Automatic alignment exposure equipment for HDI circuit board inner layer dry film

Abstract

The utility model relates to an automatic alignment exposure equipment for HDI circuit board inner layer dry film, including exposure equipment base and substrate placing table, the inside installation of circuit board is installed in the frame -shaped substrate placing table setting of exposure equipment base top, the side of substrate placing table is equipped with Z type guide slot, and the inside of guide slot is equipped with the automatic smoothing mechanism that can slide in its inside, the top both sides of exposure equipment base are equipped with the horizontal setting of translation mechanism, and the mobile end of translation mechanism is fixedly connected with automatic smoothing mechanism, compared with prior art, the utility model has the beneficial effect that when the substrate is placed in alignment with one end of the substrate placing table on one side, the substrate is placed, the automatic smoothing mechanism is driven to move through the translation mechanism, the smoothing roller can smooth the surface of the substrate, the substrate is stably positioned in the placing groove in the substrate placing table, the subsequent exposure work is ensured, the staff does not need to go back and forth to explore the body, effectively reduces the labor intensity of staff, improves the efficiency.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing, and in particular to an automatic alignment and exposure device for the inner dry film of HDI circuit boards. Background Technology

[0002] High-density interconnect (HDI) manufacturing is one of the fastest-growing areas in the printed circuit board industry. HDI boards are a type of circuit board with high wiring density using micro-blind via technology. HDI boards are divided into inner and outer circuit layers, and the internal connections of each layer are achieved through drilling and metallization. Therefore, the higher the application of HDI technology, the higher the manufacturing level of the laminate. Ordinary HDI boards are laminated once, while high-end HDI boards use two, three, or even more lamination processes, as well as electroplating for hole filling, hole stacking, and laser direct drilling.

[0003] During the manufacturing of HDI circuit boards, the substrate needs to undergo an exposure process. A common method is to manually place the substrate into an exposure tank, ensuring the substrate and tank are the same size. When placing the substrate, the operator first positions one end of the substrate closer to the worker, then lays it flat. At this point, the worker needs to lean forward at a 30-60° angle to press the other end of the substrate firmly into the tank, ensuring stability. This method requires frequent back-and-forth leaning, which is extremely damaging to the worker's back, involves high labor intensity, and can easily lead to occupational diseases. Therefore, to address these issues, an automatic alignment and exposure device for the inner dry film of HDI circuit boards is proposed. Utility Model Content

[0004] In view of the above-mentioned problems in the prior art, the main purpose of this utility model is to provide an automatic alignment and exposure device for the inner layer dry film of HDI circuit boards. After the substrate is placed, the automatic smoothing mechanism is moved by the translation mechanism to make the substrate stably positioned in the placement slot inside the substrate placement stage, ensuring that the subsequent exposure work does not require the operator to lean back and forth, effectively reducing the difficulty of operation for the operator, reducing the workload, and improving efficiency.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: an automatic alignment and exposure device for the inner layer dry film of HDI circuit boards, including an exposure device base and a substrate placement stage;

[0006] A circuit board is installed inside a frame-shaped substrate placement stage located above the base of the exposure equipment.

[0007] The side of the substrate placement stage is provided with a Z-shaped guide groove, and the inside of the guide groove is provided with an automatic smoothing mechanism that can slide inside it.

[0008] The upper sides of the exposure equipment base are equipped with horizontally arranged translation mechanisms, and the moving end of the translation mechanism is fixedly connected to the automatic smoothing mechanism.

[0009] Furthermore, the automatic smoothing mechanism includes a connecting column fixedly connected to the translation mechanism, guide sleeves fixedly connected to both sides of the bottom of the connecting column, a sliding rod slidably connected inside the guide sleeve, a protective cover fixedly connected to the other end of the sliding rod, and a smoothing roller rotatably connected inside the protective cover.

[0010] Furthermore, the sliding rod is T-shaped, and a second spring is fixedly connected to the top of the sliding rod. The other end of the second spring is fixedly connected to the guide sleeve.

[0011] During the manufacturing of HDI circuit boards, the substrate needs to undergo an exposure process. A common method is to manually place the substrate into an exposure tank, ensuring the substrate and tank are the same size. The operator first places one end of the substrate in the tank closest to the worker, then lays it flat. At this point, the worker needs to lean forward 30-60 degrees to press the other end of the substrate firmly into the tank, ensuring stability. This method requires workers to lean back repeatedly, causing significant back strain and increasing the risk of occupational diseases. By installing an automatic smoothing mechanism above the substrate placement platform, the substrate is placed flat when one side is aligned with one end of the platform. A translation mechanism moves the automatic smoothing mechanism, and a connecting column moves the guide sleeve, sliding rod, and protective cover away from the receiving slot on one side of the substrate placement platform. The smoothing roller then smooths the substrate surface, ensuring it is stably positioned within the placement slot of the platform, guaranteeing subsequent exposure work. This eliminates the need for workers to lean back repeatedly, effectively protecting their health.

[0012] The translation mechanism includes a horizontal frame that is fixedly connected to the base of the exposure equipment. A motor is fixedly connected inside the horizontal frame. The output shaft of the motor is fixedly connected to a threaded shaft. The other end of the threaded shaft is rotatably connected to the horizontal frame. A threaded sleeve is helically connected to the outside of the threaded shaft. A movable frame is fixedly connected to the outside of the threaded sleeve. A guide rod is slidably connected inside the movable frame. The other end of the guide rod is fixedly connected to an automatic smoothing mechanism.

[0013] Furthermore, the outer side of the movable frame is slidably connected to the horizontal frame, and a sliding plate is slidably connected inside the movable frame. One side of the sliding plate is fixedly connected to the guide rod, and the other end of the sliding plate is fixedly connected to a first spring. The other end of the first spring is fixedly connected to the movable frame.

[0014] Furthermore, when the automatic smoothing mechanism is performing the smoothing work, the motor drives the threaded shaft to rotate, the threaded shaft drives the threaded sleeve to move, and the threaded sleeve drives the moving frame and guide rod to move, so that the automatic smoothing mechanism smooths the substrate. After the smoothing work is completed, under the guidance of the guide groove, the automatic smoothing mechanism can be placed in the internal storage groove of the substrate placement stage to avoid affecting subsequent work.

[0015] The sliding plate and the first spring ensure that the guide rod can move up and down, thus ensuring the storage of the automatic smoothing mechanism.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] 1. By setting an automatic smoothing mechanism above the substrate placement stage to smooth the substrate, when the substrate is placed with one side aligned with one end of the substrate placement stage, the automatic smoothing mechanism is moved by the translation mechanism after the substrate is placed. The connecting column drives the guide sleeve, sliding rod and protective cover to disengage from the receiving groove on one side of the substrate placement stage, and the smoothing roller can smooth the surface of the substrate, so that the substrate is stably placed in the placement groove inside the substrate placement stage, ensuring the subsequent exposure work. Moreover, it eliminates the need for the operator to lean back and forth, effectively reducing the difficulty of operation for the operator, reducing the workload, saving operation time and improving efficiency.

[0018] 2. When the automatic smoothing mechanism is performing the smoothing work, the motor drives the threaded shaft to rotate, the threaded shaft drives the threaded sleeve to move, and the threaded sleeve drives the moving frame and guide rod to move, so that the automatic smoothing mechanism smooths the substrate. After the smoothing work is completed, under the guidance of the guide groove, the automatic smoothing mechanism can be placed in the internal storage groove of the substrate placement stage to avoid affecting subsequent work.

[0019] The sliding plate and the first spring ensure that the guide rod can move up and down, thus ensuring the storage of the automatic smoothing mechanism. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the substrate placement platform structure of this utility model;

[0022] Figure 3 This is a schematic diagram of the translation mechanism structure of this utility model;

[0023] Figure 4 This is a cross-sectional view of the movable frame of this utility model;

[0024] Figure 5 This is a schematic diagram of the automatic smoothing mechanism of this utility model.

[0025] Legend: 1. Exposure equipment base; 2. Substrate placement stage; 3. Translation mechanism; 301. Horizontal frame; 302. Motor; 303. Threaded shaft; 304. Threaded sleeve; 305. Moving frame; 306. Guide rod; 307. Sliding plate; 308. First spring; 4. Guide groove; 5. Automatic smoothing mechanism; 501. Connecting column; 502. Guide sleeve; 503. Sliding rod; 504. Protective cover; 505. Smoothing roller; 506. Second spring. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some embodiments of this utility model, but not all embodiments. Example

[0027] Automatic alignment and exposure equipment for the inner layer dry film of HDI circuit boards, such as Figure 1-5 As shown, it includes an exposure equipment base 1 and a substrate placement stage 2;

[0028] A circuit board is installed inside a frame-shaped substrate placement stage 2 located above the exposure equipment base 1.

[0029] The side of the substrate placement stage 2 is provided with a Z-shaped guide groove 4, and the guide groove 4 is provided with an automatic smoothing mechanism 5 that can slide inside it.

[0030] The exposure equipment base 1 has horizontally arranged translation mechanisms 3 installed on both sides above it, and the moving end of the translation mechanism 3 is fixedly connected to the automatic smoothing mechanism 5.

[0031] The automatic smoothing mechanism 5 includes a connecting column 501 fixedly connected to the translation mechanism 3. Guide sleeves 502 are fixedly connected to both sides of the bottom of the connecting column 501. A sliding rod 503 is slidably connected inside the guide sleeve 502. A protective cover 504 is fixedly connected to the other end of the sliding rod 503. A smoothing roller 505 is rotatably connected inside the protective cover 504.

[0032] The sliding rod 503 is T-shaped, and a second spring 506 is fixedly connected to the top of the sliding rod 503. The other end of the second spring 506 is fixedly connected to the guide sleeve 502.

[0033] During the manufacturing of HDI circuit boards, the substrate needs to undergo an exposure process. A common method is to manually place the substrate into an exposure tank. The substrate and the exposure tank are the same size. When placing the substrate, the worker first places one end of the substrate in the tank closest to the worker, then flattens it. At this point, the worker needs to lean forward at a 30-60° angle to press the other end of the substrate firmly into the exposure tank, ensuring stability. This placement method requires frequent back-and-forth leaning, which is very damaging to the worker's back and can easily lead to occupational diseases. It is also a high-intensity job. [The last sentence appears to be incomplete and possibly refers to a different method, possibly related to a substrate placement platform.] An automatic smoothing mechanism 5 is provided for smoothing the substrate. When the substrate is placed with one side aligned with one end of the substrate placement table 2, the substrate may be flat, but one side of the substrate may be tilted up and cannot be accurately placed into the placement groove. The automatic smoothing mechanism 5 is moved by the translation mechanism 3. The connecting column 501 drives the guide sleeve 502, sliding rod 503 and protective cover 504 to disengage from the storage groove on one side of the substrate placement table 2. The smoothing roller 505 can then smooth the surface of the substrate, so that the substrate is stably placed in the placement groove inside the substrate placement table 2, ensuring the subsequent exposure work. Moreover, it eliminates the need for staff to lean back and forth, effectively protecting the health of the staff.

[0034] The smoothing roller 505 can rotate to avoid scratching the substrate surface. The surface of the smoothing roller 505 is covered with a rubber layer, which protects the substrate when it is being squeezed. The second spring 506 can ensure that the protective cover 504 below the sliding rod 503 and the smoothing roller 505 can be automatically adjusted to a certain extent to achieve stable squeezing of the substrate into the placement groove.

[0035] The translation mechanism 3 includes a horizontal frame 301 fixedly connected to the exposure equipment base 1. A motor 302 is fixedly connected inside the horizontal frame 301. The output shaft of the motor 302 is fixedly connected to a threaded shaft 303. The other end of the threaded shaft 303 is rotatably connected to the horizontal frame 301. A threaded sleeve 304 is screwed to the outside of the threaded shaft 303. A movable frame 305 is fixedly connected to the outside of the threaded sleeve 304. A guide rod 306 is slidably connected inside the movable frame 305. The other end of the guide rod 306 is fixedly connected to the automatic smoothing mechanism 5.

[0036] The outer side of the movable frame 305 is slidably connected to the horizontal frame 301. A sliding plate 307 is slidably connected inside the movable frame 305. One side of the sliding plate 307 is fixedly connected to the guide rod 306. The other end of the sliding plate 307 is fixedly connected to a first spring 308. The other end of the first spring 308 is fixedly connected to the movable frame 305.

[0037] When the automatic smoothing mechanism 5 is performing the smoothing work, the motor 302 drives the threaded shaft 303 to rotate, the threaded shaft 303 drives the threaded sleeve 304 to move, and the threaded sleeve 304 drives the moving frame 305 and the guide rod 306 to move, so that the automatic smoothing mechanism 5 smooths the substrate. After the smoothing work is completed, under the guidance of the guide groove 4, the automatic smoothing mechanism 5 can be located in the internal storage groove of the substrate placement stage 2 to avoid affecting subsequent work.

[0038] The sliding plate 307 and the first spring 308 ensure that the guide rod 306 can move up and down, thus ensuring the storage of the automatic smoothing mechanism 5.

[0039] Finally, it should be noted that the above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. An automatic alignment and exposure device for the inner layer dry film of HDI circuit boards, characterized in that: Includes an exposure equipment base (1) and a substrate placement stage (2); A circuit board is installed inside a frame-shaped substrate placement stage (2) located above the exposure equipment base (1); The substrate placement platform (2) has a Z-shaped guide groove (4) on its side, and an automatic smoothing mechanism (5) that can slide inside the guide groove (4) is provided. The exposure equipment base (1) is equipped with horizontally arranged translation mechanisms (3) on both sides above, and the moving end of the translation mechanism (3) is fixedly connected to the automatic smoothing mechanism (5).

2. The automatic alignment exposure apparatus for the dry film of the inner layer of the HDI circuit board according to claim 1, characterized in that: The translation mechanism (3) includes a horizontal frame (301) fixedly connected to the exposure equipment base (1). A motor (302) is fixedly connected inside the horizontal frame (301). The output shaft of the motor (302) is fixedly connected to a threaded shaft (303). The other end of the threaded shaft (303) is rotatably connected to the horizontal frame (301). A threaded sleeve (304) is spirally connected to the outside of the threaded shaft (303). A movable frame (305) is fixedly connected to the outside of the threaded sleeve (304). A guide rod (306) is slidably connected inside the movable frame (305). The other end of the guide rod (306) is fixedly connected to the automatic smoothing mechanism (5).

3. The automatic alignment exposure apparatus for the dry film of the inner layer of the HDI circuit board according to claim 2, characterized in that: The outer side of the movable frame (305) is slidably connected to the horizontal frame (301). A sliding plate (307) is slidably connected inside the movable frame (305). One side of the sliding plate (307) is fixedly connected to the guide rod (306). A first spring (308) is fixedly connected to the other end of the sliding plate (307). The other end of the first spring (308) is fixedly connected to the movable frame (305).

4. The automatic alignment exposure apparatus for dry film of HDI circuit board inner layer according to claim 1, characterized in that: The automatic smoothing mechanism (5) includes a connecting column (501) fixedly connected to the translation mechanism (3). Guide sleeves (502) are fixedly connected to both sides of the bottom of the connecting column (501). A sliding rod (503) is slidably connected inside the guide sleeve (502). A protective cover (504) is fixedly connected to the other end of the sliding rod (503). A smoothing roller (505) is rotatably connected inside the protective cover (504).

5. The automatic alignment exposure apparatus for the dry film of the inner layer of the HDI circuit board according to claim 4, characterized in that: The sliding rod (503) is T-shaped, and a second spring (506) is fixedly connected to the top of the sliding rod (503). The other end of the second spring (506) is fixedly connected to the guide sleeve (502).

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