A small computer mainframe structure

Abstract

The utility model discloses a small computer host structure, and upper cover plate, middle frame and bottom plate are fixed through stud, and upper cover plate and middle frame have clearance space between both, and PC ornament strip is further equipped on the rear side of middle frame, and the upside of PC ornament strip on middle frame is equipped with big air outlet, and the air inlet of lower air inlet air flue and VESA hanging bracket hole are equipped on bottom plate, and the corresponding place of CPU processor position of mainboard is equipped with turbine fan, copper fin and heat conduction copper pipe, and heat conduction copper pipe conducts the temperature of CPU processor to copper fin, and then the heat on copper fin is taken away through the air flow of turbine fan. The utility model discloses the mode of copper pipe plus copper fin, and the efficiency of heat conduction is greatly improved, and the perpendicular through type air flue of up and down air inlet is adopted, and the fan noise is greatly reduced, and the structure adopts integrated molding plus modular assembly, and the screw fixing mode is greatly reduced, and the overall simplicity and assembly production efficiency of product are improved, and it is simple and beautiful.

Description

Technical Field

[0001] This utility model relates to the field of computer technology, and in particular to a small computer host structure. Background Technology

[0002] With the development of technology, computers have become increasingly smaller, which has led to higher requirements for computer structure and heat dissipation. Existing miniature computer mainframes have two major heat dissipation problems:

[0003] 1. Heat dissipation bottleneck: Traditional heat dissipation methods are inefficient in limited space, often leading to excessively high CPU temperatures, resulting in throttling and system crashes;

[0004] 2. Poor expandability: The compact structure sacrifices hardware compatibility and maintainability. Conventional solutions (such as increasing fan size and speed, changing heat-conducting materials, increasing copper pipe size or heat spreader) result in problems such as high noise, high cost, and increased size. Utility Model Content

[0005] The purpose of this invention is to provide a small computer host structure to solve the above-mentioned technical problems.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A small computer host structure includes a top cover, a middle frame, a bottom plate, a large air outlet, an air inlet, a turbine fan, copper fins, heat pipes, a motherboard, and a CPU processor. The top cover, middle frame, and bottom plate are fixed by studs, and there is a 2mm gap between the top cover and the middle frame. A PC trim strip is provided on the rear side of the middle frame. A large air outlet is provided on the upper side of the PC trim strip on the middle frame. An air inlet for the lower air intake channel and VESA mounting holes are provided on the bottom plate. A turbine fan, copper fins, and heat pipes are provided at the corresponding position of the CPU processor on the motherboard. The heat pipes conduct the temperature of the CPU processor to the copper fins, and then the heat on the copper fins is carried away by the airflow of the turbine fan.

[0008] The rear side of the middle frame also features a lock hole to enhance anti-theft capabilities. It also includes foot pads, with recessed areas at the four corners of the base plate for attaching the foot pads. These recessed areas have stud holes to ensure accurate and aesthetically pleasing attachment of the foot pads.

[0009] Compared with the prior art, this utility model has the following advantages: The use of copper pipes and copper fins greatly improves heat conduction efficiency; the vertical through-flow air duct significantly reduces fan noise, with traditional fan systems reaching over 40dB, while the overall noise level of this utility model can be reduced to below 30dB; the integrated molding and modular assembly structure of this utility model greatly reduces screw fixing methods compared to the traditional approach, improving the overall simplicity of the product and assembly efficiency; furthermore, compared to the traditional main unit covered with screws, this application features a completely screwless design, providing users with a simple and aesthetically pleasing experience. Attached Figure Description

[0010] In the diagram: Top cover 10, middle frame 11, bottom plate 12, PC trim 13, large air outlet 15, air inlet 16, feet 17, turbine fan 18, copper fins 19, heat pipe 20, motherboard 21, CPU processor 22.

[0011] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0012] Figure 2 A schematic diagram of the bottom structure of this utility model.

[0013] Figure 3 A schematic diagram of the assembly structure of this utility model. Detailed Implementation

[0014] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0015] A small computer host structure includes a top cover 10, a middle frame 11, a bottom plate 12, a large air outlet 15, an air inlet 16, a turbine fan 18, copper fins 19, a heat-conducting copper pipe 20, a motherboard 21, and a CPU processor 22. The top cover 10, the middle frame 11, and the bottom plate 12 are fixed by studs, and there is a 2mm gap between the top cover 10 and the middle frame 11. This design allows the gap between the top cover and the middle frame to become the air inlet for the heat dissipation system, achieving the required airflow of the turbine fan within a limited space, so as to ensure the output air pressure and airflow of the turbine fan, reduce the noise generated when the turbine fan rotates, and at the same time, the distance of the gap just ensures the dust prevention requirement.

[0016] The rear side of the mid-frame 11 also features a PC trim strip 13. The PC trim strip 13 is designed to be separate so that when switching motherboard interfaces, it is not necessary to re-open the mid-frame 11. Instead, the corresponding interface of the PC trim strip 13 can be changed, thus avoiding the cost issues caused by mold opening. On the other hand, it also increases the expandability and practicality of the case, achieving the goal of one case to accommodate multiple motherboards.

[0017] A large air vent 15 is located on the upper side of the PC trim strip 13 on the mid-frame 11. An air inlet 16 for a lower air intake duct and VESA mounting holes are located on the base plate 12. A turbine fan 18, copper fins 19, and a heat pipe 20 are located at the corresponding position of the CPU processor 22 on the motherboard 21. The heat pipe 20 conducts the heat from the CPU processor 22 to the copper fins 19, and then the heat is carried away by the airflow from the turbine fan 18. The mid-frame 11 features an unobstructed large air vent 15 to ensure unobstructed airflow and reduce noise from wind resistance. A lock hole is also designed at the rear of the mid-frame 11 to enhance security. The base plate 12 incorporates the lower air intake vent 16 and VESA mounting holes, enabling various application scenarios. A large, unobstructed air vent 15 is opened at the back of the mid-frame to ensure that the fan duct can remove heat to the maximum extent, while also reducing the air resistance of the fan vent and reducing the noise generated by the air resistance.

[0018] In this embodiment, foot pads 17 are also included. The four corners of the base plate 12 are provided with recessed areas for attaching the foot pads, and the recessed areas are provided with stud holes to ensure accurate and aesthetically pleasing attachment of the foot pads 17. The foot pads not only provide anti-slip protection when the entire unit is placed, but also ensure the distance between the bottom of the unit and the placement surface, guaranteeing unobstructed airflow at the bottom air inlet 16.

[0019] The small computer host adopts a top and bottom air intake and a vertical through-flow air duct. The top is the main air intake and the bottom is the auxiliary air intake. The main air intake ensures the air volume of the turbine fan to meet the air pressure and air volume output of the fan to meet the heat dissipation requirements. The auxiliary air intake removes heat from the memory, hard drive and some heat-generating components by optimizing the air duct. The air outlet adopts an unobstructed design to reduce the air resistance at the outlet and achieve the best air intake and exhaust duct, while also reducing the noise caused by air resistance.

[0020] Due to space limitations, miniaturization and performance optimization of the heat dissipation module are unavoidable in small computer mainframes. The key issue is how to achieve optimal heat conduction and dissipation. This invention uses a combination of a heat-conducting copper pipe or vapor chamber and a copper fin. A turbine fan removes the heat from the fin. The turbine fan uses PWM to automatically adjust the fan speed according to the CPU temperature, ensuring both heat dissipation requirements and optimal size and noise levels.

[0021] The above description is a preferred embodiment of the present utility model. For those skilled in the art, any changes, modifications, substitutions and variations made to the implementation methods without departing from the principles and spirit of the present utility model, based on the teachings of the present utility model, still fall within the protection scope of the present utility model.

Claims

1. A small computer mainframe structure, characterized by comprising: The system includes a top cover, middle frame, bottom plate, large exhaust vent, air inlet, turbine fan, copper fins, heat pipes, motherboard, and CPU processor. The top cover, middle frame, and bottom plate are fixed with studs, and there is a 2mm gap between the top cover and the middle frame. The rear side of the middle frame is also equipped with a PC trim strip. Above the PC trim strip on the middle frame is a large exhaust vent. The bottom plate has an air inlet for the lower air intake duct and VESA mounting holes. At the corresponding position of the CPU processor on the motherboard, there is a turbine fan, copper fins, and heat pipes. The heat pipes conduct the heat of the CPU processor to the copper fins, and then the heat on the copper fins is carried away by the airflow of the turbine fan.

2. The small computer host structure of claim 1, wherein, The rear side of the middle frame is also provided with a lock hole.

3. The small computer host structure of claim 1, wherein, It also includes foot pads, and the four corners of the base plate are provided with recessed areas for attaching the foot pads, and the recessed areas are provided with stud holes.

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