A silicon ingot mold turnover device
By designing an industrial silicon ingot mold flipping device, which utilizes an inclined structure to flip the silicon ingot, the problems of difficult transportation and ground damage caused by the large weight of the silicon ingot were solved, and a safe and efficient transportation process was achieved.
CN224465880UActive Publication Date: 2026-07-07GANSU HEXI SILICON NEW MATERIAL CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GANSU HEXI SILICON NEW MATERIAL CO LTD
- Filing Date
- 2025-09-17
- Publication Date
- 2026-07-07
AI Technical Summary
Technical Problem
Industrial silicon ingots are heavy and can easily damage the ground during transport, causing product defects and making them difficult to transport.
Method used
An industrial silicon ingot mold flipping device was designed. The device uses a gap formed by a first inclined plane and a second inclined plane to support the industrial silicon ingot. By pushing the device to flip the ingot mold, the silicon ingot falls down along the inclined plane, avoiding direct contact with the ground.
Benefits of technology
This technology enables flexible flipping of silicon ingots, avoiding damage to the ground and improving the safety and convenience of transportation.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224465880U_ABST
Abstract
The utility model relates to environmental protection fire and new material field especially, more particularly to a kind of industrial silicon ingot mould turnover equipment.Industrial silicon ingot mould turnover equipment includes main body structure (2), and main body structure (2) includes horizontal bottom plate and vertical vertical plate;Lower support (5) is arranged on horizontal bottom plate, and lower support (5) is also arranged on horizontal bottom plate;Vertical vertical plate is arranged with vertical support (7), and side edge wheel (9) is also arranged on vertical vertical plate;Gap (8) is arranged between horizontal bottom plate and vertical vertical plate;Inclined second inclined surface (4) is arranged on horizontal bottom plate;Vertical vertical plate is arranged with first inclined surface (3);First inclined surface (3) and second inclined surface (4) constitute gap (8).Will not pound ground.
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