Heating module circuit board heat dissipation structure

Abstract

This utility model relates to a heat dissipation structure for a heating module circuit board, including a housing, a heat-conducting component, and a circuit board with a thyristor. Specifically: ① A partition in the housing separates the water tank and the mounting compartment, and the partition has heat-conducting holes; ② The heat-conducting component seals the heat-conducting holes and is in contact with the water flow; ③ The circuit board is located inside the mounting compartment, and the heat dissipation terminals of the thyristor are mounted on the heat-conducting component. This utility model utilizes active water flow for heat dissipation, solving the problem of heat accumulation in the thyristor within a compact space, while simultaneously isolating thermal interference to the temperature sensor; when applied to small liquid-containing electrical appliances such as smart toilets, it has advantages such as not occupying extra space, quiet operation, and high reliability.

Description

Technical Field

[0001] This utility model relates to the field of electric heater technology, specifically to a heat dissipation structure for a heating module circuit board. Background Technology

[0002] Ceramic heating elements, due to their advantages such as high power density and safety, are gradually becoming the core component of high-power heaters. For example, the water tank structure of a small-volume, high-power heater described in patent document CN217330247U heats the fluid inside the tank using ceramic heating elements. This heater integrates a control circuit board outside the water tank, monitors the outlet water temperature in real time using a temperature sensor, and adjusts the power of the ceramic heating element using a thyristor.

[0003] However, thyristors generate significant heat during operation, especially under frequent switching or high-load conditions, where their temperature rises sharply. Insufficient heat dissipation will lead to two problems: ① Decreased device reliability: Long-term high-temperature operation of thyristors will accelerate aging and may even cause thermal breakdown, resulting in control circuit failure; ② Temperature detection interference: The control board is usually located near the outlet temperature sensor, and the heat from the thyristor can easily be conducted through the circuit board to the sensor housing, interfering with the temperature sampling accuracy. Therefore, a heat dissipation solution is usually required for the thyristors.

[0004] The aforementioned small-volume, high-power heaters are mainly used in small appliances such as smart toilets. However, their heat dissipation solutions have significant limitations: ① Insufficient passive heat dissipation: The compact structure limits the heat dissipation space, and traditional aluminum heat sinks are difficult to conduct heat efficiently; ② Active heat dissipation is not applicable: Fan cooling increases size, power consumption, and noise, which contradicts the miniaturization and quiet operation requirements of instant heaters; ③ Lack of thermal isolation: Ordinary circuit board substrates have poor thermal conductivity, and heat accumulates in the thyristor area, which cannot be effectively dissipated. There is also a lack of thermal isolation design for temperature sensors.

[0005] Therefore, there is an urgent need for a heat dissipation structure for the heating module circuit board to achieve efficient heat dissipation of the thyristors within a limited space and ensure the long-term stable operation of the heating system. Utility Model Content

[0006] In order to achieve efficient heat dissipation of thyristors in a limited space, this utility model provides a heat dissipation structure for a heating module circuit board.

[0007] The technical solution adopted by this utility model is as follows: a heat dissipation structure for a heating module circuit board, comprising: a housing having a partition, wherein the two side cavities of the partition respectively form part of a water tank and an installation compartment, and the partition is provided with heat conduction holes; a heat conduction component that seals the heat conduction holes and is in contact with the water flow in the water tank; and a circuit board with a thyristor disposed in the installation compartment, wherein the heat dissipation terminals of the thyristor are connected and installed on the heat conduction component.

[0008] Preferably, the heat-conducting component includes an integral plate body and a heat-conducting bowl; the plate body is fixed to the side of the partition facing the mounting chamber, and the heat dissipation terminal is connected and installed on the plate body; the heat-conducting bowl is disposed in the middle of the plate body and is embedded and sealed in the heat-conducting hole.

[0009] Preferably, the partition is provided with guide ribs on the side facing the water tank, the guide ribs form a meandering flow channel, the flow channel is provided with baffles within the range of the heat conduction holes, and a flow gap is formed between the upper end of the baffles and the bottom of the heat conduction bowl.

[0010] Preferably, the plate body is fixed to the partition by screws.

[0011] Preferably, the heat-conducting hole is a stepped hole, and a sealing ring is provided between the stepped surface of the heat-conducting hole and the heat-conducting bowl.

[0012] Preferably, the edge of the board body maintains a gap of more than 5mm with the circuit board.

[0013] Preferably, the heat-conducting component is made of a metal material with a high thermal conductivity.

[0014] Preferably, the thyristor is arranged horizontally outside the circuit board, and the terminals of the thyristor are electrically connected to the circuit board.

[0015] This utility model has the following beneficial effects:

[0016] 1. High-efficiency heat conduction and heat dissipation: By directly sealing the heat conduction holes on the partition with heat-conducting components, the heat generated by the heat dissipation terminals of the thyristor is efficiently transferred to the flowing water in the water tank. The high specific heat capacity and flow characteristics of water are used to achieve active heat dissipation, which is significantly better than traditional air cooling or static heat sink solutions. This effectively suppresses the temperature rise of the thyristor and avoids the risk of device failure or thermal breakdown due to overheating.

[0017] 2. Thermal interference isolation: The partition physically separates the installation compartment from the water tank. Combined with the directional heat conduction path of the heat-conducting component, the heat from the thyristor is concentrated and guided to the water flow for dissipation. This greatly reduces the diffusion of heat to other areas of the circuit board and surrounding temperature sensors, effectively solving the problem of heat conduction through the circuit board substrate interfering with the temperature sampling accuracy and ensuring the accuracy of the temperature control system response.

[0018] 3. Compact structure: It makes full use of the existing water tank flow as a heat dissipation medium, without the need for additional cooling fans or large radiators. It fully meets the stringent requirements of small appliances such as smart toilets for space and quiet operation. The design of the heat-conducting bowl embedded with heat-conducting holes further optimizes the space layout.

[0019] 4. Heat dissipation stability: The combination of the flow channel and the baffle at the bottom of the heat-conducting bowl creates a flow gap, which forces the water to form turbulence in the heat-conducting area to maintain stable contact with the heat-conducting bowl and ensure heat dissipation stability.

[0020] 5. Reliability: The heat-conducting component adopts an integrated design of the plate body and the heat-conducting bowl, and is made of metal materials with high thermal conductivity such as aluminum alloy, brass or copper. It is designed with stepped holes and sealing rings, which not only reduces the interface thermal resistance, but also ensures the reliability and sealing of heat conduction under long-term operation.

[0021] 6. Easy installation: The board body is fixed to the partition with screws, and the thyristor is connected horizontally externally, which simplifies the assembly of the circuit board and the disassembly and assembly of the heat dissipation module, and facilitates production and replacement of faulty components. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the external appearance of an embodiment of the present utility model.

[0023] Figure 2 This is an exploded view of an embodiment of the present invention.

[0024] Figure 3 This is a schematic diagram of the box body in an embodiment of this utility model.

[0025] Figure 4 This is a cross-sectional schematic diagram of an embodiment of the present utility model.

[0026] 1-Box body, 1.1-Baffle, 1.2-Water tank, 1.3-Installation chamber, 1.4-Heat conduction hole, 1.5-Guide rib, 1.6-Flow channel, 1.7-Baffle, 1.8-Flow gap;

[0027] 2-Heat-conducting component, 2.1-Plate body, 2.2-Heat-conducting bowl;

[0028] 3-Circuit board, 3.1-Thyristor, 3.2-Heat dissipation terminal, 3.3-Wiring terminal;

[0029] 4-Sealing ring;

[0030] 5-Ceramic heating element;

[0031] 6-Box lid. Detailed Implementation

[0032] The present invention will be further described below with reference to the embodiments and accompanying drawings.

[0033] In the embodiments, such as Figures 1-4The diagram shows a heat dissipation structure for a heating module circuit board. The heating module is essentially the same as the water tank structure of the small-volume, high-power heater described in patent document CN217330247U, with improvements mainly focused on the heat dissipation structure of the circuit board. This heat dissipation structure includes: a housing 1 with a partition 1.1, the two side cavities of which respectively form part of a water tank 1.2 (the housing 1, ceramic heating element 5, and housing cover 6 together form a complete double-layer water tank 1.2) and an installation chamber 1.3; heat-conducting holes 1.4 are provided on the partition 1.1; a heat-conducting component 2, which seals the heat-conducting holes 1.4 and contacts the water flow in the water tank 1.2; and a circuit board 3 with a thyristor 3.1, disposed within the installation chamber 1.3, with the heat dissipation terminal 3.2 of the thyristor 3.1 connected and mounted on the heat-conducting component 2.

[0034] In this embodiment, the heat from the heat dissipation terminal 3.2 of the thyristor 3.1 is directly transferred to the water flow in the water tank 1.2 by sealing the heat dissipation hole 1.4 of the partition 1.1 with the heat-conducting component 2. This active heat dissipation by the water flow suppresses temperature rise and solves the problem of device overheating failure. The partition 1.1 physically isolates the mounting chamber 1.3 from the water tank 1.2, reducing the diffusion of heat to the circuit board 3 and temperature sensor, and avoiding thermal interference with temperature control accuracy. Moreover, no additional heat dissipation device is required, meeting the space and quiet operation requirements of small electrical appliances.

[0035] In the embodiments, such as Figures 1-4 As shown, the heat-conducting component 2 includes an integral plate body 2.1 and a heat-conducting bowl 2.2. The plate body 2.1 is fixed to the side of the partition 1.1 facing the mounting chamber 1.3, and the heat dissipation terminal 3.2 is connected and installed on the plate body 2.1. The heat-conducting bowl 2.2 is located in the middle of the plate body 2.1 and is embedded and sealed in the heat-conducting hole 1.4. The heat-conducting bowl 2.2 embedded in the heat-conducting hole 1.4 increases the heat exchange area. The integral plate body 2.1 and the heat-conducting bowl 2.2, made of high thermal conductivity metal materials such as aluminum alloy, brass, or copper, reduce the interfacial thermal resistance. The plate body 2.1 is fixed to the mounting chamber side of the partition 1.1 and directly supports the heat dissipation terminal 3.2 to achieve efficient heat conduction. The structure of the heat-conducting bowl 2.2 sealing the heat-conducting hole 1.4 optimizes the spatial layout and is suitable for compact designs.

[0036] In the embodiments, such as Figures 3-4 As shown, the side of the partition 1.1 facing the water tank 1.2 is provided with guide ribs 1.5, which form a meandering flow channel 1.6. Within the range of the heat conduction hole 1.4, the flow channel 1.6 is provided with a baffle 1.7. The upper end of the baffle 1.7 forms a flow gap 1.8 between it and the bottom of the heat conduction bowl 2.2. The meandering flow channel 1.6 formed by the guide ribs 1.5 extends the water flow path; the baffle 1.7 blocks the straight flow of water. The flow gap 1.8 formed by the baffle 1.7 and the bottom of the heat conduction bowl 2.2 guides the water flow to impact the bottom of the heat conduction bowl 2.2 to form turbulence, ensuring that heat is continuously carried away and improving heat exchange stability.

[0037] In the embodiments, such as Figure 2 As shown, the plate body 2.1 is fixed to the partition 1.1 with screws. The screw fixing achieves a rigid connection between the plate body 2.1 and the partition 1.1, ensuring that the heat-conducting component 2 can conduct heat stably for a long time; it also simplifies the assembly process and facilitates disassembly and maintenance.

[0038] In the embodiments, such as Figure 2 , Figure 4 As shown, the heat conduction hole 1.4 is a stepped hole, and a sealing ring 4 is provided between the stepped surface of the heat conduction hole 1.4 and the heat conduction bowl 2.2. The stepped hole structure provides an installation positioning surface for the sealing ring 4 to prevent water leakage from the water tank 1.2; the sealing ring 4 isolates water vapor from entering the installation chamber 1.3 and protects the circuit board 3; this structure also reduces the machining accuracy requirements of the heat conduction hole 1.4.

[0039] In the embodiments, such as Figure 1 , Figure 2 As shown, the edge of the board body 2.1 maintains a gap of more than 5mm with the circuit board 3. The gap of more than 5mm blocks the heat conduction path from the board body 2.1 to the circuit board 3, reducing thermal interference; and provides a safe distance for the components on the circuit board 3, avoiding the risk of short circuit.

[0040] In the embodiments, such as Figure 1 , Figure 2 As shown, the thyristor 3.1 is horizontally arranged outside the circuit board 3, and the terminal 3.3 of the thyristor 3.1 is electrically connected to the circuit board 3. The horizontal external placement of the thyristor 3.1 reduces the local heat density of the circuit board 3; the connection of the terminal 3.3 to the circuit board 3 facilitates maintenance and replacement; the heat dissipation terminal 3.2 is installed detached from the substrate of the circuit board 3, eliminating the heat accumulation problem caused by the poor thermal conductivity of the substrate.

[0041] Obviously, the above embodiments of this utility model are merely examples for illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Other obvious variations or modifications derived from the essential spirit of the present utility model still fall within the protection scope of the present utility model.

Claims

1. A heating module circuit board heat dissipation structure, characterized by, include: The box body (1) has a partition (1.1), the inner and outer cavities of the partition (1.1) respectively form part of the water tank (1.2) and the installation compartment (1.3), and the partition (1.1) is provided with heat conduction holes (1.4). The heat-conducting component (2) seals the heat-conducting hole (1.4) and comes into contact with the water flow in the water tank (1.2); A circuit board (3) with a thyristor (3.1) is disposed in the mounting chamber (1.3), and the heat dissipation terminal (3.2) of the thyristor (3.1) is connected and mounted on the heat-conducting component (2).

2. The heating module circuit board heat spreading structure of claim 1, wherein, The heat-conducting component (2) includes an integral plate body (2.1) and a heat-conducting bowl (2.2). The plate body (2.1) is fixed to the side of the partition (1.1) facing the mounting chamber (1.3), and the heat dissipation terminal (3.2) is connected and installed on the plate body (2.1); The heat-conducting bowl (2.2) is disposed in the middle of the plate body (2.1) and is embedded and sealed in the heat-conducting hole (1.4).

3. The heating module circuit board heat dissipation structure of claim 2, wherein, The partition (1.1) has a guide rib (1.5) on the side facing the water tank (1.2), the guide rib (1.5) forms a meandering flow channel (1.6), the flow channel (1.6) has a baffle (1.7) within the range of the heat conduction hole (1.4), and the upper end of the baffle (1.7) forms a flow gap (1.8) between the bottom of the heat conduction bowl (2.2).

4. The heating module circuit board heat spreading structure of claim 2, wherein, The plate body (2.1) is fixed to the partition (1.1) by screws.

5. The heating module circuit board heat spreading structure of claim 2, wherein, The heat-conducting hole (1.4) is a stepped hole, and a sealing ring (4) is provided between the stepped surface of the heat-conducting hole (1.4) and the heat-conducting bowl (2.2).

6. The heating module circuit board heat spreading structure of claim 2, wherein, The edge of the board body (2.1) maintains a gap of more than 5 mm with the circuit board (3).

7. The heating module circuit board heat spreading structure of claim 2, wherein, The heat-conducting component (2) is made of a metal material with a high thermal conductivity.

8. The heating module circuit board heat spreading structure of claim 1, wherein, The thyristor (3.1) is arranged horizontally outside the circuit board (3), and the terminal (3.3) of the thyristor (3.1) is electrically connected to the circuit board (3).

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