Wave-soldering conveyer chain tin-attachment sink-down pcba circuit board carrier device

Abstract

The utility model discloses a kind of sinking type PCBA circuit board carrier devices of avoiding wave-soldering conveying chain to be attached tin, including carrier, be equipped with soldering tin furnace below the carrier, be equipped with conveying device in the soldering tin furnace top, the carrier left and right sides, the conveying device includes chain, connecting frame, recess is equipped on the connecting frame, the carrier left and right sides are equipped with support shaft, the support shaft is matched with the recess.The utility model has the beneficial effect that: carrier is sinking type design, avoids wave-soldering machine chain contact welding furnace welding surface, PCBA can keep stable, reduce the generation of tin slag, improve the first pass rate of welding, to reduce production cost, improve welding quality, avoid soldering waste, it is both economic and environmental protection.

Description

Technical Field

[0001] This utility model relates to the field of PCBA circuit board soldering carrier device, and in particular to a sunken PCBA circuit board carrier device that avoids solder residue on the wave soldering conveyor chain. Background Technology

[0002] In the manufacturing process of PCBA (Printed Circuit Board Assembly), wave soldering is a commonly used soldering technique for mass soldering of components on circuit boards. The soldering process involves passing the PCBA, pre-loaded with electronic components, through a wave containing molten solder to electrically connect the solder joints to the component leads.

[0003] During the soldering process, the PCBA carrier moves on the wave soldering machine. The carrier easily causes solder to adhere to the chain, especially during high-volume, repetitive soldering. A lot of solder dross can stick to the chain, and if this dross falls onto the circuit board, it can cause short circuits, creating quality issues and seriously affecting product reliability. Furthermore, solder is a valuable material, and traditional carriers result in a large contact area between the chain and the solder, producing more solder ash and leading to significant solder waste and increased production costs. Utility Model Content

[0004] The purpose of this invention is to overcome the above-mentioned technical defects and propose a sunken PCBA circuit board carrier device that avoids solder residue on the wave soldering conveyor chain.

[0005] The technical solution adopted by this utility model to achieve its technical objective is: a sunken PCBA circuit board carrier device to avoid solder adhering to the wave soldering conveyor chain, including a carrier, a soldering furnace provided below the carrier, and conveying devices provided above the soldering furnace and on the left and right sides of the carrier. The conveying devices include a chain and a connecting frame, the connecting frame is provided with a groove, and support shafts are provided on the left and right sides of the carrier, the support shafts cooperating with the grooves.

[0006] Preferably, the carrier includes a PCBA placement area at its bottom and solder baffles on its left and right sides. The support shaft is disposed outside the solder baffles, and baffles are also provided at the front and rear ends of the carrier. A fixing frame is provided along the edge of the PCBA placement area, and a rivet fitted with a spring is provided between the PCBA placement area and the fixing frame.

[0007] Preferably, the PCBA placement area and the solder-blocking wall are fixedly connected by rivets.

[0008] Preferably, the PCBA placement area has a hollow structure.

[0009] Preferably, the connecting frame includes a horizontal portion and a vertical portion, the horizontal portion being connected to the chain, and the groove being disposed in the vertical portion.

[0010] Preferably, the connecting frames are spaced apart on the chain, and the support shafts are spaced apart on the tin-blocking walls on the left and right sides of the carrier.

[0011] Preferably, the length of the support shaft is less than the thickness of the groove.

[0012] The beneficial effects of this utility model are: the carrier is a sunken design, which avoids the wave soldering machine chain from contacting the soldering surface of the soldering furnace, so that the PCBA can remain stable, reduce the generation of solder dross, improve the first pass rate of soldering, thereby reducing production costs, improving soldering quality, and avoiding solder waste, which is both economical and environmentally friendly. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 for Figure 1 A schematic diagram of the three-dimensional structure viewed from below;

[0015] Figure 3 This is a magnified view of a portion of the chain and connecting frame;

[0016] Figure 4 This is a schematic diagram of the vehicle structure;

[0017] Figure 5 This is a schematic diagram of the connection between the connecting frame and the support shaft;

[0018] Figure 6 This is a cross-sectional view of the connection between the connecting frame and the support shaft.

[0019] The diagram is marked as follows:

[0020] 1. Carrier; 2. Soldering furnace; 3. Conveying device; 4. Chain; 5. Connecting frame; 6. Groove; 7. Support shaft;

[0021] 11. PCBA placement area; 12. Solder baffle; 13. Baffle; 14. Fixing frame; 51. Horizontal section; 52. Vertical section. Detailed Implementation

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments. Example

[0023] like Figure 1-6As shown: A sunken PCBA circuit board carrier device to avoid solder residue on the wave soldering conveyor chain includes a carrier 1, a soldering furnace 2 is provided below the carrier 1, and a conveying device 3 is provided above the soldering furnace 2 and on the left and right sides of the carrier 1. The conveying device 3 includes a chain 4 and a connecting frame 5. The connecting frame 5 is provided with a groove 6. The left and right sides of the carrier 1 are provided with support shafts 7, and the support shafts 7 cooperate with the grooves 6.

[0024] The carrier 1 includes a PCBA placement area 11 at its bottom and solder baffles 12 on its left and right sides. The support shaft 7 is located outside the solder baffles 12. Baffles 13 are also provided at the front and rear ends of the carrier 1. A fixing frame 14 is provided along the edge of the PCBA placement area 11. A rivet with a spring is provided between the PCBA placement area 11 and the fixing frame 14.

[0025] The PCBA placement area 11 and the solder barrier 12 are fixedly connected by rivets.

[0026] The PCBA placement area 11 has a hollow structure.

[0027] The connecting frame 5 includes a horizontal part 51 and a vertical part 52. The horizontal part 51 is connected to the chain 4 by welding or pin connection. The groove 6 is provided in the vertical part 52.

[0028] The connecting frames 5 are arranged at intervals on the chain 4, and the support shafts 7 are arranged at intervals on the tin-blocking walls 12 on the left and right sides of the carrier 1.

[0029] The length of the support shaft 7 is less than the thickness of the groove 6.

[0030] The working principle and process of this utility model are as follows:

[0031] The PCBA pre-loaded with electronic components is placed in the PCBA placement area 11 of the carrier 1. Molten solder is injected into the soldering furnace 2. The carrier 1 is placed in the groove 6 on the connecting frame 5 through the support shaft 7, so that the carrier 1 sinks and is immersed in the molten solder in the soldering furnace 2. The PCBA placement area 11 of the carrier 1 has a hollow structure, and its lower side contacts the solder. While the chain 4 rotates forward, it drives the carrier 1 to move forward through the connecting frame 5. The pins and solder joints of the electronic components are coated with solder. After being removed from the soldering furnace 2 and cooled, the soldering is completed.

[0032] Because carrier 1 is a sunken design, the wave soldering claws do not come into contact with the solder flowing on the soldering furnace from the side of the carrier. Only the lower side of the PCB placement area 11 comes into contact with the solder. Solder does not stick to the chain 4, and solder dross no longer falls onto the PCBA, improving the soldering quality and preventing short circuits on the PCBA circuit board.

Claims

1. A recessed PCBA circuit board carrier device for preventing solder residue on wave soldering conveyor chains, comprising a carrier, characterized in that: A soldering furnace is provided below the carrier, and a conveying device is provided above the soldering furnace and on the left and right sides of the carrier. The conveying device includes a chain and a connecting frame. The connecting frame is provided with a groove. Support shafts are provided on the left and right sides of the carrier, and the support shafts cooperate with the grooves.

2. The sunken PCBA circuit board carrier device for avoiding solder residue on the wave soldering conveyor chain according to claim 1, characterized in that: The carrier includes a PCBA placement area at its bottom and solder baffles on its left and right sides. The support shaft is located outside the solder baffles. Baffles are also provided at the front and rear ends of the carrier. A fixed pressure frame is provided along the edge of the PCBA placement area. A rivet with a spring is provided between the PCBA placement area and the fixed pressure frame.

3. The sunken PCBA circuit board carrier device for avoiding solder residue on the wave soldering conveyor chain according to claim 2, characterized in that: The PCBA placement area is fixedly connected to the solder barrier wall by rivets.

4. The sunken PCBA circuit board carrier device for avoiding solder residue on the wave soldering conveyor chain according to claim 3, characterized in that: The PCBA placement area has a hollow structure.

5. The sunken PCBA circuit board carrier device for avoiding solder residue on the wave soldering conveyor chain according to claim 1, characterized in that: The connecting frame includes a horizontal part and a vertical part, the horizontal part is connected to the chain, and the groove is provided in the vertical part.

6. The sunken PCBA circuit board carrier device for avoiding solder residue on the wave soldering conveyor chain according to claim 1, characterized in that: The connecting frames are arranged at intervals on the chain, and the support shafts are arranged at intervals on the tin-blocking walls on the left and right sides of the carrier.

7. The sunken PCBA circuit board carrier device for avoiding solder residue on the wave soldering conveyor chain according to claim 1, characterized in that: The length of the support shaft is less than the thickness of the groove.

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