Miniaturized thin-film chip coupler

Abstract

This application discloses a miniaturized thin-film chip coupler, including a PCB board and a first coupling line and a second coupling line disposed on the PCB board. The first coupling line has an input section and a direct output section at its two ends, respectively. The second coupling line has a coupling output section and a thin-film resistor at its two ends, respectively. Multiple first branches and multiple second branches protrude from the opposite ends of the first and second coupling lines, respectively. Multiple third coupling branches and multiple fourth coupling branches protrude from the facing ends of the first and second coupling lines, respectively. A pair of fifth coupling branches protrude from the ends of the first coupling line facing the second coupling line, and a pair of sixth coupling branches protrude from the ends of the second coupling line facing the first coupling line. This miniaturized thin-film chip coupler, through structural design, simplifies the circuit structure, improves product consistency, and can meet the requirements of mass production while reducing costs.

Description

Technical Field

[0001] This application relates to the field of coupler technology, and in particular to a miniaturized thin-film chip coupler. Background Technology

[0002] Currently, while traditional air stripline waveguide-based couplers offer good performance, their large size often fails to meet practical application requirements. Subsequent microstrip line-based coupler designs have further reduced device size and expanded the applicable scenarios. However, for some applications, couplers based on traditional fabrication and structure designs are still too large to meet the miniaturization and integrability requirements of modern communication systems. Utility Model Content

[0003] The purpose of this invention is to provide a miniaturized thin-film chip coupler to overcome the shortcomings of the prior art.

[0004] To achieve the above objectives, this utility model provides the following technical solution:

[0005] This application discloses a miniaturized thin-film chip coupler, characterized in that it includes a PCB board and a first coupling line and a second coupling line disposed on the PCB board. The two ends of the first coupling line are respectively provided with an input section and a direct output section. The two ends of the second coupling line are respectively provided with a coupling output section and a thin-film resistor. The opposite end faces of the first and second coupling lines are respectively provided with a plurality of first branches and a plurality of second branches. The opposite end faces of the first and second coupling lines are respectively provided with a plurality of third coupling branches and a plurality of fourth coupling branches. The two ends of the first coupling line facing the second coupling line are provided with a pair of fifth coupling branches. The two ends of the second coupling line facing the first coupling line are provided with a pair of sixth coupling branches.

[0006] Preferably, in the miniaturized thin-film chip coupler described above, the first coupling line and the second coupling line are arranged in parallel.

[0007] Preferably, in the miniaturized thin-film chip coupler described above, a plurality of third coupling branches are arranged one-to-one with a plurality of first branches, and a plurality of fourth coupling branches are arranged one-to-one with a plurality of second branches.

[0008] Preferably, in the miniaturized thin-film chip coupler described above, a plurality of the fourth coupling branches are arranged one-to-one between adjacent third coupling branches.

[0009] Preferably, in the miniaturized thin-film chip coupler described above, the input section, the direct output section, and the coupled output section are all provided with metallized vias.

[0010] Preferably, in the above miniaturized thin-film chip coupler, the PCB board is an aluminum nitride ceramic substrate.

[0011] Preferably, in the above miniaturized thin-film chip coupler, the thin-film resistor is printed on the PCB board by thin-film technology.

[0012] Compared with the prior art, the advantages of the present utility model are as follows:

[0013] By utilizing the high dielectric constant and high thermal conductivity characteristics of the aluminum nitride ceramic substrate, while realizing the miniaturized design of the circuit, the power tolerance characteristics of the circuit are improved; by printing the isolation resistor on the ceramic dielectric substrate by thin-film technology, the simplification and miniaturization of the circuit are realized; by loading coupling branches on two coupling lines, the adjustment of the odd and even mode phase velocities of the circuit is achieved, the directivity of the circuit is improved, the distance between the two coupling lines is enlarged, and the sensitivity of the circuit to processing tolerances is reduced; the branches loaded outside the two coupling lines are equivalent to loading a capacitance to the ground, realizing further miniaturization of the circuit; the circuit structure is simple, the product consistency is good, it can meet mass production and reduce costs. Description of the Drawings

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings described below are only some embodiments recorded in the present application. For those of ordinary skill in the art, other drawings can be obtained without creative efforts based on these drawings.

[0015] Figure 1 The following shows a schematic structural diagram of the miniaturized thin-film chip coupler in a specific embodiment of the present utility model. Detailed Embodiments

[0016] The following will combine the drawings in the embodiments of the present utility model to describe the technical solutions in the embodiments of the present utility model in detail. Obviously, the described embodiments are only some embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.

[0017] Refer Figure 1As shown, the miniaturized thin-film chip coupler in this embodiment includes a PCB board 1 and a first coupling line 2 and a second coupling line 3 disposed on the PCB board 1. The two ends of the first coupling line 2 are respectively provided with an input part 4 and a direct output part 5. The two ends of the second coupling line 3 are respectively provided with a coupling output part 6 and a thin-film resistor 7. Multiple first branches 8 and multiple second branches 9 are respectively protruding on the opposite end faces of the first coupling line 2 and the second coupling line 3. Multiple third coupling branches 10 and multiple fourth coupling branches 11 are respectively protruding on the facing end faces of the first coupling line 2 and the second coupling line 3. A pair of fifth coupling branches 12 are protruding on the end faces of the first coupling line 2 facing the second coupling line 3. A pair of sixth coupling branches 13 are protruding on the end faces of the second coupling line 3 facing the first coupling line 2.

[0018] Furthermore, the first coupling line 2 and the second coupling line 3 are arranged in parallel.

[0019] Furthermore, multiple third coupling branches 10 are configured to correspond one-to-one with multiple first branches 8, and multiple fourth coupling branches 11 are configured one-to-one with multiple second branches 9.

[0020] Furthermore, multiple fourth coupling branches 11 are arranged one-to-one between adjacent third coupling branches 10.

[0021] Furthermore, the input section 4, the direct output section 5, and the coupled output section 6 are all provided with metallized vias 14.

[0022] Furthermore, PCB board 1 is an aluminum nitride ceramic substrate. By utilizing the high dielectric constant and high thermal conductivity of the aluminum nitride ceramic substrate, the circuit can be miniaturized while improving its power handling characteristics.

[0023] Furthermore, the thin-film resistor 7 is printed on the PCB board 1 using a thin-film process. By printing the isolation resistor on the ceramic dielectric substrate using a thin-film process, the circuit design is simplified and miniaturized.

[0024] In this technical solution, the odd and even mode phase velocities of the circuit are adjusted by loading coupling stubs through two coupling lines, which improves the circuit's orientation and expands the spacing between the two coupling lines, reducing the circuit's sensitivity to manufacturing tolerances. The externally loaded stubs of the two coupling lines are equivalent to loading capacitance to ground, which further miniaturizes the circuit. The circuit structure is simple, the product consistency is good, and it can meet the needs of mass production and reduce costs.

[0025] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0026] The above are merely specific embodiments of this application. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A miniaturized film chip coupler, characterized by: The device includes a PCB board and a first coupling line and a second coupling line disposed on the PCB board. The first coupling line has an input section and a direct output section at its two ends, and the second coupling line has a coupling output section and a thin film resistor at its two ends, respectively. Multiple first branches and multiple second branches are protruding on the opposite end faces of the first and second coupling lines, and multiple third coupling branches and multiple fourth coupling branches are protruding on the facing end faces of the first and second coupling lines, respectively. A pair of fifth coupling branches are protruding on the end faces of the first and second coupling lines facing the second coupling line, and a pair of sixth coupling branches are protruding on the end faces of the second and second coupling lines facing the first coupling line.

2. The miniaturized film chip coupler of claim 1, wherein: The first coupling line and the second coupling line are arranged in parallel.

3. The miniaturized film chip coupler of claim 1, wherein: The plurality of third coupling branches are configured one-to-one with the plurality of first branches, and the plurality of fourth coupling branches are configured one-to-one with the plurality of second branches.

4. The compact thin film chip coupler of claim 1, wherein: Multiple fourth coupling branches are arranged one-to-one between adjacent third coupling branches.

5. The compact thin film chip coupler of claim 1, wherein: The input section, direct output section, and coupled output section are all provided with metallized vias.

6. The miniature film chip coupler according to claim 1, wherein: The PCB board is an aluminum nitride ceramic substrate.

7. The miniature film chip coupler according to claim 1, wherein: The thin-film resistor is printed on the PCB board using a thin-film process.

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