A packaging structure of a thin film capacitor core
By incorporating a silicone gasket into the film capacitor core encapsulation structure and utilizing the outer shell and plastic shell for compression, the problem of potting compound leakage is solved, encapsulation efficiency and reliability are improved, and overflow is avoided.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUNAN AIYUANDA CAPACITOR CO LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-07-03
Smart Images
Figure CN224457889U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to a thin-film capacitor, and more particularly to a packaging structure for a thin-film capacitor core. Background Technology
[0002] In the encapsulation of film capacitors, the core needs to be encapsulated within a plastic shell to secure it. A potting compound is required to connect and fix the plastic and aluminum shells. During potting, the potting compound flows between the plastic and aluminum shells. To prevent the potting compound from leaking out of the electrode lead-out holes on the aluminum shell, these holes need to be sealed. The traditional method is to manually seal the areas requiring sealing with silicone sealant beforehand. However, this method is inefficient, and the amount of silicone sealant used is difficult to control, easily leading to excessive silicone sealant overflow at the sealing site. Utility Model Content
[0003] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a packaging structure for a thin-film capacitor core.
[0004] To solve the above-mentioned technical problems, the technical solution proposed by this utility model is as follows: a packaging structure for a thin-film capacitor core, characterized in that: it includes a shell, a plastic shell, and a core; the plastic shell is disposed inside the shell, and the core is encapsulated inside the plastic shell by potting compound; the plastic shell and the shell are respectively provided with a first lead-out hole and a second lead-out hole for leading out the core electrode; the first lead-out hole is disposed above the second lead-out hole; a silicone gasket is disposed around the second lead-out hole, and the shell and the plastic shell compress the silicone gasket.
[0005] In the aforementioned encapsulation structure of the thin-film capacitor core, preferably, the outer casing is provided with an annular groove for mounting a silicone gasket; after the silicone gasket is placed in the annular groove, the top of the silicone gasket extends out of the annular groove.
[0006] In the above-mentioned encapsulation structure of the thin-film capacitor core, preferably, an electrode lead-out cavity is provided on the first lead-out hole, and the electrode lead-out cavity passes through the second lead-out hole on the outer shell; the electrode lead-out cavity is integrally formed with the plastic shell.
[0007] In the aforementioned encapsulation structure of the thin-film capacitor core, preferably, a support post for the core is provided on the inner bottom surface of the plastic shell.
[0008] Compared with the prior art, the advantages of this utility model are as follows: In this utility model, by setting silicone gaskets around the second lead hole of the lead core electrode and squeezing the silicone gaskets with the outer shell and plastic shell, the silicone gaskets block the epoxy resin after it is injected, thereby preventing the epoxy resin from flowing out from the position of the second lead hole on the aluminum shell. Attached Figure Description
[0009] Figure 1 This is a schematic diagram of the packaging structure of the thin-film capacitor core in Example 1.
[0010] Figure 2 This is a schematic diagram of the installation structure of the silicone gasket in Example 1.
[0011] Figure 3 This is a schematic diagram of the electrode lead-out cavity in Example 1.
[0012] Legend
[0013] 1. Outer shell; 11. Second lead-out hole; 12. Annular groove; 2. Plastic shell; 21. First lead-out hole; 22. Support column; 3. Core; 4. Silicone gasket; 5. Electrode lead-out cavity. Detailed Implementation
[0014] To facilitate understanding of this utility model, it will be described more comprehensively and in detail below with reference to the accompanying drawings and preferred embodiments. However, the scope of protection of this utility model is not limited to the following specific embodiments.
[0015] It should be noted that when a component is described as being "fixed to, attached to, connected to or connected to" another component, it can be directly fixed to, attached to, connected to or connected to the other component, or it can be indirectly fixed to, attached to, connected to or connected to the other component through other intermediate connectors.
[0016] Unless otherwise defined, all technical terms used herein have the same meaning as commonly understood by those skilled in the art. The technical terms used herein are for the purpose of describing particular embodiments only and are not intended to limit the scope of protection of this invention. Example 1
[0017] like Figure 1 The diagram illustrates a packaging structure for a thin-film capacitor core 3, comprising a housing 1, a plastic shell 2, and a core 3. The plastic shell 2 is disposed within the housing 1, and the core 3 is encapsulated within the plastic shell 2 using potting compound. The potting compound is epoxy resin, which has high fluidity before curing. In this embodiment, the plastic shell 2 and the housing 1 are respectively provided with lead-out holes for the electrodes of the core 3, and the electrodes of the core 3 are copper busbars. For distinction, the lead-out hole on the plastic shell 2 is called the first lead-out hole 21, and the lead-out hole on the housing 1 is called the second lead-out hole 11. The first lead-out hole 21 is located above the second lead-out hole 11; a silicone gasket 4 is disposed around the second lead-out hole 11, and the housing 1 and the plastic shell 2 press against the silicone gasket 4.
[0018] In this embodiment, the Shore hardness of the silicone pad is about 40HA, and the weight of the plastic shell 2 and the core 3 can be used to compress the silicone pad. In order to further ensure the compression of the silicone pad, the plastic shell 2 can be fixed to the outer shell 1 with bolts or fixing pins.
[0019] In this embodiment, the outer shell 1 is made of aluminum. An annular groove 12 for mounting the silicone gasket 4 is provided on the outer shell 1. After the silicone gasket 4 is placed in the annular groove 12, the top of the silicone gasket 4 extends out of the annular groove 12, allowing the plastic shell 2 to press against the silicone gasket 4. In this embodiment, during assembly, the silicone gasket 4 is simply placed flat in the annular groove 12, and then the plastic shell 2 is placed inside the aluminum shell to press against the silicone gasket 4.
[0020] In this embodiment, by setting a silicone gasket 4 around the second lead hole 11 of the lead core 3 electrode and pressing the silicone gasket 4 between the outer shell 1 and the plastic shell 2, the silicone gasket blocks the epoxy resin after it is injected, thereby preventing the epoxy resin from flowing out from the position of the second lead hole 11 on the aluminum shell.
[0021] In this embodiment, as Figure 2 and Figure 3 As shown, an electrode lead-out cavity 5 is provided on the first lead-out hole 21, and the electrode lead-out cavity 5 passes through the second lead-out hole 11 on the outer shell 1; the electrode lead-out cavity 5 is integrally formed with the plastic shell 2. The copper busbar on the core 3 passes directly through the electrode lead-out cavity 5, so that the electrode lead-out cavity 5 can separate the copper busbar from the outer shell 1 to prevent short circuit.
[0022] In this embodiment, as Figure 2 As shown, the inner bottom surface of the plastic shell 2 is provided with a support post 22 for the core 3. When the core 3 is encapsulated in the plastic shell 2, the core 3 is first placed stably inside the plastic shell 2, at which time the lower end face of the core 3 is gently placed on the support post 22; there is a gap between the lower end face of the core 3 and the bottom surface of the plastic shell 2 to accommodate the copper busbar, thus facilitating the layout of the copper busbar; after the epoxy resin is poured in and cured, the core 3 and the copper busbar are fixed in the plastic shell 2 by the epoxy resin.
Claims
1. A packaging structure for a thin-film capacitor core, characterized in that: It includes an outer shell, a plastic shell, and a core; the plastic shell is disposed inside the outer shell, and the core is encapsulated inside the plastic shell by potting compound; the plastic shell and the outer shell are respectively provided with a first lead-out hole and a second lead-out hole for leading out the core electrode; the first lead-out hole is located above the second lead-out hole; a silicone gasket is disposed around the second lead-out hole, and the outer shell and the plastic shell compress the silicone gasket.
2. The packaging structure of the thin-film capacitor core according to claim 1, characterized in that: The outer casing is provided with an annular groove for installing a silicone gasket; after the silicone gasket is placed into the annular groove, the top of the silicone gasket extends out of the annular groove.
3. The packaging structure of the thin-film capacitor core according to claim 1, characterized in that: The first lead-out hole is provided with an electrode lead-out cavity, which passes through the second lead-out hole on the outer shell; the electrode lead-out cavity is integrally formed with the plastic shell.
4. The packaging structure of the thin-film capacitor core according to claim 1, characterized in that: The inner bottom surface of the plastic shell is provided with a core support column.