Air guide module and electronic equipment

By designing an adjustable air guide module that connects to the mounting section, the problem of existing air guides being unable to adapt to the heat dissipation requirements of different components is solved, achieving flexible heat dissipation adjustment and stable cooling effect, thus improving adaptability and energy efficiency.

CN224457344UActive Publication Date: 2026-07-03SUMA TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SUMA TECH CO LTD
Filing Date
2025-09-01
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

Existing air guide covers cannot flexibly adapt to the heat dissipation requirements of different components, and have poor adaptability.

Method used

An air guide module was designed, including a module body, an air guide component, and a mounting part. The air guide component is connected to the mounting part through a detachable assembly part, which can adjust the position and angle of the air guide component relative to the air inlet to adapt to the heat dissipation requirements of different components.

Benefits of technology

The flexibility and adaptability of the air guide module have been improved, and the flow direction of the cooling air can be adjusted according to the heat dissipation requirements of different components to ensure heat dissipation effect, save energy and improve stability.

✦ Generated by Eureka AI based on patent content.

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Abstract

This application provides an air guide module and an electronic device. The air guide module includes a module body, which includes a support member and an air guide. The air guide is disposed within the support member and, together with the support member, defines a placement cavity on the side of the air guide. The placement cavity has an air inlet on the side facing the fan. The module body has a mounting portion. The component to be cooled is disposed within the placement cavity. An air guide is located on the side of the placement cavity with the air inlet, and is used to guide the cooling air output by the fan into the placement cavity. The air guide includes an assembly portion, which is connected to and relatively fixed to the mounting portion. The assembly portion is detachable and configured such that when reconnected to the mounting portion, the position of the air guide relative to the air inlet can be adjusted. By adjusting the position of the air guide, the flow direction of the cooling air can be changed according to the cooling requirements of different components to be cooled, thereby ensuring the cooling effect of different components and improving the adaptability and flexibility of the air guide module.
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Description

Technical Field

[0001] This application relates to the field of server heat dissipation technology, and in particular to an air guide module and electronic equipment. Background Technology

[0002] As technology advances, server computing power continues to increase, and the demands for processing speed and data volume are rising, leading to increased power consumption of server components. If these components are not effectively cooled, overheating can occur, affecting the server's normal operation and potentially damaging the components.

[0003] In related technologies, server heat dissipation is achieved by using an air guide shroud. The air guide shroud contains an internal air duct structure that guides airflow in a predetermined direction. When the fan operates, it draws in cooling air and blows it into the air guide shroud. The air flows along the air ducts within the shroud, passes over the surfaces of heat-generating components, absorbs heat, and is then expelled.

[0004] However, due to the different heat dissipation requirements of different components, the existing air guide shroud cannot flexibly adapt to the heat dissipation requirements of different components, and its adaptability is poor. Utility Model Content

[0005] This application provides an air guide module and electronic device to solve the problem that existing air guides cannot flexibly adapt to the heat dissipation requirements of different components and have poor adaptability.

[0006] In a first aspect, embodiments of this application provide an air guide module, comprising:

[0007] The module body includes a support member and an air guide shroud. The air guide shroud is located inside the support member and together with the support member, defines a placement cavity on the side of the air guide shroud. The placement cavity has an air inlet on the side facing the fan. The module body has a mounting part.

[0008] The heat dissipation element is located inside the placement cavity;

[0009] An air guide is located on the side of the placement cavity where an air inlet is provided. The air guide is used to guide the cooling air output by the fan into the placement cavity. The air guide includes an assembly part, which is connected to and fixed relative to the mounting part. The assembly part is detachable and is configured such that when it is reconnected to the mounting part, the position of the air guide relative to the air inlet can be adjusted.

[0010] In one possible implementation, the air guide shroud has a mounting portion on the side adjacent to the air inlet, and the mounting portion is connected to and fixed relative to the carrier.

[0011] When the heat dissipation requirements change, the assembly can be disassembled and reinstalled. By changing the position of the air guide relative to the air inlet, the tilt angle or direction of the air guide can be adjusted, thereby changing the air inlet angle of the cooling air. At the same time, since the mounting part is connected to and relatively fixed to the carrier, the carrier can support the mounting part, ensuring the stability of the air guide cover and the air guide, and preventing displacement or loosening caused by the impact of the cooling air.

[0012] In one possible implementation, the carrier has a mounting part on the side adjacent to the air inlet, thereby providing a fixed connection point for the installation of the air guide. The air guide is fixed and positioned by the cooperation between the mounting part and the assembly part.

[0013] In one possible implementation, the air guide further includes an air guide plate and a connector. The air guide plate is located on the side of the placement cavity where the air inlet is located and is opposite to the air inlet. The connector is located on the side of the air guide plate away from the center of the air inlet and is connected to the air guide plate. The connector has an assembly part.

[0014] The assembly part is configured to change its position relative to the mounting part when it is reconnected to the mounting part, thereby adjusting the position of the air guide plate relative to the air inlet.

[0015] With this configuration, when the assembly part is reconnected to the mounting part, the position of the assembly part relative to the mounting part can be changed to adjust the position of the air guide plate relative to the air inlet, thereby adjusting the air inlet angle. This allows the air inlet angle to be changed according to different heat dissipation requirements, improving the flexibility and adaptability of the air guide shroud module.

[0016] In one possible implementation, one of the assembly part and the mounting part has a connection port, and the other has a connecting shaft. The connecting shaft is disposed within the connection port, and the connecting shaft is configured such that when it is disposed within the connection port again, the position of the air guide relative to the air inlet can be adjusted.

[0017] This configuration allows the rotating connecting shaft to change the position of the air guide relative to the air inlet when the assembly part is reconnected to the mounting part, thereby changing the air inlet angle. This enables users to flexibly adjust the angle between the air guide plate and the air inlet, thus changing the air inlet angle and coverage of the cooling air.

[0018] In one possible implementation, when the connecting shaft is located inside the connecting port, the connecting port is used to restrict the rotation of the connecting shaft within the connecting port. By restricting the rotation of the connecting shaft, it can be ensured that the air guide can maintain a stable position and angle after installation, and the air guide can be prevented from rotating or shifting due to the impact of the cooling airflow or other external forces, thus ensuring the stability and reliability of the air guide module.

[0019] In one possible implementation, the inner wall of the connection port has a first meshing tooth, and the circumferential direction of the connecting shaft has a second meshing tooth. When the connecting shaft is located inside the connection port, the second meshing tooth meshes with the first meshing tooth. Through the meshing between the first meshing tooth and the second meshing tooth, a stable connection between the connecting shaft and the connection port is achieved, preventing the connecting shaft from rotating inside the connection port, and further ensuring the stability of the air guide 200.

[0020] In one possible implementation, the inner wall of the connection port forms a polygonal hole, which is a centrally symmetrical structure.

[0021] The circumferential direction of the connecting shaft is adapted to the structure of the polygonal hole.

[0022] This design ensures that when the connecting shaft is inserted into the connector, the inner wall of the polygonal hole makes tight contact with the circumference of the connecting shaft, thus preventing the connecting shaft from rotating due to the impact of cooling airflow or other external forces. Furthermore, when the angle of the air guide needs to be adjusted, the connecting shaft can be removed, rotated to the desired angle, and then reinserted into the connector.

[0023] In one possible implementation, there are multiple air guide hoods, which are spaced apart along a first direction within the support member and together with the support member define a plurality of placement cavities. Each placement cavity has one or two air guides on the side with the air inlet. When the same placement cavity has two air guides on the side with the air inlet:

[0024] Two air guides are arranged sequentially along the first direction on the side of the placement cavity where the air inlet is located, and the module body is provided with a mounting part at the position corresponding to each air guide.

[0025] This configuration, by setting up multiple air guides and air guide components, allows for the placement of components with different heat dissipation requirements in different placement chambers, thereby flexibly adjusting the flow rate and coverage of the cooling air.

[0026] Secondly, embodiments of this application provide an electronic device, including:

[0027] case;

[0028] The fan is housed within the casing.

[0029] As in any of the first aspects, the air guide module is located inside the housing and is opposite to the air outlet side of the fan.

[0030] The air guide module and electronic device provided in this application include a module body, which includes a support member and an air guide. The air guide is disposed within the support member and, together with the support member, defines a placement cavity on the side of the air guide. The placement cavity has an air inlet on the side facing the fan. The module body has a mounting portion. A heat-dissipating element is disposed within the placement cavity. An air guide is located on the side of the placement cavity with the air inlet and is used to guide the cooling air output by the fan into the placement cavity. The air guide includes an assembly portion, which is connected to and relatively fixed to the mounting portion. The assembly portion is detachable and configured such that when reconnected to the mounting portion, the position of the air guide relative to the air inlet can be adjusted. By adjusting the position of the air guide, the flow direction of the cooling air can be changed according to the heat dissipation requirements of different heat-dissipating elements, thereby ensuring the heat dissipation effect of different heat-dissipating elements and improving the adaptability and flexibility of the air guide module. Attached Figure Description

[0031] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0032] Figure 1 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application;

[0033] Figure 2 A schematic diagram of the structure of the air guide module provided in the embodiments of this application. Figure 1 ;

[0034] Figure 3 A schematic diagram of the structure of the air guide module provided in the embodiments of this application. Figure 2 ;

[0035] Figure 4 for Figure 2 Connection diagram between the middle assembly section and the installation section Figure 1 ;

[0036] Figure 5 for Figure 2 Connection diagram between the middle assembly section and the installation section Figure 2 .

[0037] Explanation of reference numerals in the attached figures:

[0038] 10-Air guide shroud module;

[0039] 20 - Shell;

[0040] 30 - Components to be cooled;

[0041] 100 - Module body; 110 - Supporting component; 111 - Mounting part; 120 - Air guide cover; 130 - Placement cavity; 131 - Air inlet;

[0042] 200 - Air guide component; 210 - Air guide plate; 220 - Connector; 221 - Assembly part.

[0043] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0044] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of the embodiments of this application.

[0045] In the embodiments of this application, the terms "upper," "lower," "inner," "middle," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are mainly for better describing the embodiments of this application and their implementations, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation. Furthermore, some of the above terms may be used to indicate other meanings besides orientation or positional relationship; for example, the term "upper" may also be used in some cases to indicate a certain dependency or connection relationship. For those skilled in the art, the specific meaning of these terms in the embodiments of this application can be understood according to the specific circumstances.

[0046] Furthermore, the terms "set up," "connect," and "fix" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure according to the specific circumstances.

[0047] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the present application described herein can be implemented, for example, in orders other than those illustrated or described herein.

[0048] In this application, the terms "exemplarily" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplarily" or "for example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplarily" or "for example" is intended to present the relevant concepts in a specific manner.

[0049] Unless otherwise stated, the term "multiple" means two or more.

[0050] As technology advances, server computing power continues to increase, and the demands for processing speed and data volume are rising, leading to increased power consumption of server components. If these components are not effectively cooled, overheating can occur, affecting the server's normal operation and potentially damaging the components.

[0051] In related technologies, server heat dissipation is achieved by using an air guide shroud. The air guide shroud contains an internal air duct structure that guides airflow in a predetermined direction. When the fan operates, it draws in cooling air and blows it into the air guide shroud. The air flows along the air ducts within the shroud, passes over the surfaces of heat-generating components, absorbs heat, and is then expelled.

[0052] However, due to the different heat dissipation requirements of different components, the existing air guide shroud cannot flexibly adapt to the heat dissipation requirements of different components, and its adaptability is poor.

[0053] In view of this, embodiments of this application provide an air guide module and an electronic device. The air guide module includes a module body, which includes a support member and an air guide. The air guide is disposed within the support member and, together with the support member, defines a placement cavity on the side of the air guide. The placement cavity has an air inlet on the side facing the fan. The module body has a mounting portion. A heat-dissipating element is disposed within the placement cavity. An air guide is located on the side of the placement cavity with the air inlet and is used to guide the cooling air output by the fan into the placement cavity. The air guide includes an assembly portion, which is connected to and relatively fixed to the mounting portion. The assembly portion is detachable and configured such that when reconnected to the mounting portion, the position of the air guide relative to the air inlet can be adjusted. By adjusting the position of the air guide, the flow direction of the cooling air can be changed according to the heat dissipation requirements of different heat-dissipating elements to ensure the heat dissipation effect of different heat-dissipating elements, thereby improving the adaptability and flexibility of the air guide module.

[0054] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will be described below with reference to the accompanying drawings.

[0055] Please refer to Figures 1 to 5 In one aspect, embodiments of this application provide a wind deflector module 10, including a module body 100 and a heat dissipation element 30.

[0056] The module body 100 includes a support member 110 and an air guide shroud 120. The air guide shroud 120 is disposed inside the support member 110 and together with the support member 110 on the side of the air guide shroud 120, defines a placement cavity 130. The placement cavity 130 has an air inlet 131 on the side facing the fan, and the heat dissipation element 30 is disposed inside the placement cavity 130.

[0057] When the fan starts working, the cooling air output by the fan can enter the air guide shroud 120 through the air inlet 131, thereby carrying away the heat generated by the heat-dissipating element 30.

[0058] The number of placement cavities 130 can be multiple, and the multiple placement cavities 130 are used to accommodate different heat dissipation components 30, so that they can be adapted to the heat dissipation requirements and layout of different heat dissipation components 30.

[0059] In this embodiment, the support member 110 is mainly used to support the air guide shroud 120 and the heat dissipation component 30. The air guide shroud 120 can be an integral structure with the support member 110, or it can be manufactured separately for installation. This embodiment does not impose any restrictions on this.

[0060] For example, the carrier 110 is connected to the air guide shroud 120 by screws.

[0061] In this embodiment, the heat-dissipating component 30 includes a supercapacitor, an M.2 board, and a RAID card. Specifically, the supercapacitor is mainly used to provide emergency power when the electronic device loses power, such as to save unwritten data. The M.2 board is used to install solid-state drives, and the RAID card is used to manage and control a storage array composed of multiple hard drives, improving the performance and reliability of the storage system through data redundancy and parallel read / write operations.

[0062] RAID cards generate significant heat due to the need for real-time processing of large amounts of data exchange and computation, thus requiring substantial cooling. In contrast, supercapacitors and M.2 cards generate less heat and have lower cooling requirements. Therefore, the cooling needs of different components 30 vary, and the existing air duct 120 cannot flexibly adapt to these diverse cooling demands.

[0063] In this embodiment, no restrictions are placed on the heat dissipation element 30, and an adaptive selection can be made according to actual needs.

[0064] Therefore, the air guide module 10 provided in this embodiment also includes an air guide 200. The air guide 200 is located on the side of the placement cavity 130 where the air inlet 131 is provided. The air guide 200 is used to guide the cooling air output by the fan into the placement cavity 130. The air guide 200 includes an assembly part 221, which is connected to and relatively fixed to the mounting part 111 on the module body 100. The assembly part 221 is detachable. When the assembly part 221 is reconnected to the mounting part 111, the position of the air guide 200 relative to the air inlet 131 can be adjusted.

[0065] Specifically, when it is necessary to adjust the position of the air guide 200 relative to the air inlet 131, the user can disassemble the assembly 221 and reinstall it by changing the position of the air guide 200 relative to the air inlet 131, thereby adjusting the tilt angle or direction of the air guide 200, and thus changing the air inlet angle of the cooling air. This allows the air guide 200 to flexibly guide the direction of the cooling air according to the heat dissipation requirements of different heat dissipation components 30, improving the flexibility and adaptability of the air guide shroud module 10.

[0066] For example, since RAID cards have high heat dissipation requirements, the position of the air guide 200 relative to the air inlet 131 can be adjusted to increase the air inlet angle of the air inlet 131 in the placement cavity 130 where the RAID card is located. This allows cooling air to be blown onto the RAID card at a greater flow rate, thus meeting the high heat dissipation requirements of the RAID card. Conversely, for supercapacitors and M.2 boards, since their heat generation is relatively small, the air inlet angle of the air inlet 131 in the placement cavity 130 where the supercapacitors and M.2 boards are located can be decreased. This reduces the cooling airflow entering the placement cavity 130, but still ensures sufficient heat dissipation while avoiding unnecessary energy waste.

[0067] Furthermore, since the air guide module 10 provided in this embodiment can adjust the tilt angle or direction of the air guide 200 by reinstalling and changing the position of the air guide 200 relative to the air inlet 131, without the need for a motor or other driving device, it can effectively save energy during use. At the same time, the structure is relatively simple and the manufacturing cost is low.

[0068] Please refer to Figures 1 to 5 In some embodiments, the air guide shroud 120 has a mounting portion 111 on the side adjacent to the air inlet 131, and the mounting portion 111 is connected to and fixed relative to the carrier 110.

[0069] Specifically, the assembly part 221 of the air guide 200 is connected to the mounting part 111, so that the air guide 200 can be fixed on the air guide cover 120. At the same time, when the heat dissipation requirements change, the assembly part 221 can be disassembled and reinstalled. By changing the position of the air guide 200 relative to the air inlet 131, the tilt angle or direction of the air guide 200 can be adjusted, thereby changing the air inlet angle of the cooling air.

[0070] Furthermore, since the mounting part 111 is connected to and relatively fixed to the support member 110, the support member 110 can support the mounting part 111, ensuring the stability of the air guide shroud 120 and the air guide member 200, and preventing displacement or loosening caused by the impact of cooling air.

[0071] Meanwhile, since the mounting part 111 is located on the side of the air guide shroud 120 adjacent to the air inlet 131, the air guide 200 is installed on the side of the air inlet 131, thereby guiding the cooling air more efficiently and improving the heat dissipation efficiency.

[0072] It should be noted that this embodiment does not impose any restrictions on the connection method between the mounting part 111 and the assembly part 221, and an adaptive selection can be made according to actual needs.

[0073] For example, the assembly part 221 is a bolt and the mounting part 111 is a threaded hole. When it is necessary to adjust the angle of the air guide 200, the bolt can be screwed in to adjust the screwing depth, so as to adjust the mounting angle of the air guide 200.

[0074] Please refer to Figures 1 to 5 In some embodiments, the carrier 110 is provided with a mounting part 111 on the side adjacent to the air inlet 131, thereby providing a fixed connection point for the installation of the air guide 200. The air guide 200 is fixed and positioned by the cooperation of the mounting part 111 and the assembly part 221.

[0075] Meanwhile, since the mounting part 111 is located on the side of the air inlet 131 of the carrier 110, the air guide 200 is installed on the side of the air inlet 131, which can guide the cooling air more efficiently and improve the heat dissipation efficiency.

[0076] Please refer to Figures 1 to 5 In some embodiments, the air guide 200 further includes an air guide plate 210 and a connector 220. The air guide plate 210 is located on the side of the placement cavity 130 where the air inlet 131 is provided, and is opposite to the air inlet 131. The connector 220 is located on the side of the air guide plate 210 away from the center of the air inlet 131, and is connected to the air guide plate 210. The connector 220 has an assembly portion 221.

[0077] When the assembly part 221 is reconnected to the mounting part 111, the position of the assembly part 221 relative to the mounting part 111 can be changed to adjust the position of the air guide plate 210 relative to the air inlet 131.

[0078] Specifically, in this embodiment, the air guide 200 includes an air guide plate 210 and a connector 220. The air guide plate 210 is located on the side of the placement cavity 130 where the air inlet 131 is provided, and is opposite to the air inlet 131, so that it can receive the cooling air from the fan more effectively and guide the cooling air into the placement cavity 130, thereby improving the heat dissipation efficiency of the heat dissipation component 30.

[0079] The connector 220 is located on the side of the air guide plate 210 away from the center of the air inlet 131 and is connected to the air guide plate 210. The connector 220 has an assembly part 221, which cooperates with the mounting part 111 on the body of the air guide cover 120. When the assembly part 221 is connected to the mounting part 111 again, the position of the assembly part 221 relative to the mounting part 111 can be changed to adjust the position of the air guide plate 210 relative to the air inlet 131, thereby adjusting the air inlet angle of the air inlet 131. This allows the air inlet angle of the air inlet 131 to be changed according to different heat dissipation requirements, improving the flexibility and adaptability of the air guide cover module 10.

[0080] Specifically, when the assembly part 221 is reconnected to the mounting part 111, the connector 220 can be rotated relative to the mounting part 111. This allows the connector 220 to drive the air guide plate 210 to rotate, causing the angle between the air guide plate 210 and the air inlet 131 to change, thereby altering the air inlet angle of the cooling air.

[0081] For example, when the component 30 to be cooled is a RAID card or other component 30 with high heat dissipation requirements, the user can rotate the connector 220 after disassembling the assembly part 221 to increase the angle between the air guide plate 210 and the air inlet 131. This can guide more cooling air into the placement cavity 130, thereby improving heat dissipation efficiency.

[0082] Please refer to Figures 1 to 5 In some embodiments, one of the assembly part 221 and the mounting part 111 has a connection port and the other has a connecting shaft. The connecting shaft is disposed in the connection port and is configured such that when the connecting shaft is disposed in the connection port again, the position of the air guide 200 relative to the air inlet 131 can be adjusted.

[0083] Specifically, in this embodiment, the assembly part 221 has a connecting shaft, and the mounting part 111 has a connecting port. The connecting shaft is located inside the connecting port, so that when the assembly part 221 is reconnected to the mounting part 111, the connecting shaft can be rotated to change the position of the air guide 200 relative to the air inlet 131, thereby changing the air inlet angle. This allows the user to flexibly adjust the angle between the air guide plate 210 and the air inlet 131, thereby changing the air inlet angle and coverage of the cooling air.

[0084] In other embodiments, the assembly part 221 has a connection port, and the mounting part 111 has a connecting shaft. The connecting shaft is also located within the connection port, so that when the assembly part 221 is reconnected to the mounting part 111, the connecting shaft can be rotated to change the position of the air guide 200 relative to the air inlet 131, thereby changing the air inlet angle.

[0085] In this embodiment, no restrictions are placed on the connection method between the connecting shaft and the connecting port; an adaptive selection can be made according to actual needs.

[0086] Please refer to Figures 1 to 5 In some embodiments, when the connecting shaft is located inside the connecting port, the connecting port is used to restrict the rotation of the connecting shaft within the connecting port. By restricting the rotation of the connecting shaft, it can be ensured that the air guide 200 can maintain a stable position and angle after installation, and prevent the air guide 200 from rotating or shifting due to the airflow impact of the cooling air or other external forces, thus ensuring the stability and reliability of the air guide shroud module 10.

[0087] Please refer to Figures 1 to 5In some embodiments, the inner wall of the connection port has a first meshing tooth, and the circumferential direction of the connecting shaft has a second meshing tooth. When the connecting shaft is located inside the connection port, the second meshing tooth meshes with the first meshing tooth.

[0088] Specifically, in this embodiment, the inner wall of the connection port has a first meshing tooth, and the circumferential direction of the connecting shaft has a second meshing tooth. When the connecting shaft is located inside the connection port, the second meshing tooth meshes with the first meshing tooth, thereby achieving a stable connection between the connecting shaft and the connection port through the meshing between the first and second meshing teeth, preventing the connecting shaft from rotating inside the connection port, and further ensuring the stability of the air guide 200.

[0089] In this embodiment, no restrictions are placed on the shape and size of the first and second meshing teeth, and an adaptive selection can be made according to actual needs.

[0090] It should also be noted that the more teeth the first and second meshing teeth have, the higher the adjustment precision of the connecting shaft, meaning the more angles the user can select for the air guide 200. Conversely, the fewer teeth the connecting shaft has, the lower the adjustment precision, meaning the fewer angles the user can select for the air guide 200. This allows for adaptive selection based on actual needs.

[0091] Please refer to Figures 1 to 5 In some embodiments, the inner wall of the connector is formed by a polygonal hole, which is a centrally symmetrical structure. The circumferential direction of the connecting shaft is adapted to the structure of the polygonal hole.

[0092] Specifically, the polygonal holes in the centrally symmetrical structure are evenly distributed on each side and at each corner, allowing the connecting shaft to be inserted into the connector at various angles. Furthermore, due to the shape matching between the polygonal holes and the connecting shaft, the inner wall of the polygonal holes and the circumference of the connecting shaft are in close contact when inserted, preventing the connecting shaft from rotating due to airflow impact from cooling air or other external forces. Additionally, when the angle of the air guide 200 needs adjustment, the connecting shaft can be removed, rotated to the desired angle, and then reinserted into the connector.

[0093] In this embodiment, no restrictions are placed on the specific structure of the polygonal hole. The structure and size of the polygonal hole can be selected adaptively according to actual needs.

[0094] For example, the polygonal hole is a hexagonal hole, and the connecting shaft can achieve angle adjustment in six directions.

[0095] Please refer to Figures 1 to 5In some embodiments, there are multiple air guide hoods 120. The air guide hoods 120 are spaced apart in the support member 110 along the first direction and together with the support member 110 define a number of placement cavities 130. Each placement cavity 130 has one or two air guides 200 on the side with the air inlet 131.

[0096] Specifically, in this embodiment, by setting multiple air guide shrouds 120 and air guide components 200, the heat dissipation components 30 with different heat dissipation requirements can be placed in different placement cavities 130 according to their heat dissipation requirements, thereby flexibly adjusting the flow rate and coverage of the cooling air.

[0097] For example, for the heat dissipation component 30 with high heat dissipation requirements, two air guides 200 can be provided in the placement cavity 130 corresponding to the heat dissipation component 30, and the position of the air guides 200 can be adjusted to increase the air inlet angle, thereby increasing the flow rate and coverage of the cooling air. For the heat dissipation component 30 with low heat dissipation requirements, two air guides 200 can be provided in the placement cavity 130 corresponding to the heat dissipation component 30, and the position of the air guides 200 can be adjusted to decrease the air inlet angle, thereby increasing the flow rate and coverage of the cooling air.

[0098] Meanwhile, for the heat dissipation component 30 with lower heat dissipation requirements, the placement cavity 130 where the heat dissipation component 30 with lower heat dissipation requirements is located can be arranged adjacent to the placement cavity 130 where the heat dissipation component 30 with higher heat dissipation requirements is located. Thus, the two adjacent placement cavities 130 can share a single air guide 200. The air inlet angle of the air guide 200 can be adjusted between 0° and 180°. This allows the air inlet angle of the placement cavity 130 with lower heat dissipation requirements to be reduced, thereby increasing the air inlet angle of the placement cavity 130 with higher heat dissipation requirements. This eliminates the need to set up multiple air guides 200 for separate adjustment, further saving manufacturing costs.

[0099] When two air guides 200 are provided on the side of the same placement cavity 130 where the air inlet 131 is located, the two air guides 200 are arranged sequentially along the first direction on the side of the placement cavity 130 where the air inlet 131 is located. The module body 100 is provided with a mounting part 111 at the position corresponding to each air guide 200, so that each air guide 200 can be independently installed and adjusted through the mounting part 111.

[0100] Please refer to Figures 1 to 5 Secondly, this embodiment provides an electronic device including a housing 20, a fan, and an air guide module 10 as described in any of the first aspects. The air guide module 10 is disposed inside the housing 20 and is opposite to the air outlet side of the fan.

[0101] The fan is housed inside the housing 20 so that the air guide module 10 is opposite to the air outlet side of the fan.

[0102] In this embodiment, the electronic device is a server chassis. In other embodiments, the electronic device may be other devices that require heat dissipation. This embodiment does not impose any restrictions on this.

[0103] The electronic device provided in this embodiment includes the air guide module 10 of any one of the first aspects. Therefore, the electronic device has the beneficial effects of the air guide module 10. By adjusting the position of the air guide 200, the flow direction of the cooling air can be changed according to the heat dissipation requirements of different heat dissipation components 30, so as to ensure the heat dissipation effect of different heat dissipation components 30, improve the adaptability and flexibility of the air guide module 10, enable the electronic device to maintain good heat dissipation, and extend the service life of the electronic device.

[0104] Finally, it should be noted that other embodiments of this utility model will readily occur to those skilled in the art upon consideration of the specification and practice of the utility model disclosed herein. This utility model is intended to cover any variations, uses, or adaptations of this utility model that follow the general principles of this utility model and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this utility model is limited only by the appended claims.

Claims

1. A wind deflector module, characterized by, include: The module body includes a support member and an air guide shroud. The air guide shroud is disposed inside the support member and together with the support member on the side of the air guide shroud, defines a placement cavity. The placement cavity has an air inlet on the side facing the fan. The module body has a mounting section; The heat dissipation element is disposed within the placement cavity; An air guide is located on the side of the placement cavity where the air inlet is located. The air guide is used to guide the cooling air output by the fan into the placement cavity. The air guide includes an assembly part, which is connected to and fixed relative to the mounting part. The assembly part is detachable. The assembly part is configured such that when it is reconnected to the mounting part, the position of the air guide relative to the air inlet can be adjusted.

2. The wind deflector module of claim 1, wherein, The air guide cover has a mounting part on one side adjacent to the air inlet, and the mounting part is connected to and fixed relative to the carrier.

3. The wind deflector module of claim 1, wherein, The support member has the mounting portion on the side adjacent to the air inlet.

4. The wind cone module of claim 1, wherein, The air guide further includes an air guide plate and a connector. The air guide plate is located on the side of the placement cavity where the air inlet is located and is opposite to the air inlet. The connector is located on the side of the air guide plate away from the center of the air inlet and is connected to the air guide plate. The connector has the assembly part. The assembly part is configured such that when it is reconnected to the mounting part, the position of the assembly part relative to the mounting part can be changed to adjust the position of the air guide plate relative to the air inlet.

5. The wind deflector module of claim 4, wherein, One of the assembly part and the mounting part has a connection port, and the other has a connecting shaft. The connecting shaft is disposed in the connection port, and the connecting shaft is configured such that when it is disposed in the connection port again, the position of the air guide relative to the air inlet can be adjusted.

6. The wind cone module of claim 5, wherein, When the connecting shaft is located within the connecting port, the connecting port is used to restrict the rotation of the connecting shaft within the connecting port.

7. The wind cone module of claim 6, wherein, The inner wall of the connection port has a first meshing tooth, and the circumferential direction of the connecting shaft has a second meshing tooth. When the connecting shaft is located inside the connection port, the second meshing tooth meshes with the first meshing tooth.

8. The air guide shroud module according to claim 6, characterized in that, The inner wall of the connection port forms a polygonal hole, which is a centrally symmetrical structure. The circumferential direction of the connecting shaft is adapted to the structure of the polygonal hole.

9. A cowling module according to any one of claims 1-8, characterized in that The number of air guide hoods is multiple, and the air guide hoods are spaced apart within the support member along a first direction, and together with the support member, define a plurality of placement cavities. Each placement cavity has one or two air guides on the side with the air inlet. When the same placement cavity has two air guides on the side with the air inlet: Two air guides are sequentially arranged along the first direction on the side of the placement cavity where the air inlet is located, and the module body is provided with a mounting part at the position corresponding to each air guide.

10. An electronic device, comprising: include: case; A fan, wherein the fan is disposed within the housing; The air guide module as described in any one of claims 1-9 is disposed within the housing and is opposite to the air outlet side of the fan.