBP. For example, high-speed and low-speed signals of the CPU on the server motherboard are transmitted to the switch board and GPU BOX via the MBP. However, this embodiment is not limited to this; the CPU may also be connected to the switch board via cables, thereby transmitting signals to the GPU BOX via traces within the switch board and interconnect board. The GPU BOX, a computing device, generates heat during computation. To address this, the CPU BOX controls the cooling system CBOX to dissipate heat from the GPU BOX.

[0090] Example 2

[0091] In this embodiment, the spacing D2 between the first power input area 111 and the second power input area 112, and the spacing D1 between the second power input area 112 and the third power input area 113 are different. This arrangement allows for more flexible relationships between the spacing D2 between the first power input area 111 and the second power input area 112, and between the second power input area 112 and the third power input area 113, to meet different usage requirements and operating conditions.

[0092] Example 3

[0093] Optionally, the server chassis has a mounting surface located at the second end. The first power input area 111, the second power input area 112, and the third power input area 113 are all disposed on the mounting surface. A heat dissipation unit is also provided on the mounting surface, located within the array structure. Thus, the first power input area 111, the second power input area 112, and the third power input area 113 are arranged in an array on the mounting surface, with a heat dissipation unit integrated synchronously within the array area. This achieves coordinated physical placement of the power input interface and the heat dissipation unit, allowing the heat dissipation unit (such as ventilation holes, heat-conducting fins, or air duct grilles) to directly cover or surround the heat source area of ​​the power input area. This prevents the heat dissipation path from being blocked during power cable plugging and unplugging operations, ensuring that the input terminals and surrounding components continuously receive effective heat dissipation under high loads.

[0094] In this embodiment, the first power input area 111, the second power input area 112, and the third power input area 113 are arranged together with the heat dissipation unit on a unified mounting surface, and the heat dissipation unit is located within the array structure. This enables airflow to penetrate directionally within the gap of the input interface, achieves short and efficient heat convection paths, and minimizes wind pressure loss, thereby improving the heat dissipation efficiency per unit area and optimizing the overall opening ratio and airflow uniformity of the rear window of the chassis.

[0095] Optionally, the heat dissipation unit includes at least one of a first heat dissipation unit 114, a second heat dissipation unit 115, and a third heat dissipation unit 116. The first heat dissipation unit 114 is located at least one of the following: between the first power input region 111 and the second power input region 112, and between the second power input region 112 and the third power input region 113. The second heat dissipation unit 115 is located between at least two adjacent sub-input regions 41 in a first direction. The third heat dissipation unit 116 is located between at least two adjacent sub-input regions 41 in a second direction. In this way, the zoned heat dissipation strategy achieves precise thermal management and enhanced heat exchange efficiency, thereby reducing heat accumulation and optimizing the overall temperature distribution.

[0096] like Figure 9As shown, the heat dissipation unit includes a first heat dissipation unit 114, which is located between the first power input region 111 and the second power input region 112, and between the second power input region 112 and the third power input region 113. This arrangement of the first heat dissipation unit 114 can specifically improve heat exchange between different power supply modules, especially in the region between the high-power first power supply module and the second power supply module.

[0097] It should be noted that the first heat dissipation part 114 being located between the first power input area 111 and the second power input area 112 means that the first heat dissipation part 114 does not overlap with the first power input area 111 and the second power input area 112 (they are set independently of each other).

[0098] It should be noted that the first heat dissipation part 114 being located between the second power input area 112 and the third power input area 113 means that the first heat dissipation part 114 does not overlap with either the second power input area 112 or the third power input area 113 (they are set independently of each other).

[0099] Optionally, the first heat dissipation section 114 includes a plurality of first heat dissipation holes 1141 spaced apart along a first direction and / or a second direction. This densely distributed array of first heat dissipation holes 1141 enhances airflow and cooling effect, effectively preventing heat accumulation in areas with high power density and reducing the risk of system overheating. This configuration enables the server chassis to maintain good thermal management under high load conditions, ensuring all power supply modules operate within their optimal temperature range, thereby improving the stability and performance of the entire server system. Simultaneously, the zoned heat dissipation design reflects refined control of internal heat flow, contributing to improved energy efficiency and equipment reliability.

[0100] Example 4

[0101] like Figure 10 As shown, the heat dissipation unit includes a second heat dissipation unit 115, which is located between at least two adjacent sub-input regions 41 in a first direction. In this way, the second heat dissipation holes 1151 in the second heat dissipation unit 115 can directly absorb and dissipate the large amount of heat generated by the sub-input regions 41, providing additional heat dissipation channels and ensuring that each sub-input region 41 operates at a suitable operating temperature, preventing performance degradation or hardware damage caused by localized overheating. Simultaneously, the layout of the second heat dissipation holes 1151 effectively isolates the hot airflow between adjacent sub-input regions 41, preventing hot air from circulating inside the chassis, reducing thermal interference, maintaining a balanced temperature throughout the power supply chassis, thereby improving the overall thermal management and operational reliability of the system, optimizing energy efficiency, and reducing the overall operating cost of the server.

[0102] It should be noted that the second heat dissipation part 115 being located between at least two adjacent sub-input regions 41 in the first direction means that the second heat dissipation part 115 does not overlap with any of the sub-input regions 41 (they are set independently of each other).

[0103] Optionally, the second heat dissipation section 115 includes a plurality of second heat dissipation holes 1151 spaced apart along the first direction and / or the second direction. This densely distributed array of second heat dissipation holes 1151 enhances airflow and cooling effect, effectively preventing heat accumulation in areas with high power density and reducing the risk of system overheating. This configuration enables the server chassis to maintain good thermal management under high load conditions, ensuring all power supply modules operate within their optimal temperature range, thereby improving the stability and performance of the entire server system. Simultaneously, the zoned heat dissipation design reflects precise control of internal heat flow, contributing to improved energy efficiency and equipment reliability.

[0104] Example 5

[0105] like Figure 11 As shown, the array structure has two or more rows, and the heat dissipation unit includes a third heat dissipation unit 116, which is located between at least two adjacent sub-input regions 41 in the second direction. By rationally allocating the third heat dissipation unit 116 between at least two adjacent sub-input regions 41 in the second direction, not only is excessive space occupied by the heat dissipation unit avoided, but sufficient opening ratio is also ensured, optimizing the internal space layout of the chassis. This allows the power supply chassis to maintain good thermal management performance while achieving a compact design. Simultaneously, the above configuration maximizes overall heat dissipation efficiency and isolates heat sources, thereby significantly improving the thermal management performance of high-power-density power supply modules and reducing inter-module thermal radiation effects.

[0106] It should be noted that the third heat dissipation unit 116 being located between at least two adjacent sub-input regions 41 in the second direction means that the third heat dissipation unit 116 does not overlap with any of the sub-input regions 41 (they are set independently of each other).

[0107] Optionally, the third heat dissipation section 116 includes a plurality of third heat dissipation holes 1161 spaced apart along the first and / or second directions. This densely distributed array of third heat dissipation holes 1161 enhances airflow and cooling effect, effectively preventing heat accumulation in areas with high power density and reducing the risk of system overheating. This configuration enables the server chassis to maintain good thermal management under high load conditions, ensuring all power supply modules operate within their optimal temperature range, thereby improving the stability and performance of the entire server system. Simultaneously, the zoned heat dissipation design reflects refined control of internal heat flow, contributing to improved energy efficiency and equipment reliability.

[0108] Example 6

[0109] like Figure 12 As shown, the heat dissipation unit includes a first heat dissipation unit 114 and a second heat dissipation unit 115. The first heat dissipation unit 114 is located between a first power input region 111 and a second power input region 112, and between the second power input region 112 and a third power input region 113. The second heat dissipation unit 115 is located between at least two adjacent sub-input regions 41 in a first direction. The first heat dissipation unit 114 includes a plurality of first heat dissipation holes 1141 spaced apart along the first direction and / or the second direction. The second heat dissipation unit 115 includes a plurality of second heat dissipation holes 1151 spaced apart along the first direction and / or the second direction.

[0110] In this embodiment, the aforementioned arrangement of the first heat dissipation unit 114 can specifically improve heat exchange between different power supply modules, especially in the area between the high-power first power supply module 30 and the second power supply module. The dense array of first heat dissipation holes 1141 enhances airflow and cooling effect, effectively preventing heat accumulation in the power-intensive area and reducing the risk of system overheating. Thus, this arrangement enables the server chassis to maintain good thermal management under high-load conditions, ensuring all power supply modules are within their optimal operating temperature range, thereby improving the stability and performance of the entire server system. Simultaneously, the zoned heat dissipation design reflects refined control of internal heat flow, contributing to improved energy efficiency and equipment reliability.

[0111] It should be noted that the first heat dissipation part 114 being located between the first power input area 111 and the second power input area 112 means that the first heat dissipation part 114 does not overlap with the first power input area 111 and the second power input area 112 (they are set independently of each other).

[0112] It should be noted that the first heat dissipation part 114 being located between the second power input area 112 and the third power input area 113 means that the first heat dissipation part 114 does not overlap with either the second power input area 112 or the third power input area 113 (they are set independently of each other).

[0113] It should be noted that the second heat dissipation part 115 being located between at least two adjacent sub-input regions 41 in the first direction means that the second heat dissipation part 115 does not overlap with any of the sub-input regions 41 (they are set independently of each other).

[0114] It should be noted that the first heat dissipation hole 1141 and the second heat dissipation hole 1151 do not overlap and are set independently of each other.

[0115] In this embodiment, the second heat dissipation holes 1151 in the second heat dissipation section 115 can directly absorb and dissipate the large amount of heat generated by the sub-input area 41, providing additional heat dissipation channels to ensure that each sub-input area 41 can operate at a suitable operating temperature, preventing performance degradation or hardware damage caused by local overheating. Simultaneously, the layout of the second heat dissipation holes 1151 can effectively isolate the hot airflow between adjacent sub-input areas 41, preventing hot air from circulating inside the chassis, reducing thermal interference, maintaining a balanced temperature throughout the power supply chassis, thereby improving the overall thermal management and operational reliability of the system, optimizing energy efficiency, and reducing the overall operating cost of the server.

[0116] Example 7

[0117] like Figure 13 As shown, the heat dissipation unit includes a first heat dissipation unit 114 and a third heat dissipation unit 116. The first heat dissipation unit 114 is located between a first power input region 111 and a second power input region 112, and between the second power input region 112 and a third power input region 113. The third heat dissipation unit 116 is located between at least two adjacent sub-input regions 41 in a second direction. The first heat dissipation unit 114 includes a plurality of first heat dissipation holes 1141 spaced apart along a first direction and / or a second direction. The third heat dissipation unit 116 includes a plurality of third heat dissipation holes 1161 spaced apart along a first direction and / or a second direction.

[0118] In this embodiment, the aforementioned arrangement of the first heat dissipation unit 114 can specifically improve heat exchange between different power supply modules, especially in the area between the high-power first power supply module 30 and the second power supply module. The dense array of first heat dissipation holes 1141 enhances airflow and cooling effect, effectively preventing heat accumulation in the power-intensive area and reducing the risk of system overheating. Thus, this arrangement enables the server chassis to maintain good thermal management under high-load conditions, ensuring all power supply modules are within their optimal operating temperature range, thereby improving the stability and performance of the entire server system. Simultaneously, the zoned heat dissipation design reflects refined control of internal heat flow, contributing to improved energy efficiency and equipment reliability.

[0119] It should be noted that the first heat dissipation part 114 being located between the first power input area 111 and the second power input area 112 means that the first heat dissipation part 114 does not overlap with the first power input area 111 and the second power input area 112 (they are set independently of each other).

[0120] It should be noted that the first heat dissipation part 114 being located between the second power input area 112 and the third power input area 113 means that the first heat dissipation part 114 does not overlap with either the second power input area 112 or the third power input area 113 (they are set independently of each other).

[0121] It should be noted that the third heat dissipation unit 116 being located between at least two adjacent sub-input regions 41 in the second direction means that the third heat dissipation unit 116 does not overlap with any of the sub-input regions 41 (they are set independently of each other).

[0122] It should be noted that the first heat dissipation hole 1141 and the third heat dissipation hole 1161 do not overlap and are set independently of each other.

[0123] In this embodiment, by rationally allocating the third heat dissipation hole 1161 between at least two adjacent sub-input regions 41, not only is excessive space occupied by the heat dissipation unit avoided, but sufficient opening ratio is also ensured, optimizing the internal space layout of the chassis. This allows the power supply chassis to maintain good thermal management performance while maintaining a compact design. Simultaneously, the above arrangement achieves the goal of maximizing overall heat dissipation efficiency and isolating heat sources, thereby significantly improving the thermal management performance of high-power-density power supply modules and reducing inter-module thermal radiation effects.

[0124] Example 8

[0125] like Figure 14 As shown, the heat dissipation unit includes a second heat dissipation unit 115 and a third heat dissipation unit 116. The second heat dissipation unit 115 is located between at least two adjacent sub-input regions 41 in a first direction. The third heat dissipation unit 116 is located between at least two adjacent sub-input regions 41 in a second direction. The second heat dissipation unit 115 includes a plurality of second heat dissipation holes 1151 spaced apart along the first and / or second directions. The third heat dissipation unit 116 includes a plurality of third heat dissipation holes 1161 spaced apart along the first and / or second directions. Thus, through refined thermal management design, not only is the heat dissipation efficiency of the second power supply module effectively improved under high power density conditions, but also the modular and isolated heat dissipation strategy enhances the thermal stability and ease of maintenance of the entire power supply chassis, significantly improving the operational reliability and performance of the server system.

[0126] In this embodiment, by providing a second and a third heat dissipation section, heat sources in different directions are dispersed, avoiding the bottleneck of a single heat dissipation section and ensuring that hot air is evenly distributed inside the chassis, thus improving the overall efficiency of the heat dissipation system. Simultaneously, the independent design of the second heat dissipation section 115 and the third heat dissipation section 116 effectively isolates heat conduction between power supply module groups and between sub-input areas 41, reducing the range of thermal impact and ensuring that each module operates in an independent thermal environment, thereby reducing performance fluctuations caused by thermal interference.

[0127] It should be noted that the second heat dissipation part 115 being located between at least two adjacent sub-input regions 41 in the first direction means that the second heat dissipation part 115 does not overlap with any of the sub-input regions 41 (they are set independently of each other).

[0128] It should be noted that the third heat dissipation unit 116 being located between at least two adjacent sub-input regions 41 in the second direction means that the third heat dissipation unit 116 does not overlap with any of the sub-input regions 41 (they are set independently of each other).

[0129] It should be noted that the second heat dissipation hole 1151 and the third heat dissipation hole 1161 do not overlap and are set independently of each other.

[0130] Specifically, by rationally allocating the second heat dissipation hole 1151 and the third heat dissipation hole 1161 within the sub-input area 41, not only is excessive space occupied by the heat dissipation unit avoided, but sufficient opening ratio is also ensured, optimizing the internal space layout of the chassis. This allows the power supply chassis to maintain good thermal management performance while maintaining a compact design. In this way, the above-mentioned configuration achieves the goal of maximizing overall heat dissipation efficiency and isolating heat sources, thereby significantly improving the thermal management performance of high-power-density power supply modules and reducing the thermal radiation effect between modules.

[0131] Example 9

[0132] like Figure 15 As shown, the heat dissipation unit includes a first heat dissipation unit 114, a second heat dissipation unit 115, and a third heat dissipation unit 116. The first heat dissipation unit 114 is located between a first power input region 111 and a second power input region 112, and between the second power input region 112 and a third power input region 113. The second heat dissipation unit 115 is located between at least two adjacent sub-input regions 41 in a first direction. The third heat dissipation unit 116 is located between at least two adjacent sub-input regions 41 in a second direction. The first heat dissipation unit 114 includes a plurality of first heat dissipation holes 1141 spaced apart along the first and / or second directions. The second heat dissipation unit 115 includes a plurality of second heat dissipation holes 1151 spaced apart along the first and / or second directions. The third heat dissipation unit 116 includes a plurality of third heat dissipation holes 1161 spaced apart along the first and / or second directions. In this way, through refined thermal management design, not only is the heat dissipation efficiency of the second power supply module effectively improved under high power density conditions, but also the thermal stability and ease of maintenance of the entire power supply chassis are enhanced through modular and isolated heat dissipation strategies, significantly improving the operational reliability and performance of the server system.

[0133] In this embodiment, the aforementioned arrangement of the first heat dissipation unit 114 can specifically improve heat exchange between different power supply modules, especially in the area between the high-power first and second power supply modules. The dense array of first heat dissipation holes 1141 enhances airflow and cooling effect, effectively preventing heat accumulation in the power-intensive area and reducing the risk of system overheating. Thus, this arrangement enables the server chassis to maintain good thermal management under high-load conditions, ensuring all power supply modules operate within their optimal temperature range, thereby improving the stability and performance of the entire server system. Simultaneously, the zoned heat dissipation design reflects refined control of internal heat flow, contributing to improved energy efficiency and equipment reliability.

[0134] In this embodiment, by providing a second and a third heat dissipation section, heat sources in different directions are dispersed, avoiding the bottleneck of a single heat dissipation section and ensuring that hot air is evenly distributed inside the chassis, thus improving the overall efficiency of the heat dissipation system. Simultaneously, the independent design of the second heat dissipation section 115 and the third heat dissipation section 116 effectively isolates heat conduction between power supply module groups and between sub-input areas 41, reducing the range of thermal impact and ensuring that each module operates in an independent thermal environment, thereby reducing performance fluctuations caused by thermal interference.

[0135] It should be noted that the first heat dissipation part 114 being located between the first power input area 111 and the second power input area 112 means that the first heat dissipation part 114 does not overlap with the first power input area 111 and the second power input area 112 (they are set independently of each other).

[0136] It should be noted that the first heat dissipation part 114 being located between the second power input area 112 and the third power input area 113 means that the first heat dissipation part 114 does not overlap with either the second power input area 112 or the third power input area 113 (they are set independently of each other).

[0137] It should be noted that the second heat dissipation part 115 being located between at least two adjacent sub-input regions 41 in the first direction means that the second heat dissipation part 115 does not overlap with any of the sub-input regions 41 (they are set independently of each other).

[0138] It should be noted that the third heat dissipation unit 116 being located between at least two adjacent sub-input regions 41 in the second direction means that the third heat dissipation unit 116 does not overlap with any of the sub-input regions 41 (they are set independently of each other).

[0139] Specifically, by rationally allocating the second heat dissipation hole 1151 and the third heat dissipation hole 1161 within the sub-input area 41, not only is excessive space occupied by the heat dissipation unit avoided, but sufficient opening ratio is also ensured, optimizing the internal space layout of the chassis. This allows the power supply chassis to maintain good thermal management performance while maintaining a compact design. In this way, the above-mentioned configuration achieves the goal of maximizing overall heat dissipation efficiency and isolating heat sources, thereby significantly improving the thermal management performance of high-power-density power supply modules and reducing the thermal radiation effect between modules.

[0140] As can be seen from the above description, the embodiments of this utility model achieve the following technical effects:

[0141] The fan area is located at the second end of the server chassis. Along the projection direction from the first end to the second end, the orthographic projection of the power configuration area on the end face of the second end is outside the range of the orthographic projection of the fan area on the end face of the second end. By physically isolating the power configuration area and the fan area in space, the power configuration area does not block the air intake of the fan area, forming a unidirectional and undisturbed airflow channel from the first end to the second end. This achieves the purpose of avoiding the direct intake of hot exhaust gas from the power module by the fan and preventing the superposition of heat backflow and local temperature rise, thereby improving the cooling efficiency of the fan area. This solves the problem of unreasonable layout of the power configuration area and fan heat dissipation area in high-density servers in related technologies, which affects the heat dissipation effect.

[0142] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A server chassis, characterized by, include: The first and second ends are set relative to each other; A fan area (11) is configured to house a fan (90), the fan area (11) being located at the second end; An I / O component area and a computing area are located at the first end and stacked together; the I / O component area is configured to accommodate I / O components; the computing area is configured to accommodate computing components. The power configuration area is configured to supply power to the fan area (11), the IO component area, and the computing area; The orthographic projection of the power configuration area on the end face of the second end is outside the range of the orthographic projection of the fan area (11) on the end face of the second end.

2. The server chassis of claim 1, wherein, The server chassis includes: A first sidewall and a second sidewall are arranged opposite to each other, and the first sidewall and the second sidewall are arranged along a first direction; The substrate (17) is connected to the first sidewall and the second sidewall to form a U-shaped structure around the first sidewall and the second sidewall; the power supply configuration area is located between the fan area (11) and the substrate (17); The direction from the first end to the second end is set at an angle to the first direction.

3. The server chassis of claim 2, wherein, The power configuration area includes a first power input area (111), a second power input area (112), and a third power input area (113) arranged sequentially along the first direction. The first power input area (111) is configured to be electrically connected to a first power supply module (30) that supplies power to the fan area (11). The second power input area (112) and the third power input area (113) are both configured to be electrically connected to a second power supply module that supplies power to the IO component area and the computing area.

4. The server chassis of claim 3, wherein, The second power input area (112) and the third power input area (113) each include a plurality of sub-input areas (41). The first power input area (111) and the plurality of sub-input areas (41) are arranged in an array to form an array structure. The horizontal direction of the array structure is the first direction, and the vertical direction of the array structure is the second direction. The second direction is set at an angle to the first direction, and the direction from the first end to the second end is set at an angle to the second direction.

5. The server chassis of claim 4, wherein, The boundary of the second power input area (112) near the third power input area (113) and the boundary of the third power input area (113) near the second power input area (112) have a first spacing D1. In any two adjacent sub-input areas (41) in the first direction, the boundary of the first sub-input area (41) near the second sub-input area (41) and the boundary of the second sub-input area (41) near the first sub-input area (41) have a distance d, and the first spacing D1 is greater than or equal to the distance d.

6. The server chassis of claim 4, wherein, The boundary of the second power input region (112) near the third power input region (113) has a first spacing D1, and the boundary of the third power input region (113) near the second power input region (112) has a second spacing D2, and the boundary of the first power input region (111) near the second power input region (112) has a second spacing D2, which is equal to the first spacing D1.

7. The server chassis of any of claims 4-6, wherein, The server chassis has a mounting surface located at the second end. The first power input area (111), the second power input area (112), and the third power input area (113) are all disposed on the mounting surface. A heat dissipation part is also disposed on the mounting surface, and the heat dissipation part is located within the array structure.

8. The server chassis of claim 7, wherein, The heat dissipation section includes at least one of a first heat dissipation section (114), a second heat dissipation section (115), and a third heat dissipation section (116), wherein, The first heat dissipation part (114) is located at least one of the following: between the first power input area (111) and the second power input area (112), and between the second power input area (112) and the third power input area (113); The second heat dissipation unit (115) is located between at least two of the sub-input regions (41) that are adjacent in the first direction; The third heat dissipation unit (116) is located between at least two adjacent sub-input regions (41) in the second direction.

9. The server chassis according to claim 8, characterized in that, The first heat dissipation part (114) includes a plurality of first heat dissipation holes (1141) spaced apart along the first direction and / or the second direction; and / or, The second heat dissipation section (115) includes a plurality of second heat dissipation holes (1151) spaced apart along the first direction and / or the second direction; and / or, The third heat dissipation section (116) includes a plurality of third heat dissipation holes (1161) spaced apart along the first direction and / or the second direction.

10. The server chassis of claim 7, wherein, The server chassis includes: A power module (100) is located in the power configuration area. The power module (100) includes a power chassis and a power board (50) disposed in the power chassis. The power chassis has the mounting surface. The middle backplate (70) is located between the IO component area and the fan area (11), and the power module (100) supplies power to the fan area (11) and the computing area through the middle backplate (70).

11. The server chassis of claim 10, wherein, The power supply chassis includes a body (10) and a cover plate (20). The body (10) includes a base plate and a surrounding plate disposed on the base plate. The cover plate (20) is detachably disposed on the surrounding plate.

12. The server chassis of claim 11, wherein, The body (10) has a first snap-fit ​​portion (12) and a mating recess (13), and the cover plate (20) includes: The cover body (21) has a second snap-fit ​​part (211) and a mounting part; The locking structure (22) includes a locking part which is retractably disposed within the mounting part; the locking structure (22) has a locked state in which at least a portion of the locking part extends into the mating recess (13) and an unlocked state in which the locking part is withdrawn from the mating recess (13); In this part, one of the first latching part (12) and the second latching part (211) is a protrusion, and the other of the first latching part (12) and the second latching part (211) is a recess. The protrusion extends into the recess to limit and stop the recess.

13. The server chassis of claim 10, wherein, The server chassis also includes: A shielding structure (60) is provided on the power board (50). The shielding structure (60) includes a shielding body (61) and a cable clip (62). The cable clip (62) is disposed on the surface of the shielding body (61) facing away from the power board (50) for clamping the cable bundle.

14. The server chassis of claim 13, wherein, The shielding body (61) has a plurality of fourth heat dissipation holes (611), which are spaced apart along the first direction and / or the second direction.

15. A server, characterized by The server chassis included in any one of claims 1 to 14.

Images