An integrated circuit packaging structure

By combining the encapsulation box, encapsulation cover, and heat sink, the problems of inconvenient modular assembly and poor heat dissipation of potting encapsulation structures are solved, thus realizing convenient installation and efficient heat dissipation of integrated circuit packaging structures.

CN224460562UActive Publication Date: 2026-07-03JIANGXI WINDSPEAKER TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIANGXI WINDSPEAKER TECHNOLOGY CO LTD
Filing Date
2025-08-26
Publication Date
2026-07-03

AI Technical Summary

Technical Problem

Some potting encapsulation structures are not convenient for modular assembly and installation, and the heat dissipation effect of the potted integrated circuit package structure is poor.

Method used

It adopts a combination structure of encapsulation box, encapsulation cover and heat dissipation components, including box body, sleeve, rubber ring, column, cover body, ring, rubber gasket, potting hole and heat dissipation coil, connecting plate, liquid inlet and liquid outlet. Through threaded assembly and potting hole design, modular combination installation is achieved and water-cooling heat dissipation auxiliary components are introduced to improve heat dissipation effect.

Benefits of technology

It enables convenient modular assembly and installation before potting, and improves the heat dissipation effect of the integrated circuit packaging structure through an integrated water-cooling heat dissipation auxiliary component.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224460562U_ABST
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Abstract

This utility model relates to the field of circuit packaging technology, and in particular to an integrated circuit packaging structure, including a packaging box, a packaging cover, and a heat sink. The packaging box has a packaging cover on top, and the packaging cover has a heat sink on top. In this utility model, the packaging box, packaging cover, and heat sink are configured such that the cover is installed on the top of the box, and rubber gaskets are installed inside the ring and on the top of the cover. A locking stud is threaded inside the sleeve, and the connecting plate and the top of the cover are threaded together by the stud, so that the heat sink is inserted into the inside of the top of the cover. Circuit board potting compound is filled into the box and the cover through the potting hole, so that the bottom of the heat sink is immersed in the top surface of the circuit board potting compound. The packaging structure facilitates modular assembly before potting, and the packaging structure uses an integrated potting water-cooling heat dissipation auxiliary component to improve the heat dissipation effect of the integrated circuit packaging structure.
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