FPC single-sided panel with hollowing

Abstract

This utility model discloses an FPC cutout single-sided panel, including a first protective film, a copper circuit layer, and a second protective film. The first protective film has a first cutout area. The copper circuit layer has multiple vias located below the first cutout area, which are used for inserting DIP connectors. The second protective film is attached to the bottom of the copper circuit layer and has a second cutout area, which corresponds to and is offset from the first cutout area. The first cutout area on the first protective film and the second cutout area on the second protective film provide space and convenience for DIP connector insertion. The offset arrangement of the second cutout area from the first cutout area avoids pad recesses, ensuring smooth DIP connector insertion. This allows for the replacement of the original FPC double-sided panel with an FPC cutout single-sided panel, making full use of existing equipment, reducing processing costs, and improving product quality.

Description

Technical Field

[0001] This utility model relates to the field of flexible printed circuit board technology, and in particular to an FPC hollow single-sided panel. Background Technology

[0002] When manufacturing battery cells for new energy vehicles and energy storage, DIP (Dual In-line Package) connectors need to be inserted into FPC boards. However, the soldering surfaces of DIP connectors and nickel strips are not the same, so double-sided FPC boards are usually used. The double-sided FPC solution has the following problems: First, for ultra-long double-sided FPC boards exceeding 1 meter, drilling, copper plating, and exposure cannot be processed using existing equipment; second, copper thickness is difficult to control during copper plating, making it difficult to control the fusing value of circuit fuses; third, the processing steps for double-sided FPC boards are numerous and the processing cost is high. Therefore, in terms of product quality and processing cost, it cannot meet customer requirements. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes an FPC perforated single-sided panel that can be processed using existing equipment, reducing processing costs and improving product quality.

[0004] This utility model embodiment provides an FPC cutout single-sided panel, including:

[0005] A first protective film, wherein the first protective film has a first hollow area;

[0006] A copper layer with multiple vias located below the first cutout area, the vias being used to insert a DIP connector.

[0007] The second protective film is attached to the copper layer of the circuit. The second protective film has a second hollow area, which corresponds to and is offset from the first hollow area.

[0008] According to some embodiments of this utility model, the misalignment distance between the second hollow area and the first hollow area is ≥0.5mm.

[0009] According to some embodiments of the present invention, a pad is provided on the adjacent side of the via, and the edge-to-edge distance from the opening position of the pad to the adjacent via is ≥0.5mm.

[0010] According to some embodiments of the present invention, the first protective film includes a first film layer and a first adhesive layer, and the thickness of the first film layer and the first adhesive layer is 25±0.1μm.

[0011] According to some embodiments of the present invention, the second protective film includes a second film layer and a second adhesive layer, both of which have a thickness of 25±0.1μm.

[0012] According to some embodiments of the present invention, both the first film layer and the second film layer are made of polyimide film.

[0013] According to some embodiments of the present invention, both the first adhesive layer and the second adhesive layer are thermosetting adhesive layers.

[0014] According to some embodiments of the present invention, the copper layer of the circuit is an RA copper layer, and the thickness of the copper layer of the circuit is 35±0.1μm.

[0015] According to some embodiments of the present invention, a reinforcing sheet is provided at the position of the second protective film in the second hollow area.

[0016] According to some embodiments of this utility model, the reinforcing sheet is made of metal sheet or FR-4 plate.

[0017] The embodiments of this utility model have at least the following beneficial effects:

[0018] The aforementioned FPC cutout single-sided board includes a first protective film, a copper circuit layer, and a second protective film. The first cutout area on the first protective film and the second cutout area on the second protective film provide space and convenience for DIP connector insertion. Multiple vias on the copper circuit layer are used for DIP connector insertion. The staggered arrangement of the second cutout area and the first cutout area avoids pad depressions, ensuring smooth DIP connector insertion, guaranteeing soldering quality, and effectively preventing pad depressions caused by the cutout structure, thus achieving good circuit connection. This allows for the replacement of the original FPC double-sided board with an FPC cutout single-sided board, making full use of existing equipment, reducing processing costs, and improving product quality.

[0019] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0021] Figure 1 This is a schematic diagram of the structure of the FPC hollow single-sided board and DIP connector according to an embodiment of the present utility model;

[0022] Figure 2 for Figure 1One of the schematic diagrams of the longitudinal cross-sectional structure of an FPC perforated single-sided panel is shown;

[0023] Figure 3 for Figure 1 The second schematic diagram of the longitudinal cross-sectional structure of the FPC perforated single-sided panel is shown.

[0024] Figure 4 This is a schematic diagram of the front circuitry of an FPC cutout single-sided panel according to an embodiment of the present invention.

[0025] Figure label:

[0026] First protective film 100, first film layer 110, first adhesive layer 120, first cutout area 130, circuit copper layer 200, via 210, second protective film 300, second film layer 310, second adhesive layer 320, second cutout area 330, DIP connector 400. Detailed Implementation

[0027] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0028] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0029] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first," "second," etc., are used in the description, they are only for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the sequential relationship of the indicated technical features.

[0030] In the description of this utility model, unless otherwise explicitly defined, the terms "setting", "installing", "connecting", "linking", etc. should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in combination with the specific content of the technical solution.

[0031] Please refer to Figure 1 and Figure 2 This embodiment discloses an FPC cutout single-sided panel, which includes a first protective film 100, a copper circuit layer 200, and a second protective film 300. The first protective film 100 has a first cutout area 130. The copper circuit layer 200 is provided with a plurality of vias 210, which are located below the first cutout area 130 and are used to insert DIP connectors 400. The second protective film 300 is attached to the bottom of the copper circuit layer 200 and has a second cutout area 330. The second cutout area 330 corresponds to and is offset from the first cutout area 130. The offset setting means that the coverage areas of the first cutout area 130 and the second cutout area 330 overlap but do not completely coincide on the projection surface of the copper circuit layer 200.

[0032] A first protective film 100, a copper circuit layer 200, and a second protective film 300 are sequentially attached from top to bottom. The first protective film 100 protects the copper circuit layer 200 from external damage, while the second protective film 300 further protects the copper circuit layer 200 and forms a complete protective structure. A first cutout area 130 on the first protective film 100 and a second cutout area 330 on the second protective film 300 provide space and convenience for the insertion of the DIP connector 400. Multiple vias 210 on the copper circuit layer 200 are used for inserting the DIP connector 400. The staggered arrangement of the second cutout area 330 and the first cutout area 130 avoids pad depressions, ensuring smooth insertion of the DIP connector, guaranteeing soldering quality, effectively preventing pad depressions caused by structural cutouts, and achieving good circuit connection. This allows for the replacement of the original double-sided FPC with a single-sided FPC with a cutout design. For ultra-long FPC single panels exceeding 1m, existing equipment can be used for drilling, copper plating, and exposure. During copper plating, the copper thickness is easier to control. This shortens the processing flow, reduces processing costs, and improves product quality.

[0033] Please refer to Figure 3 In some embodiments, the misalignment distance between the second cutout region 330 and the first cutout region 130 is ≥0.5mm. For example, Figure 3 The distance indicated by mark D1 is the misalignment distance between the second cutout area 330 and the first cutout area 130. The vertical misalignment is to ensure that the pad surface does not sink. By reasonably distributing the structural stress, the stress concentration on a foundation is effectively dispersed, thereby avoiding sinking or deformation of the pad area due to excessive local stress, making the overall structure more stable and ensuring the flatness of the pad surface.

[0034] Please refer to Figure 3 In some embodiments, a pad is provided adjacent to the via 210, and the edge-to-edge distance from the opening position of the pad to the adjacent via 210 is ≥0.5mm. For example, Figure 3The distance indicated by mark D2 is the edge-to-edge distance from the opening position of the pad to the adjacent via 210. Setting a certain edge-to-edge distance ensures the solder area on the solder ring and avoids poor soldering due to insufficient solder area.

[0035] Please refer to Figure 3 In some embodiments, the first protective film 100 includes a first film layer 110 and a first adhesive layer 120, both with a thickness of 25±0.1μm. The first film layer 110 provides good wear resistance, effectively protecting the copper layer 200 from external environmental damage; through the adhesive effect of the first adhesive layer 120, the first film layer 110 can be tightly adhered to the substrate surface, providing long-term protection. The thickness of both the first film layer 110 and the first adhesive layer 120 (25±0.1μm) isolates moisture, chemicals, and dust, preventing oxidation and corrosion of the copper foil; and possesses a certain mechanical strength to prevent damage from bending, friction, or external forces, thus improving durability.

[0036] Please refer to Figure 3 In some embodiments, the second protective film 300 includes a second film layer 310 and a second adhesive layer 320, both with a thickness of 25±0.1μm. The second film layer 310 provides good wear resistance, effectively protecting the copper layer 200 from external environmental damage; through the adhesive effect of the second adhesive layer 320, the second film layer 310 can be tightly adhered to the substrate surface, providing long-term protection. The thickness of both the second film layer 310 and the second adhesive layer 320 (25±0.1μm) isolates moisture, chemicals, and dust, preventing oxidation and corrosion of the copper foil; and possesses a certain mechanical strength to avoid damage from bending, friction, or external forces, thus improving durability.

[0037] Please refer to Figure 3 In some embodiments, both the first film layer 110 and the second film layer 310 are made of polyimide film. Polyimide film has excellent high and low temperature resistance, electrical insulation, and adhesion.

[0038] Please refer to Figure 3 In some embodiments, both the first adhesive layer 120 and the second adhesive layer 320 are thermosetting adhesive layers. The first film layer 110 is bonded to the copper circuit layer 200, and the second film layer 310 is bonded to the copper circuit layer 200, using thermosetting adhesive.

[0039] Please refer to Figure 1In some embodiments, the circuit copper layer 200 is a RA copper layer (Rolled Annealed copper), and the thickness of the circuit copper layer 200 is 35±0.1μm. Rolled copper has good flexibility and is resistant to bending; controlling the thickness at 35±0.1μm helps to minimize the volume of the copper layer while ensuring electrical performance, thereby improving the overall utilization efficiency and size of the circuit board, and effectively preventing problems such as electrical performance fluctuations and cracking caused by excessive thickness or thinness.

[0040] Please refer to Figure 2 and Figure 4 In some embodiments, a reinforcing sheet is provided on the second protective film 300 at the location of the second hollow area 330; the reinforcing sheet is made of metal sheet or FR-4 plate. The reinforcing sheet is used to enhance the structural strength of the second hollow area 330 and prevent the overall structure from becoming weak and damaged due to the hollowing during use. The reinforcing sheet is made of metal sheet or FR-4 plate, which has good rigidity and can effectively improve the load-bearing capacity of the second hollow area 330.

[0041] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. An FPC hollowed-out single-sided panel, characterized by, include: A first protective film (100) has a first hollow area (130). A copper layer (200) is provided with a plurality of vias (210), the vias (210) being located below the first cutout area (130), and the vias (210) being used to insert a DIP connector (400). The second protective film (300) is attached to the copper layer (200) of the circuit. The second protective film (300) has a second hollow area (330) which corresponds to and is offset from the first hollow area (130).

2. The FPC hollowed single panel according to claim 1, wherein, The misalignment distance between the second hollow area (330) and the first hollow area (130) is ≥0.5mm.

3. The FPC hollowed single panel of claim 2, wherein, A pad is provided on the adjacent side of the via (210), and the edge-to-edge distance from the opening position of the pad to the adjacent via (210) is ≥0.5mm.

4. The FPC hollowed single panel of claim 1, wherein, The first protective film (100) includes a first film layer (110) and a first adhesive layer (120), and the thickness of the first film layer (110) and the first adhesive layer (120) is 25±0.1μm.

5. The FPC cutout single-sided panel according to claim 4, characterized in that, The second protective film (300) includes a second film layer (310) and a second adhesive layer (320), both of which have a thickness of 25±0.1μm.

6. The FPC hollowed single panel of claim 5, wherein, Both the first film layer (110) and the second film layer (310) are made of polyimide film.

7. The FPC hollowed single panel of claim 5, wherein, Both the first adhesive layer (120) and the second adhesive layer (320) are thermosetting adhesive layers.

8. The FPC hollowed single panel of claim 1, wherein, The line copper layer (200) is an RA copper layer, and the thickness of the line copper layer (200) is 35±0.1μm.

9. The FPC hollowed single panel of claim 1, wherein, The second protective film (300) is provided with a reinforcing sheet at the position of the second hollow area (330).

10. The FPC hollowed single panel of claim 9, wherein, The reinforcing sheet is made of metal sheet or FR-4 plate.

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