Image sensor packaging structure with small angular deviation of transparent cover plate

Abstract

This utility model discloses an image sensor packaging structure with small angular deviation of the transparent cover plate, relating to the field of semiconductor packaging technology. It includes an image sensor, a substrate, supporting sidewalls, and a transparent cover plate. The supporting sidewalls are annular structures located on the upper surface of the image sensor, with the photosensitive area located within the ring. The supporting sidewalls include four sidewalls; the first and third sidewalls are of equal height and higher than the second and fourth sidewalls. The first and third sidewalls have horizontally penetrating fixing holes. The lower sidewall of the fixing hole is flat and flush with the upper side of the second sidewall. The upper ends of the first and third sidewalls have vertically connected glue injection holes that connect to the fixing holes. The transparent cover plate is inserted into the fixing holes on both sides, with its lower bottom surface supported by the second and fourth sidewalls, and its upper bottom surface flush with the opening of the glue injection hole. This utility model solves the problem of the transparent cover plate warping due to uneven glue application, ensuring the signal reception accuracy of the image sensor.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to an image sensor packaging structure with small angular deviation of the transparent cover plate. Background Technology

[0002] An image sensor is a core component of an image device that converts optical sensing signals into electronic signals. When packaging an image sensor, it is usually electrically connected to the substrate, typically by wire bonding. Pads or other electrical connection points are provided on the substrate to connect the image sensor to external electronic circuits, enabling signal sensing, processing, and interaction.

[0003] Image sensor packaging structures typically require the use of sealant to seal the leads to ensure their stability. Then, a sidewall plate is placed around the photosensitive area of ​​the image sensor above the image sensor chip as a support sidewall. A transparent cover plate is placed on the support sidewall. The purpose of the support sidewall is to limit the distance between the transparent cover plate and the photosensitive area of ​​the image sensor to avoid ghosting.

[0004] In existing technologies, adhesive is typically used to connect the supporting sidewall and the transparent cover plate. Adhesive is applied to the upper part of the supporting sidewall using a dispensing method, and then the transparent cover plate is placed on top. However, dispensing may result in unevenness. If the amount of adhesive is not evenly distributed circumferentially, the cured adhesive may cause the transparent cover plate to locally lift due to stress differences, forming a micro-angle deviation of less than 0.1°. However, for precision optical systems, this angle deviation caused by local lifting cannot be ignored, because the angle deviation may affect the reception of light by the image sensor. Utility Model Content

[0005] To address the aforementioned technical issues, the image sensor packaging structure with a small angular deviation of the transparent cover plate provided by this utility model can prevent the transparent cover plate from affecting the image sensor's reception of light signals due to localized warping.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is as follows:

[0007] This utility model provides an image sensor packaging structure with small angular deviation of the transparent cover plate, comprising an image sensor, a substrate, a supporting sidewall, and a transparent cover plate; the image sensor is fixed on the substrate; the image sensor and the substrate are connected by several leads; the image sensor has a photosensitive area; the side of the image sensor on which the photosensitive area is disposed is the upper surface of the image sensor; the supporting sidewall is disposed on the upper surface of the image sensor and is a ring structure; the photosensitive area is located inside the ring of the supporting sidewall, and the leads are located outside the ring of the supporting sidewall; the supporting sidewall includes a first sidewall. The wall consists of a first side panel, a second side panel, a third side panel, and a fourth side panel; the surfaces of the first side panel, the second side panel, the third side panel, and the fourth side panel are all vertically arranged; the first side panel and the third side panel have the same height; the second side panel and the fourth side panel have the same height; the first side panel is higher than the second side panel; the two horizontal sides of the second side panel are respectively fixed to the surfaces of the first side panel and the third side panel; the two horizontal sides of the fourth side panel are respectively fixed to the surfaces of the first side panel and the third side panel. The first, second, third, and fourth side wall panels are arranged in a ring. A first through-hole is formed on the surface of the first side wall panel. The axis of the first fixing hole is perpendicular to the surface of the first side wall panel and extends horizontally. A second through-hole is formed on the surface of the third side wall panel. The axis of the second fixing hole is perpendicular to the surface of the third side wall panel and extends horizontally. The vertical projection of the first fixing hole on the third side wall panel completely coincides with the second fixing hole. The lower sidewall of the first fixing hole is flat. The lower sidewall of the first fixing hole is flush with the upper sidewall of the second sidewall; the upper end of the first sidewall is provided with a plurality of first injection holes; the first injection holes are vertically connected to the first fixing hole; the upper end of the third sidewall is provided with a plurality of second injection holes; the second injection holes are vertically connected to the second fixing hole; the opposite sides of the transparent cover are respectively inserted into the first fixing hole and the second fixing hole; the lower bottom surface of the transparent cover is supported on the upper sidewalls of the second sidewall and the fourth sidewall; the upper bottom surface of the transparent cover is flush with the lower openings of the first injection holes and the second injection holes.

[0008] The image sensor packaging structure with small angular deviation of the transparent cover plate provided by this utility model preferably has the first glue injection hole evenly distributed along the length direction of the first side wall plate; and the second glue injection hole evenly distributed along the length direction of the third side wall plate.

[0009] The image sensor packaging structure with small angular deviation of the transparent cover plate provided by this utility model preferably has the same number of second injection holes as the number of first injection holes.

[0010] The image sensor packaging structure with small angular deviation of the transparent cover plate provided by this utility model preferably has rounded corners on the two sides of the transparent cover plate inserted into the first fixing hole and the second fixing hole.

[0011] The image sensor packaging structure with small angular deviation of the transparent cover plate provided by this utility model preferably has adhesive at the contact point between the outer edge of the bottom surface of the transparent cover plate and the second side wall plate, the fourth side wall plate, the lower side wall of the first fixing hole, and the lower side wall of the second fixing hole.

[0012] The above technical solution has the following advantages or beneficial effects:

[0013] This utility model discloses an image sensor packaging structure with small angular deviation of the transparent cover plate, relating to the field of semiconductor packaging technology. It includes an image sensor, a substrate, a supporting sidewall, and a transparent cover plate. The image sensor is fixed on the substrate. The image sensor and the substrate are connected by several leads. The image sensor has a photosensitive area. The side of the image sensor where the photosensitive area is located is the upper surface of the image sensor. The supporting sidewall is disposed on the upper surface of the image sensor and has a ring structure. The photosensitive area is located inside the ring of the supporting sidewall, and the leads are located outside the ring of the supporting sidewall. The supporting sidewall includes a first sidewall panel, a second sidewall panel, a third sidewall panel, and a fourth sidewall panel; the surfaces of the first, second, third, and fourth sidewall panels are all vertically arranged; the first and third sidewall panels are at the same height; the second and fourth sidewall panels are at the same height; the first sidewall panel is higher than the second sidewall panel; the two horizontal sides of the second sidewall panel are respectively fixed to the surfaces of the first and third sidewall panels; the two horizontal sides of the fourth sidewall panel are respectively fixed to the first and third sidewall panels. On the surface of the panel; the surfaces of the first side wall panel, the second side wall panel, the third side wall panel, and the fourth side wall panel are arranged in a ring; a first fixing hole is formed through the surface of the first side wall panel; the axis of the first fixing hole is perpendicular to the surface of the first side wall panel and extends horizontally; a second fixing hole is formed through the surface of the third side wall panel; the axis of the second fixing hole is perpendicular to the surface of the third side wall panel and extends horizontally; the vertical projection of the first fixing hole on the third side wall panel completely coincides with the second fixing hole; the lower sidewall of the first fixing hole is flat. The first fixing hole has its lower sidewall flush with the upper side of the second sidewall; the upper end of the first sidewall has several first glue injection holes; the first glue injection holes are vertically connected to the first fixing hole; the upper end of the third sidewall has several second glue injection holes; the second glue injection holes are vertically connected to the second fixing hole; the opposite sides of the transparent cover are respectively inserted into the first fixing hole and the second fixing hole; the lower bottom surface of the transparent cover is supported on the upper side of the second sidewall and the fourth sidewall; the upper bottom surface of the transparent cover is flush with the lower openings of the first glue injection holes and the second glue injection holes. This invention provides an image sensor packaging structure with a small transparent cover angle deviation, solving the problem in the prior art where the transparent cover easily warps locally due to uneven glue distribution on the lower side, affecting the image sensor's signal reception; this invention can prevent the transparent cover from affecting the image sensor's light signal reception due to local warping. Attached Figure Description

[0014] The present invention, its features, shape, and advantages will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings. Like reference numerals denote like parts throughout the drawings. The drawings are not intentionally drawn to scale; the focus is on illustrating the gist of the invention.

[0015] Figure 1 This is a cross-sectional view of the image sensor packaging structure with small angular deviation of the transparent cover plate provided in Embodiment 1 of this utility model.

[0016] Figure 2 This is a schematic diagram of the supporting sidewall structure of the image sensor packaging structure with small angular deviation of the transparent cover plate provided in Embodiment 1 of this utility model.

[0017] Figure 3 This is a schematic diagram of the connection structure between the supporting sidewall and the transparent cover plate of the image sensor packaging structure with small angular deviation of the transparent cover plate provided in Embodiment 1 of this utility model.

[0018] Figure 4 This is a schematic diagram showing the connection between the second fixing hole and the second injection hole in the image sensor packaging structure with a small angular deviation of the transparent cover plate provided in Embodiment 1 of this utility model. Detailed Implementation

[0019] The technical solutions of the present utility model will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, and not all of them. Therefore, the detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely to illustrate selected embodiments of the present utility model. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without inventive effort are within the protection scope of the present utility model.

[0020] Example 1:

[0021] The image sensor packaging structure with small angular deviation of the transparent cover plate provided in Embodiment 1 of this utility model is as follows: Figures 1 to 4As shown, the system includes an image sensor 1, a substrate 2, a supporting sidewall 3, and a transparent cover plate 4. The image sensor 1 is fixed on the substrate 2. The image sensor 1 and the substrate 2 are connected by several leads 5. The image sensor 1 has a photosensitive area 11. The side of the image sensor 1 on which the photosensitive area 11 is located is the upper surface of the image sensor 1. The supporting sidewall 3 is disposed on the upper surface of the image sensor 1. The supporting sidewall 3 has a ring structure. The photosensitive area 11 is located inside the ring of the supporting sidewall 3. The leads 5 are located outside the ring of the supporting sidewall 3. The supporting sidewall 3 includes a first sidewall plate 31, a second sidewall plate 32, a third sidewall plate 33, and a fourth sidewall plate 34. The first side wall panel 31, the second side wall panel 32, the third side wall panel 33, and the fourth side wall panel 34 are all vertically arranged; the first side wall panel 31 and the third side wall panel 33 are at the same height; the second side wall panel 32 and the fourth side wall panel 34 are at the same height; the first side wall panel 31 is higher than the second side wall panel 32; the two horizontal sides of the second side wall panel 32 are respectively fixed to the surfaces of the first side wall panel 31 and the third side wall panel 33; the two horizontal sides of the fourth side wall panel 34 are respectively fixed to the surfaces of the first side wall panel 31 and the third side wall panel 33; the first side wall panel 31, the second side wall panel 32, the third side wall panel 33, the fourth side wall panel 34, and the fourth side wall panel 34 are all vertically arranged ... The surfaces of the third side wall panel 33 and the fourth side wall panel 34 form a ring; a through-hole 311 is provided on the surface of the first side wall panel 31; the axis of the first fixing hole 311 is perpendicular to the surface of the first side wall panel 31 and extends horizontally; a through-hole 331 is provided on the surface of the third side wall panel 33; the axis of the second fixing hole 331 is perpendicular to the surface of the third side wall panel 33 and extends horizontally; the vertical projection of the first fixing hole 311 on the surface of the third side wall panel 33 completely coincides with the second fixing hole 331; the lower sidewall of the first fixing hole 311 is flat; the lower sidewall of the first fixing hole 311... The wall is flush with the upper side of the second side wall panel 32; the upper end of the first side wall panel 31 is provided with a plurality of first glue injection holes 312; the first glue injection holes 312 are vertically connected to the first fixing holes 311; the upper end of the third side wall panel 33 is provided with a plurality of second glue injection holes 332; the second glue injection holes 332 are vertically connected to the second fixing holes 331; the opposite sides of the transparent cover plate 4 are respectively inserted into the first fixing holes 311 and the second fixing holes 331; the lower bottom surface of the transparent cover plate 4 is supported on the upper side of the second side wall panel 32 and the fourth side wall panel 34; the upper bottom surface of the transparent cover plate 4 is flush with the lower openings of the first glue injection holes 312 and the second glue injection holes 332.

[0022] The above-mentioned "the vertical projection of the first fixing hole 311 on the surface of the third side wall panel 33 is completely coincident with the second fixing hole 331" means that in this embodiment, both the first fixing hole 311 and the second fixing hole 331 are square holes, and the transparent cover plate 4 is a square plate. The hole axes of the first fixing hole 311 and the second fixing hole 331 are coaxial in the horizontal direction, and their projections on the surface of the third side wall panel 31 are completely coincident. The purpose of this structure is to ensure that both ends of the transparent cover plate 4 are at the same height and are fixed by the same structure.

[0023] When the image sensor packaging structure with small angular deviation of the transparent cover plate provided in Embodiment 1 of this utility model is working, the signal will pass through the transparent cover plate 4 and be received by the photosensitive area 11.

[0024] During actual assembly, the supporting sidewall 3 is first fixed to the image sensor 1. Then, the transparent cover plate 4 is inserted from one side of the first fixing hole 311 and inserted into the second fixing hole 331 (the holes of the first fixing hole 311 and the second fixing hole 331 are horizontal, and the lower sidewalls are flat). This makes the lower sidewalls of the first fixing hole 311 and the second fixing hole 331 abut against the lower sidewall of the transparent cover plate 4. Then, glue is filled into each of the first glue injection holes 312 and each of the second glue injection holes 332, so that the upper side of the transparent cover plate 4 is attached to the upper sidewall of the first fixing hole 311 and the upper side of the transparent cover plate 4 is attached. On the upper sidewall of the second fixing hole 331, after the adhesive cures, even if the adhesive expands due to thermal expansion and contraction, it will not push the transparent cover plate 4 upwards. Instead, it will deform upwards from the first injection hole 312 and the second injection hole 332. In this embodiment, the transparent cover plate 4 is fitted with an interference fit (under the interference fit, the upper sidewall of the first fixing hole 311 will continuously apply pressure to the transparent cover plate towards the lower sidewall of the first fixing hole 311 to ensure the seal between the transparent cover plate 4 and the lower sidewall of the first fixing hole 311, and the same applies to the second fixing hole 331). In the first fixing hole 311 and the second fixing hole 331, from the first injection hole 312, the adhesive will expand upwards from the first injection hole 332. The glue injected into the glue hole 312 and the second glue injection hole 332 is intended to restrict the movement of the transparent cover plate 4 along the axial direction of the first fixing hole 31. After the glue cures, the transparent cover plate 4 is fixed. (In this embodiment, it is preferable to apply glue to the lower edge of the bottom surface of the transparent cover plate 4 to ensure that the transparent cover plate 4 is sealed to the lower side wall of the first fixing hole 311 of the first side wall plate 31, to the upper side of the second side wall plate 32, to the lower side wall of the second fixing hole 331 of the third side wall plate 33, and to the upper side of the fourth side wall plate 34. This can further prevent air leakage in the photosensitive area. In this preferred mode, the first side wall plate 31 has a back-to-the-third...) The platform extending from the side wall panel 33 has its upper side plane flush with the lower side plane of the first fixing hole 311. The upper side of this platform can easily catch the glue dripping onto the lower edge of the transparent cover plate 4. Similarly, the third side wall panel 33 has a platform extending away from the first side wall panel 31. In this mode, the transparent cover plate can be set into a trapezoidal structure, that is, the upper edge of the transparent cover plate 4 at the first fixing hole 311 is flush with the outer opening of the first fixing hole 311, and the lower edge of the transparent cover plate 4 is in the middle of the platform extending from the first side wall panel 31 away from the third side wall panel 33. This facilitates the normal feeding of the glue needle.Compared to existing technologies that directly apply adhesive to the underside of the transparent cover plate 4 to fix it to the upper part of the side wall, this embodiment places the transparent cover plate 4 on a plane and fixes it to the upper side wall of the first fixing hole 311 and the second fixing hole 331 via the upper side of the transparent cover plate 4. Adhesive is applied to the lower edge of the transparent cover plate 4 to enhance the sealing. Since the adhesive is above and around the transparent cover plate, there is no basis for the adhesive below to push up the transparent cover plate 4. This can prevent the transparent cover plate 4 from partially lifting up due to the expansion of the adhesive below (due to temperature changes) during subsequent use, and prevent the formation of angles (the adhesive distribution of the transparent cover plate 4 is uneven, and the transparent cover plate 4 will lift up more on the side with more adhesive than on the side with less adhesive), which will ultimately affect the light passing through the transparent cover plate 4 and the image sensor receiving the image.

[0025] The image sensor packaging structure with small angle deviation of the transparent cover plate provided in Embodiment 1 of this utility model solves the problem in the prior art that the transparent cover plate is prone to local lifting due to uneven distribution of glue on the lower side, which affects the signal reception of the image sensor; this utility model can avoid the transparent cover plate from affecting the light signal reception of the image sensor due to local lifting.

[0026] As a preferred embodiment, in this case, the first injection holes 312 are evenly distributed along the length of the first side wall panel 31; the second injection holes 332 are evenly distributed along the length of the third side wall panel 33. By providing multiple first injection holes 312 and multiple second injection holes 332 evenly distributed along the length of the side wall panels, adhesive can be simultaneously injected into the gap between the fixing hole and the transparent cover from multiple points. This avoids the uneven flow of adhesive caused by traditional single-point injection, ensuring the connection stability of the transparent cover within the first fixing hole 311 and the second fixing hole 331.

[0027] In this embodiment, the number of second injection holes 332 is the same as the number of first injection holes 312. By symmetrically setting the same number of first injection holes 312 and second injection holes 332, the amount of glue filling on both sides of the transparent cover plate 4 (inside the first fixing hole and the second fixing hole) is consistent, avoiding uneven local stress and unstable connection caused by excessive or insufficient glue filling on one side.

[0028] To facilitate the insertion of the transparent cover plate 4 into the first fixing hole 311 and the second fixing hole 331, as a preferred embodiment, the two sides of the transparent cover plate 4 inserted into the first fixing hole 311 and the second fixing hole 331 are provided with rounded corners. The rounded corners allow for position calibration of the transparent cover plate 4 when it contacts the first fixing hole 311 and the second fixing hole 331, providing a certain margin of error when the device moves the transparent cover plate 4. The presence of the rounded corners also increases the space between the transparent cover plate 4 and the lower sidewalls of the first fixing hole 311 and the second fixing hole 331, providing sufficient space for subsequent glue filling.

[0029] In summary, this utility model discloses an image sensor packaging structure with small angular deviation of the transparent cover plate, relating to the field of semiconductor packaging technology. It includes an image sensor, a substrate, a supporting sidewall, and a transparent cover plate. The image sensor is fixed on the substrate. The image sensor and the substrate are connected by several leads. The image sensor has a photosensitive area. The side of the image sensor where the photosensitive area is located is the upper surface of the image sensor. The supporting sidewall is disposed on the upper surface of the image sensor and has a ring structure. The photosensitive area is located inside the ring of the supporting sidewall, and the leads are located outside the ring of the supporting sidewall. The supporting sidewall includes a first sidewall panel, a second sidewall panel, a third sidewall panel, and a fourth sidewall panel; the surfaces of the first, second, third, and fourth sidewall panels are all vertically arranged; the first and third sidewall panels have the same height; the second and fourth sidewall panels have the same height; the first sidewall panel is higher than the second sidewall panel; the horizontal sides of the second sidewall panel are respectively fixed to the surfaces of the first and third sidewall panels; the horizontal sides of the fourth sidewall panel are respectively fixed to the surfaces of the first and third sidewall panels. On the surface of the side wall panels; the surfaces of the first side wall panel, the second side wall panel, the third side wall panel, and the fourth side wall panel are arranged in a ring; a first through-hole is formed on the surface of the first side wall panel; the axis of the first fixing hole is perpendicular to the surface of the first side wall panel and extends horizontally; a second through-hole is formed on the surface of the third side wall panel; the axis of the second fixing hole is perpendicular to the surface of the third side wall panel and extends horizontally; the vertical projection of the first fixing hole on the third side wall panel completely coincides with the second fixing hole; the lower sidewall of the first fixing hole is... The first sidewall of the first fixing hole is flush with the upper side of the second sidewall plate; the upper end of the first sidewall plate has several first glue injection holes; the first glue injection holes are vertically connected to the first fixing hole; the upper end of the third sidewall plate has several second glue injection holes; the second glue injection holes are vertically connected to the second fixing hole; the opposite sides of the transparent cover plate are respectively inserted into the first fixing hole and the second fixing hole; the lower bottom surface of the transparent cover plate is supported on the upper side of the second sidewall plate and the fourth sidewall plate; the upper bottom surface of the transparent cover plate is flush with the lower openings of the first glue injection holes and the second glue injection holes. The image sensor packaging structure with a small angle deviation of the transparent cover plate provided by this utility model solves the problem in the prior art where the transparent cover plate easily warps locally due to uneven glue distribution on the lower side, affecting the image sensor's signal reception; this utility model can avoid the transparent cover plate affecting the image sensor's light signal reception due to local warping.

[0030] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the contents of the present utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present utility model.

Claims

1. An image sensor packaging structure with small angular deviation of the transparent cover plate, comprising an image sensor, a substrate, a supporting sidewall, and a transparent cover plate; the image sensor is fixed on the substrate; the image sensor and the substrate are connected by a plurality of leads; the image sensor has a photosensitive area; the side of the image sensor on which the photosensitive area is disposed is the upper surface of the image sensor; the supporting sidewall is disposed on the upper surface of the image sensor; the supporting sidewall is an annular structure; the photosensitive area is located inside the annular support sidewall; the leads are located outside the annular support sidewall. Its features are, The supporting sidewall includes a first sidewall panel, a second sidewall panel, a third sidewall panel, and a fourth sidewall panel; the surfaces of the first, second, third, and fourth sidewall panels are all vertically arranged; the first and third sidewall panels have the same height; the second and fourth sidewall panels have the same height; the first sidewall panel is higher than the second sidewall panel; the two horizontal sides of the second sidewall panel are respectively fixed to the surfaces of the first and third sidewall panels; the two horizontal sides of the fourth sidewall panel are respectively fixed to the surfaces of the first and third sidewall panels; the surfaces of the first, second, third, and fourth sidewall panels form a ring. A through-hole is formed on the surface of the first side wall panel; the axis of the first fixing hole is perpendicular to the surface of the first side wall panel and extends horizontally; a through-hole is formed on the surface of the third side wall panel; the axis of the second fixing hole is perpendicular to the surface of the third side wall panel and extends horizontally; the vertical projection of the first fixing hole on the third side wall panel completely coincides with the second fixing hole; the lower sidewall of the first fixing hole is flat; the lower sidewall of the first fixing hole is flush with the upper side of the second side wall panel; The upper end of the first side wall panel is provided with a plurality of first glue injection holes; the first glue injection holes are vertically connected to the first fixing holes; the upper end of the third side wall panel is provided with a plurality of second glue injection holes; the second glue injection holes are vertically connected to the second fixing holes; The first fixing hole and the second fixing hole are respectively inserted into the opposite sides of the transparent cover plate; the bottom surface of the transparent cover plate is supported on the upper surface of the second side wall plate and the fourth side wall plate; The top surface of the transparent cover is flush with the lower openings of the first and second glue injection holes.

2. The image sensor package structure with a small transparent cover plate angle deviation according to claim 1, wherein, The first injection holes are evenly distributed along the length of the first side wall panel; the second injection holes are evenly distributed along the length of the third side wall panel.

3. The image sensor package structure with a small transparent cover plate angle deviation according to claim 2, wherein The number of the second injection holes is the same as the number of the first injection holes.

4. The image sensor package structure with a small transparent cover plate angle deviation according to claim 1, wherein The transparent cover plate has rounded corners on both sides where it is inserted into the first fixing hole and the second fixing hole.

5. The image sensor package structure with a small transparent cover plate angle deviation according to claim 1, wherein Adhesive is applied to the contact points between the outer edge of the bottom surface of the transparent cover and the second side wall, the fourth side wall, the lower side wall of the first fixing hole, and the lower side wall of the second fixing hole.

Images