A new structure of flat solid-state relay

Abstract

A new structure's flat solid - state relay, including shell seat, circuit board, silicon controlled rectifier, heat dissipation base plate, cover seat and fixed frame, the middle part of shell seat is equipped with installation cavity, the left and right sides of circuit board are equipped with connecting piece in pairs, the left and right sides of shell seat are also equipped with a pair of installation site, silicon controlled rectifier is electrically connected with circuit board, heat dissipation base plate and cover seat are arranged at the lower end and upper end of shell seat respectively, fixed frame is equipped with positioning part and support part, the lower end of positioning part is equipped with positioning cavity, support part is arranged on the front and back sides of positioning part, positioning column is arranged on the front and back inner wall surfaces of installation cavity, positioning column supports and fits support part, first positioning block is also arranged on positioning column, first positioning groove is arranged on support part, first positioning block cooperates with first positioning groove, so that fixed frame fixes and assembles silicon controlled rectifier on heat dissipation base plate through positioning cavity. The utility model has the advantages of reasonable and simple structure, convenient assembly, stable and reliable quality.

Description

Technical Field

[0001] This utility model relates to the field of relay technology, and in particular to a novel flat solid-state relay. Background Technology

[0002] A solid-state relay (SSR) is a contactless switch composed of microelectronic circuits, discrete electronic components, and power electronic devices. This type of relay achieves contactless and spark-free connection and disconnection of circuits through the switching characteristics of electronic components (such as switching transistors and triacs). Therefore, it is also called a "contactless switch." Existing solid-state relays typically use potting technology to encapsulate semiconductor devices such as triacs within a housing. However, potted solid-state relays are inconvenient to repair, require high-precision manufacturing processes, and struggle to ensure the uniformity and quality of the potting compound, resulting in poor product consistency. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a new type of flat solid-state relay with a structure that is easy to assemble and has stable and reliable quality.

[0004] The technical solution adopted by this utility model to solve its technical problem is a novel flat solid-state relay, including a housing, a circuit board, a thyristor, a heat sink, and a cover. The housing has a mounting cavity in the middle that is open at both the top and bottom. The circuit board is installed in the mounting cavity. Connecting pieces are provided in pairs on the left and right sides of the circuit board. The housing also has a pair of mounting positions on each of the left and right sides opposite to the mounting cavity. The terminals of the connecting pieces are fitted into the mounting positions. The thyristor is electrically connected to the circuit board. The heat sink and the cover are respectively located at the lower and upper ends of the housing. The thyristor is also attached to the heat sink. The board solid-state relay also includes a mounting bracket, which has a positioning part and a support part. The lower end of the positioning part has a positioning cavity for cooperating with the thyristor. The support part is arranged on the front and rear sides of the positioning part. The front and rear inner walls of the mounting cavity are provided with positioning posts. The lower end of the positioning post is flush with the lower opening of the mounting cavity. The positioning post supports and fits the support part. Each positioning post is also provided with a first positioning block. Each support part is provided with a first positioning groove. The first positioning block cooperates with the first positioning groove so that the mounting bracket fixes the thyristor to the heat sink base plate through the positioning cavity.

[0005] The advantages of the above technical solution are as follows: the positioning column forms a supporting fit with the support part, and the fixing frame can maintain good positional parallelism when installed in the mounting cavity. This allows the positioning cavity on the positioning part to form an accurate and reliable fit with the thyristor, thereby ensuring the stability of the fixing frame's effect on the thyristor. Furthermore, through the cooperation of the first positioning block and the first positioning groove, the fixing frame can stably and tightly connect the thyristor to the heat dissipation base plate. The structural design is reasonable and simple, and it is also easy to assemble. The quality of the flat solid-state relay is also stable and reliable.

[0006] Furthermore, the connector is provided with snap-fit ​​pins on the terminal, which are arranged on the front and rear sides. The mounting position is provided with corresponding snap-fit ​​grooves, and the snap-fit ​​pins are engaged in the snap-fit ​​grooves to lock the connector.

[0007] The advantages of the above technical solution are: through the cooperation of the snap-fit ​​pins and snap-fit ​​slots, the wiring terminals of the connecting piece and the mounting position are fixedly connected, which not only ensures the stable and reliable wiring connection, but also limits the position of the circuit board with the connecting piece. The structural design is reasonable.

[0008] Furthermore, a support column is provided on the inner wall of the mounting cavity, the circuit board is placed on the support column, and a pressing column is provided on the bottom end of the hook of the cover seat, the pressing column is used to press against the circuit board.

[0009] The advantages of adopting the above technical solution are as follows: by setting support columns, the circuit board is provided with support force; by setting pressure columns, the circuit board can be fixed to the support columns after the cover is installed, and there will be no obvious vertical displacement. The installation of the circuit board is more stable, and the installation does not require screw fixing, which is convenient for assembly.

[0010] Furthermore, the cover is provided with a mounting post directly above the indicator light on the circuit board. The mounting post is hollow and has a light-transmitting element tightly installed inside.

[0011] The advantages of adopting the above technical solution are: by setting up a light-transmitting component, the flat solid-state relay can have the function of indicating the working status, making it more reasonable to use. In addition, the light-transmitting component is tightly installed in the mounting column, which can prevent external rainwater or dust from entering and extend the service life of the circuit board.

[0012] Furthermore, the cover is also provided with a protective baffle, which is positioned relative to the connection between the mounting position and the mounting cavity, and the lower end of the protective baffle is clearance-fitted with the wiring terminal of the connecting piece.

[0013] The advantages of adopting the above technical solution are: the protective baffle can prevent external rainwater or dust from entering, and also prevent sparks generated during wiring from entering the installation cavity, making the circuit board safer to use and effectively extending its service life.

[0014] Furthermore, the lower end of the housing is provided with a recessed cavity, which is arranged around the lower opening of the mounting cavity and on which the heat dissipation base plate is placed. The inner wall of the recessed cavity is also provided with a fastening protrusion, which fastens the heat dissipation base plate to the recessed cavity.

[0015] The advantages of the above technical solution are: by setting a concave cavity, the installation of the heat dissipation base plate is positioned; by setting a fastening protrusion, the installation firmness of the heat dissipation base plate is improved; and no injection of plastic glue is required, making the installation method simple and reasonable.

[0016] Furthermore, a pair of opposite corners of the heat dissipation base plate are set as outward oblique angles, and a pair of opposite corners of the concave cavity are set as inward oblique angles, with the inward oblique angles and the outward oblique angles correspondingly fitted together.

[0017] The advantages of adopting the above technical solution are: the combination of external and internal bevel angles makes the installation of the heat dissipation base plate more secure, and the external and internal bevel angles are set diagonally, avoiding the phenomenon of incorrect installation of the front and back of the heat dissipation base plate.

[0018] Furthermore, a second positioning block is provided on the annular side wall of the heat dissipation base plate, and a second positioning groove is provided on the inner side wall of the cavity, the second positioning groove cooperating with the second positioning block.

[0019] The advantages of adopting the above technical solution are: the cooperation of the second positioning block and the second positioning groove makes the connection stability between the heat dissipation base plate and the cavity higher, and also avoids the phenomenon of incorrect left and right installation of the heat dissipation base plate.

[0020] Furthermore, two flip covers are hinged to the cover base, and at least one of the flip covers has a pair of protective blocks at its lower edge. The protective blocks are used to cooperate with the mounting position, and each flip cover is also provided with a locking through hole.

[0021] The advantages of adopting the above technical solution are as follows: the flip cover protects the wiring screws in the installation position, and the protective block prevents the operator from touching the wiring screws when holding the wire. The locking hole allows the operator to perform wiring operations directly without opening the flip cover, making the operation simple, convenient, quick, and safer.

[0022] Furthermore, a thermally conductive component is provided between the thyristor and the heat dissipation base plate, and the thermally conductive component is a silicone pad or a ceramic substrate.

[0023] The advantages of the above technical solution are: a thermally conductive component, such as a silicone pad or ceramic substrate, is placed between the thyristor and the heat sink, thereby improving the thermal conductivity between the thyristor and the heat sink, and thus improving the heat dissipation efficiency of the thyristor. Attached Figure Description

[0024] Figure 1 This is an exploded view of the structure of this utility model;

[0025] Figure 2 This is a schematic diagram of the shell base structure of this utility model;

[0026] Figure 3 This is another view of the housing structure of this utility model;

[0027] Figure 4 for Figure 3 Enlarged structural diagram of the middle section;

[0028] Figure 5 This is a schematic diagram of the fixing frame structure of this utility model;

[0029] Figure 6 This is another view of the fixing frame structure of this utility model;

[0030] Figure 7 This is a schematic diagram of the cover structure of this utility model;

[0031] Figure 8 This is a schematic diagram of the connecting piece structure of this utility model;

[0032] Figure 9 This is a schematic diagram of the heat dissipation base plate structure of this utility model;

[0033] Figure 10 This is a schematic diagram of the flip-top structure of this utility model.

[0034] In the diagram: 1-House base, 2-Circuit board, 3-SCR, 4-Heat dissipation base plate, 5-Cover, 6-Mounting cavity, 7-Connecting piece, 8-Mounting position, 9-Fixing bracket, 10-Positioning part, 11-Supporting part, 12-Positioning cavity, 13-Positioning post, 14-First positioning block, 15-First positioning groove, 16-Snap-fit ​​foot, 17-Snap-fit ​​groove, 18-Supporting post, 19-Pressure post, 20-Mounting post, 21-Light-transmitting element, 22-Protective baffle, 23-Concave cavity, 24-Fasting protrusion, 25-Outer bevel angle, 26-Inner bevel angle, 27-Second positioning block, 28-Second positioning groove, 29-Flip cover, 30-Protective baffle, 31-Locking through hole, 32-Heat-conducting element, 33-Wiring screw. Detailed Implementation

[0035] To more clearly illustrate the technical solutions in the embodiments of this utility model and / or the prior art, the specific implementation methods of this utility model will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are merely some embodiments of this utility model. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without creative effort. Furthermore, references to orientation only indicate the relative positional relationship between the components, not their absolute positional relationship.

[0036] Please see Figures 1 to 10 As shown, a novel flat solid-state relay includes a housing 1, a circuit board 2, a silicon controlled rectifier (SCR) 3, a heat sink 4, and a cover 5. The housing 1 has a mounting cavity 6 that is open at both the top and bottom in the middle. The circuit board 2 is installed inside the mounting cavity 6. Connecting pieces 7 are provided on both the left and right sides of the circuit board 2. The housing 1 also has a pair of mounting positions 8 on both the left and right sides opposite the mounting cavity 6. The terminals of the connecting pieces 7 are fitted into the mounting positions 8. More specifically, a wiring screw 33 is threaded into the mounting position 8. The wiring screw 33 has a clamping plate. The wiring screw 33 drives the clamping plate to rotate, thereby pressing the wire terminal onto the terminal of the connecting piece 7. The thyristor 3 is electrically connected to the circuit board 2. The heat sink 4 and the cover 5 are respectively located at the lower and upper ends of the housing 1. The thyristor 3 is also attached to the heat sink 4. The flat solid-state relay also includes a fixing frame 9, which has a positioning part 10 and a support part 11. The lower end of the positioning part 10 has a positioning cavity 12, which is used to cooperate with the thyristor 3. The support part 11 is located on both sides of the positioning part 10. Positioning posts 13 are provided on both the front and rear inner walls of the mounting cavity 6. The lower end of the positioning post 13 is flush with the lower opening of the mounting cavity 6. The positioning post 13 supports and fits the support part 11. Each positioning post 13 is also provided with a first positioning block 14, and each support part 11 is provided with a first positioning groove 15. The first positioning block 14 and the first positioning groove 15 cooperate to fix the thyristor 3 onto the heat dissipation base plate 4 through the positioning cavity 12. In the above structure, the positioning post 13 forms a supporting and fitting effect on the support part 11, and the fixing frame... When installed in the mounting cavity 6, the 9 can maintain good positional parallelism. The two positioning posts 13 will clamp the fixing frame 9 to a certain extent, so that the positioning cavity 12 on the positioning part 11 and the thyristor 3 can form an accurate and reliable fit, thereby ensuring the stability of the fixing frame 9's action on the thyristor 3. Then, through the cooperation of the first positioning block 14 and the first positioning groove 15, the fixing frame 9 can stably and tightly connect the thyristor 3 to the heat dissipation base plate 4. The structural design is reasonable and simple, and it is also easy to assemble. The quality of the flat solid-state relay is also stable and reliable.

[0037] In this embodiment, the connector 7 is also provided with a locking pin 16 on its terminal. The locking pin 16 is arranged on both the front and rear sides. The mounting position 8 is provided with a corresponding locking groove 17. The locking pin 16 is engaged in the locking groove 17 to lock the connector 7. Multiple spiks are provided on the left and right sides of the locking pin 16. The spiks interact with the inner wall of the locking groove 17 to form a lock. In the above structure, the engagement of the locking pin 16 and the locking groove 17 makes the terminal of the connector 7 and the mounting position 8 form a fixed connection. While ensuring a stable and reliable wiring connection, it also has the function of limiting the position of the circuit board 2 with the connector 7. The structural design is reasonable.

[0038] In this embodiment, the inner wall of the mounting cavity 6 is also provided with support columns 18, and there are four support columns 18. The circuit board 2 is placed on the support columns 18. The bottom end of the hook of the cover 5 is also provided with a pressing column 19, which is used to press against the circuit board 2. In the above structure, by setting the support columns 18, the circuit board 2 is provided with support force. By setting the pressing column 19, the circuit board 2 can be fixedly matched with the support columns 18 after the cover 5 is installed, and there will be no obvious vertical displacement. The installation of the circuit board 2 is more stable, and the installation does not require screw fixation, which is convenient for assembly.

[0039] In this embodiment, the cover 5 is provided with a mounting post 20 directly above the indicator light on the circuit board 2. The mounting post 20 is hollow, and a light-transmitting element 21 is tightly installed inside the mounting post 20. In the above structure, by setting the light-transmitting element 21, the flat solid-state relay can have the function of indicating the working status, which is more reasonable. Moreover, the light-transmitting element 21 is tightly installed inside the mounting post 20, which can prevent external rainwater or dust from entering and extend the service life of the circuit board 2.

[0040] In this embodiment, the cover 5 is also provided with a protective baffle 22. The protective baffle 22 is set at the connection between the mounting position 8 and the mounting cavity 6. The lower end of the protective baffle 22 is fitted with the wiring terminal of the connecting piece 7 with a gap. In the above structure, the setting of the protective baffle 22 can prevent external rainwater or dust from entering, and also prevent the sparks generated during wiring from entering the mounting cavity 6, making the use of the circuit board 2 safer and effectively extending its service life.

[0041] In this embodiment, the lower end of the housing 1 is provided with a cavity 23. The cavity 23 is arranged around the lower opening of the mounting cavity 6 and the aforementioned heat dissipation base plate 4 is placed thereon. The inner side wall of the cavity 23 is also provided with a fastening protrusion 24. The fastening protrusion 24 secures the heat dissipation base plate 4 in the cavity 23. In the above structure, by providing the cavity 23, the installation of the heat dissipation base plate 4 is positioned. By providing the fastening protrusion 24, the installation firmness of the heat dissipation base plate 4 is improved. There is no need for injection molding glue. The installation method is simple and reasonable.

[0042] In this embodiment, a pair of opposite corners of the heat dissipation base plate 4 are set as outward bevels 25, and a pair of opposite corners of the cavity 23 are set as inward bevels 26. The inward bevels 26 and the outward bevels 25 are installed in a corresponding fit. In the above structure, the fit between the outward bevels 25 and the inward bevels 26 makes the installation of the heat dissipation base plate 4 more secure. Moreover, the outward bevels 25 and the inward bevels 26 are set diagonally, which avoids the phenomenon of incorrect installation of the front and back of the heat dissipation base plate 4. The outer side of the circumferential sidewall of the heat dissipation base plate 4 is provided with a chamfer structure.

[0043] In this embodiment, a second positioning block 27 is also provided on the circumferential side wall of the heat dissipation base plate 4, and a second positioning groove 28 is also provided on the inner side wall of the cavity 23. The second positioning groove 28 cooperates with the second positioning block 27. In the above structure, the cooperation of the second positioning block 27 and the second positioning groove 28 makes the connection stability between the heat dissipation base plate 4 and the cavity 23 higher, and also avoids the phenomenon of incorrect left and right installation of the heat dissipation base plate 4.

[0044] In this embodiment, two flip covers 29 are hinged to the cover base 5, and at least one flip cover 29 has a pair of protective blocks 30 at its lower edge. The protective blocks 30 are used to cooperate with the mounting position 8. Each flip cover 29 is also provided with a locking hole 31. In the above structure, the flip cover 29 protects the wiring screw 33 in the mounting position 8. The setting of the protective blocks 30 prevents the operator from touching the wiring screw 33 when holding the wire and making wiring. By setting the locking hole 31, the operator can directly make wiring without opening the flip cover 29. The operation is simple, convenient and quick, and safer to use.

[0045] In this embodiment, a heat-conducting component 32 is also provided between the thyristor 3 and the heat dissipation base plate 4. The heat-conducting component 32 is a silicone pad or a ceramic substrate. In the above structure, the heat-conducting component 32 with a silicone pad or ceramic substrate is provided between the thyristor 3 and the heat dissipation base plate 4, thereby improving the heat conduction efficiency between the thyristor 3 and the heat dissipation base plate 4, and thus improving the heat dissipation efficiency of the thyristor 3.

[0046] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the protection scope of the present invention.

Claims

1. A novel flat solid-state relay, comprising a housing (1), a circuit board (2), a thyristor (3), a heat sink (4), and a cover (5), wherein the housing (1) has a mounting cavity (6) open at both the top and bottom in the middle, the circuit board (2) has connecting pieces (7) arranged in pairs on the left and right sides, and the housing (1) also has a pair of mounting positions (8) on the left and right sides opposite to the mounting cavity (6), the thyristor (3) is electrically connected to the circuit board (2), and the heat sink (4) and the cover (5) are respectively located at the lower end and the upper end of the housing (1), characterized in that: The flat solid-state relay also includes a mounting bracket (9), which has a positioning part (10) and a support part (11). The lower end of the positioning part (10) has a positioning cavity (12), which is used to cooperate with the thyristor (3). The support part (11) is arranged on the front and rear sides of the positioning part (10). The front and rear inner walls of the mounting cavity (6) are provided with positioning posts (13). The lower end of the positioning post (13) is flush with the lower opening of the mounting cavity (6). The positioning post (13) supports and fits the support part (11). The positioning post (13) is also provided with a first positioning block (14). The support part (11) is provided with a first positioning groove (15). The first positioning block (14) cooperates with the first positioning groove (15) so that the mounting bracket (9) fixes the thyristor (3) on the heat sink base plate (4) through the positioning cavity (12).

2. A new structure of flat solid state relay according to claim 1, characterized in that: The connector (7) is also provided with snap-fit ​​pins (16) on the wiring end. The snap-fit ​​pins (16) are arranged on the front and rear sides. The mounting position (8) is provided with corresponding snap-fit ​​grooves (17). The snap-fit ​​pins (16) are fitted into the snap-fit ​​grooves (17) to lock the connector (7).

3. A new structure of flat solid state relay according to claim 1 or 2, characterized in that: The inner wall of the mounting cavity (6) is also provided with a support column (18), the circuit board (2) is placed on the support column (18), and the bottom end of the hook of the cover (5) is also provided with a pressing column (19), the pressing column (19) is used to press against the circuit board (2).

4. A new structure of flat solid state relay according to claim 1, characterized in that: The cover (5) is provided with a mounting post (20) directly above the indicator light on the circuit board (2). The mounting post (20) is hollow and a light-transmitting element (21) is tightly arranged inside the mounting post (20).

5. A novel construction of a flat solid state relay according to claim 1, characterized in that: The cover (5) is also provided with a protective baffle (22), which is set at the connection between the mounting position (8) and the mounting cavity (6), and the lower end of the protective baffle (22) is fitted with the wiring end of the connecting piece (7) with a gap.

6. A new structure of flat solid state relay according to claim 1, characterized in that: The lower end of the housing (1) is provided with a cavity (23). The cavity (23) is arranged around the lower end opening of the mounting cavity (6) and the heat dissipation base plate (4) is placed thereon. The inner side wall of the cavity (23) is also provided with a fastening protrusion (24). The fastening protrusion (24) makes the heat dissipation base plate (4) fastened in the cavity (23).

7. A novel construction of a flat solid state relay according to claim 6, characterized in that: The heat dissipation base plate (4) has a pair of opposite corners set as outward oblique angles (25), and the cavity (23) has a pair of opposite corners set as inward oblique angles (26). The inward oblique angles (26) and the outward oblique angles (25) are installed in a corresponding and matching manner.

8. A novel construction of a flat solid state relay according to claim 7, characterized in that: The heat dissipation base plate (4) is provided with a second positioning block (27) on the circumferential side wall, and the inner side wall of the cavity (23) is provided with a second positioning groove (28), which cooperates with the second positioning block (27).

9. A new structure of flat solid state relay according to claim 1, characterized in that: Two flip covers (29) are hinged to the cover base (5), and at least one of the flip covers (29) is provided with a pair of protective blocks (30) at the lower edge. The protective blocks (30) are used to cooperate with the mounting position (8). Each flip cover (29) is also provided with a locking through hole (31).

10. A new structure of flat solid state relay according to claim 1, characterized in that: A heat-conducting component (32) is provided between the thyristor (3) and the heat dissipation base plate (4), and the heat-conducting component (32) is a silicone pad or a ceramic substrate.

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