A high-brightness, low-loss EMC ultraviolet LED lamp bead module
By adopting a composite connection structure of plug-in part and EMC bracket in EMC ultraviolet LED lamp bead module, the connection strength is enhanced by adhesive and interlocking parts, which solves the problem of unstable connection between EMC bracket and package chip, and improves the reliability and optical performance of device.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN XINKE PHOTOELECTRIC TECH CO LTD
- Filing Date
- 2025-07-08
- Publication Date
- 2026-07-03
Smart Images
Figure CN224460457U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of ultraviolet LED lamp bead technology, and in particular to a high-brightness, low-loss EMC ultraviolet LED lamp bead module. Background Technology
[0002] In the packaging process of EMC (electromagnetic compatibility) ultraviolet LED lamp bead modules, the connection stability between the EMC bracket and the package directly affects the reliability and optical performance of the device.
[0003] For example, in application number 202421854348.2, a high-brightness, low-loss EMC ultraviolet LED lamp bead module is described. The protrusion of the encapsulation sheet in the above application is connected to the side of the EMC bracket by interlocking. The interlocking point is fixed by adhesive. When it is fixed by adhesive alone, there are no mechanical anchoring points. Moreover, the thermal expansion coefficients of the EMC bracket and the encapsulation sheet materials are quite different. Under temperature changes or external impact, interface stress is easily generated, which leads to peeling or cracking of the adhesive layer and causes the encapsulation sheet to fall off.
[0004] Therefore, how to achieve the connection and fixation between the EMC bracket and the packaged chip through a composite connection structure has become a technical problem that urgently needs to be solved in this field. Utility Model Content
[0005] The purpose of this invention is to provide a high-brightness, low-loss EMC ultraviolet LED lamp bead module to solve the problems mentioned in the background art.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a high-brightness, low-loss EMC ultraviolet LED lamp bead module, comprising:
[0007] EMC bracket;
[0008] A light-emitting component, the light-emitting component including an ultraviolet LED chip disposed in the inner cavity of an EMC support, the inner cavity of the EMC support being provided with a connection portion for conducting electricity to the ultraviolet LED chip;
[0009] An encapsulation assembly is used to seal the inner cavity of an EMC support. The encapsulation assembly includes an encapsulation piece disposed on the side of the EMC support. The side of the encapsulation piece is provided with an insertion portion. The side of the insertion portion is inserted and connected to the side of the EMC support. An adhesive portion for fixing the insertion portion is provided at the insertion point between the insertion portion and the EMC support. An interlocking portion for increasing the connection strength is provided on the side of the insertion portion.
[0010] Preferably, the insertion part includes:
[0011] Insertion blocks, a plurality of said insertion blocks are disposed on the side of the package sheet, and the side of said insertion blocks are interlocked with the side of the EMC bracket;
[0012] The slot is located on the side of the EMC bracket and is used for inserting the plug.
[0013] Preferably, the adhesive portion includes ceramic adhesive, which is disposed in the inner cavity of the slot and is used to bond and fix the insert to the inner wall of the slot.
[0014] Preferably, the top of the insert has multiple fixing grooves, which are used to increase the bonding area between the ceramic adhesive and the insert.
[0015] Preferably, the occlusal portion includes:
[0016] Interlaced protrusions, a plurality of said interlaced protrusions are disposed on the bottom inner wall of the slot;
[0017] Interlaced grooves, a plurality of interlaced grooves are provided on the bottom of the insert block, the interlaced grooves and interlaced protrusions are arranged alternately.
[0018] Preferably, the insert is L-shaped, and the L-shape of the insert is used to mechanically fix the insert.
[0019] Preferably, the connecting portion includes:
[0020] The first conductive terminal is disposed in the inner cavity of the EMC bracket, and the side of the first conductive terminal is electrically connected to the positive electrode of the ultraviolet LED chip.
[0021] The second conductive terminal is disposed in the inner cavity of the EMC bracket, and its side is electrically connected to the negative electrode of the ultraviolet LED chip.
[0022] The technical effects and advantages of this utility model are as follows:
[0023] This invention provides a connecting part at the connection between the EMC bracket and the package sheet, and uses an adhesive part to bond and fix the connecting part to the insertion point of the EMC bracket. The connecting part is provided with an interlocking part on its side, and the mechanical interlocking of the interlocking part enhances the connection strength of the connecting part, avoiding reliance on adhesive fixation alone and reducing the possibility of the adhesive part falling off when the package sheet is subjected to external pressure. Attached Figure Description
[0024] Figure 1 This is a side view of the entire utility model.
[0025] Figure 2 This is a cross-sectional view of the entire utility model.
[0026] Figure 3 This is a top view of the EMC bracket of this utility model.
[0027] Figure 4This is a schematic diagram of the structure of the packaging sheet of this utility model.
[0028] Figure 5 This is a cross-sectional view of the packaging component of this utility model.
[0029] In the diagram: 1. EMC bracket; 101. Slot; 102. Interlaced protrusions; 2. First conductive terminal; 3. Second conductive terminal; 4. UV LED chip; 5. Encapsulation sheet; 6. Insert block; 601. Interlaced groove; 602. Fixing groove; 7. Ceramic adhesive. Detailed Implementation
[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0031] This utility model provides, for example Figure 1-5 As shown:
[0032] Example 1: A high-brightness, low-loss EMC ultraviolet LED lamp bead module, comprising: an EMC bracket 1, a light-emitting component, and a packaging component;
[0033] Specifically, the light-emitting component includes an ultraviolet LED chip 4 disposed in the inner cavity of the EMC bracket 1, the inner cavity of the EMC bracket 1 is provided with a connection part for the ultraviolet LED chip 4 to conduct electricity, and the encapsulation component is used to seal the inner cavity of the EMC bracket 1.
[0034] It should be noted that the encapsulation assembly includes an encapsulation sheet 5 disposed on the side of the EMC bracket 1. The side of the encapsulation sheet 5 is provided with an insertion part. The side of the insertion part is inserted and connected to the side of the EMC bracket 1. An adhesive part for fixing the insertion part is provided at the insertion point between the insertion part and the EMC bracket 1. An interlocking part for increasing the connection strength is provided on the side of the insertion part.
[0035] It should be noted that the encapsulation sheet 5 is made of sapphire lens, and the sapphire lens has a light transmittance of more than 95% for ultraviolet light, achieving a high-brightness and low-loss light emission effect.
[0036] Specifically, the insertion part includes: insertion block 6 and slot 101;
[0037] It should be noted that multiple insert blocks 6 are disposed on the side of the package sheet 5, and the side of the insert blocks 6 is interlocked with the side of the EMC bracket 1. The slot 101 is opened on the side of the EMC bracket 1 and is used for the insertion of the insert blocks 6. The multiple insert blocks 6 are arranged in a triangular shape on the side of the package sheet 5.
[0038] Specifically, the insert 6 is L-shaped, and the L-shape of the insert 6 is used to mechanically fix the insert 6. The insert 6 and the encapsulation sheet 5 are made of the same material and are formed by laser cutting of sapphire. The adhesive part includes ceramic glue 7, which is set in the inner cavity of the slot 101. The ceramic glue 7 is used to bond and fix the insert 6 to the inner wall of the slot 101.
[0039] It should be noted that during encapsulation, the ceramic adhesive 7 is first placed into the slot 101, and the insert 6 at the bottom of the encapsulation piece 5 is inserted into the slot 101. The encapsulation piece 5 is pushed, and the side of the insert 6 penetrates the inner wall of the slot 101. The top of the insert 6 is provided with multiple fixing grooves 602. The fixing grooves 602 are used to increase the bonding area between the ceramic adhesive 7 and the insert 6, and the ceramic adhesive 7 is bonded to the inner wall of the fixing grooves 602.
[0040] Specifically, the occlusal portion includes: staggered protrusions 102 and staggered grooves 601;
[0041] It should be noted that multiple staggered protrusions 102 are provided on the bottom inner wall of the slot 101, and multiple staggered grooves 601 are provided on the bottom of the insert block 6. The staggered grooves 601 and the staggered protrusions 102 are staggered.
[0042] Specifically, the staggered protrusions 102 and the staggered grooves 601 are engaged and fixed, and the top of the slot 101 has space for the insertion and movement of the insert 6.
[0043] Example 2: A connecting part applied to the high-brightness, low-loss EMC ultraviolet LED lamp bead module in Example 1;
[0044] The connecting part includes: a first conductive terminal 2 and a second conductive terminal 3;
[0045] It should be noted that the first conductive terminal 2 is disposed in the inner cavity of the EMC bracket 1, and the side of the first conductive terminal 2 is electrically connected to the positive electrode of the ultraviolet LED chip 4. The second conductive terminal 3 is disposed in the inner cavity of the EMC bracket 1, and the side of the second conductive terminal 3 is electrically connected to the negative electrode of the ultraviolet LED chip 4.
[0046] In actual use, a plug 6 is provided at the connection between the EMC bracket 1 and the package 5. The plug 6 is bonded and fixed to the slot 101 of the EMC bracket 1 using an adhesive part. The plug 6 is provided with an interlocking part on its side. The mechanical interlocking of the interlocking part enhances the connection strength of the plug 6, avoids relying solely on adhesive fixation, and reduces the possibility of the plug 6 falling off at the adhesive part when the package 5 is subjected to external pressure.
[0047] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A high-brightness low-loss EMC ultraviolet LED lamp bead module, characterized in that, include: EMC bracket (1); The light-emitting component includes an ultraviolet LED chip (4) disposed in the inner cavity of the EMC bracket (1), and the inner cavity of the EMC bracket (1) is provided with a connection part for the ultraviolet LED chip (4) to conduct electricity. The encapsulation assembly is used to seal the inner cavity of the EMC bracket (1). The encapsulation assembly includes an encapsulation piece (5) disposed on the side of the EMC bracket (1). The side of the encapsulation piece (5) is provided with an insertion part. The side of the insertion part is inserted and connected to the side of the EMC bracket (1). The insertion part and the EMC bracket (1) are provided with an adhesive part for fixing the insertion part. The side of the insertion part is provided with an interlocking part for increasing the connection strength. 2.The EMC ultraviolet LED lamp bead module with high brightness and low loss according to claim 1, wherein The insertion part includes: Insert (6), a plurality of inserts (6) are disposed on the side of the encapsulation sheet (5), and the side of the inserts (6) is interlocked with the side of the EMC bracket (1); Slot (101) is provided on the side of the EMC bracket (1) and is used for inserting the plug (6). 3.The EMC ultraviolet LED lamp bead module with high brightness and low loss according to claim 2, characterized in that, The adhesive part includes ceramic adhesive (7), which is disposed in the inner cavity of the slot (101) and is used to bond and fix the plug (6) to the inner wall of the slot (101). 4.The EMC ultraviolet LED lamp bead module with high brightness and low loss according to claim 3, characterized in that, The top of the insert (6) is provided with a plurality of fixing grooves (602), which are used to increase the bonding area between the ceramic adhesive (7) and the insert (6).
5. A high-brightness, low-loss EMC ultraviolet LED lamp bead module according to claim 2, characterized in that, The occlusal portion includes: Interlaced protrusions (102), a plurality of said interlaced protrusions (102) are disposed on the bottom inner wall of the slot (101); Interlaced grooves (601), a plurality of interlaced grooves (601) are disposed at the bottom of the insert (6), the interlaced grooves (601) and interlaced protrusions (102) are interlaced. 6.The EMC ultraviolet LED lamp bead module with high brightness and low loss according to claim 2, wherein The insert (6) is configured in an L-shape, and the L-shape of the insert (6) is used to mechanically fix the insert (6). 7.The EMC ultraviolet LED lamp bead module with high brightness and low loss of claim 1, wherein, The connecting part includes: The first conductive terminal (2) is disposed in the inner cavity of the EMC bracket (1), and the side of the first conductive terminal (2) is electrically connected to the positive electrode of the ultraviolet LED chip (4). The second conductive terminal (3) is disposed in the inner cavity of the EMC bracket (1), and the side of the second conductive terminal (3) is electrically connected to the negative electrode of the ultraviolet LED chip (4).