A thermo-compression bonding device and thermo-compression bonding system
By integrating heating and pressing functions into hot press rollers or hot press blocks, the problem of poor bonding of high melting point soft material film strips is solved, and efficient and uniform hot pressing bonding of film strips and substrates is achieved, which is suitable for various types of film strips.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUHAN DR LASER TECH CORP LTD
- Filing Date
- 2025-07-15
- Publication Date
- 2026-07-07
AI Technical Summary
Existing film strip bonding solutions cannot meet the bonding requirements of film strips with high melting points and soft materials. Traditional hot air heating methods are difficult to control the temperature, resulting in poor bonding or film strip shrinkage due to heat. Furthermore, existing static hot pressing solutions have insufficient bonding.
The film strip is heat-pressed by using hot-press rollers or hot-press blocks that integrate heating and pressing functions. The film strip is heat-pressed and bonded by driving the hot-press rollers or hot-press blocks to move. Temperature sensors and non-stick coatings are used to control the temperature and prevent adhesion, so as to achieve uniform heat pressing between the film strip and the substrate.
It improves the adhesion between the film strip and the substrate, avoids film strip shrinkage and adhesion problems, solves the problem of poor adhesion and blistering in the prior art, and adapts to the hot pressing requirements of different types of film strips.
Smart Images

Figure CN224465293U_ABST