A packaging module

Abstract

This application relates to the semiconductor field and discloses a packaging module, including: a circuit board, a first power transistor, a second power transistor, a heat dissipation structure, and an insulating thermally conductive structure; the first power transistor and the second power transistor are both fixed on the same side of the circuit board; the first power transistor includes a first heat exchange surface facing away from the circuit board, and the second power transistor includes a second heat exchange surface facing away from the circuit board; the distance between the first heat exchange surface and the circuit board is different from the distance between the second heat exchange surface and the circuit board; the heat dissipation structure includes a first thermally conductive surface and a second thermally conductive surface, the first thermally conductive surface is connected to the first heat exchange surface through an insulating thermally conductive structure, and the second thermally conductive surface is connected to the second heat exchange surface through another insulating thermally conductive structure. The packaging module provided by this application solves the problem of simultaneously dissipating heat from two types of power transistors with different packaging forms in the same power electronic topology by using a single heat dissipation structure.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a packaging module. Background Technology

[0002] Hybrid packaging refers to the combination of through-hole packages and top-side cooling for common power switching transistors. Power switching transistors include various diodes, thyristors (SCRs), insulated-gate bipolar transistors (IGBTs), and metal-oxide-semiconductor field-effect transistors (MOSFETs). Common through-hole packages include TO-220 and TO-247. Because these two types of packages differ in form, height, size, circuit board soldering methods, and mounting methods, yet are used interchangeably in power electronic topologies, there is a conflict in the heat dissipation methods of the two packages for the overall package module. Utility Model Content

[0003] This application discloses a packaging module for solving the problem of heat dissipation of power transistors with different packaging forms in the same power electronic topology.

[0004] To achieve the above objectives, this application provides the following technical solution:

[0005] A packaging module includes: a circuit board, a first power transistor, a second power transistor, a heat dissipation structure, and an insulating and thermally conductive structure;

[0006] The first power transistor and the second power transistor are both fixed on the same side of the circuit board; the first power transistor includes a first heat exchange surface facing away from the circuit board, and the second power transistor includes a second heat exchange surface facing away from the circuit board; the distance between the first heat exchange surface and the circuit board is different from the distance between the second heat exchange surface and the circuit board.

[0007] The heat dissipation structure includes a first heat-conducting surface and a second heat-conducting surface. The first heat-conducting surface is connected to the first heat exchange surface through one of the insulating heat-conducting structures, and the second heat-conducting surface is connected to the second heat exchange surface through another insulating heat-conducting structure.

[0008] The packaging module provided in this application includes two power transistors, namely a first power transistor and a second power transistor, fixed on the same side of a circuit board. It also includes a heat dissipation structure for simultaneously cooling both power transistors. To ensure heat transfer efficiency and insulation protection, the heat dissipation structure and the power transistors are connected via an insulating thermally conductive structure. Specifically, the first power transistor includes a first heat exchange surface located on the side of the first power transistor facing away from the circuit board; the second power transistor includes a second heat exchange surface located on the side of the second power transistor facing away from the circuit board. Due to the different packaging forms of the first and second power transistors, the distance between the first heat exchange surface and the circuit board is different from the distance between the second heat exchange surface and the circuit board, i.e., the packaging height of the first heat exchange surface is different from the packaging height of the second heat exchange surface. The heat dissipation structure includes a first thermally conductive surface and a second thermally conductive surface; the first thermally conductive surface and the first heat exchange surface are insulated and thermally conductively connected via an insulating thermally conductive structure, and the second thermally conductive surface and the second heat exchange surface are insulated and thermally conductively connected via another insulating thermally conductive structure. The packaging module provided in this application solves the problem of simultaneously cooling power transistors with different packaging forms in the same power electronic topology by using a single heat dissipation structure to cool both power transistors.

[0009] In some embodiments, the insulating thermally conductive structure includes a first thermally conductive element, an insulating thermally conductive element, and a second thermally conductive element. The first thermally conductive element is used to fill the gap between the insulating thermally conductive element and the heat dissipation structure, and the second thermally conductive element is used to fill the gap between the insulating thermally conductive element and the power transistor. The power transistor includes the first power transistor and the second power transistor.

[0010] In some embodiments, the first heat-conducting element, the insulating heat-conducting element, and the second heat-conducting element are an integral structure;

[0011] The first heat-conducting component is fixedly connected to the heat dissipation structure; the second heat-conducting component is fixedly connected to the power transistor.

[0012] In some embodiments, the heat dissipation structure includes a heat dissipation body and a heat-conducting boss;

[0013] The thermally conductive boss includes a first thermally conductive surface, a second thermally conductive surface, and a third thermally conductive surface; along the thickness direction of the circuit board, the first thermally conductive surface is located between the second thermally conductive surface and the third thermally conductive surface;

[0014] The heat dissipation body is thermally connected to the third heat-conducting surface.

[0015] In some embodiments, the heat dissipation body includes a liquid cooling plate or an air-cooled radiator.

[0016] In some embodiments, the heat dissipation body and the heat-conducting protrusion are an integral structure.

[0017] In some embodiments, the packaging module further includes a fixing plate and a buffer pad, wherein the fixing plate is disposed on the side of the circuit board away from the heat dissipation structure;

[0018] The buffer pad is disposed between the circuit board and the fixing plate, and one buffer pad is disposed for each of the first power transistor and the second power transistor.

[0019] In some embodiments, the cushioning pad is an insulating thermally conductive pad.

[0020] In some embodiments, a heat-conducting plate is provided between the heat dissipation structure and the fixing plate.

[0021] In some embodiments, the fixing plate is fixed to the heat dissipation structure by a first fixing member; the first fixing member passes through the circuit board. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a packaging module provided in an embodiment of this application;

[0023] Figure 2 This is a schematic diagram of another packaging module provided in an embodiment of this application;

[0024] Figure 3 This is a schematic diagram of another packaging module provided in an embodiment of this application;

[0025] Figure 4 This is a schematic diagram of another packaging module provided in an embodiment of this application;

[0026] Figure 5 This is a schematic diagram of another packaging module provided in an embodiment of this application;

[0027] Figure 6 for Figure 5 A schematic diagram of the insulating and thermally conductive structure in the packaging module;

[0028] Icons: 1-Circuit board; 2-First power transistor; 3-Second power transistor; 4-Heat dissipation structure; 5-Insulating thermally conductive structure; 6-Fixing plate; 7-Buffer pad; 8-Heat conductive plate; 11-First surface; 12-Second surface; 21-First heat exchange surface; 22-Bottom support; 31-Second heat exchange surface; 41-Heat dissipation body; 42-Heat conductive boss; 43-Third heat conductive component; 421-First heat conductive surface; 422-Second heat conductive surface; 423-Third heat conductive surface; 411-Liquid cooling plate; 412-Air-cooled radiator; 51-First heat conductive component; 52-Insulating thermally conductive component; 53-Second heat conductive component; 71-Insulating thermally conductive pad; 81-Fourth heat conductive component; 91-First fixing component; 92-Second fixing component; 93-Third fixing component; 911-Buffer column; 4111-Cooling channel. Detailed Implementation

[0029] First, let me introduce the application scenario of this application: Typically, through-hole packaged power transistors are vertically inserted into the circuit board (PCB) and soldered; while surface-mount top-heat-dissipating packaged power transistors are surface-mount packages, with their pins soldered onto the circuit board. When these two different types of power transistors are used together, there are many challenges in coordinating heat dissipation.

[0030] Based on the above application scenarios, this application provides a packaging module to solve the common mixed heat dissipation problem when through-hole packaging and top heat dissipation packaging are used together.

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application. In the description of the embodiments of this application, unless otherwise stated, " / " means "or", for example, A / B can mean A or B; "and / or" in the text is only a description of the relationship between related objects, indicating that there can be three relationships, for example, A and / or B can represent: A alone, A and B at the same time, and B alone. In addition, in the description of the embodiments of this application, "multiple" means two or more.

[0032] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature, and in the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0033] like Figure 1 As shown, this application embodiment provides a packaging module, including: a circuit board 1, a first power transistor 2, a second power transistor 3, a heat dissipation structure 4, and an insulating and thermally conductive structure 5;

[0034] The first power transistor 2 and the second power transistor 3 are both fixed on the same side of the circuit board 1; the first power transistor 2 includes a first heat exchange surface 21 facing away from the circuit board 1, and the second power transistor 3 includes a second heat exchange surface 31 facing away from the circuit board 1; the distance between the first heat exchange surface 21 and the circuit board 1 is different from the distance between the second heat exchange surface 31 and the circuit board 1.

[0035] The heat dissipation structure 4 includes a first heat-conducting surface 421 and a second heat-conducting surface 422. The first heat-conducting surface 421 is connected to the first heat exchange surface 21 through an insulating heat-conducting structure 5, and the second heat-conducting surface 422 is connected to the second heat exchange surface 31 through another insulating heat-conducting structure 5.

[0036] The packaging module provided in this application embodiment includes two power transistors, namely a first power transistor 2 and a second power transistor 3, fixed on the same side of the circuit board 1, and also includes a heat dissipation structure 4 for simultaneously dissipating heat from both power transistors. To ensure heat transfer efficiency and insulation protection, the heat dissipation structure 4 and the power transistors are connected by an insulating thermally conductive structure 5. Specifically, the first power transistor 2 includes a first heat exchange surface 21, which is located on the side of the first power transistor 2 away from the circuit board 1; the second power transistor 3 includes a second heat exchange surface 31, which is located on the side of the second power transistor 3 away from the circuit board 1. Because the packaging forms of the first power transistor 2 and the second power transistor 3 are different, the distance between the first heat exchange surface 21 and the circuit board 1 is different from the distance between the second heat exchange surface 31 and the circuit board 1, that is, the packaging height of the first heat exchange surface 21 and the packaging height of the second heat exchange surface 31 are different. The heat dissipation structure 4 includes a first heat-conducting surface 421 and a second heat-conducting surface 422. The first heat-conducting surface 421 is insulated and thermally connected to the first heat exchange surface 21 through an insulating heat-conducting structure 5, and the second heat-conducting surface 422 is insulated and thermally connected to the second heat exchange surface 31 through another insulating heat-conducting structure 5. The packaging module provided in this application embodiment dissipates heat for two types of power transistors simultaneously through a heat dissipation structure 4, solving the problem of simultaneous heat dissipation for power transistors with different packaging forms in the same power electronic topology.

[0037] In one embodiment, such as Figure 1 As shown, circuit board 1 includes a first surface 11 and a second surface 12 facing each other. A first power transistor 2 uses a through-hole package and is supported on circuit board 1 by a base 22. The leads of the first power transistor 2 penetrate circuit board 1 along the direction from the first surface 11 to the second surface 12 and are soldered to circuit board 1. A second power transistor 3 uses a surface-mount package, with its leads being surface-mount and soldered to the first surface 11. Both the first power transistor 2 and the second power transistor 3 employ top heat dissipation. Specifically, the side of the first power transistor 2 facing away from the first surface 11 has an externally heat-conducting charged metal, the top surface of which is the first heat exchange surface 21; the side of the second power transistor 3 facing away from the first surface 11 also has an externally heat-conducting charged metal, the top surface of which is the second heat exchange surface 31. Here, the top surface can be understood as the surface of the power transistor away from the first surface 11.

[0038] Because the first power transistor 2 and the second power transistor 3 have different packaging forms, the height of the first heat exchange surface 21 is different from the height of the second heat exchange surface 31. The height of the first heat exchange surface 21 can also be understood as the distance between the first heat exchange surface 21 and the first surface 11. Similarly, the height of the second heat exchange surface 31 can also be understood as the distance between the second heat exchange surface 31 and the first surface 11.

[0039] The packaging module provided in this application embodiment uses both through-hole and surface-mount power transistors and dissipates heat for both types of power transistors through a heat dissipation structure 4. Since the height of the first heat exchange surface 21 is different from the height of the second heat exchange surface 31, the heat dissipation structure 4 also has a first heat-conducting surface 421 and a second heat-conducting surface 422 with different heights. Furthermore, since both the first heat exchange surface 21 and the second heat exchange surface 31 are charged metal surfaces, an insulating heat-conducting structure 5 is provided between the first heat-conducting surface 421 and the first heat exchange surface 21 and connected thereto, and an insulating heat-conducting structure 5 is also provided between the second heat-conducting surface 422 and the second heat exchange surface 31 and connected thereto.

[0040] For example, the first power transistor 2 and the second power transistor 3 are switching transistors.

[0041] In one embodiment, the heat dissipation structure 4 is fixed to the circuit board 1. For example, the heat dissipation structure 4 is directly connected to and fixed relative to the circuit board 1; or, the heat dissipation structure 4 is fixed to the circuit board 1 by other structures.

[0042] Understandably, when the number of power transistors in the package module is large, the area of ​​circuit board 1 is large. A large circuit board 1, even without heating, can exhibit bending issues. Furthermore, when the current flowing through the power transistors is large, the resulting heat generation on circuit board 1 can also cause bending. Bending of circuit board 1 can further lead to poor connections or gaps between the power transistors and the heat dissipation structure 4. In severe cases, poor thermal conductivity between the power transistors and the heat dissipation structure 4 can cause thermal damage to the power transistors.

[0043] Based on this, such as Figure 1 As shown, the packaging module provided in this application embodiment also includes a fixing plate 6 and a buffer pad 7. The fixing plate 6 is disposed on the side of the circuit board 1 away from the heat dissipation structure 4; the buffer pad 7 is disposed between the circuit board 1 and the fixing plate 6, and the first power transistor 2 and the second power transistor 3 are respectively provided with a buffer pad 7.

[0044] like Figure 1As shown, the fixing plate 6 and the heat dissipation structure 4 sandwich the circuit board 1 in the middle, forming a "sandwich" structure to prevent the large area of ​​the circuit board 1 from bending. The fixing plate 6 provides support and fixation, ensuring the stability of the entire packaging module. A buffer pad 7 is disposed between the circuit board 1 and the fixing plate 6, with one buffer pad 7 corresponding to each of the first power transistor 2 and the second power transistor 3. The buffer pad 7 is used to absorb vibration and impact, protecting the power transistors and the circuit board 1 from mechanical stress. For example, the heat dissipation structure 4 above the power transistors is a rigid structure, while the power transistors and the circuit board 1 are relatively soft and can undergo slight deformation. The buffer pad 7 can absorb the mechanical stress between the heat dissipation structure 4 and the power transistors.

[0045] In one embodiment, when there are a large number of power transistors on the circuit board 1, the circuit board 1 itself will be slightly bent, and the flatness of the contact surface between each power transistor and the heat dissipation structure 4 is inconsistent. The buffer pad 7 presses each power transistor against the heat dissipation structure 4 through the rigid fixing plate 6 to ensure reliable contact between each power transistor and the heat dissipation structure 4.

[0046] In addition, when the heat dissipation structure 4 is directly connected to the circuit board 1, due to the material of the circuit board 1, the crimping screws cannot be tightened with a large force like metal plates. Excessive force in fixing the circuit board 1 may cause the circuit board 1 to bend or even break.

[0047] In some embodiments, such as Figure 1 As shown, the fixing plate 6 is fixed to the heat dissipation structure 4 by the first fixing member 91; the first fixing member 91 penetrates the circuit board 1. The first fixing member 91 penetrates the circuit board 1, tightly connecting the fixing plate 6, the circuit board 1, and the heat dissipation structure 4 together. In this way, the structure of the entire packaging module is more stable, and the relative positions between the components are effectively fixed.

[0048] The design of the first fixing member 91 penetrating the circuit board 1 only requires a through hole on the circuit board 1, which simplifies the assembly process and reduces production complexity and cost. Furthermore, the design of the first fixing member 91 penetrating the circuit board 1 also provides some support and protection for the circuit board 1, preventing it from being affected by external pressure.

[0049] In one embodiment, the fixing plate 6 is a metal plate, such as an aluminum plate or an aluminum alloy plate.

[0050] In some embodiments, such as Figure 2 As shown, the buffer pad 7 is an insulating thermally conductive pad 71. The insulating thermally conductive pad 71 not only has good thermal conductivity but also provides electrical insulation. While absorbing vibration and shock, the insulating thermally conductive pad 71 can also effectively conduct heat from the circuit board 1 to the fixing plate 6.

[0051] In some embodiments, such as Figure 2As shown, a heat-conducting plate 8 is disposed between the heat dissipation structure 4 and the fixing plate 6. The heat-conducting plate 8 acts as a bridge for heat conduction, ensuring more efficient heat transfer from the fixing plate 6 to the heat dissipation structure 4. By placing the heat-conducting plate 8 between the heat dissipation structure 4 and the fixing plate 6, the thermal management performance of the entire packaging module can be further optimized. In addition, the heat-conducting plate 8 also provides a certain mechanical support, protecting the circuit board 1 from the influence of external pressure and improving the mechanical stability of the entire packaging module.

[0052] In one embodiment, such as Figure 2 As shown, one end of the heat-conducting plate 8 is connected to the fixing plate 6, and the other end is connected to the heat dissipation structure 4 via a third fixing member 93. The heat-conducting plate 8 is a metal plate, such as an aluminum plate or an aluminum alloy plate. A fourth heat-conducting element 81 is provided between the heat-conducting plate 8 and the heat dissipation structure 4 to fill the gap between them, reduce thermal resistance, and improve heat transfer efficiency. For example, the fourth heat-conducting element 81 is thermal grease or thermal gel.

[0053] In another embodiment, the heat-conducting plate 8 and the fixing plate 6 are an integral structure.

[0054] In some embodiments, such as Figure 1 and Figure 2 As shown, the heat dissipation structure 4 includes a heat dissipation body 41 and a heat-conducting protrusion 42;

[0055] The heat-conducting boss 42 includes a first heat-conducting surface 421, a second heat-conducting surface 422, and a third heat-conducting surface 423; along the thickness direction of the circuit board 1, the first heat-conducting surface 421 is located between the second heat-conducting surface 422 and the third heat-conducting surface 423.

[0056] The heat sink 41 is thermally connected to the third thermally conductive surface 423.

[0057] In one embodiment, such as Figure 1 As shown, the heat dissipation structure 4 includes a heat dissipation body 41 and a heat-conducting protrusion 42; the heat-conducting protrusion 42 includes a first heat-conducting surface 421, a second heat-conducting surface 422, and a third heat-conducting surface 423. The heat-conducting protrusion 42 is insulated and thermally connected to the first heat exchange surface 21 through the first heat-conducting surface 421, and is also insulated and thermally connected to the second heat exchange surface 31 through the second heat-conducting surface 422, and finally transfers heat to the heat dissipation body 41 through the third heat-conducting surface 423.

[0058] The first heat-conducting surface 421 is located between the second heat-conducting surface 422 and the third heat-conducting surface 423. This layout can better adapt to heat exchange surfaces of different heights, ensuring efficient heat conduction. Since the first power transistor 2 and the second power transistor 3 have different package heights, this design can better adapt to these differences, ensuring efficient heat dissipation even under different package forms.

[0059] The heat sink 41 has various options, for example, in some embodiments of this application, such as Figure 1 and Figure 2 As shown, the heat dissipation body 41 includes a liquid cooling plate 411. Alternatively, in some other embodiments of this application, such as Figure 3 and Figure 4 As shown, the heat dissipation body 41 includes an air-cooled heat sink 412.

[0060] In the case where the heat dissipation body 41 in the heat dissipation structure 4 is a liquid cooling plate 411, such as Figure 1 and Figure 2 As shown, the liquid cooling plate 411 has a cooling channel 4111 inside for containing coolant.

[0061] Due to its thinness and dense cooling channels, the liquid cooling plate 411 suffers from reduced heat dissipation if too many mounting holes are designed on it. This is because the traditional method for the first power transistor 2 involves directly pressing it onto the liquid cooling plate 411 with screws through the holes in the middle of the transistor. Pressing it onto the liquid cooling plate 411 with screws would directly damage the water channels, making it impossible to design cooling channels 4111 for direct heat dissipation in the area directly opposite the first heat exchange surface 21 of the first power transistor 2. Similarly, the second power transistor 3 also faces the problem of excessive drilling damaging the design of the cooling channels 4111, thus affecting its heat dissipation performance.

[0062] In the packaging module provided in this application embodiment, the first fixing member 91 sequentially passes through the fixing plate 6 and the circuit board 1 and is connected to the heat-conducting boss 42. A buffer post 911 is also sleeved between the heat-conducting boss 42 and the circuit board 1 in the first fixing member 91, providing support for the circuit board 1 and buffering vibrations experienced by the circuit board 1. For example, the buffer post 911 is a plastic post. The second fixing member 92 passes through the liquid cooling plate 411 and is connected to the heat-conducting boss 42. The first fixing member 91 and the second fixing member 92 assemble the liquid cooling plate 411, the heat-conducting boss 42, the circuit board 1, and the fixing plate 6 into an integral structure, thereby securing the first power transistor 2 and the second power transistor 3 to the heat-conducting boss 42. Figure 2 As shown, the third fixing member 93 penetrates the liquid cooling plate 411 and connects to the heat-conducting plate 8 to fix the heat-conducting plate 8.

[0063] In the case where the heat dissipation body 41 in the heat dissipation structure 4 is an air-cooled heat sink 412, such as Figure 3 As shown, the air-cooled radiator 412 includes a heat sink and heat dissipation fins. A first fixing member 91 passes through the fixing plate 6 and the circuit board 1 sequentially and is connected to the heat-conducting protrusion 42. A second fixing member 92 passes through the heat sink of the air-cooled radiator 412 and is connected to the heat-conducting protrusion 42. The first fixing member 91 and the second fixing member 92 assemble the air-cooled radiator 412, the heat-conducting protrusion 42, the circuit board 1, and the fixing plate 6 into an integral structure.

[0064] like Figures 1-4 As shown, a third thermal conductive element 43 is provided between the heat dissipation body 41 and the thermal conductive protrusion 42 to fill the gap between the heat dissipation body 41 and the thermal conductive protrusion 42, thereby reducing thermal resistance. For example, the third thermal conductive element 43 may be thermal grease or thermal gel, etc.

[0065] In some embodiments, such as Figure 4 As shown, the heat sink 41 and the thermally conductive protrusion 42 are an integrated structure. Designing the heat sink 41 and the thermally conductive protrusion 42 as a single unit reduces connection issues between components, thereby simplifying the assembly process and reducing production complexity and cost. The integrated structure of the heat sink 41 and the thermally conductive protrusion 42 reduces relative movement and potential poor contact between them, thus improving the reliability of the entire system. Furthermore, the reduced connection interfaces between components decrease thermal resistance, thereby enhancing overall thermal conductivity. This integrated design allows for more efficient heat dissipation within a limited space, making the entire packaging module more compact.

[0066] In some embodiments, such as Figures 1-4 As shown, the insulating and heat-conducting structure 5 includes a first heat-conducting element 51, an insulating and heat-conducting element 52, and a second heat-conducting element 53. The first heat-conducting element 51 is used to fill the gap between the insulating and heat-conducting element 52 and the heat dissipation structure 4, and the second heat-conducting element 53 is used to fill the gap between the insulating and heat-conducting element 52 and the power tube. The power tube includes a first power tube 2 and a second power tube 3.

[0067] like Figure 4 As shown, an insulating thermally conductive structure 5 is provided between the first thermally conductive surface 421 and the first heat exchange surface 21 and / or between the second thermally conductive surface 422 and the second heat exchange surface 31. This design ensures good thermal conductivity while maintaining electrical insulation. The insulating thermally conductive structure 5 includes a first thermally conductive element 51, an insulating thermally conductive element 52, and a second thermally conductive element 53. The first thermally conductive element 51 is used to fill the gap between the insulating thermally conductive element 52 and the heat dissipation structure 4, increasing the contact area and enhancing thermal conductivity. The second thermally conductive element 53 is used to fill the gap between the insulating thermally conductive element 52 and the first power transistor 2 and / or the second power transistor 3, similarly increasing the contact area and thermal conductivity. For example, the first thermally conductive element 51 is thermally conductive grease or thermally conductive gel, the insulating thermally conductive element 52 is ceramic, and the second thermally conductive element 53 is thermally conductive grease or thermally conductive gel. The first thermally conductive element 51 and the second thermally conductive element 53 can be the same material or different materials.

[0068] By filling the gaps using the first thermally conductive element 51 and the second thermally conductive element 53, thermal resistance can be significantly reduced, thereby improving the overall thermal conductivity. The presence of the insulating thermally conductive element 52 ensures electrical insulation between the heat dissipation structure 4 and the power transistors, preventing potential short circuits and improving system reliability. Since the first power transistor 2 and the second power transistor 3 have different package heights, this multi-layer insulating thermally conductive structure 5 can better accommodate these differences, ensuring efficient heat dissipation even under different package configurations.

[0069] In one embodiment, there are multiple first power transistors 2. Among the two insulating heat-conducting structures 5 corresponding to two adjacent first power transistors 2, the two first heat-conducting elements 51 are an integral structure, and the two insulating heat-conducting elements 52 are an integral structure.

[0070] In another embodiment, there are multiple first power transistors 3, and in the two insulating heat-conducting structures 5 corresponding to two adjacent second power transistors 3, the two first heat-conducting elements 51 are an integral structure, and the two insulating heat-conducting elements 52 are an integral structure.

[0071] In some embodiments, such as Figure 5 and Figure 6 As shown, the first heat-conducting component 51, the insulating heat-conducting component 52, and the second heat-conducting component 53 are an integral structure; the first heat-conducting component 51 is fixedly connected to the heat dissipation structure 4; the second heat-conducting component 53 is fixedly connected to the first power transistor 2 and / or the second power transistor 3.

[0072] like Figure 6 As shown, the first heat-conducting component 51, the insulating heat-conducting component 52, and the second heat-conducting component 53 are a single integrated structure. This design simplifies the assembly process and reduces connection problems between components. Figure 5 As shown, the first heat-conducting component 51 is fixedly connected to the heat dissipation structure 4, ensuring a stable connection between the heat dissipation structure 4 and the insulating heat-conducting component 52. The second heat-conducting component 53 is fixedly connected to the first power transistor 2 and / or the second power transistor 3, ensuring a stable connection between the power transistor and the insulating heat-conducting component 52. This fixed connection method ensures close contact between the various components, reduces thermal resistance, and thus enhances the overall thermal conductivity.

[0073] For example, the insulating and thermally conductive structure 5 is a copper-clad ceramic substrate. The copper-clad ceramic substrate is welded together with the thermally conductive boss 42 and the charged metal of the power transistor.

[0074] There are several options for copper-clad ceramic substrates. For example, copper can be directly bonded to the ceramic substrate using a high-temperature, high-pressure process (DCB). Alternatively, copper foil can be connected to the ceramic substrate using active metal brazing (AMB).

[0075] The following combination Figures 1-5 The design concept of the packaging module provided in this application is explained in detail.

[0076] With the first heat exchange surface 21 of the first power transistor 2 facing upwards, it is bent 90° along its pins and vertically soldered onto the first surface 11 of the circuit board 1, designing the first power transistor 2 as a top-heat-dissipating type. The second power transistor 3 is then soldered to the first power transistor 2 on the first surface 11 of the circuit board 1 in a normal layout. Stepped heat-conducting bosses 42 are designed for the first power transistor 2 and the second power transistor 3. The bosses are made of metal, typically aluminum alloy. The circuit board 1 and the power transistors are pressed onto the heat sink 41, such as a liquid cooling plate 411 or a finned heat sink, using screws on the bottom layer of the circuit board 1. Thermal grease is applied between the first heat exchange surface 21 and the second heat exchange surface 31 and the heat-conducting bosses 42, and a ceramic substrate is placed there. Alternatively, a copper-clad ceramic substrate can be used between the power transistor and the heat-conducting bosses 42 to weld the power transistor and the heat-conducting bosses 42 into one piece, further increasing the heat conduction efficiency.

[0077] When there are many power transistors and the circuit board 1 has a large area, an insulating buffer pad 7 is placed on the bottom layer of the circuit board 1, and a buffer pad 7 is placed directly below each power transistor. Below the buffer pad 7 is an aluminum alloy fixing plate 6. The aluminum alloy fixing plate 6 is screwed to the top heat-conducting boss 42. The purpose is to prevent the circuit board 1 with a large area from bending, which may cause some power transistors to have poor contact with the heat-conducting boss 42 or gaps.

[0078] Especially in the case of liquid cooling heat dissipation design, when the liquid cooling plate 411 is very thin, the above-mentioned thermal management scheme can fix the power transistors of the two packages onto the liquid cooling plate 411. Since the top thermally conductive protrusion 42 and the bottom fixing plate 6 are both metal plates, the thermally conductive protrusion 42 and the fixing plate 6 clamp the circuit board 1 in the middle, thereby securing the power transistors on the circuit board 1 so that they fit tightly against the thermally conductive protrusion 42. The design method of this application is stable, reliable and has high heat dissipation efficiency.

[0079] Furthermore, the circuit board 1 is pressed together by the upper and lower metal structural components, namely the heat-conducting boss 42 and the fixing plate 6, to form a whole, which can reduce the number of screws on the liquid cooling plate 411 or the air-cooled heat sink 412. In particular, the fewer screws on the liquid cooling plate 411 can reduce the impact on the cooling channel 4111 when the liquid cooling plate 411 dissipates heat.

[0080] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this application without departing from the spirit and scope of this application. Therefore, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application also intends to include these modifications and variations.

Claims

1. A packaging module, characterized by include: Circuit board, first power transistor, second power transistor, heat dissipation structure and insulating heat-conducting structure; The first power transistor and the second power transistor are both fixed on the same side of the circuit board; the first power transistor includes a first heat exchange surface facing away from the circuit board, and the second power transistor includes a second heat exchange surface facing away from the circuit board; the distance between the first heat exchange surface and the circuit board is different from the distance between the second heat exchange surface and the circuit board. The heat dissipation structure includes a first heat-conducting surface and a second heat-conducting surface. The first heat-conducting surface is connected to the first heat exchange surface through one of the insulating heat-conducting structures, and the second heat-conducting surface is connected to the second heat exchange surface through another insulating heat-conducting structure.

2. The package module of claim 1, wherein The insulating and heat-conducting structure includes a first heat-conducting element, an insulating heat-conducting element, and a second heat-conducting element. The first heat-conducting element is used to fill the gap between the insulating heat-conducting element and the heat dissipation structure, and the second heat-conducting element is used to fill the gap between the insulating heat-conducting element and the power transistor. The power transistor includes the first power transistor and the second power transistor.

3. The package module of claim 2, wherein The first heat-conducting component, the insulating heat-conducting component, and the second heat-conducting component are an integral structure; The first heat-conducting component is fixedly connected to the heat dissipation structure; the second heat-conducting component is fixedly connected to the power transistor.

4. The package module of claim 1, wherein The heat dissipation structure includes a heat dissipation body and a heat-conducting boss. The thermally conductive boss includes a first thermally conductive surface, a second thermally conductive surface, and a third thermally conductive surface; along the thickness direction of the circuit board, the first thermally conductive surface is located between the second thermally conductive surface and the third thermally conductive surface; The heat dissipation body is thermally connected to the third heat-conducting surface.

5. The package module of claim 4, wherein The heat dissipation body includes a liquid cooling plate or an air-cooled heat sink.

6. The package module of claim 4, wherein The heat dissipation body and the heat-conducting boss are an integral structure.

7. The package module according to any one of claims 1 to 6, wherein The packaging module also includes a fixing plate and a buffer pad, wherein the fixing plate is disposed on the side of the circuit board away from the heat dissipation structure; The buffer pad is disposed between the circuit board and the fixing plate, and one buffer pad is disposed for each of the first power transistor and the second power transistor.

8. The package module of claim 7, wherein, The buffer pad is an insulating and thermally conductive pad.

9. The package module of claim 8, wherein, A heat-conducting plate is provided between the heat dissipation structure and the fixing plate.

10. The package module of claim 7, wherein The fixing plate is fixed to the heat dissipation structure by a first fixing member; the first fixing member passes through the circuit board.

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