A reflow soldering carrier compatible with FPC silk screening and taping

Abstract

The utility model relates to a kind of compatible FPC silk screen and the reflow soldering carrier of patch, it includes: carrier, the carrier includes carrier plate, accommodating recess being opened on the any surface of the carrier plate, the multiple positioning columns being set in the accommodating recess and the multiple magnetic steel being embedded in the carrier plate and corresponding with the accommodating recess;Magnetic pressing plate, the magnetic pressing plate includes pressing plate body, multiple first positioning holes being opened on the pressing plate body and cooperating with multiple the positioning column and multiple silk screen patch array holes being opened on the pressing plate body;The accommodating space of accommodating FPC board is formed between the magnetic pressing plate and the accommodating recess. FPC board can be clamped between them using the interaction of magnetic pressing plate and carrier.

Description

Technical Field

[0001] This utility model belongs to the field of welding carrier technology, and relates to a reflow soldering carrier compatible with FPC screen printing and patch. Background Technology

[0002] Due to the increasing miniaturization of PCBs in electronic products, surface-mount components have emerged, rendering traditional soldering methods inadequate. As SMT (Surface Mount Technology) technology has matured, the emergence of various surface-mount components (SMCs) and surface-mount devices (SMDs) has led to the development of reflow soldering technology and equipment, which is now widely used in almost all electronic product fields. Reflow soldering equipment contains a heating circuit that heats air or nitrogen to a sufficiently high temperature and blows it onto the circuit board with components already mounted, melting the solder on both sides of the components and bonding them to the motherboard. The advantages of this process include easy temperature control, prevention of oxidation during soldering, and easier control of manufacturing costs.

[0003] Existing FPC reflow soldering carriers include the following types: (1) Aluminum alloy carriers: have high thermal conductivity, suitable for mass production, but require surface anodizing treatment. After long-term use, the oxide layer wears off, resulting in solder adhesion; (2) Synthetic stone carriers: have a temperature resistance of 260℃, low thermal conductivity, and are suitable for small-batch production; (3) Antistatic bakelite: have low cost and good processability, but low thermal conductivity and limited temperature resistance. Above 220℃, they will soften, discolor, and release odors, affecting the carrier life and FPC soldering quality; (4) Magnetic carriers: have uniform adsorption force and high positioning accuracy, suitable for thin plate soldering, but have average thermal conductivity and high cost. Therefore, developing a reflow soldering carrier that is compatible with FPC silkscreen printing and surface mount technology, and has a lower manufacturing cost, is of practical significance. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a reflow soldering carrier that is compatible with FPC screen printing and surface mount technology.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: a reflow soldering carrier compatible with FPC screen printing and surface mount technology, comprising:

[0006] The carrier includes a carrier plate, a receiving groove formed on any surface of the carrier plate, a plurality of positioning posts disposed in the receiving groove, and a plurality of magnets embedded in the carrier plate and corresponding to the receiving groove.

[0007] A magnetic pressure plate, the magnetic pressure plate comprising a pressure plate body, a plurality of first positioning holes formed on the pressure plate body and cooperating with a plurality of positioning posts, and a plurality of silkscreen patch array holes formed on the pressure plate body.

[0008] The magnetic pressure plate and the receiving groove form a receiving space for the FPC board.

[0009] Ideally, the carrier plate is made of aluminum alloy.

[0010] Furthermore, the carrier plate has clearance grooves at the middle of both ends, and the two sides of the carrier plate are recessed inward to form limiting steps that are away from the receiving grooves.

[0011] Furthermore, the multiple positioning posts are arranged in two rows, respectively close to the two side edges of the receiving groove.

[0012] Ideally, the FPC board has multiple second positioning holes that cooperate with the multiple positioning posts.

[0013] Due to the application of the above technical solutions, this utility model has the following advantages compared with the prior art: This utility model is a reflow soldering carrier compatible with FPC screen printing and surface mount technology. The interaction between the magnetic pressure plate and the carrier can clamp the FPC board between them (that is, the carrier has a receiving groove, a magnet is embedded, and the magnetic pressure plate is attracted to effectively position and attract the FPC, ensuring the accuracy of screen printing and surface mount technology and preventing warping and deformation); it also ensures the normal operation of screen printing and surface mount technology by opening screen printing and surface mount array holes.

[0014] Furthermore, aluminum alloy carriers are preferred, with a structural design compatible with both screen printing and surface mount equipment tracks. This allows a single carrier to handle screen printing, surface mount, and reflow soldering without the need for relocation. The positioning of the FPC is more reliable than traditional aluminum alloy carriers, and effective adsorption prevents the FPC from warping and deforming during screen printing and surface mount processes, thus avoiding defects. Compared to traditional magnetic carriers, it is lower in cost, has better thermal conductivity, and effectively ensures reflow soldering quality. Attached Figure Description

[0015] Figure 1 This is a structural schematic diagram of the reflow soldering carrier compatible with FPC screen printing and surface mount technology. Detailed Implementation

[0016] The present invention will be further described below with reference to the embodiments shown in the accompanying drawings.

[0017] like Figure 1 The reflow soldering carrier shown is compatible with FPC screen printing and surface mount technology. It mainly includes a matching carrier 1 and a magnetic pressure plate 2, etc.

[0018] The carrier 1 includes a carrier plate 11 and a receiving groove 12 formed on any surface of the carrier plate 11. Figure 1The carrier plate 11 is made of aluminum alloy. Multiple positioning posts 14 are disposed within the receiving groove 12, and multiple magnets 13 are embedded within the carrier plate 11 and correspond to the receiving groove 12. In this embodiment, the carrier plate 11 has clearance grooves 111 at the center of both ends, and the two sides of the carrier plate 11 are recessed inward to form limiting steps 112 that are away from the receiving groove 12. This structural design is compatible with both screen printing and surface mount equipment tracks, enabling a single carrier to support screen printing, surface mount, and reflow soldering without the need for multiple transfers. The multiple positioning posts 14 are arranged in two rows, respectively close to the two side edges of the receiving groove 12.

[0019] The magnetic pressure plate 2 includes a pressure plate body 21, multiple first positioning holes 23 formed on the pressure plate body 21 and cooperating with multiple positioning posts 14, and multiple screen printing patch array holes 22 formed on the pressure plate body 21. Each screen printing patch array hole 22 can be used for screen printing and patching of the corresponding area of ​​the FPC board 1'. Specifically, the magnetic pressure plate 2 and the receiving groove 12 form a receiving space for the FPC board 1'. In this way, the interaction between the magnetic pressure plate 2 and the carrier 1 can clamp the FPC board 1' between them (i.e., the carrier 1 has a receiving groove 12, a magnet 13 is embedded, and the magnetic pressure plate 2 is attracted to effectively position and attract the FPC board 1', ensuring the accuracy of screen printing and patching and preventing warping and deformation). This is because the FPC board 1' has multiple second positioning holes 11' that cooperate with multiple positioning posts 14, so that the positioning posts 14 pass through the corresponding first positioning holes 23 and second positioning holes 11', which can achieve precise positioning.

[0020] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the scope of protection of this utility model.

Claims

1. A reflow soldering carrier compatible with FPC silk screening and taping, characterized by, It includes: The carrier (1) includes a carrier plate (11), a receiving groove (12) formed on any surface of the carrier plate (11), a plurality of positioning posts (14) disposed in the receiving groove (12), and a plurality of magnets (13) embedded in the carrier plate (11) and corresponding to the receiving groove (12). Magnetic pressure plate (2), the magnetic pressure plate (2) includes a pressure plate body (21), a plurality of first positioning holes (23) formed on the pressure plate body (21) and cooperating with a plurality of positioning posts (14), and a plurality of screen printing patch array holes (22) formed on the pressure plate body (21). The magnetic pressure plate (2) and the receiving groove (12) form a receiving space for the FPC plate (1').

2. The reflow solder carrier compatible with FPC screen printing and taping according to claim 1, wherein: The carrier plate (11) is made of aluminum alloy.

3. The FPC compatible screen and patch reflow carrier of claim 1 or 2, wherein: The carrier plate (11) has clearance grooves (111) at the middle of both ends, and the two sides of the carrier plate (11) are recessed inward to form limiting steps (112) that are away from the receiving groove (12).

4. The FPC compatible screen and patch reflow carrier of claim 1 or 2, wherein: The multiple positioning posts (14) are arranged in two rows, respectively close to the two sides of the receiving groove (12).

5. The reflow solder carrier compatible with FPC screen printing and taping according to claim 1, wherein: The FPC board (1') has multiple second positioning holes (11') that cooperate with the multiple positioning posts (14).

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