Circuit board structure and display device

Abstract

This utility model discloses a circuit board structure and a display device, relating to the field of circuit board technology. The circuit board structure includes: a first substrate, a second substrate, a first circuit, and a second circuit. The first substrate has a first surface; the second substrate is disposed on the first surface of the first substrate; and the first circuit includes a first circuit layer disposed on the first surface; the second circuit includes a second circuit layer disposed on the second substrate; wherein the number of layers in the second circuit layer is greater than the number of layers in the first circuit layer. The technical solution provided by this utility model uses two different substrates: the first substrate has fewer circuit layers but better heat dissipation, while the second substrate has more circuit layers but higher integration. Therefore, circuits that generate more heat can be mounted on the first substrate, while complex circuits can be mounted on the second substrate, allowing the circuit board structure to balance the problems of heat dissipation and excessively large board area.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board structure and a display device. Background Technology

[0002] As MiniLED TVs and monitors increasingly require more backlight zones and higher backlight current, backlight driver control boards need improved heat dissipation and smaller board size. Currently, most backlight driver control boards on the market use double-sided boards or aluminum substrates.

[0003] Double-sided boards have at least two circuit layers, allowing traces to be routed on both sides. This saves space for complex signal connections, allowing for a smaller board size. However, heat dissipation is generally poor, and the cost is higher. Aluminum-based boards are single-sided boards with only one circuit layer. Using an aluminum substrate provides excellent heat dissipation, strong current carrying capacity, high mechanical strength, and lower cost. However, aluminum-based boards can only have traces routed on one side, requiring a larger board area for complex signal connections.

[0004] Different circuits exist on the same circuit board. Some circuits have high heat dissipation power of the components, while others are complex. Therefore, existing circuit boards either have poor local heat dissipation or are too large, making it impossible to balance the problems of heat dissipation and excessive board area. Utility Model Content

[0005] The main purpose of this invention is to propose a circuit board structure and display device that balances the problems of heat dissipation and excessively large board area.

[0006] To achieve the above objectives, the circuit board structure proposed in this utility model includes: a first substrate, a second substrate, a first circuit, and a second circuit; the first substrate has a first surface; the second substrate is disposed on the first surface of the first substrate; and the first circuit includes a first circuit layer disposed on the first surface; the second circuit includes a second circuit layer disposed on the second substrate; wherein the number of layers of the second circuit layer is greater than the number of layers of the first circuit layer.

[0007] In one embodiment, the first circuit further includes a first chip disposed on the first board surface, the first chip being electrically connected to the first circuit layer; and / or,

[0008] The second circuit also includes a second chip disposed on the second substrate, and the second chip is electrically connected to the second circuit layer.

[0009] In one embodiment, the first substrate includes an aluminum substrate and a first insulating layer disposed on the aluminum substrate, wherein the first circuit layer is disposed on the side of the first insulating layer opposite to the aluminum substrate; and / or,

[0010] The second substrate includes a second insulating layer, and the second circuit layer is disposed on opposite sides of the second insulating layer.

[0011] In one embodiment, the first circuit layer and the second circuit layer overlap at least partially in the thickness direction of the first substrate, such that the first circuit layer and the second circuit layer are soldered together and electrically connected.

[0012] In one embodiment, the first substrate and the second substrate are spaced apart in the thickness direction of the first substrate.

[0013] In one embodiment, a first mounting area and a second mounting area are formed on a first surface of the first substrate, the first circuit is disposed corresponding to the first mounting area, and the second substrate is disposed corresponding to the second mounting area.

[0014] In one embodiment, the first mounting area and the second mounting area are arranged in parallel along the length or width direction of the first substrate.

[0015] In one embodiment, the first mounting area is arranged in a ring shape and surrounds the outside of the second mounting area.

[0016] In one embodiment, the first line layer and the second line are electrically connected by a plug-in connection structure.

[0017] This utility model also proposes a display device, the display device including a circuit board structure, the circuit board structure including: a first substrate, a second substrate, a first circuit and a second circuit; the first substrate has a first surface; the second substrate is disposed on the first surface of the first substrate; and the first circuit includes a first circuit layer disposed on the first surface; the second circuit includes a second circuit layer disposed on the second substrate; wherein the number of layers of the second circuit layer is greater than the number of layers of the first circuit layer.

[0018] The technical solution of this utility model sets up two different substrates. The first substrate has fewer circuit layers but better heat dissipation, while the second substrate has more circuit layers but higher integration. Therefore, circuits that generate more heat can be installed on the first substrate, while complex circuits can be installed on the second substrate, so that the circuit board structure can balance the problems of heat dissipation and excessive board area. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 A schematic diagram of an embodiment of the circuit board structure provided by this utility model;

[0021] Figure 2 A schematic diagram of another embodiment of the circuit board structure provided by this utility model;

[0022] Figure 3 for Figure 2 Top view of the circuit board structure;

[0023] Figure 4 A schematic diagram of another embodiment of the circuit board structure provided by this utility model;

[0024] Figure 5 for Figure 4 Top view of the circuit board structure.

[0025] Explanation of icon numbers:

[0026] 100. Circuit board structure; 1. First substrate; 11. First insulating layer; 12. Aluminum base layer; 2. Second substrate; 21. Second insulating layer; 3. First circuit; 31. First circuit layer; 32. First chip; 4. Second circuit; 41. Second circuit layer; 42. Second chip; a. First mounting area; b. Second mounting area.

[0027] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0030] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0031] Different circuits exist on the same circuit board. Some circuits have high heat dissipation power of the components, while others are complex. Therefore, existing circuit boards either have poor local heat dissipation or are too large, making it impossible to balance the problems of heat dissipation and excessive board area.

[0032] This utility model proposes a circuit board structure.

[0033] Please see Figure 1 In one embodiment of the present invention, the circuit board structure 100 includes: a first substrate 1, a second substrate 2, a first circuit 3, and a second circuit 4; the first substrate 1 has a first surface; the second substrate 2 is disposed on the first surface of the first substrate 1; and the first circuit 3 includes a first circuit layer 31 disposed on the first surface; the second circuit 4 includes a second circuit layer 41 disposed on the second substrate 2; wherein the number of layers of the second circuit layer 41 is greater than the number of layers of the first circuit layer 31.

[0034] The technical solution of this utility model involves setting up two substrates: a first substrate 1 and a second substrate 2. A first circuit layer 31 is provided on the first surface of the first substrate 1, forming a single-sided board. Electrical components and the second substrate 2 are disposed corresponding to the first surface and electrically connected to the first circuit layer 31 on the first surface. Since the first surface of the first substrate 1 is also used to mount the second substrate 2, the area of ​​the first substrate 1 is larger than that of the second substrate 2. Therefore, the heat dissipation area of ​​the first substrate 1 is larger than that of the second substrate 2, resulting in better heat dissipation. Because the second circuit layer 41 on the second substrate 2 has multiple layers, the circuit integration is higher, requiring less area for the same complex circuit. The second circuit 4 (control circuit), which has complex circuitry and low heat generation power, is placed on the second substrate 2, thereby reducing the area required for the corresponding mounting substrate. The first circuit 3 (drive circuit), which has high heat generation power and simple circuitry, is placed on the first substrate 1, thereby accelerating heat dissipation. Therefore, different types of circuits can be placed on different substrates, thus achieving both heat dissipation and preventing the overall area of ​​the circuit board structure 100 from becoming too large. By setting multiple second circuit layers 41 on the second substrate 2, a double-sided board or a multi-layer board can be formed.

[0035] Since the first circuit layer 31 and the second circuit layer 41 cannot form a circuit independently, they only serve as conductors and require the installation of electrical components to form a complete circuit. The first circuit 3 also includes a first chip 32, which is electrically connected to the first circuit layer 31; the second circuit 4 also includes a second chip 42, which is electrically connected to the second circuit layer 41. The first chip 32 generates more heat than the second chip 42 during operation; therefore, the first chip 32 is mounted on the first substrate 1, and the second chip 42 is mounted on the second substrate 2. For better heat dissipation, the chip mounting positions are spaced apart during the circuit layer design to prevent concentrated chip placement and resulting in excessively high local temperatures.

[0036] The specific structure of the first substrate 1 is as follows: the first substrate 1 includes an aluminum base layer 12 and a first insulating layer 11 disposed on the aluminum base layer 12. The first circuit layer 31 is disposed on the side of the first insulating layer 11 facing away from the aluminum base layer 12. As a metal base layer, aluminum has excellent thermal conductivity, which can quickly conduct the heat generated by the power devices from the first circuit layer 31 through the first insulating layer 11 to the aluminum base layer 12, and dissipate the heat through the large area of ​​the aluminum base layer 12, thereby significantly reducing thermal resistance and improving heat dissipation efficiency. Compared with the substrate material of double-sided or multi-layer boards—FR-4 board (reinforced fiberglass board, composed of fiberglass and epoxy resin), the aluminum base layer 12 not only maintains good thermal conductivity, but also has excellent mechanical strength, impact resistance and vibration resistance, making it suitable for various harsh working environments and providing stable installation conditions for the installation of other components in the circuit board structure 100.

[0037] The specific structure of the second substrate 2 is as follows: the second substrate 2 includes a second insulating layer 21 made of FR-4 material, and two second circuit layers 41 can be disposed on both sides of the second insulating layer 21 to form a double-sided board. Since the number of second circuit layers 41 is greater than the number of first circuit layers 31, the circuit integration is higher.

[0038] In another embodiment, the specific structure of the second substrate 2 includes multiple layers of second insulating layers 21, with a second circuit layer 41 disposed between adjacent second insulating layers 21, and second circuit layers 41 disposed on both sides of the second substrate 2. This forms a multilayer board with the following structure: second circuit layer 41 - second insulating layer 21 - second circuit layer 41 - second insulating layer 21 - second circuit layer 41 - second insulating layer 21 - second circuit layer 41. The number of second circuit layers 41 in the multilayer board is greater than the number of first circuit layers 31, thus resulting in higher circuit integration.

[0039] In order to interconnect the first circuit 3 and the second circuit 4 to form an integrated circuit, and to mount the second substrate 2 on the first substrate 1, the first circuit layer 31 and the second circuit layer 41 overlap at least partially in the thickness direction of the first substrate 1. Since the first circuit layer 31 and the second circuit layer 41 are essentially copper foils, electrical conduction can be achieved when they are in contact at corresponding positions. The first circuit layer 31 and the second circuit layer 41 are soldered and electrically connected.

[0040] In the above-described mounting embodiment where the second substrate 2 is mounted on the first substrate 1, the first circuit layer 31 and the second circuit layer 41 need to be bonded together to achieve soldering and conductivity. This mounting method is stable and occupies a small space. However, in this mounting method, heat dissipation on the side where the first substrate 1 and the second substrate 2 are in contact is somewhat affected. An improvement is made by spacing the first substrate 1 and the second substrate 2 along the thickness direction of the first substrate 1, and by spacing the first circuit layer 31 and the second circuit layer 41 along the thickness direction, thereby creating an air passage between the aluminum substrate formed on the first substrate 1 and the double-sided panel formed on the second substrate 2 to enhance heat dissipation. How the first circuit 3 and the second circuit 4 are interconnected will be explained later.

[0041] A first mounting area a and a second mounting area b are formed on a first surface of the first substrate 1, spaced apart. The first circuit 3 is disposed corresponding to the first mounting area a, and the second substrate 2 is disposed corresponding to the second mounting area b. Since the first circuit 3 and the second circuit 4 include heat-generating electrical components, the first circuit 3 and the second circuit 4 are equivalent to two heat sources. To avoid the first mounting area a and the second mounting area b overlapping and causing the two heat sources to be too close together, resulting in poor heat dissipation, a further step is taken. In one embodiment, please refer to... Figure 2 and Figure 3 The first mounting area a and the second mounting area b are arranged parallel to each other along the length or width direction of the first substrate 1. Furthermore, the first circuit 3 and the second circuit 4 are located within their respective mounting areas, facilitating the installation of electrical components and circuit maintenance. In another embodiment, please refer to... Figure 4 and Figure 5 The first mounting area a is arranged in a ring shape and surrounds the outer side of the second mounting area b. The second mounting area b is contained within the first mounting area a, which reduces the overall area occupied by the circuit board. Furthermore, since the first mounting area a is located in the outer region of the second mounting area b, the first mounting area a is larger and has a greater degree of dispersion than the second mounting area b. This allows for the placement of the first circuit 3, which generates significant heat, within it, enabling the electrical components (such as the first chip 32) in the first circuit 3 to be more dispersed, avoiding the concentration of high-heat-generating components. For example, multiple first chips 32 can be arranged at intervals along the circumference of the second substrate 2 within the first mounting area a.

[0042] Regarding the embodiment mentioned above, in which the first substrate 1 and the second substrate 2 are spaced apart, such that an air passage is formed between the aluminum substrate formed on the first substrate 1 and the double-sided panel formed on the second substrate 2, how can the first circuit 3 and the second circuit 4 be interconnected, and how should the second substrate 2 be mounted? Electrical connection can be achieved through a plug-in connection structure. For details, please refer to [link to relevant documentation]. Figure 2 and Figure 4 The circuit board structure 100 includes a male socket and a female socket. The male socket is fixed and electrically connected to the first circuit layer 31, and the female socket is fixed and electrically connected to the second circuit layer 41. When the male socket and the female socket are plugged in, the first circuit 3 and the second circuit 4 are connected. Because the male and female sockets are provided between the first circuit layer 31 and the second circuit layer 41, an air passage is formed between the aluminum substrate formed on the first substrate 1 and the double-sided board formed on the second substrate 2.

[0043] This utility model also proposes a display device, which includes a circuit board structure 100. The specific structure of the circuit board structure 100 is as described in the above embodiments. Since this display device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The circuit board structure 100 includes: a first substrate 1, a second substrate 2, a first circuit 3, and a second circuit 4; the first substrate 1 has a first plate surface; the second substrate 2 is disposed on the first plate surface of the first substrate 1; and the first circuit 3 includes a first circuit layer 31 disposed on the first plate surface; the second circuit 4 includes a second circuit layer 41 disposed on the second substrate 2; wherein the number of layers of the second circuit layer 41 is greater than the number of layers of the first circuit layer 31.

[0044] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A circuit board structure for a display device, characterized in that, The circuit board structure includes: The first substrate has a first plate surface; A second substrate is disposed on a first surface of the first substrate; and The first circuit includes a first circuit layer disposed on the first board surface; The second circuit includes a second circuit layer disposed on the second substrate; The second line layer has more layers than the first line layer.

2. The circuit board structure of claim 1, wherein, The first circuit further includes a first chip disposed on the first board surface, the first chip being electrically connected to the first circuit layer; and / or, The second circuit also includes a second chip disposed on the second substrate, and the second chip is electrically connected to the second circuit layer.

3. The circuit board structure of claim 1, wherein, The first substrate includes an aluminum base layer and a first insulating layer disposed on the aluminum base layer, wherein the first circuit layer is disposed on the side of the first insulating layer opposite to the aluminum base layer; and / or, The second substrate includes a second insulating layer, and the second circuit layer is disposed on opposite sides of the second insulating layer.

4. The circuit board structure of claim 1, wherein, In the thickness direction of the first substrate, the first circuit layer and the second circuit layer overlap at least partially, such that the first circuit layer and the second circuit layer are soldered together and electrically connected.

5. The circuit board structure of claim 1, wherein, The first substrate and the second substrate are spaced apart in the thickness direction of the first substrate.

6. The circuit board structure of claim 1, wherein, A first mounting area and a second mounting area are formed on a first plate surface of the first substrate, the first circuit is disposed corresponding to the first mounting area, and the second substrate is disposed corresponding to the second mounting area.

7. The circuit board structure of claim 6, wherein, The first mounting area and the second mounting area are arranged in parallel along the length or width direction of the first substrate.

8. The circuit board structure of claim 6, wherein, The first installation area is arranged in a ring shape and surrounds the outside of the second installation area.

9. The circuit board structure according to any one of claims 5 to 8, wherein, The first line layer and the second line are electrically connected through a plug-in connection structure.

10. A display device, characterized by comprising: Includes the circuit board structure as described in any one of claims 1 to 9.

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