Photovoltaic power module heat sink substrate
By using a one-piece stamped heat dissipation substrate, the problems of increased cost and encapsulation failure caused by the snap ring fixing method are solved, achieving efficient heat dissipation and reliable connection, and improving the production efficiency and reliability of photovoltaic power modules.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- STARPOWER SEMICON LTD
- Filing Date
- 2025-06-30
- Publication Date
- 2026-07-03
AI Technical Summary
In existing photovoltaic power module packaging, the ring fixing method increases material costs and limits production efficiency, while the press-fitting process is prone to introducing the risk of packaging failure, affecting reliability and heat dissipation performance.
The heat dissipation substrate is formed by one-piece stamping. The substrate has stamped retaining rings at the holes and multiple welding protrusions on the welding surface. The retaining rings and the substrate are made of the same continuous material. The heat dissipation surface is a slightly convex curved surface and is made by precision stamping and hydroforming processes.
It reduced material costs and production pressure, improved automated production efficiency, avoided the risk of substrate deformation, and optimized module reliability and heat dissipation performance.
Smart Images
Figure CN224460327U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of power module packaging, specifically to a heat dissipation substrate for photovoltaic power modules. Background Technology
[0002] As a core component of new energy power generation systems, photovoltaic power modules undertake the critical tasks of power conversion and regulation. During operation, the power modules generate a large amount of heat, which must be quickly conducted to the heat sink through the bottom heat dissipation substrate to prevent module failure due to overheating. Therefore, the reliable connection and efficient heat dissipation capacity of the heat dissipation substrate directly affect the performance and lifespan of the module.
[0003] Currently, power module packaging commonly uses snap rings to fix the substrate to the housing. However, this solution has two significant problems: First, the use of snap rings increases material costs and limits the production efficiency of automated production lines; second, the pressing process of snap rings applies significant pressure to the module, which can easily introduce packaging failure risks, such as substrate deformation or interface delamination, thereby affecting the reliability and heat dissipation performance of the module.
[0004] Therefore, there is an urgent need for a new packaging technology that can simplify structural design, reduce manufacturing costs, and improve production efficiency and module reliability while ensuring heat dissipation performance. Utility Model Content
[0005] To address the above technical problems, this utility model provides a heat dissipation substrate for photovoltaic power modules.
[0006] The technical problem solved by this utility model can be achieved by the following technical solution:
[0007] A heat dissipation substrate for a photovoltaic power module includes: a heat dissipation substrate integrally stamped;
[0008] The heat dissipation substrate has a stamped retaining ring at the substrate hole;
[0009] The welding surface of the heat dissipation substrate is provided with multiple welding protrusions.
[0010] Preferably, the retaining ring and the heat dissipation substrate are made of the same continuous material and are formed in one step by a stamping die.
[0011] Preferably, the inner side of the retaining ring is provided with a stress relief groove with a depth of 0.1 mm.
[0012] Preferably, the heat dissipation substrate is formed by stamping a roll of material using a stamping die.
[0013] Preferably, the heat dissipation surface of the heat dissipation substrate has a slightly convex curved surface structure.
[0014] Preferably, the radius of curvature of the micro-convex surface structure is 500-800 mm.
[0015] Preferably, the heat dissipation substrate is made of copper-based or aluminum-based metal materials.
[0016] Preferably, the copper-based metal material is pure copper T2 (Y2).
[0017] Preferably, the weld bulge is formed by hydraulic equipment using a punch.
[0018] Preferably, the height of the welding bulge is 0.1 to 0.2 mm.
[0019] The advantages or beneficial effects of this utility model's technical solution are as follows:
[0020] This invention uses an integrated heat dissipation substrate with a retaining ring stamped on it. While ensuring efficient heat dissipation, it significantly reduces material costs and production pressure, improves automated production efficiency, and avoids the risk of substrate deformation caused by traditional press-fit retaining rings. This effectively optimizes the reliability and economy of photovoltaic power modules. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the welding surface of the heat dissipation substrate of the photovoltaic power module of this utility model;
[0022] Figure 2 This is a front view of the heat dissipation substrate of the photovoltaic power module of this utility model;
[0023] Figure 3 This is a partially enlarged schematic diagram of the heat dissipation substrate of the photovoltaic power module of this utility model;
[0024] Figure 4 This is a schematic diagram of the heat dissipation surface of the photovoltaic power module heat dissipation substrate of this utility model.
[0025] Explanation of reference numerals in the attached diagram: 1. Welding surface; 2. Welding protrusion; 3. Snap ring; 4. Heat dissipation surface. Detailed Implementation
[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0027] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.
[0028] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.
[0029] Reference Figures 1 to 3 This utility model provides a heat dissipation substrate for a photovoltaic power module, comprising: a heat dissipation substrate integrally stamped;
[0030] The heat dissipation substrate is provided with a stamped retaining ring 3 at the substrate hole position;
[0031] The welding surface 1 of the heat dissipation substrate is provided with multiple welding protrusions 2.
[0032] Specifically, in this embodiment of the invention, a retaining ring 3 structure is set at the edge hole of the substrate by precision stamping process, which replaces the traditional press-fit retaining ring, thereby achieving rapid assembly, reducing production costs and improving structural reliability.
[0033] In a preferred embodiment of this invention, the retaining ring 3 and the heat dissipation substrate are made of the same continuous material and are formed in one step by a stamping die. The heat dissipation substrate is made of pure copper, copper alloy, pure aluminum, or aluminum alloy, preferably aluminum alloy 5052 or pure copper T2 (Y2) with high thermal conductivity (>200W / m·K) and excellent stamping formability, in order to meet the balance between heat dissipation requirements and process adaptability.
[0034] In practical implementation, the machining can be completed on a 400-600 ton press using a precision progressive die, and a 0.1mm deep stress relief groove is pre-set on the inner side of the retaining ring 3 to absorb residual stamping stress. After 1000 cycles in a temperature range of -40 to 125℃, the resulting structure showed no cracks or plastic deformation at the joints, meeting the IEC 61215 photovoltaic module mechanical durability standard. This design is particularly suitable for scenarios requiring a balance between lightweight design and heat dissipation efficiency.
[0035] As a preferred embodiment of this utility model, refer to Figure 4 The heat dissipation substrate of this invention is formed by stamping strip material using a stamping die. The heat dissipation surface 4 of the substrate exhibits a certain arch, forming a slightly convex curved surface structure. This arch design is achieved through precise control of the stamping process parameters. Specifically, during the stamping process, a lower die with a pre-arched curved surface is used in conjunction with a flat punch to induce an elastic deformation of 0.05-0.15mm in the central area of the substrate, forming a slightly convex curved surface with a curvature radius of 500-800mm. This slightly convex curved surface structure design achieves adaptive fitting between the heat dissipation surface 4 and the heat sink through elastic deformation, significantly optimizing the interface contact pressure distribution, effectively compensating for assembly tolerances and surface unevenness, thereby greatly reducing interface thermal resistance. Its elastic properties can absorb dimensional changes during thermal cycling, avoid contact pressure attenuation, and ensure long-term stable heat dissipation performance.
[0036] Compared to traditional planar designs, this structure significantly improves interface heat conduction efficiency through elastic adaptive bonding, while also enhancing vibration resistance and thermal cycling performance, achieving more reliable and efficient heat dissipation.
[0037] In a preferred embodiment of this invention, the weld bump 2 is formed by hydraulic pressing with a punch, with a height between 0.1 and 0.2 mm. This process utilizes a precision servo hydraulic system in conjunction with a carbide punch to perform localized plastic deformation processing on the substrate under a pressure of 500-800 MPa, ensuring consistent bump shape and dimensional accuracy (tolerance controlled within ±0.01 mm). This weld bump 2 design achieves a highly consistent bump structure through precision hydraulic forming, ensuring uniform pressure distribution at the welding interface and significantly reducing contact thermal resistance. Its plastic deformation processing method preserves the integrity of the substrate material, avoiding the formation of a heat-affected zone. Simultaneously, the optimized height of 0.1–0.2 mm ensures sufficient welding gap control while maintaining the structural strength of the substrate. This process also offers advantages in high repeatability and rapid prototyping, making it particularly suitable for mass automated production. Compared to traditional methods such as laser processing, this hydraulic stamping process reduces production costs by more than 50% while ensuring higher connection reliability, and completely avoids material thermal damage and microstructural defects caused by laser processing.
[0038] In summary, this utility model adopts an integrated stamping process, designing the retaining ring 3 and the substrate body as a continuous structure of the same material, and forming it in one step through a precision stamping die; the heat dissipation surface 4 adopts a micro-convex curved surface design to achieve adaptive and tight fit with the heat sink; the welding surface 1 is provided with an array-type hydraulically formed convex hull structure to ensure a highly reliable connection of the welding interface.
[0039] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A photovoltaic power module heat spreading substrate, characterized by, include: A heat dissipation substrate formed by one-piece stamping; The heat dissipation substrate has a stamped retaining ring at the substrate hole; The welding surface of the heat dissipation substrate is provided with multiple welding protrusions.
2. A photovoltaic power module heat sink substrate according to claim 1, wherein, The retaining ring and the heat dissipation substrate are made of the same continuous material and are formed in one step by a stamping die.
3. A photovoltaic power module heat sink substrate according to claim 2, wherein, The inner side of the retaining ring is provided with a stress relief groove with a depth of 0.1 mm.
4. The photovoltaic power module heat sink substrate of claim 1, wherein, The heat dissipation substrate is formed by stamping strip material using a stamping die.
5. A photovoltaic power module heat sink substrate according to claim 4, wherein, The heat dissipation surface of the heat dissipation substrate has a slightly convex curved surface structure.
6. A photovoltaic power module heat sink substrate according to claim 5, wherein, The radius of curvature of the micro-convex surface structure is 500-800 mm.
7. The photovoltaic power module heat sink substrate of claim 1, wherein, The heat dissipation substrate is made of copper or aluminum metal.
8. A photovoltaic power module heat sink substrate according to claim 7, wherein, The copper-based metal material is pure copper T2(Y2).
9. The photovoltaic power module heat sink substrate of claim 1, wherein, The weld protrusion is formed by hydraulic equipment using a punch.
10. A photovoltaic power module heat dissipation substrate according to claim 9, characterized in that, The height of the welding bulge is 0.1 to 0.2 mm.