A device with a large-size heat sink

Abstract

This utility model discloses a device for a large-size heat sink, relating to the field of heat sink technology. It includes a heat sink base, a housing on top of the base, a printed circuit board below the base, and wing-shaped features on both sides of the base. The base is V-shaped, and several first heat dissipation fins are arranged on its upper surface. Four rivets are stamped through the lower part of each wing, with a T-shaped upper part and a stepped lower part. Screws are installed through the lower part of each rivet, penetrating the printed circuit board. This large-size heat sink device solves the problems of high cost and difficult maintenance associated with traditional heat sinks, is suitable for PCB components, improves heat dissipation efficiency, reduces maintenance costs, and meets the heat dissipation needs of thin and light devices.

Description

Technical Field

[0001] This utility model relates to the field of heat sink technology, and specifically to a device for a large-size heat sink. Background Technology

[0002] Printed circuit board (PCB) heat sinks are key components used to reduce the operating temperature of electronic components. They improve PCB reliability by increasing the heat dissipation area and heat conduction efficiency. They are mostly made of aluminum, with a thermal conductivity of 200-237 W / m·K, or copper, with a thermal conductivity of 385 W / m·K. The surface is anodized or nickel-plated to enhance oxidation resistance. Structurally, they are divided into two types: passive and active. Passive heat sinks rely on natural convection cooling through fin arrays and are suitable for components with power consumption ≤5W. Active heat sinks integrate micro fans or heat pipes and can handle high-power chips above 20W.

[0003] In existing heat sink technologies, such as the high-efficiency heat sink with application number 201210329042.0, the technical solution is as follows: it includes a sheet body made of aluminum alloy and formed by stamping. Heat sinks are provided on both sides of the sheet body, with the same spacing between the heat sinks. The top of the heat sink is arc-shaped. The surface of the sheet body is provided with mounting holes, which are made by drilling and milling machines and are of the same size. However, in order to meet the heat dissipation requirements of high-power components, existing heat sinks often use large-area fin arrays and thick copper-aluminum substrates, resulting in material costs accounting for 15%-20% of the total cost of PCB components and increasing the weight by 20%-30%. This makes it difficult to adapt to thinner and lighter devices. Although the fixed welding structure with built-in rivets can ensure mechanical strength, special tools are required to break the solder joints during maintenance, which can easily cause PCB pads to fall off or components to be damaged, increasing maintenance costs and disassembly risks.

[0004] In view of this, this case arose in response to the aforementioned issues. Summary of the Invention

[0005] In order to overcome the shortcomings and deficiencies of the existing technology, the purpose of this utility model is to provide a device for large-size heat sinks.

[0006] The objective of this utility model is achieved through the following technical solution:

[0007] A device for a large-size heat sink includes a heat sink base, a housing on top of the heat sink base, a printed circuit board below the heat sink base, wings on the left and right sides of the heat sink base, the heat sink base being V-shaped, a plurality of first heat dissipation fins on the upper surface of the heat sink base, four rivets punched through the lower part of each wing, the upper part of each rivet being T-shaped and the lower part being stepped, and a screw being installed through the lower part of each rivet, the screw penetrating the printed circuit board.

[0008] Preferably, a plurality of second heat dissipation fins are evenly distributed on the upper surface of the flying wing.

[0009] By adopting the above technical solution, the second heat dissipation fin on the flying wing and the first heat dissipation fin on the heat dissipation base form a three-dimensional heat dissipation array, which increases the total heat dissipation area, reduces thermal resistance, and effectively controls the temperature range of the printed circuit board.

[0010] Preferably, the rivet post is hexagonal, and a threaded hole is formed through the inside of the rivet post.

[0011] Using the above technical solution, the hexagonal rivet post is easy to install and fix quickly with a wrench. The threaded hole and screw match, which shortens the disassembly time and avoids damage to the solder pads compared with the traditional welding structure, thus reducing maintenance costs.

[0012] Preferably, the stepped bottom of the rivet includes a large-diameter ring and a small-diameter ring, with the small-diameter ring located below the large-diameter ring.

[0013] By adopting the above technical solution, the large-diameter ring and the small-diameter ring at the bottom of the stepped rivet post form a limiting structure. The small-diameter ring accurately positions the mounting hole, while the large-diameter ring provides stable support, reducing the installation error range and preventing the increase in contact thermal resistance caused by the swaying of the heat sink.

[0014] Preferably, the small-diameter ring passes through the mounting hole of the printed circuit board, the mounting hole diameter of the printed circuit board is adapted to the outer diameter of the small-diameter ring, and the bottom of the large-diameter ring is attached to the upper surface of the printed circuit board.

[0015] Using the above technical solution, the large-diameter ring is attached to the surface of the printed circuit board, increasing the contact area compared to traditional single-point riveting. Combined with the thermally conductive silicone layer, the heat conduction efficiency is improved and the temperature uniformity error is reduced.

[0016] Preferably, the screw is provided with blue adhesive on its outer side, and the angle of the blue adhesive surrounding the outer side of the screw is in the range of 90°-180°.

[0017] Using the above technical solution, the blue adhesive surrounds the screw at 90°-180°, providing an anti-loosening function while allowing for manual disassembly. This balances mechanical strength and ease of maintenance, and reduces the risk of screw loosening under vibration.

[0018] Preferably, a chip is disposed at the bottom of the heat sink base, the chip is attached to a printed circuit board, and the surface of the chip is coated with a thermally conductive silicone layer.

[0019] By adopting the above technical solution, the thermally conductive silicone layer reduces the contact thermal resistance, allowing the chip's heat to be quickly conducted to the heat dissipation fins, thus improving heat dissipation efficiency.

[0020] The beneficial effects of this utility model are as follows: the device for this large-size heat sink,

[0021] 1. Three-dimensional heat dissipation structure for efficient temperature reduction: The V-shaped heat sink base, combined with the wing-shaped dual-fin array, forms a 360° convection channel with the first and second heat dissipation fins, which improves the natural convection heat transfer coefficient. Compared with traditional flat heat sinks, the temperature is reduced at the same power consumption, making it suitable for high-power components. The combination of thermally conductive silicone layer and stepped rivet pillars ensures that the heat sink is tightly attached to the PCB, shortening the heat conduction path by 40% and solving the problem of local overheating caused by poor contact in traditional structures.

[0022] 2. Quick-release mechanical connection improves maintenance efficiency: The threaded connection between the rivet and the M3 screw replaces welding. Only a screwdriver is needed for installation, and one person can complete the disassembly and assembly. The anti-loosening design of the blue glue enhances the bonding force and prevents it from loosening due to vibration. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall installation structure of this utility model;

[0024] Figure 2 This is a front view of the heat sink base of this utility model;

[0025] Figure 3 This is a top view of the heat sink base of this utility model;

[0026] Figure 4 This is a top view schematic diagram of the rivet post structure of this utility model;

[0027] Figure 5 This is a schematic diagram of the M3 screw structure of this utility model.

[0028] The attached diagram is labeled as follows: 1. Heat sink base; 2. Flying wing; 3. Second heat sink fin; 4. First heat sink fin; 5. Rivet post; 501. Large diameter ring; 502. Small diameter ring; 6. Threaded hole; 7. Screw; 8. Blue glue; 9. Housing; 10. Printed circuit board; 11. Thermally conductive silicone layer; 12. Chip. Detailed Implementation

[0029] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and accompanying drawings. The content mentioned in the embodiments is not intended to limit the present invention.

[0030] like Figure 1-5 As shown:

[0031] A device for a large-size heat sink includes a heat sink base 1, a housing 9 on top of the heat sink base 1, a printed circuit board 10 below the heat sink base 1, wings 2 on the left and right sides of the heat sink base 1, the heat sink base 1 being V-shaped, a plurality of first heat dissipation fins 4 on the upper surface of the heat sink base 1, and four rivets 5 being stamped through below each wing 2. The rivets 5 are T-shaped at the top and stepped at the bottom, and screws 7 are installed through the bottom of the rivets 5, with the screws 7 penetrating the printed circuit board 10.

[0032] The heat sink base 1 is made of 6063 aluminum, which has low density and high thermal conductivity, balancing performance and cost. Several second heat dissipation fins 3 are evenly distributed on the upper surface of the wing 2. The protruding part of the wing 2 is in contact with the heat source device, and its area is slightly larger than that of the heat source device. Through contact with the heat source object, heat is conducted into the heat sink base 1 and then released into the air. By increasing the area of ​​the heat sink base 1 and optimizing the fin-shaped wing design, the convection effect with the air is enhanced. At the same time, nano carbon is sprayed on the surface of the heat sink base 1, so that the heat conducted in the aluminum is released into the air more quickly and widely through radiation, which can significantly improve the heat dissipation effect.

[0033] The rivet 5 is a regular hexagon with a threaded hole 6 running through it. The bottom of the rivet 5 is stepped, comprising a large-diameter ring 501 and a small-diameter ring 502. The small-diameter ring 502 is located below the large-diameter ring 501 and passes through the mounting hole of the printed circuit board 10. The mounting hole diameter of the printed circuit board 10 is adapted to the outer diameter of the small-diameter ring 502. The bottom of the large-diameter ring 501 fits against the upper surface of the printed circuit board 10. The rivet 5 is made of iron, nickel-plated, or tin-plated. The hexagonal shape of the rivet 5 facilitates quick installation and fixation using a wrench. The threaded hole 6 connects to the screw 7. Compared to traditional welding structures, this design shortens disassembly time, avoids pad damage, and reduces maintenance costs. The large-diameter ring 501 and small-diameter ring 502 at the bottom of the stepped rivet 5 form a limiting structure. The small-diameter ring 502 precisely positions the mounting hole, while the large-diameter ring 501 provides stable support, reducing the installation error range and preventing increased contact thermal resistance caused by heat sink wobbling. The large-diameter ring 501 adheres to the surface of the printed circuit board 10, increasing the contact area compared to traditional single-point riveting. Combined with the thermally conductive silicone layer 11, heat conduction efficiency is improved, and temperature uniformity error is reduced.

[0034] Screw 7 is an M3 model. Screw 7 has a blue adhesive 8 on its outer side. The angle of the blue adhesive 8 around the outer side of screw 7 is 90°-180°, which provides an anti-loosening function while allowing manual disassembly. It takes into account both mechanical strength and ease of maintenance. The risk of screw 7 loosening under vibration is reduced to a minimum.

[0035] A chip 12 is provided at the bottom of the heat sink base 1. The chip 12 is attached to the printed circuit board 10. The surface of the chip 12 is coated with a thermally conductive silicone layer 11. The thermally conductive silicone layer 11 reduces the contact thermal resistance, and the heat of the chip 12 can be quickly conducted to the heat sink fins, thereby improving the heat dissipation efficiency.

[0036] Working principle:

[0037] The heat dissipation process of this utility model is as follows: the heat generated by the heat source on the printed circuit board 10 is conducted to the heat sink base 1 through the thermally conductive silicone layer 11, and then the heat is radiated and convected to the surrounding air by the first heat sink 4 and the second heat sink 3. The V-shaped base design guides the airflow along the gap between the fins to enhance the natural convection effect. The tilt angle of the flying wing 2 optimizes the airflow direction and reduces eddy current loss.

[0038] Installation and Fixing: Align the rivet 5 of the heat sink base 1 with the mounting hole of the printed circuit board 10. First, fix the length from the protruding part of the rivet 5 to the step of the large diameter ring 501. Then select the thickness of the thermally conductive silicone layer 11. The theoretical formula for calculating the thickness of the thermally conductive silicone layer 11 is the length from the protruding part of the rivet 5 to the step of the large diameter ring 501 minus the height of the heat source device, and then minus the height of the protruding part of the wing 2. The actual thickness of the thermally conductive silicone layer 11 is the theoretical calculation result plus 0.7-1.0mm to obtain the actual required thickness. Insert the small diameter ring 502 into the hole for positioning. Use a screwdriver to tighten the screw 7 so that the large diameter ring 501 is in close contact with the surface of the printed circuit board 10. The blue glue 8 forms an elastic damping layer at the thread of the screw 7 to prevent the thread from loosening due to vibration. When disassembling, rotate the screw 7 counterclockwise to easily remove the heat sink without heating or damaging the structure.

[0039] Thermal conduction optimization: The thermally conductive silicone layer 11 fills the microscopic gaps under pressure, eliminating the air layer and improving thermal conduction efficiency; the metal material of the rivet 5 serves as an auxiliary heat conduction path, further accelerating heat diffusion.

[0040] The above embodiments are preferred implementations of this utility model. In addition, this utility model can also be implemented in other ways. Any obvious substitutions without departing from the concept of this utility model are within the protection scope of this utility model.

Claims

1. A device for a large-size heat sink, comprising a heat sink base (1), a housing (9) disposed above the heat sink base (1), and a printed circuit board (10) disposed below the heat sink base (1), characterized in that: The heat sink base (1) is provided with wings (2) on both the left and right sides. The heat sink base (1) is V-shaped. Several first heat dissipation fins (4) are provided on the upper surface of the heat sink base (1). Rivets (5) are punched through the lower part of each wing (2). There are four rivets (5). The upper part of the rivet (5) is T-shaped. The lower part of the rivet (5) is stepped. Screws (7) are installed through the lower part of the rivet (5). The screws (7) penetrate the printed circuit board (10).

2. The apparatus of claim 1, wherein: The upper surface of the flying wing (2) is evenly distributed with several second heat dissipation fins (3).

3. The apparatus of claim 1, wherein: The rivet (5) is hexagonal, and a threaded hole (6) is provided through the rivet (5).

4. The apparatus of claim 3, wherein: The bottom of the rivet (5) is stepped and includes a large diameter ring (501) and a small diameter ring (502), with the small diameter ring (502) located below the large diameter ring (501).

5. The apparatus of claim 4, wherein: The small diameter ring (502) passes through the mounting hole of the printed circuit board (10), and the mounting hole diameter of the printed circuit board (10) is adapted to the outer diameter of the small diameter ring (502). The bottom of the large diameter ring (501) is attached to the upper surface of the printed circuit board (10).

6. The apparatus of claim 1, wherein: The screw (7) is provided with blue glue (8) on the outside, and the angle range of the blue glue (8) surrounding the outside of the screw (7) is 90°-180°.

7. The apparatus of claim 1, wherein: A chip (12) is provided at the bottom of the heat sink base (1), the chip (12) is attached to the printed circuit board (10), and the surface of the chip (12) is coated with a thermally conductive silicone layer (11).

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