Driver chips and display modules

Abstract

This application discloses a driver chip and a display module. The driver chip includes: a chip body having a first surface; a first conductive bump array protruding from the first surface and including a plurality of first conductive bumps arranged along a first direction; and at least one second conductive bump array protruding from the first surface, each second conductive bump array including a plurality of second conductive bumps arranged along the first direction; wherein W1 / W2≥1.2, W1 is the distance between the first conductive bump array and the at least one second conductive bump array in a second direction perpendicular to the first direction, and W2 is the dimension of the at least one second conductive bump array in the second direction; the driver chip further includes at least one support bump array protruding from the first surface and located between the first conductive bump array and the at least one second conductive bump array, each support bump array including a plurality of support bumps arranged along the first direction. This application can reduce the deformation of the driver chip when it is bonded to a display panel.

Description

Technical Field

[0001] This application relates to the field of display module technology, and in particular to a driver chip and a display module. Background Technology

[0002] Automotive display modules are an indispensable part of modern automotive systems. The driver chip (IC) in the automotive display module is mainly responsible for image acquisition, processing, transmission, and display. Current automotive display modules have stringent requirements for the bonding function of the driver chip (poor bonding is considered a safety hazard). During the bonding process of the driver chip, anisotropic conductive adhesive (ACF) is used to connect the driver chip to the ITO electrodes on the glass substrate (COG (Chip On Glass) process). Due to uneven ACF overflow (accumulation) in the IC bonding area, it is easy to cause weak COG indentation (poor progressiveness). Utility Model Content

[0003] This application provides a driver chip and a display module that can improve the problem of weak COG indentation caused by uneven ACF glue overflow in the bonding area of ​​the driver chip.

[0004] In a first aspect, embodiments of this application provide a driver chip, including:

[0005] The chip body has a first surface;

[0006] A first conductive protrusion array, protruding from the first surface, includes a plurality of first conductive protrusions arranged along a first direction; and

[0007] At least one second conductive protrusion row is provided on the first surface, and each second conductive protrusion row includes a plurality of second conductive protrusions arranged along the first direction;

[0008] Wherein, W1 / W2≥1.2, W1 is the distance between the first conductive bump array and at least one second conductive bump array in a second direction perpendicular to the first direction, and W2 is the size of at least one second conductive bump array in the second direction; the driving chip further includes at least one support bump array, the at least one support bump array protruding from the first surface and located between the first conductive bump array and at least one second conductive bump array, each of the support bump arrays including a plurality of support bumps arranged along the first direction.

[0009] In some embodiments, W1 / W2 < 1.6, and the support protrusions are arranged in a row.

[0010] In some embodiments, W1 / W2≥1.6, and the support protrusions are arranged in two rows along the second direction.

[0011] In some embodiments, the plurality of support protrusions of the two rows of support protrusions are arranged alternately in the second direction.

[0012] In some embodiments, a plurality of support protrusions of at least one of the support protrusion rows are uniformly distributed between the first conductive protrusion row and at least one second conductive protrusion row;

[0013] In the same row of support protrusions, the center distance between two adjacent support protrusions is 120μm-240μm.

[0014] In some embodiments, the cross-sectional shape of the support protrusion along its protrusion direction is rhomboid.

[0015] In some embodiments, the length of the long diagonal of the rhombus is 80μm-120μm, the length of the short diagonal of the rhombus is 30μm-60μm, and the long diagonal of the rhombus extends along the second direction, while the short diagonal of the rhombus extends along the first direction.

[0016] In some embodiments, W1 ≥ 600 μm.

[0017] In some embodiments, the number of rows of the second conductive protrusions is the same as the number of rows of the first conductive protrusions, and the distance between at least one of the supporting protrusions and the first conductive protrusions along the second direction is equal to the distance between the supporting protrusions and the second conductive protrusions along the second direction; or

[0018] The number of rows of the second conductive protrusion row is greater than the number of rows of the first conductive protrusion row, and the distance between at least one of the supporting protrusion rows and the first conductive protrusion row along the second direction is less than the distance between the supporting protrusion row and the second conductive protrusion row along the second direction.

[0019] Secondly, embodiments of this application provide a display module, including:

[0020] Display panel, and

[0021] The aforementioned driver chip is connected to the first surface of the display panel via conductive adhesive.

[0022] The driver chip provided in this application provides a support protrusion between the first conductive protrusion and the second conductive protrusion when the distance (W1) between the first conductive protrusion and the second conductive protrusion in the second direction is greater than or equal to 1.2 times the size (W2) of the second conductive protrusion in the second direction. This provides support for the blank area between the first conductive protrusion and the second conductive protrusion, thereby reducing the deformation of the driver chip when it is bonded to the display panel, reducing the overflow of conductive adhesive, and thus improving the problem of weak COG indentation. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0025] Figure 1 This is a schematic diagram of a driver chip provided in an exemplary embodiment of this disclosure;

[0026] Figure 2 This is a schematic diagram of another structure of the driver chip provided in an exemplary embodiment of this disclosure;

[0027] Figure 3 This is a schematic diagram of the structure of the display module provided in an exemplary embodiment of this disclosure.

[0028] Explanation of reference numerals in the attached drawings: Chip body - 1; First conductive bump row - 2; First conductive bump - 21; Second conductive bump row - 3; Second conductive bump - 31; Support bump row - 4; Support bump - 41; Display panel - 5; Conductive adhesive - 6. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0030] Firstly, please refer to Figures 1-2 This application provides a driver chip, including:

[0031] Chip body 1 has a first surface;

[0032] A first conductive protrusion row 2, protruding from the first surface, includes a plurality of first conductive protrusions 21 arranged along a first direction A; and

[0033] At least one second conductive protrusion row 3 is provided on the first surface, and each second conductive protrusion row 3 includes a plurality of second conductive protrusions 31 arranged along the first direction A;

[0034] Wherein, W1 / W2≥1.2, W1 is the distance between the first conductive bump row 2 and at least one second conductive bump row 3 in the second direction B perpendicular to the first direction A, and W2 is the size of at least one second conductive bump row 3 in the second direction B; the driving chip also includes at least one support bump row 4, the at least one support bump row 4 protrudes from the first surface and is located between the first conductive bump row 2 and at least one second conductive bump row 3, and each of the support bump rows 4 includes a plurality of support bumps 41 arranged along the first direction A.

[0035] It is understandable that the driver chip is usually equipped with multiple input bumps and multiple output bumps, namely multiple first conductive bumps 21 and multiple second conductive bumps 31. The multiple first conductive bumps 21 and multiple second conductive bumps 31 are usually arranged opposite each other, so that there is a certain blank area between the first conductive bump row 2 and the second conductive bump row 3. When the width of the blank area (i.e., the distance W1 between the first conductive bump row 2 and the second conductive bump row 3 in the second direction B) is greater than or equal to 1.2 times the size (W2) of the second conductive bump row 3 in the second direction B, when the driver chip and the display panel 5 are connected by conductive adhesive 6, the blank area is easily deformed by pressure due to the lack of support, causing the conductive adhesive 6 to overflow from the blank area and form an accumulation, which in turn leads to the gradual weakening of the indentation.

[0036] In this application, when the width (W1) of the blank area is greater than or equal to 1.2 times the dimension (W2) of the second conductive protrusion row 3 in the second direction B, a support protrusion row 4 is provided between the first conductive protrusion row 2 and the second conductive protrusion row 3. This provides support for the blank area between the first conductive protrusion row 2 and the second conductive protrusion row 3, thereby reducing the deformation of the driver chip when it is bonded to the display panel 5, reducing the overflow of the conductive adhesive 6, and thus improving the problem of weak COG indentation.

[0037] It is understood that the first conductive protrusion row 2 and the second conductive protrusion row 3 can be parallel to each other along the first direction A, where W1 is the distance between opposite sides of the first conductive protrusion row 2 and the second conductive protrusion row 3, and W2 is the distance between opposite sides of at least one second conductive protrusion row 3 along the second direction B. The first conductive protrusion row 2 and the second conductive protrusion row 3 can also have an angle along the first direction A, where W1 is the minimum distance between opposite sides of the first conductive protrusion row 2 and the second conductive protrusion row 3, and W2 is the maximum distance between opposite sides of at least one second conductive protrusion row 3 along the second direction B.

[0038] In one embodiment, the first conductive protrusion row 2, at least one second conductive protrusion row 3, and at least one supporting protrusion row 4 are arranged parallel to each other along the second direction B.

[0039] Please see Figure 1 In some embodiments, W1 / W2 < 1.6, and the support protrusion row 4 is arranged in a row.

[0040] It is understandable that when the width (W1) of the blank area is less than 1.6 times the size (W2) of the second conductive protrusion row 3 in the second direction B, setting a row of supporting protrusion rows 4 in the blank area can effectively support the blank area, thus reducing manufacturing costs.

[0041] Please see Figure 2 In some embodiments, W1 / W2 ≥ 1.6, and the support protrusion row 4 is arranged in two rows along the second direction B.

[0042] It is understandable that when the width (W1) of the blank area is greater than or equal to 1.6 times the size (W2) of the second conductive protrusion row 3 in the second direction B, setting two rows of support protrusion rows 4 in the blank area can effectively support the blank area. In this way, the support effect can be guaranteed while controlling the manufacturing cost.

[0043] It is understandable that the width (W1) of the blank area on the driver chip is usually no more than 1.8 times the size (W2) of the second conductive bump row 3 in the second direction B.

[0044] Please see Figure 2 In some embodiments, the plurality of support protrusions of the two support protrusion rows 4 are arranged alternately in the second direction B.

[0045] It is understandable that by arranging the multiple support protrusions 41 of the two support protrusion rows 4 in a staggered manner in the second direction B, the support protrusions 41 can be distributed more evenly in the blank area, which can improve the uniformity and smoothness of glue discharge.

[0046] In some embodiments, a plurality of support protrusions 41 of at least one of the support protrusion rows 4 are evenly distributed between the first conductive protrusion row 2 and at least one second conductive protrusion row 3.

[0047] In the same row of support protrusions 4, the center distance between two adjacent support protrusions 41 is 120μm-240μm.

[0048] It is understandable that by making the support protrusions 41 evenly distributed between the first conductive protrusion row 2 and the second conductive protrusion row 3, the overall support for the blank area can be improved. By controlling the center distance H1 between two adjacent support protrusions 41, the conductive adhesive 6 can flow between the support protrusions 41 while effectively supporting the blank area, thus ensuring the fluidity of the conductive adhesive 6.

[0049] In some embodiments, the cross-sectional shape of the support protrusion 41 along its protruding direction is rhomboid.

[0050] As an example, the cross-sectional shape of the support protrusion 41 along its protruding direction can be rectangular, square, circular, elliptical, rhomboid, etc.

[0051] It is understandable that by setting the cross-sectional shape of the support protrusion 41 along its protruding direction to a rhombus, a streamlined structure can be created, which facilitates the flow of conductive adhesive 6 between the support protrusions 41 and also facilitates the processing of the support protrusions 41.

[0052] In some embodiments, the length H2 of the long diagonal of the rhombus is 80μm-120μm, the length H3 of the short diagonal of the rhombus is 30μm-60μm, and the long diagonal of the rhombus extends along the second direction B, while the short diagonal of the rhombus extends along the first direction A.

[0053] It is understandable that by controlling the length of the long diagonal and the short diagonal of the rhombus, the support protrusion 41 can effectively support the blank area, while facilitating the flow of conductive adhesive 6 between the support protrusions 41.

[0054] In some embodiments, the cross-sectional area of ​​the first conductive protrusion 21 along its protrusion direction is greater than the cross-sectional area of ​​the second conductive protrusion 22 along its protrusion direction.

[0055] In some embodiments, the first conductive protrusion 21 has a rectangular cross-sectional shape along its protrusion direction. The length of the rectangle extends along the second direction B, the width of the rectangle extends along the first direction A, the length of the long diagonal of the rhombus is equal to the length of the rectangle, and the length of the short diagonal of the rhombus is equal to the width of the rectangle. This improves the flowability of the conductive adhesive 6 between the first conductive protrusion 21 and the supporting protrusion 41.

[0056] In some embodiments, W1 ≥ 600 μm.

[0057] It is understandable that when the width of the blank area (i.e., the distance W1 between the first conductive protrusion row 2 and the second conductive protrusion row 3 in the second direction B) is ≥600μm, the blank area is easily deformed by pressure when the driver chip and the display panel 5 are connected by the conductive adhesive 6, causing the conductive adhesive 6 to overflow from the blank area and form an accumulation, which in turn leads to the gradual weakening of the indentation.

[0058] In some embodiments, the number of rows of the second conductive protrusion row 3 is the same as the number of rows of the first conductive protrusion row 1, and the distance H4 between at least one of the supporting protrusion rows 4 and the first conductive protrusion row 2 along the second direction B is equal to the distance H5 between the supporting protrusion row 4 and the second conductive protrusion row 3 along the second direction B.

[0059] It can be understood that by making the distance between the supporting protrusion row 4 and the first conductive protrusion row 2 along the second direction B equal to the distance between the supporting protrusion row 4 and the second conductive protrusion row 3 along the second direction B, even if the supporting protrusion row 4 is located in the middle of the first conductive protrusion row 2 and the second conductive protrusion row 3, the supporting effect of the supporting protrusion row 4 can be improved.

[0060] In some embodiments, the number of rows of the second conductive protrusion row 3 is greater than the number of rows of the first conductive protrusion row 1, and the distance H4 between at least one of the supporting protrusion rows 4 and the first conductive protrusion row 2 along the second direction B is less than the distance H5 between the supporting protrusion row 4 and the second conductive protrusion row 3 along the second direction B.

[0061] It is understandable that since the second conductive protrusion row 3 has more rows than the first conductive protrusion row 1, the second conductive protrusion row 3 has a greater number of wires. By making the distance between the supporting protrusion row 4 and the first conductive protrusion row 2 along the second direction B smaller than the distance between the supporting protrusion row 4 and the second conductive protrusion row 3 along the second direction B, even if the supporting protrusion row 4 is closer to the first conductive protrusion row 2, it is easier to arrange the wires of the second conductive protrusion row 3. The first conductive protrusion row 2 can also be provided with multiple rows, such as 2 rows, 3 rows, etc.

[0062] It is understandable that when the support protrusions are arranged in a row of 4, such as Figure 1 As shown, the distance between the supporting protrusion row 4 and the first conductive protrusion row 2 along the second direction B is the distance between their opposite sides. Similarly, the distance between the supporting protrusion row 4 and the second conductive protrusion row 3 along the second direction B is the distance between their opposite sides. When at least two rows of supporting protrusion rows 4 are provided, such as... Figure 2 As shown, at least two support protrusion rows 4 are considered as a whole. The distance between the at least two support protrusion rows 4 and the first conductive protrusion row 2 along the second direction B is the distance between the two sides of the first conductive protrusion row 2 opposite to it. The distance between the at least two support protrusion rows 4 and the second conductive protrusion row 3 along the second direction B is the distance between the two sides of the second conductive protrusion row 3 opposite to it.

[0063] In some embodiments, the first conductive protrusion 21, the second conductive protrusion 31, and the supporting protrusion 41 have the same protrusion height.

[0064] Secondly, please refer to Figure 3 This application provides a display module, including:

[0065] Display panel 5, and

[0066] The aforementioned driving chip is connected to the first surface of the display panel 5 via conductive adhesive 6.

[0067] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0068] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0069] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0070] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A driving chip, characterized in that, include: The chip body has a first surface; The first conductive protrusion row is provided on the first surface and includes a plurality of first conductive protrusions arranged along the first direction; as well as At least one second conductive protrusion row is provided on the first surface, and each second conductive protrusion row includes a plurality of second conductive protrusions arranged along the first direction; Wherein, W1 / W2≥1.2, W1 is the distance between the first conductive bump array and at least one second conductive bump array in a second direction perpendicular to the first direction, and W2 is the size of at least one second conductive bump array in the second direction; the driving chip further includes at least one support bump array, the at least one support bump array protrudes from the first surface and is located between the first conductive bump array and at least one second conductive bump array, and each of the support bump arrays includes a plurality of support bumps arranged along the first direction.

2. The driving chip according to claim 1, wherein, If W1 / W2 < 1.6, then a row of support protrusions is provided.

3. The driving chip according to claim 1, wherein, W1 / W2≥1.6, and the support protrusions are arranged in two rows along the second direction.

4. The driving chip according to claim 3, wherein the first and second driving signals are generated by the driving chip. The plurality of support protrusions in the two rows of support protrusions are arranged in an alternating manner in the second direction.

5. The driver chip as described in claim 1, characterized in that, The plurality of support protrusions of at least one of the support protrusion rows are evenly distributed between the first conductive protrusion row and at least one second conductive protrusion row; In the same row of support protrusions, the center distance between two adjacent support protrusions is 120μm-240μm.

6. The driving chip according to claim 1, wherein, The cross-sectional shape of the support protrusion along its protruding direction is rhomboid.

7. The driving chip according to claim 6, wherein the driving chip is configured to perform the driving of the display panel in the driving mode selected from the plurality of driving modes. The length of the long diagonal of the rhombus is 80μm-120μm, the length of the short diagonal of the rhombus is 30μm-60μm, and the long diagonal of the rhombus extends along the second direction, while the short diagonal of the rhombus extends along the first direction.

8. The driving chip according to claim 1, wherein, W1≥600μm.

9. The driving chip according to claim 1, wherein, The number of rows of the second conductive protrusion is the same as the number of rows of the first conductive protrusion, and the distance between at least one of the supporting protrusions and the first conductive protrusion along the second direction is equal to the distance between the supporting protrusion and the second conductive protrusion along the second direction; or The number of rows of the second conductive protrusion row is greater than the number of rows of the first conductive protrusion row, and the distance between at least one of the supporting protrusion rows and the first conductive protrusion row along the second direction is less than the distance between the supporting protrusion row and the second conductive protrusion row along the second direction.

10. A display module, characterized by include: Display panel, and The driver chip according to any one of claims 1-9, wherein the first surface of the driver chip is connected to the display panel by conductive adhesive.

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