A top surface heat dissipation power module with reinforced thermal contact and a plastic package structure

Abstract

The utility model relates to power module technology discloses a kind of top surface heat dissipation power module and plastic package structure of reinforced thermal contact, including power module body, and its power module body includes plastic package shell and plastic package shell and has metal pin of extension;The top of plastic package shell is equipped with metal heat dissipation surface;Plastic package shell bottom is equipped with several support units, and the middle of plastic package shell bottom is also equipped with positioning unit.The power module designed in the utility model carries out structure optimization to top surface heat dissipation module, and the mounting method of reasonable combination can effectively control the solder layer thickness between module pin and PCB, and ensure that there is enough installation pressure between radiator and module, realize better thermal contact.

Description

Technical Field

[0001] This utility model relates to power module technology, and more particularly to a top-surface heat dissipation power module and its encapsulation structure that enhances thermal contact. Background Technology

[0002] With the development of third-generation semiconductors, the power density of power modules is constantly increasing, and users have higher requirements for the cost, ease of installation and application, and flexibility of power modules. For example, some surface-mount power module customers usually mount the heat sink as the bottom surface for heat dissipation. However, in order to achieve more flexible layout optimization, customers want the power module to be directly soldered to the PCB, while heat dissipation is achieved by using a heat sink mounted on the top surface of the module.

[0003] For example, existing technology US11355424 proposes a power module that can achieve top heat dissipation. While top heat dissipation modules bring convenience to customers, they also bring new challenges, namely, how to ensure that the heat sink can be effectively and reliably installed on the heat sink, and minimize contact thermal resistance as much as possible.

[0004] After the top-mounted power module is soldered onto the PCB, the thickness of the solder layer between the pins and the PCB is difficult to control, resulting in contact gaps between the top heat dissipation surface and the heat sink. Therefore, during installation, it is often necessary to increase the thickness of the thermal grease to fill these gaps and ensure good thermal contact between the heat sink and the module's heat dissipation surface. However, thermal grease has poor thermal performance, and increasing its thickness means greater thermal resistance, which in turn affects the overall performance of the model. Summary of the Invention

[0005] This invention addresses the problem of contact gaps between the top heat dissipation surface and the heat sink in the prior art by providing a top heat dissipation power module and its encapsulated structure that enhances thermal contact.

[0006] To solve the above-mentioned technical problems, the present invention provides a solution through the following technical method:

[0007] A top-surface heat dissipation power module with enhanced thermal contact includes a power module body, which includes a plastic-encapsulated housing and metal pins extending from the plastic-encapsulated housing; the top of the plastic-encapsulated housing is provided with a metal heat dissipation surface; the bottom of the plastic-encapsulated housing is provided with several support units, and a positioning unit is also provided in the middle of the bottom of the plastic-encapsulated housing.

[0008] Preferably, the support units are located at the four corners of the bottom of the plastic-encapsulated housing and are symmetrical in shape.

[0009] Preferably, the thickness of the support unit is 0.05 mm to 0.2 mm; the thickness of the positioning unit is 0.05 mm to 0.2 mm.

[0010] Preferably, the support unit and the support unit are square or circular in shape.

[0011] Preferably, the metal pins include auxiliary signal metal pins and main signal metal pins; and the auxiliary signal metal pins are located on the same side of the power module body, while the main signal metal pins are located on the opposite side of the auxiliary signal metal pins.

[0012] Preferably, the auxiliary signal metal pins include a first group of auxiliary signal metal pins and a second group of auxiliary signal metal pins; the first group of auxiliary signal metal pins consists of a first auxiliary signal metal pin, a second auxiliary signal metal pin, and a third auxiliary signal metal pin in sequence; the second group of auxiliary signal metal pins consists of a fourth auxiliary signal metal pin, a fifth auxiliary signal metal pin, and a sixth auxiliary signal metal pin in sequence; a first enhancement unit is provided between the second and third auxiliary signal metal pins; and a second enhancement unit is provided between the fourth and fifth auxiliary signal metal pins.

[0013] Preferably, the main signal metal pins are, in sequence, a first main signal metal pin, a second main signal metal pin, and a third main signal metal pin; a third enhancement unit is provided between the first main signal metal pin and the second main signal metal pin, and a fourth enhancement unit is provided between the second main signal metal pin and the third main signal metal pin.

[0014] To address the aforementioned technical problems, this application also provides a plastic encapsulation structure for enhanced thermal contact, characterized in that it includes a top surface heat dissipation power module for enhanced thermal contact.

[0015] Preferably, the system also includes a PCB board, a pressure plate, and a heat sink, which are installed sequentially. The positioning unit of the power module is used to position the pressure plate.

[0016] This utility model, by adopting the above technical solution, has significant technical effects:

[0017] The power module designed in this utility model optimizes the structure of the top heat dissipation module and, with a reasonable installation method, can effectively control the solder layer thickness between the module pins and the PCB, and ensure sufficient installation pressure between the heat sink and the module to achieve better thermal contact. Attached Figure Description

[0018] Figure 1 This is the front view of the power module of this utility model.

[0019] Figure 2 This is a three-dimensional structural diagram of the power module of this utility model.

[0020] Figure 3This is a schematic diagram of the installation of the plastic-encapsulated structure of this utility model.

[0021] Among them, 1—power module body, 2—molded shell, 3—metal pin, 4—support unit, 5—positioning unit, 6—PCB board, 7—press plate, 8—heat sink, 31—auxiliary signal metal pin, 32—main signal metal pin, 311—first auxiliary signal metal pin, 312—second auxiliary signal metal pin, 313—third auxiliary signal metal pin, 314—fourth auxiliary signal metal pin, 315—fifth auxiliary signal metal pin, 316—sixth auxiliary signal metal pin, 317—first enhancement unit, 318—second enhancement unit, 321—first main signal metal pin, 322—second main signal metal pin, 323—third main signal metal pin, 324—third enhancement unit, and 325—fourth enhancement unit. Detailed Implementation

[0022] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0023] Example 1

[0024] A top-surface heat dissipation power module with enhanced thermal contact includes a power module body 1, which includes a plastic-encapsulated housing 2 and metal pins 3 extending from the plastic-encapsulated housing 2; the top of the plastic-encapsulated housing 2 is provided with a metal heat dissipation surface; the bottom of the plastic-encapsulated housing 2 is provided with several support units 4, and the middle of the bottom of the plastic-encapsulated housing 2 is also provided with a positioning unit 5.

[0025] The support units 4 are located at the four corners of the bottom of the plastic-encapsulated housing 2, and are symmetrically shaped. Figure 1 In the process, there are four support units 4, located at the four corners of the plastic-encapsulated housing 2; and the support unit 4 is circular in shape. The thickness of the support unit 4 is 0.1mm; the thickness of the positioning unit 5 is 0.1mm.

[0026] Metal pin 3 includes auxiliary signal metal pin 31 and main signal metal pin 32; and the auxiliary signal metal pin 31 is located on the same side of the power module body 1, while the main signal metal pin 32 is located on the opposite side of the auxiliary signal metal pin 31.

[0027] The auxiliary signal metal pins 31 include a first group of auxiliary signal metal pins 31 and a second group of auxiliary signal metal pins 31; the first group of auxiliary signal metal pins 31 are, in sequence, a first auxiliary signal metal pin 311, a second auxiliary signal metal pin 312, and a third auxiliary signal metal pin 313; the second group of auxiliary signal metal pins 31 are, in sequence, a fourth auxiliary signal metal pin 314, a fifth auxiliary signal metal pin 315, and a sixth auxiliary signal metal pin 316; a first enhancement unit 317 is provided between the second auxiliary signal metal pin 312 and the third auxiliary signal metal pin 313; a second enhancement unit 318 is provided between the fourth auxiliary signal metal pin 314 and the fifth auxiliary signal metal pin 315.

[0028] The main signal metal pins 32 are sequentially the first main signal metal pin 321, the second main signal metal pin 322, and the third main signal metal pin 323; a third main signal metal pin 324 is provided between the first main signal metal pin 321 and the second main signal metal pin 322, and a fourth enhancement unit 325 is provided between the second main signal metal pin 322 and the third main signal metal pin 323.

[0029] Example 2

[0030] A top-surface heat dissipation power module with enhanced thermal contact includes a power module body 1, which includes a plastic-encapsulated housing 2 and metal pins 3 extending from the plastic-encapsulated housing 2; the top of the plastic-encapsulated housing 2 is provided with a metal heat dissipation surface; the bottom of the plastic-encapsulated housing 2 is provided with several support units 4, and the middle of the bottom of the plastic-encapsulated housing 2 is also provided with a positioning unit 5.

[0031] The support unit 4 is located at the four corners of the bottom of the plastic-encapsulated housing 2 and is symmetrical in shape.

[0032] The support units 4 are located at the four corners of the bottom of the plastic-encapsulated housing 2, and are symmetrically shaped. Figure 1 In the process, there are four support units 4, located at the four corners of the plastic-encapsulated housing 2; and the support unit 4 is square in shape. The thickness of the support unit 4 is 0.05mm; the thickness of the positioning unit 5 is 0.05mm. The positioning unit 5 is circular in shape.

[0033] Metal pin 3 includes auxiliary signal metal pin 31 and main signal metal pin 32; and the auxiliary signal metal pin 31 is located on the same side of the power module body 1, while the main signal metal pin 32 is located on the opposite side of the auxiliary signal metal pin 31.

[0034] The auxiliary signal metal pins 31 include a first group of auxiliary signal metal pins 31 and a second group of auxiliary signal metal pins 31. The first group of auxiliary signal metal pins 31 consists of a first auxiliary signal metal pin 311, a second auxiliary signal metal pin 312, and a third auxiliary signal metal pin 313, respectively. The second group of auxiliary signal metal pins 31 consists of a fourth auxiliary signal metal pin 314, a fifth auxiliary signal metal pin 315, and a sixth auxiliary signal metal pin 316, respectively. A first enhancement unit 317 is provided between the second auxiliary signal metal pin 312 and the third auxiliary signal metal pin 313. A second enhancement unit 318 is provided between the fourth auxiliary signal metal pin 314 and the fifth auxiliary signal metal pin 315. The first enhancement unit 317 and the second enhancement unit 318 have the same shape, which is set to V-shape here.

[0035] The main signal metal pins 32 are sequentially designated as first main signal metal pin 321, second main signal metal pin 322, and third main signal metal pin 323. A third main signal metal pin 324 is located between the first main signal metal pin 321 and the second main signal metal pin 322, and a fourth reinforcement unit 325 is located between the second main signal metal pin 322 and the third main signal metal pin 323. The third main signal metal pin 324 and the fourth reinforcement unit 325 have the same shape, which is square. The creepage reinforcement unit enhances the electrical safety performance of the module, protecting not only the module but also auxiliary circuits, equipment, and personal safety.

[0036] Example 3

[0037] A top-surface heat dissipation power module with enhanced thermal contact includes a power module body 1, which includes a plastic-encapsulated housing 2 and metal pins 3 extending from the plastic-encapsulated housing 2; the top of the plastic-encapsulated housing 2 is provided with a metal heat dissipation surface; the bottom of the plastic-encapsulated housing 2 is provided with several support units 4, and the middle of the bottom of the plastic-encapsulated housing 2 is also provided with a positioning unit 5.

[0038] The support unit 4 is located at the four corners of the bottom of the plastic-encapsulated housing 2 and is symmetrical in shape.

[0039] The thickness of the support unit 4 is 0.2 mm; the thickness of the positioning unit 5 is 0.2 mm.

[0040] The support unit 4 and the support unit 4 are square in shape.

[0041] Metal pin 3 includes auxiliary signal metal pin 31 and main signal metal pin 32; and the auxiliary signal metal pin 31 is located on the same side of the power module body 1, while the main signal metal pin 32 is located on the opposite side of the auxiliary signal metal pin 31.

[0042] The auxiliary signal metal pins 31 include a first group of auxiliary signal metal pins 31 and a second group of auxiliary signal metal pins 31; the first group of auxiliary signal metal pins 31 are, in sequence, a first auxiliary signal metal pin 311, a second auxiliary signal metal pin 312, and a third auxiliary signal metal pin 313; the second group of auxiliary signal metal pins 31 are, in sequence, a fourth auxiliary signal metal pin 314, a fifth auxiliary signal metal pin 315, and a sixth auxiliary signal metal pin 316; a first enhancement unit 317 is provided between the second auxiliary signal metal pin 312 and the third auxiliary signal metal pin 313; a second enhancement unit 318 is provided between the fourth auxiliary signal metal pin 314 and the fifth auxiliary signal metal pin 315.

[0043] The main signal metal pins 32 are sequentially the first main signal metal pin 321, the second main signal metal pin 322, and the third main signal metal pin 323; a third main signal metal pin 324 is provided between the first main signal metal pin 321 and the second main signal metal pin 322, and a fourth enhancement unit 325 is provided between the second main signal metal pin 322 and the third main signal metal pin 323.

[0044] Example 4

[0045] A top-surface heat dissipation power module with enhanced thermal contact includes a power module body 1, which includes a plastic-encapsulated housing 2 and metal pins 3 extending from the plastic-encapsulated housing 2; the top of the plastic-encapsulated housing 2 is provided with a metal heat dissipation surface; the bottom of the plastic-encapsulated housing 2 is provided with several support units 4, and the middle of the bottom of the plastic-encapsulated housing 2 is also provided with a positioning unit 5.

[0046] The support unit 4 is located at the four corners of the bottom of the plastic-encapsulated housing 2 and is symmetrical in shape.

[0047] The thickness of the support unit 4 is 0.1 mm; the thickness of the positioning unit 5 is 0.1 mm.

[0048] The support unit 4 is circular, and the positioning unit 5 is square.

[0049] Metal pin 3 includes auxiliary signal metal pin 31 and main signal metal pin 32; and the auxiliary signal metal pin 31 is located on the same side of the power module body 1, while the main signal metal pin 32 is located on the opposite side of the auxiliary signal metal pin 31.

[0050] The auxiliary signal metal pins 31 include a first group of auxiliary signal metal pins 31 and a second group of auxiliary signal metal pins 31; the first group of auxiliary signal metal pins 31 are, in sequence, a first auxiliary signal metal pin 311, a second auxiliary signal metal pin 312, and a third auxiliary signal metal pin 313; the second group of auxiliary signal metal pins 31 are, in sequence, a fourth auxiliary signal metal pin 314, a fifth auxiliary signal metal pin 315, and a sixth auxiliary signal metal pin 316; a first enhancement unit 317 is provided between the second auxiliary signal metal pin 312 and the third auxiliary signal metal pin 313; a second enhancement unit 318 is provided between the fourth auxiliary signal metal pin 314 and the fifth auxiliary signal metal pin 315.

[0051] The main signal metal pins 32 are sequentially the first main signal metal pin 321, the second main signal metal pin 322, and the third main signal metal pin 323; a third main signal metal pin 324 is provided between the first main signal metal pin 321 and the second main signal metal pin 322, and a fourth enhancement unit 325 is provided between the second main signal metal pin 322 and the third main signal metal pin 323.

[0052] Example 5

[0053] Based on the above embodiments, this embodiment is a plastic encapsulation structure with enhanced thermal contact, which includes the aforementioned top surface heat dissipation power module with enhanced thermal contact.

[0054] Figure 3 The system also includes a PCB board 6, a pressure plate 7, and a heat sink 8, which are installed sequentially. The positioning unit 5 of the power module is used to position the pressure plate 7. The pressure plate presses the module onto the heat sink, reducing the installation force exerted by the heat sink on the PCB board and preventing excessive PCB deformation. This improves the fitting accuracy of the installation gap between the module and the heat sink. The pressing force of the pressure plate combined with the screws ensures more sufficient thermal contact between the module and the heat sink, thereby enhancing the module's heat dissipation capacity.

Claims

1. A top-side heat spreading power module with enhanced thermal contact, comprising a power module body, characterized in that, The power module body includes a plastic-encapsulated housing and metal leads extending from the plastic-encapsulated housing; the top of the plastic-encapsulated housing has a metal heat dissipation surface; the bottom of the plastic-encapsulated housing has several support units, and the middle of the bottom of the plastic-encapsulated housing also has a positioning unit.

2. A power module of claim 1 wherein, The support units are located at the four corners of the bottom of the plastic-encapsulated housing and are symmetrical in shape.

3. The power module of claim 1 wherein, The thickness of the support unit is 0.05mm to 0.2mm; the thickness of the positioning unit is 0.05mm to 0.2mm.

4. The power module of claim 1 wherein, The support unit and the support unit are square or circular in shape.

5. A top-surface heat dissipation power module for enhanced thermal contact according to claim 1, characterized in that, The metal pins include auxiliary signal metal pins and main signal metal pins; the auxiliary signal metal pins are located on the same side of the power module body, and the main signal metal pins are located on the opposite side of the auxiliary signal metal pins.

6. A power module of the type described in claim 5, wherein: The auxiliary signal metal pins include a first group of auxiliary signal metal pins and a second group of auxiliary signal metal pins; the first group of auxiliary signal metal pins consists of a first auxiliary signal metal pin, a second auxiliary signal metal pin, and a third auxiliary signal metal pin in sequence; the second group of auxiliary signal metal pins consists of a fourth auxiliary signal metal pin, a fifth auxiliary signal metal pin, and a sixth auxiliary signal metal pin in sequence; a first enhancement unit is provided between the second and third auxiliary signal metal pins; and a second enhancement unit is provided between the fourth and fifth auxiliary signal metal pins.

7. The power module of claim 5 wherein, The main signal metal pins are, in sequence, the first main signal metal pin, the second main signal metal pin, and the third main signal metal pin; a third enhancement unit is provided between the first main signal metal pin and the second main signal metal pin, and a fourth enhancement unit is provided between the second main signal metal pin and the third main signal metal pin.

8. A plastic package structure for enhancing thermal contact, characterized by Includes a top surface heat dissipation power module with enhanced thermal contact as described in any one of claims 1-7.

9. The plastic package structure with enhanced thermal contact according to claim 8, wherein, It also includes a PCB board, a pressure plate, and a heat sink, which are installed sequentially; the positioning unit of the power module is used to position the pressure plate.

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