Shielding cover and electronic equipment

Abstract

A shielding cover and an electronic device are disclosed, relating to the field of electronic equipment technology. The shielding cover includes a cover body, a conductive portion, and an insulating portion. The cover body has a recessed portion that can cooperate with other components to form a target space. The cover body can be used to shield electromagnetic interference from a first device relative to a second device, and / or electromagnetic interference from the second device relative to the first device. The first device is a device that can be disposed within the target space, and the second device is a device disposed outside the target space. The conductive portion is disposed on the cover body and can be used to connect electronic components to transmit signals. The insulating portion is at least partially disposed between the cover body and the conductive portion for electrical isolation between the cover body and the conductive portion.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to a shielding cover and an electronic device. Background Technology

[0002] In one implementation, all RF circuitry is designed on the circuit board. This approach has several problems: First, because RF components and transmission lines require limited circuit board space, the overall layout space is significantly occupied, limiting the expansion and optimization of other functional modules. Second, the circuit board has many components, and to bypass these components, the routing paths are often long, increasing insertion loss and reducing the overall system efficiency. Third, with high-density wiring, RF lines are prone to coupling interference with other signal lines, affecting the system's stability and performance. Utility Model Content

[0003] To address the aforementioned technical problems, this application provides the following technical solutions:

[0004] The first aspect of this application provides a shielding cover, comprising:

[0005] The shielding cover body has a recessed portion that can cooperate with other components to form a target space; wherein, the shielding cover body can be used to shield the electromagnetic interference of the first device relative to the second device, and / or the electromagnetic interference of the second device relative to the first device; the first device is a device that can be placed inside the target space, and the second device is a device that is placed outside the target space.

[0006] The conductive part is disposed on the shielding cover body and can be used to connect electronic components to transmit signals.

[0007] An insulating part, at least partially disposed between the shielding cover body and the conductive part, is used to electrically isolate the shielding cover body and the conductive part.

[0008] In some modified embodiments of the first aspect of this application, the insulating part includes a first insulating layer, which covers the side of the shielding cover body where the recess is provided, and the conductive part is provided on the side of the first insulating layer away from the shielding cover body.

[0009] In some modified embodiments of the first aspect of this application, the conductive part includes:

[0010] The signal line has its two ends set at different positions on the shielding cover body. The two ends of the signal line can be connected to other signal transmission lines to transmit signals.

[0011] At the base level, signal lines are installed on the base layer.

[0012] In some modified embodiments of the first aspect of this application, the insulating portion further includes a second insulating layer disposed on the side of the base layer away from the first insulating layer; the second insulating layer at least partially covers the surface of the conductive portion to achieve electrical isolation of the conductive portion.

[0013] A second aspect of this application provides an electronic device, comprising:

[0014] A carrier for carrying and conducting electronic components, the carrier carrying a first device and a second device;

[0015] Shielding cover, the shielding cover includes:

[0016] The shielding cover body has a recessed portion and is disposed on a carrier; the recessed portion and the carrier cooperate to form a target space, and the first device is located in the target space; the shielding cover body can be used to shield the electromagnetic interference of the first device relative to the second device, and / or the electromagnetic interference of the second device relative to the first device; the first device is a device that can be disposed within the target space, and the second device is a device disposed outside the target space.

[0017] The conductive part is disposed on the shielding cover body and is used to connect electronic components to transmit signals.

[0018] An insulating part, at least partially disposed between the shielding cover body and the conductive part, is used to electrically isolate the shielding cover body and the conductive part.

[0019] In some modified embodiments of the second aspect of this application, the conductive portion includes:

[0020] The signal line has its two ends set at different positions on the shielding cover body. The two ends of the signal line can be connected to other signal transmission lines to transmit signals.

[0021] The signal lines are installed on the base layer;

[0022] The insulation includes:

[0023] A first insulating layer covers a first side of the shielding cover body, and a conductive part is disposed on the side of the first insulating layer away from the shielding cover body.

[0024] A second insulating layer is disposed on the side of the base layer away from the first insulating layer; the second insulating layer at least partially covers the surface of the conductive part to achieve electrical isolation of the conductive part.

[0025] The shielding cover body, the first insulating layer, the conductive part and the second insulating layer are stacked in sequence along the first direction to form a main structure. The main structure includes a shielding plate and a side plate. The side plate is arranged along the circumference of the shielding plate and is perpendicular to the shielding plate. The side plate is connected to the carrier. The shielding plate, the side plate and the carrier enclose a target space. The circuit elements of the carrier are arranged in the target space.

[0026] The first direction points from the position away from the first side of the shielding cover body to the position closer to the first side.

[0027] In some modified embodiments of the second aspect of this application, the first end and the second end of the signal line are respectively located at the position where the shielding cover body contacts the carrier; a signal transmission line is provided at the position where the carrier contacts the shielding cover body, and the signal transmission line is connected to the first end and the second end of the signal line.

[0028] In some modified embodiments of the second aspect of this application, the signal line includes a straight line segment and two broken line segments, the two broken line segments being respectively disposed at both ends of the straight line and disposed at opposite positions on the side plate.

[0029] In some modified embodiments of the second aspect of this application, the orthographic projection of the signal line perpendicular to the carrier direction does not coincide with the first device.

[0030] In some modified embodiments of the second aspect of this application, the signal transmission line includes a first connecting line and a second connecting line;

[0031] The carrier includes:

[0032] The first connection point is located within the target space and is connected to the first end of the signal line via a first connection line.

[0033] The second connection point is located outside the target space and is connected to the second end of the signal line via a second connection line.

[0034] The first end of the signal line is positioned near the first connection point, and the second end of the signal line is positioned near the second connection point. Attached Figure Description

[0035] The above and other objects, features, and advantages of exemplary embodiments of this application will become readily understood by reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of this application are illustrated by way of example and not limitation, with the same or corresponding reference numerals denoteing the same or corresponding parts, wherein:

[0036] Figure 1 A schematic diagram of the first internal structure of an electronic device is shown.

[0037] Figure 2A schematic diagram of a second internal structure of an electronic device is shown.

[0038] Figure 3 A schematic diagram of a third internal structure of an electronic device is shown.

[0039] Figure 4 A schematic diagram of a shielding cover is shown.

[0040] Explanation of icon numbers:

[0041] 1. Shielding cover body; 11. Recessed portion; 12. Target space; 2. Conductive portion; 21. Signal line; 22. Base layer; 3. Insulating portion; 31. First insulating layer; 32. Second insulating layer; 4. First device; 5. Carrier; 6. Electronic component; 61. First component; 62. Second component; 7. Second device; 8. Signal transmission line; 81. First connecting line; 82. Second connecting line; 9. Main structure; 91. Shielding plate; 92. Side plate. Detailed Implementation

[0042] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0043] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application shall have the ordinary meaning as understood by one of ordinary skill in the art to which this application pertains.

[0044] In one implementation, all RF circuitry is designed on the circuit board. This approach has several problems: First, because RF components and transmission lines occupy limited circuit board space, the overall layout space is significantly reduced, limiting the expansion and optimization of other functional modules. Second, the circuit board has many components, and to bypass these components, the routing paths are often long, increasing insertion loss and reducing the overall system efficiency. Third, with high-density wiring, RF lines are prone to coupling interference with other signal lines, affecting the system's stability and performance.

[0045] To address the aforementioned technical problems, this disclosure proposes a shielding cover and an electronic device that can avoid routing traces on a circuit board, thereby avoiding occupying more layout space, shortening the trace path to reduce losses, and also avoiding interference caused by dense traces on the circuit board.

[0046] Example 1

[0047] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, a shielding cover includes a shielding cover body 1, a conductive part 2, and an insulating part 3. The shielding cover body 1 has a recessed part 11, which can cooperate with other components to form a target space 12. The shielding cover body 1 can be used to shield the electromagnetic interference of a first device 4 relative to a second device 7, and / or the electromagnetic interference of the second device 7 relative to the first device 4. The first device 4 is a device that can be disposed within the target space 12, and the second device 7 is a device disposed outside the target space 12. The conductive part 2 is disposed on the shielding cover body 1 and can be used to connect electronic components 6 to transmit signals. The insulating part 3 is at least partially disposed between the shielding cover body 1 and the conductive part 2 for electrically isolating the shielding cover body 1 and the conductive part 2.

[0048] The shielding cover body 1 refers to the part that constitutes the main structure of the shielding cover. It is usually made of a material with electromagnetic shielding capabilities. Its main function is to form a closed or semi-closed space through physical coverage and conductive connection to isolate the internal components (such as the first component 4) from the external environment through electromagnetic interference (EMI). The shielding cover body 1 also serves as a supporting structure to support the conductive part 2 and the insulating part 3. Its recessed part 11, together with other components, forms the target space 12 to accommodate the key electronic components 6. For example, the shielding cover body 1 can be a metal type shielding cover body 1, and the constituent materials can be aluminum alloy, copper alloy, stainless steel, etc., which have excellent shielding performance and strong conductivity. The shielding cover body 1 can also be a conductive plastic type shielding cover body 1, which is composed of plastic and conductive coatings or fillers (such as silver powder, carbon fiber), which is lightweight, corrosion-resistant, low-cost, and has moderate shielding performance. The shielding cover body 1 can also be a composite shielding cover body 1, which is composed of a metal and plastic composite structure, balancing shielding performance and lightweight. The shielding cover body 1 can also be a recessed shielding cover body 1, with a recessed area for accommodating devices. The shielding cover body 1 can also be a foldable or flexible shielding cover body 1, using flexible materials that can be bent and deformed. The shielding cover body 1 can also be a modular shielding cover body 1, composed of multiple small units. The shielding cover body 1 can be fixed by clips, spring clips, etc., making installation convenient and disassembly easy. The shielding cover body 1 can be directly soldered onto the circuit board, providing a firm fixation and good shielding performance. It can connect the conductive part 2 to circuit components on the circuit board at the soldering location, offering good conductivity. The shielding cover body 1 can also be glued to the circuit board using conductive adhesive, suitable for applications where soldering is inconvenient.

[0049] The recess 11 is part of the shielding cover and is formed on the shielding cover body 1. It is designed to create a closed or semi-closed space (i.e., "target space 12") with other components to accommodate the first device 4 that needs protection. For example, the recess 11 can form a closed or semi-closed space with the circuit board to effectively isolate the first device 4 within it, thereby preventing electromagnetic interference (EMI) from the external environment or other unshielded second devices 7. The recess 11 can extend downwards; the circuit board or other structural components can fit upwards, and the cavity formed in the middle is the target space 12.

[0050] The recess 11 can have various shapes. For example, it can be a rectangular recess 11, suitable for most regularly shaped electronic components 6; it can also be a circular recess 11, particularly suitable for cylindrical or spherical components, such as certain types of sensors or batteries; or it can be an irregularly shaped recess 11: customized for components of specific shapes to ensure optimal space utilization and component compatibility. The recess 11 can also be a shallow recess 11, suitable for components that do not require much vertical space, helping to reduce the overall height of the device; or it can be a deep recess 11, providing ample internal space for larger components. The recess 11 and the shielding cover body 1 can have a top opening, forming one or more ventilation holes. The recess 11 can also have a side opening, suitable for situations requiring lateral expansion or side wiring; the recess 11 can also be closed, with an opening only on one side that cooperates with other components (such as circuit boards), thereby forming a closed space with other components and providing a stronger electromagnetic shielding effect.

[0051] The first device 4 refers to electronic components 6 or modules placed within the target space 12 formed by the shielding cover recess 11 and other components. For example, the shielding cover can be installed inside a mobile phone, and the target space can be formed by the shielding cover recess 11 and the mobile phone's PCB board; the shielding cover can also be installed inside a computer, and the target space can be formed by the shielding cover recess 11 and the mobile phone's motherboard. The first device 4 usually needs to be protected from external electromagnetic interference, but it may also generate electromagnetic interference itself, affecting other components. For example, the first device 4 can be a radio frequency (RF) circuit or module, such as a Wi-Fi chip, Bluetooth module, or cellular communication module. RF circuits or modules operate at high frequencies and are easily affected by the external electromagnetic environment, and may also generate strong electromagnetic radiation. The first device 4 can also be a MEMS sensor (microelectromechanical system sensor), such as an accelerometer, gyroscope, or pressure sensor. These MEMS sensors have high precision requirements, and any noise generated by external electromagnetic interference can lead to measurement errors. The first device 4 can also be an analog front-end circuit, i.e., a circuit part used for signal amplification, filtering, etc. It is sensitive to noise and requires good electromagnetic shielding to ensure signal integrity.

[0052] The first device 4 can also be a precision control unit, such as a controller or processor core, which needs to operate stably in a low-noise environment.

[0053] The second device 7 encompasses all electronic components 6 that, besides those mentioned above, might cause electromagnetic interference to or be affected by the first device 4. The second device 7 can be a microcontroller unit responsible for performing logic operations and control tasks. Although it generates relatively little interference, isolation is still necessary when it is near the RF module. The second device 7 can also be a power management module, including DC-DC converters, voltage regulators, etc., which generate significant electromagnetic interference during high-current switching. The second device 7 can also be a display driver circuit, the circuit part that controls the operation of the display screen; electromagnetic interference (EMI) is easily generated on high-speed data transmission lines. The second device 7 can also be other digital processing units, including memory, interface controllers, etc., where high-speed signal transmission may cause electromagnetic leakage.

[0054] The shielding cover body 1 can have a unidirectional shielding function, primarily preventing internal components (first component 4) from emitting interference signals outwards; for example, the first component 4 can be a Wi-Fi chip (an integrated circuit with integrated Wi-Fi communication function), and the second component 7 can be a digital processor, preventing radio frequency signals from interfering with digital circuits. It can also primarily prevent external components (second component 7) from causing interference inwards; for example, the first component 4 can be a MEMS sensor (microelectromechanical system sensor), and the second component 7 can be an MCU controller (microcontroller unit), preventing noise generated by electromagnetic interference from interfering with high-precision sensing. The shielding cover body 1 can also have a bidirectional shielding capability, preventing both internal components (first component 4) from emitting interference signals outwards and external components (second component 7) from causing interference inwards.

[0055] The conductive part 2 refers to the conductive material or structure disposed on the shielding cover. Its main function is to connect electronic components 6 and transmit signals. The conductive part 2 is designed to avoid the complex wiring requirements of traditional circuit boards, thereby reducing signal loss and electromagnetic interference caused by long-distance traces. Furthermore, it enables efficient electrical connections without increasing the complexity of the PCB (circuit board). The conductive part 2 can be of various types. For example, it can be made of metallic materials such as copper, silver, and aluminum. It can also be made of conductive polymers, suitable for flexible circuit designs, capable of adapting to bending deformation while maintaining good conductivity. Conductivity can be enhanced by adding materials such as carbon nanotubes and graphene. The conductive part 2 can also be made of composite materials, combining the advantages of metals and non-metals, such as metal-coated plastics, ensuring conductivity while reducing weight.

[0056] The conductive part 2 can be a planar conductive layer, directly deposited or adhered to the surface of the insulating layer of the shielding cover to form a uniform conductive film, suitable for simple signal transmission. The conductive part 2 can also be a three-dimensional conductive wire, similar to a traditional wire but more compact, which can be directly embedded into the insulating layer of the shielding cover, suitable for complex circuit layouts. The conductive part 2 can also be a spring contact or contact spring, providing a flexible contact solution and ensuring stable contact even in vibration environments, commonly used for connections between moving parts. The conductive part 2 can also be a printed circuit, using screen printing technology to directly print conductive ink onto the insulating layer of the shielding cover, suitable for mass production and at a lower cost.

[0057] The conductive part 2 connects different points on the shielding cover body 1 to the circuit board (PCB) or other electronic components through physical connection or contact, thereby forming a complete current or signal path. This method avoids the traditional reliance on PCB surface traces, reduces wiring complexity, and can shorten signal path length, reduce signal delay and loss.

[0058] The conductive part 2 can be fixed to the PCB by soldering, providing high mechanical strength and electrical reliability. Alternatively, the conductive part 2 can be fixed to the PCB using small contacts made of flexible metal, which can automatically adjust their position during assembly to ensure stable contact, suitable for applications requiring frequent disassembly and reassembly. The conductive part 2 can also be fixed to the PCB using a plug-in connector. The PCB has specially designed slots or sockets that allow for quick insertion and removal, facilitating maintenance and component replacement. For example, the conductive part can be connected to the surface layer lines of the PCB. When connected to the surface layer lines and the conductive part is within the target space, an opening can be made on the side wall of the shielding cover to facilitate connection to the surface layer lines. The conductive part can also be connected to the inner layer lines of the PCB using a plug-in connector.

[0059] like Figure 2 As shown, the electronic component 6 connected to the conductive part 2 can be the first device 4 and the second device 7, or it can be as follows: Figure 1 and Figure 3 The diagram shows other components. The electronic components 6 connected to the conductive part 2 can be all disposed outside the target space 12, all disposed inside the target space 12, or one disposed inside the target space 12 and one disposed outside the target space 12. When all electronic components 6 are disposed outside the target space 12, the two ends of the conductive part 2 can be connected to the relative positions of the shielding cover to reduce the conductive path. For example... Figure 3As shown, electronic component 6 may include a first component 61 and a second component 62. When both the first component 61 and the second component 62 are located within the target space 12, the position of the shielding body near the electronic component 6 can be set as the connection point between the conductive part 2 and the circuit board. When one component is located within the target space 12 and the other is located outside the target space 12, for example, the first component 4 is located within the target space 12 and the second component 7 is located outside the target space 12, the position of the shielding body near the electronic component 6 can also be set as the connection point between the conductive part 2 and the circuit board to reduce the line distance on the circuit board.

[0060] The insulating part 3 refers to the material or structural layer disposed between the shielding cover body 1 and the conductive part 2. Its main function is to provide electrical isolation, preventing current leakage, short circuits, or unnecessary electromagnetic interference. In this way, the insulating part 3 ensures that the conductive part 2 can safely and effectively transmit signals without affecting the function of the shielding cover body 1, while also protecting the overall safety and reliability of the electronic device. The insulating part 3 can be a polymer insulating material, such as polyimide (PI), polytetrafluoroethylene (PTFE), and epoxy resin. The insulating part 3 can also be a ceramic insulating material, such as alumina (Al2O3) and aluminum nitride (AlN), which have good thermal conductivity and high resistivity, suitable for applications requiring heat dissipation management. The insulating part 3 can also be a composite insulating material, combining two or more materials to form an insulating layer with multiple advantages. For example, a thin metal oxide film can be coated on a substrate to increase wear resistance and corrosion resistance.

[0061] The insulation layer can be a coating-type insulation layer, a thin insulating film directly sprayed or brushed onto the surface of the shielding cover, which is simple to operate and inexpensive. The insulation layer can also be a prefabricated sheet insulation layer, made into standard-sized sheets and then glued or fixed to designated positions, suitable for mass production. The insulation layer can also be an embedded insulation layer, where the insulating material is embedded into the shielding cover structure during manufacturing, forming an integrated design and enhancing overall mechanical stability. The insulation layer can also be a multi-layered insulation structure, composed of multiple layers of different types of insulating materials, each layer designed for specific functional requirements (such as waterproofing, dustproofing, and heat insulation), providing greater flexibility and adaptability.

[0062] The conductive layer and the insulating layer are disposed on the side of the shielding cover body 1 where the recess 11 is provided, thereby providing better protection for the conductive layer. Alternatively, they can be disposed on the side of the shielding cover body 1 opposite to the recess 11, thereby making it easier to route wires from the shielding cover.

[0063] This disclosure provides a conductive layer on the shielding cover to connect the electronic component 6, and provides an insulating part 3 between the conductive part 2 and the shielding cover body 1 to electrically isolate the shielding cover body 1 and the conductive part 2. This allows the conductive part 2 to replace part of the circuit on a traditional circuit board, without running the circuit on the circuit board. This avoids occupying more layout space, shortens the routing path and reduces losses, and also avoids interference caused by dense routing on the circuit board.

[0064] like Figure 1 As shown, in some modified embodiments of this application, the insulating part 3 includes a first insulating layer 31, which covers the side of the shielding cover body 1 where the recess 11 is provided. The conductive part 2 is disposed on the side of the first insulating layer 31 away from the shielding cover body 1. The first insulating layer 31 ensures good electrical isolation between the conductive part 2 and the shielding cover body 1 without affecting the electromagnetic shielding performance of the shielding cover. The first insulating layer 31 can be a flexible polymer film or a ceramic coating, possessing excellent dielectric properties and thermal stability. The conductive part 2 is disposed on the side of the first insulating layer 31 away from the shielding cover body 1, i.e., on the inner side of the shielding cover body 1. In other words, placing the conductive part 2 within the target space 12 avoids external interference to the conductive part 2, protecting it while increasing conductivity stability.

[0065] like Figure 1 As shown, in some modified embodiments of this application, the conductive part 2 includes a signal line 21 and a base layer 22. The two ends of the signal line 21 are respectively disposed at different positions on the shielding cover body 1. The two ends of the signal line 21 can be connected to other signal transmission lines 8 to transmit signals. The signal line 21 is disposed on the base layer 22.

[0066] Signal line 21 refers to a conductor used to transmit electrical signals within electronic devices or between different components. It is typically laid on top of the substrate 22 and connected to other signal transmission lines 8 (such as traces on a PCB, flexible cables, etc.) at both ends to ensure accurate signal transmission from one point to another. Signal line 21 can be made of materials such as copper, silver wire, aluminum wire, and printed conductive ink or paste. Signal line 21 can have various shapes; for example, it can be a flat ribbon line, suitable for dense wiring, occupying little space, and suitable for multi-layer PCBs and compact electronic devices. Signal line 21 can also be a round line, with a simple structure, easy to process, and practical for conventional wiring needs. Signal line 21 can also be a microstrip line, suitable for high-frequency signal transmission, with good impedance matching characteristics. Signal line 21 can be an RF signal line 21, optimized for high-frequency signal transmission, requiring consideration of impedance matching, loss minimization, and other factors. Signal line 21 can also be a power signal line 21, carrying a large current, requiring sufficient cross-sectional area to reduce resistive heating. Signal line 21 can also be a data signal line 21, used for the transmission of digital information. Signal integrity must be ensured to avoid delay and distortion.

[0067] The base layer 22 refers to a layer of material used to carry the signal line 21. It not only provides physical support but also participates in electrical functions (such as grounding and shielding). The base layer 22 can be a fully conductive metal layer or a non-conductive insulating material with good mechanical strength. If the base layer 22 itself is a conductive material, it can be connected to the system ground through grounding springs or other means to enhance overall electromagnetic compatibility. The base layer 22 can also serve as an additional shielding layer to reduce the impact of external interference on the signal line 21. The base layer 22 can be a metal base layer 22, connected to the signal line 21 through insulating material. For example, the metal base layer 22 can be a copper base, an aluminum base, or a stainless steel base. The base layer 22 can also be a composite material base layer 22, such as a metal-coated plastic or a ceramic base layer 22. The metal-coated plastic combines the flexibility of plastic with the conductivity of metal, making it suitable for flexible circuit designs. The ceramic base layer 22 has excellent thermal conductivity and mechanical stability, making it suitable for applications in high-temperature environments. The base layer 22 can also be made of non-conductive materials, such as polyimide (PI) and glass fiber reinforced epoxy resin (FR-4), which are high-temperature resistant and chemically stable, making them suitable for flexible circuit boards. Glass fiber reinforced epoxy resin (FR-4) can be used as a standard PCB substrate and is widely applied. For example, the base layer 22 can be a composite material of copper foil and polyimide film. Electrically isolated signal lines 21 using polyimide film provide good mechanical support, and appropriate grounding design can enhance the electromagnetic compatibility performance of the entire module.

[0068] like Figure 1 As shown, in some modified embodiments of this application, the insulating part 3 further includes a second insulating layer 32, which is disposed on the side of the base layer 22 away from the first insulating layer 31. The second insulating layer 32 at least partially covers the surface of the conductive part 2 to achieve electrical isolation of the conductive part 2. The second insulating layer 32 refers to a layer of material disposed on the side of the conductive base layer 22 away from the first insulating layer 31. Its main function is to further electrically isolate the conductive part 2 (including the signal line 21) to ensure the safety and reliability of signal transmission. The second insulating layer 32 at least partially covers the surface of the conductive part 2 to avoid direct contact with the external environment or other conductive parts 2, thereby preventing problems such as short circuits or electromagnetic interference. The material of the second insulating layer 32 can be the same as that of the first insulating layer 31, such as polymer insulating materials, ceramic insulating materials, and composite insulating materials. Similarly, the structural form of the second insulating layer 32 can also be the same as that of the first insulating layer 31.

[0069] Example 2

[0070] like Figure 1 , Figure 2 and Figure 3As shown, an electronic device includes a carrier 5 for carrying and conducting electronic components 6 and a shielding cover. The carrier 5 carries a first device 4 and a second device 7. The shielding cover includes a shielding cover body 1, a conductive part 2, and an insulating part 3. The shielding cover body 1 has a recess 11 disposed on the carrier 5. The recess 11 cooperates with the carrier 5 to form a target space 12, and the first device 4 is located in the target space 12. The shielding cover body 1 can be used to shield the electromagnetic interference of the first device 4 relative to the second device 7, and / or the electromagnetic interference of the second device 7 relative to the first device 4. The first device 4 is a device that can be disposed within the target space 12, and the second device 7 is a device disposed outside the target space 12. The conductive part 2 is disposed on the shielding cover body 1 and is used to connect the electronic components 6 to transmit signals. The insulating part 3 is at least partially disposed between the shielding cover body 1 and the conductive part 2 for electrically isolating the shielding cover body 1 and the conductive part 2.

[0071] Electronic devices can be embedded control systems, such as industrial control motherboards and smart home appliance controllers, integrating multiple sensitive and interference-prone devices. Electronic devices can also be portable electronic products, such as smartphones, tablets, and wearable devices, which require multiple signal transmissions despite space constraints. Electronic devices can also be automotive electronic systems, such as vehicle radar and vehicle communication modules, operating in complex environments. Furthermore, electronic devices can be medical electronic devices, such as heart rate monitors and biosensors, requiring high stability and low noise.

[0072] The carrier 5 refers to the physical platform or substrate used to support electronic components 6 (such as the first device 4 and the second device 7) and the shielding cover structure. It is not only the basis for electrical connections but also an important component of the mechanical structure. The carrier 5 can be a rigid PCB, such as epoxy resin fiberglass board (FR-4), which is low-cost, easy to process, and suitable for most electronic devices. The carrier 5 can also be a flexible PCB, composed of polyimide film and copper foil, which can be bent and folded, suitable for space-constrained or dynamic applications. The carrier 5 can also be a metal-based PCB, such as aluminum-based or copper-based PCBs, which have good heat dissipation performance and are suitable for high-power LEDs, RF modules, etc. The carrier 5 can also be a ceramic substrate, composed of materials such as Al2O3 and AlN, which has high thermal conductivity and high insulation, suitable for high-frequency and high-temperature applications. The carrier 5 can also be a composite substrate, composed of multiple materials (such as FR-4 + metal backplate), balancing strength, thermal conductivity, and cost control.

[0073] The carrier 5 can have different structural forms. For example, the carrier 5 can be a single-sided board, a double-sided board, a multilayer board, or a modular sub-board. A single-sided board has only one side for wiring and is suitable for simple control circuits; a double-sided board can have wiring on both sides and is suitable for medium-complexity electronic devices; a multilayer board has multiple layers of circuitry stacked and can include power and ground layers, making it suitable for high-speed, high-density circuit designs (such as smartphone motherboards). The carrier 5 can also be a modular sub-board, such as a pluggable small PCB module for system designs that facilitate maintenance and upgrades.

[0074] The specific structures of the shielding cover, the first device 4, and the second device 7 can be the same as in Embodiment 1, and will not be described again here. This disclosure provides a conductive layer on the shielding cover to connect the electronic component 6, and provides an insulating part 3 between the conductive part 2 and the shielding cover body 1 to electrically isolate the shielding cover body 1 and the conductive part 2. This allows the conductive part 2 to replace part of the wiring on the conventional carrier 5, without routing the wiring through the carrier 5. This avoids occupying more layout space, shortens the wiring path, and reduces losses. At the same time, it also avoids interference caused by dense wiring on the carrier 5.

[0075] like Figure 1 As shown, in some modified embodiments of this application, the conductive part 2 includes a signal line 21 and a base layer 22. The two ends of the signal line 21 are respectively disposed at different positions on the shielding cover body 1. The two ends of the signal line 21 can be connected to other signal transmission lines 8 to transmit signals. The signal line 21 is disposed on the base layer 22.

[0076] The insulating part 3 includes a first insulating layer 31 and a second insulating layer 32. The first insulating layer 31 covers a first side of the shielding cover body 1, and the conductive part 2 is disposed on the side of the first insulating layer 31 away from the shielding cover body 1. The second insulating layer 32 is disposed on the side of the base layer 22 away from the first insulating layer 31. The second insulating layer 32 at least partially covers the surface of the conductive part 2 to achieve electrical isolation of the conductive part 2.

[0077] like Figure 4 As shown, the shielding cover body 1, the first insulating layer 31, the conductive part 2, and the second insulating layer 32 are stacked sequentially along the first direction to form the main structure 9. The main structure 9 includes a shielding plate 91 and a side plate 92. The side plate 92 is arranged along the circumference of the shielding plate 91 and is perpendicular to the shielding plate 91. The side plate 92 is connected to the carrier 5. The shielding plate 91, the side plate 92, and the carrier 5 form a target space 12. The circuit elements of the carrier 5 are arranged in the target space 12. The first direction points from the side of the shielding cover body 1 away from the recess 11 to the side close to the recess 11.

[0078] The shielding plate 91 is the core component of the shielding cover structure, consisting of multiple functional layers stacked along a specific direction, including the shielding cover body 1, the first insulating layer 31, the conductive part 2, and the second insulating layer 32. The shielding plate 91 can be a square plate, a circular plate, or other plate-like structures of any shape. The side plate 92 refers to the structural component that surrounds the shielding plate 91 and is arranged perpendicularly to it. It is also consisting of multiple functional layers stacked along a specific direction, including the shielding cover body 1, the first insulating layer 31, the conductive part 2, and the second insulating layer 32. The main function of the side plate 92 is to fix the relative position between the shielding plate 91 and the carrier 5 (such as a PCB) and to provide an interface (such as soldering points or clips) for the assembly between the shielding structure and the carrier 5; it can also form a closed or semi-closed target space 12 together with the shielding plate 91 and the carrier 5 to enhance the mechanical strength and sealing of the overall shielding structure.

[0079] like Figure 1 , Figure 2 and Figure 3 As shown, in some modified embodiments of this application, the first end and the second end of the signal line 21 are respectively located at the position where the shielding cover body contacts the carrier 5; a signal transmission line 8 is provided at the position where the carrier 5 contacts the shielding cover body, and the signal transmission line 8 is connected to the first end and the second end of the signal line 21.

[0080] Signal line 21 is arranged across regions, with its two ends located at two contact points between the shielding cover body and the carrier 5. This design allows signal line 21 to traverse the inside and outside of the shielding structure, enabling communication between internal components (first component 4) and external circuits (such as the PCB). The carrier 5 (such as the PCB) has pre-set signal transmission lines 8 at specific locations in contact with the shielding cover. These lines can be in the form of pads, gold fingers, flexible conductive pads, etc., and their purpose is to achieve physical contact or soldering connection with the signal line 21 on the shielding cover. The signal line 21 on the shielding cover forms an electrical connection path with the signal transmission line 8 on the carrier 5 through its two ends, realizing signal communication between internal components and external circuits in the shielding structure without the need for additional complex PCB traces, saving space and improving integration.

[0081] In some modified embodiments of this application, the signal line 21 includes a straight segment and two broken segments, which are respectively located at the two ends of the straight segment and at opposite positions on the side plate 92. The broken segments can be L-shaped, U-shaped, or other curved forms, depending on the space constraints and electrical performance requirements of the shielding structure. The broken segments are located at the beginning and end of the signal line 21. This structure facilitates the transition of the signal line 21 from the shielding plate 91 to the side plate 92, making it easier to connect to external circuits. The position of the segments corresponds to the side plate 92 in the shielding cover structure; it is typically used to achieve cross-region signal transmission, such as leading signals from the shielding plate 91 to different locations on the carrier 5 (PCB). The term "relative position" refers to the two side plates 92 on either side of the shielding cover or two symmetrically arranged contact points on the side plates 92 to reduce the length of the signal line 21, thereby reducing losses. The broken segments can also serve as positioning or guiding structures to assist in automated placement processes.

[0082] In some modified embodiments of this application, the orthographic projection of the signal line 21 perpendicular to the direction of the carrier 5 does not coincide with the first device 4. The signal line 21 and the first device 4 are spatially staggered; even if the signal line 21 is placed on the shielding cover, its vertical (Z-direction) projection does not cover the area where the first device 4 is located, so that the signal line 21 avoids the position of the first device 4 as much as possible, avoiding interference from the first device 4 to the signal line 21, which is suitable for scenarios where the first device 4 has strong interference.

[0083] In some modified embodiments of this application, the signal transmission line 8 includes a first connecting line 81 and a second connecting line 82; the carrier 5 includes a first connection point and a second connection point, the first connection point is disposed within the target space 12, and the first connection point is connected to the first end of the signal line 21 through the first connecting line 81; the second connection point is disposed outside the target space 12, and the second connection point is connected to the second end of the signal line 21 through the second connecting line 82; wherein, the first end of the signal line 21 is disposed near the first connection point, and the second end of the signal line 21 is disposed near the second connection point.

[0084] The first connecting line 81 is a conductive line disposed on the carrier 5, used to connect the first end of the signal line 21 to the first connection point. The second connecting line 82 is a conductive line disposed on the carrier 5, used to connect the second end of the signal line 21 to the second connection point. The first connection point is an electrical connection position on the carrier 5 located within the target space 12, and can be connected to the first device 4; the second connection point is an electrical connection position on the carrier 5 located outside the target space 12, and is usually connected to the second device 7 or the main control circuit.

[0085] The first connecting line 81, in conjunction with the first connecting point, enables reliable signal access to the first device 4 within the target space 12. The second connecting line 82, in conjunction with the second connecting point, enables efficient communication between the shielding cover and the external circuit. This configuration allows for the connection of internal and external devices through the conductive part 2 on the shielding cover, reducing the opening on the side wall of the shielding cover and thus improving the shielding performance of the shielding cover.

[0086] By placing the two ends of the signal line 21 close to the two connection points, the connection path on the carrier 5 can be shortened, thereby reducing the space occupied by the carrier 5 and avoiding increasing the complexity of the line layout of the carrier 5.

[0087] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A shielded cover characterized by, include: The shielding cover body has a recessed portion that can cooperate with other components to form a target space; wherein, the shielding cover body can be used to shield electromagnetic interference of a first device relative to a second device, and / or electromagnetic interference of the second device relative to the first device; the first device is a device that can be disposed within the target space, and the second device is a device disposed outside the target space; A conductive part is disposed on the shielding cover body, and the conductive part can be used to connect electronic components to transmit signals; An insulating portion, at least partially disposed between the shielding cover body and the conductive portion, is used to electrically isolate the shielding cover body and the conductive portion.

2. The shielding cover according to claim 1, characterized in that, The insulating part includes a first insulating layer, which covers the side of the shielding cover body where the recess is provided, and the conductive part is provided on the side of the first insulating layer away from the shielding cover body.

3. The shielding cover according to claim 2, characterized in that, The conductive part includes: The signal line has its two ends respectively located at different positions on the shielding cover body, and the two ends of the signal line can be connected to other signal transmission lines to transmit signals. The signal line is disposed on the base layer.

4. The shielding cover according to claim 2, characterized in that, The insulating portion further includes a second insulating layer disposed on the side of the base layer away from the first insulating layer; the second insulating layer at least partially covers the surface of the conductive portion to achieve electrical isolation of the conductive portion.

5. An electronic device, comprising: include: A carrier for carrying and conducting electronic components, the carrier carrying a first device and a second device; Shielding cover, the shielding cover comprising: A shielding cover body has a recessed portion disposed on the carrier; the recessed portion cooperates with the carrier to form a target space, and the first device is located in the target space; the shielding cover body can be used to shield the electromagnetic interference of the first device relative to the second device, and / or the electromagnetic interference of the second device relative to the first device; the first device is a device that can be disposed within the target space, and the second device is a device disposed outside the target space; A conductive part is disposed on the shielding cover body, and the conductive part is used to connect electronic components to transmit signals; An insulating portion, at least partially disposed between the shielding cover body and the conductive portion, is used to electrically isolate the shielding cover body and the conductive portion.

6. The electronic device according to claim 5, characterized in that, The conductive part includes: The signal line has its two ends respectively located at different positions on the shielding cover body, and the two ends of the signal line can be connected to other signal transmission lines to transmit signals. The signal line is disposed on the base layer; The insulating portion includes: A first insulating layer covers a first side of the shielding cover body, and the conductive part is disposed on the side of the first insulating layer away from the shielding cover body; A second insulating layer is disposed on the side of the base layer away from the first insulating layer; the second insulating layer at least partially covers the surface of the conductive part to achieve electrical isolation of the conductive part. The shielding cover body, the first insulating layer, the conductive part and the second insulating layer are stacked sequentially along the first direction to form a main structure. The main structure includes a shielding plate and a side plate. The side plate is arranged along the circumference of the shielding plate and is perpendicular to the shielding plate. The side plate is connected to the carrier. The shielding plate, the side plate and the carrier form the target space. The circuit elements of the carrier are arranged in the target space. The first direction is from the side of the shielding cover body away from the recessed portion to the side closer to the recessed portion.

7. The electronic device according to claim 5, characterized in that, The first and second ends of the signal line are respectively located at the positions where the shielding cover body contacts the carrier; a signal transmission line is provided at the position where the carrier contacts the shielding cover body, and the signal transmission line is connected to the first and second ends of the signal line.

8. The electronic device according to claim 6, characterized in that, The signal line includes a straight segment and two broken line segments. The two broken line segments are respectively located at both ends of the straight line and at opposite positions on the side plate.

9. The electronic device according to claim 7, characterized in that, The orthographic projection of the signal line perpendicular to the carrier direction does not coincide with the first device.

10. The electronic device according to claim 7, characterized in that, The signal transmission line includes a first connecting line and a second connecting line; The carrier includes: A first connection point is located within the target space, and the first connection point is connected to the first end of the signal line via a first connection line. The second connection point is located outside the target space, and the second connection point is connected to the second end of the signal line via a second connection line. The first end of the signal line is located near the first connection point, and the second end of the signal line is located near the second connection point.

Images