Liquid cooling device

Abstract

This utility model discloses a liquid cooling device. A first liquid cooling plate is used to contact a first chip, and a second liquid cooling plate is used to contact a second chip. An adaptive connection mechanism is movably connected between the first and second liquid cooling plates. The adaptive connection mechanism allows at least one of the first and second liquid cooling plates to have a heat dissipation state in contact with the corresponding chip surface and a clearance state to be separated from the corresponding chip. A heat dissipation space for holding the chip module is formed between the first and second liquid cooling plates, both in heat dissipation states. The adaptive connection mechanism makes the height of the heat dissipation space adjustable. This liquid cooling device adopts a double-sided liquid cooling direct-contact heat dissipation scheme, resulting in high heat dissipation efficiency; the ability of at least one liquid cooling plate to move to a clearance state allows the chip module to be easily installed into the liquid cooling device, making it convenient to use; the adjustable height of the heat dissipation space allows the heat dissipation device to be used with chip modules of different specifications, demonstrating strong versatility.

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