Spin barrel for drying semiconductor material

Abstract

The utility model provides a kind of for semiconductor material spin-drying's spin barrel, it is related to semiconductor material processing technical field, including barrel and frame body;Multiple drainage holes one are opened in the barrel;The frame body is embedded in the inside of barrel and is welded with the inner wall of barrel;The frame body includes multiple article frames integrally formed, multiple round holes are opened in the periphery of each article frame, and multiple through holes are opened in the bottom of article frame;The diameter of each through hole is greater than the diameter of round hole;Multiple article frame bottoms are located on the same horizontal plane and keep horizontal with the bottom surface of barrel, solve the problem that multiple models of semiconductor material surface humidity is removed simultaneously by current semiconductor material spin-drying machine, multiple different models of semiconductor's package are extruded together, realize the promotion of semiconductor material dehumidification effect.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor material processing technology, and specifically to a spin-drying drum for semiconductor materials. Background Technology

[0002] In the electroplating process of diode products, for materials after acid plating, it is necessary to quickly remove the moisture from the surface of the material to meet the requirements of semiconductor material processing.

[0003] In the existing technology, there are dedicated semiconductor material spin dryers to spin dry products after acid plating in order to remove the surface moisture of the semiconductor material after acid plating. However, when the current semiconductor material spin dryer removes moisture from the surface of multiple types of semiconductor materials at the same time, multiple packages containing different types of semiconductors are squeezed together, resulting in poor dehumidification effect of semiconductor materials. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this invention provides a spin-drying drum for semiconductor materials, which solves the problem that multiple packages containing different types of semiconductors are squeezed together when current semiconductor material spin dryers simultaneously remove moisture from the surfaces of various types of semiconductor materials.

[0006] (II) Technical Solution

[0007] To achieve the above objectives, this utility model provides the following technical solution:

[0008] In this utility model, the spin-drying drum for semiconductor materials includes a drum body and a frame body;

[0009] The barrel body is provided with multiple drainage holes.

[0010] The frame is embedded inside the barrel and welded to the inner wall of the barrel;

[0011] The frame includes multiple integrated storage frames, each storage frame having multiple round holes around its perimeter and multiple through holes at its bottom.

[0012] The diameter of each of the through holes is larger than the diameter of the circular hole;

[0013] The bottoms of all the storage frames are located on the same horizontal plane and are level with the bottom surface of the bucket.

[0014] Furthermore, the plurality of the storage frames are arranged in a surrounding frame with openings at both the top and bottom;

[0015] A support block is installed at the bottom of the inner part of the barrel, and the support block is welded to the inside of the barrel through a support plate.

[0016] The support block is located between the bottom of the frame and the bottom of the barrel, and serves as the bottom of the sleeve frame;

[0017] The frame is welded to the support block at one end near the support block.

[0018] Furthermore, multiple positioning posts are welded onto the support block, and the shape formed by connecting the centers of two adjacent positioning posts in sequence is consistent with the shape of the inner cavity of the sleeve frame.

[0019] The frame is fitted around the periphery of multiple positioning posts and contacts the support block.

[0020] Furthermore, the barrel body is provided with multiple drainage holes arranged in a ring around the barrel body;

[0021] The inner bottom of the barrel is provided with multiple drainage grooves that correspond one-to-one with the drainage holes, and the multiple drainage grooves converge at the center of the inner bottom of the barrel.

[0022] The drainage channel is inclined, and the lower inclined end of the drainage channel is connected to the corresponding drainage hole.

[0023] Furthermore, each of the aforementioned storage frames has a marking slot on one side of the frame;

[0024] The number of marked slots on each of the aforementioned storage boxes is different, and the number of marked slots on two adjacent storage boxes increases sequentially.

[0025] Furthermore, the barrel body is made of alloy material.

[0026] (III) Beneficial Effects

[0027] This invention provides a spin-drying drum for semiconductor materials. Compared with the prior art, it has the following advantages:

[0028] By setting a frame inside the barrel, the barrel is divided into multiple separate spaces using multiple storage frames. Various types of materials that need to be dehumidified are wrapped in bundles and placed in their respective storage frames. This solves the problem that current semiconductor material spin dryers, when removing moisture from the surface of various types of semiconductor materials simultaneously, cause multiple bundles containing different types of semiconductors to be squeezed together, resulting in poor dehumidification of the semiconductor materials. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a perspective view of the swiping bucket of this utility model;

[0031] Figure 2 for Figure 1 3D view of the middle frame;

[0032] Figure 3 for Figure 1 A three-dimensional view of the middle frame, support blocks, and multiple support plates;

[0033] Figure 4 for Figure 1 Top view;

[0034] Figure 5 for Figure 1 A 3D view of the middle barrel without the frame installed;

[0035] Figure 6 for Figure 1 A wireframe diagram of a bottom view.

[0036] Figure label:

[0037] 1. Bucket body; 10. Drain hole one; 11. Drain hole two; 111. Drainage trough; 2. Frame; 20. Storage frame; 201. Sleeve frame; 21. Through hole; 22. Marking groove; 3. Support block; 30. Positioning post; 31. Support plate. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments of this utility model are described clearly and completely. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0039] This application provides a spin-drying drum for semiconductor materials, which solves the problem that when current semiconductor material spin-dryers simultaneously remove moisture from the surface of various types of semiconductor materials, multiple packages containing different types of semiconductors are squeezed together, thereby improving the dehumidification effect of semiconductor materials.

[0040] The technical solution in this application is to solve the above-mentioned technical problems, and the general idea is as follows:

[0041] In the existing technology, there are dedicated semiconductor material spin dryers to spin dry products after acid plating in order to remove moisture from the surface of semiconductor materials after acid plating. However, when current semiconductor material spin dryers remove moisture from the surface of various types of semiconductor materials at the same time, multiple packages containing different types of semiconductors are squeezed together, resulting in poor dehumidification effect of semiconductor materials.

[0042] Research has found that, for example Figures 1-6 As shown, by setting a frame inside the barrel, the barrel is divided into multiple separate spaces using multiple storage frames set in the frame. Various types of materials that need to be dehumidified are wrapped in bundles and placed in their respective storage frames. This solves the problem that when current semiconductor material spin dryers remove moisture from the surface of various types of semiconductor materials at the same time, multiple bundles containing different types of semiconductors are squeezed together, thus improving the dehumidification effect of semiconductor materials.

[0043] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0044] Example:

[0045] like Figures 1-2 As shown, a spin-drying drum for semiconductor materials includes a drum body 1 and a frame body 2.

[0046] The barrel body 1 is provided with multiple drainage holes 10;

[0047] The frame 2 is embedded inside the barrel 1 and welded to the inner wall of the barrel 1;

[0048] The frame 2 includes multiple integrated storage frames 20, each of which has multiple round holes around its perimeter and multiple through holes 21 at its bottom.

[0049] The diameter of each of the through holes 21 is larger than the diameter of the circular hole;

[0050] The bottoms of all the storage frames 20 are located on the same horizontal plane and are level with the bottom surface of the barrel 1.

[0051] By setting a frame 2 inside the barrel 1, and using multiple storage frames 20 set in the frame 2 to divide the barrel 1 into multiple separate spaces, various types of materials that need to be dehumidified are wrapped in bundles and placed in the corresponding storage frames 20. This solves the problem that when current semiconductor material spin dryers remove moisture from the surface of various types of semiconductor materials at the same time, multiple bundles containing different types of semiconductors are squeezed together, resulting in poor dehumidification effect of semiconductor materials.

[0052] Furthermore, multiple through holes 21 are opened at the bottom of the storage frame 20, and the diameter of the through holes 21 is set to be larger than the diameter of the round hole on the storage frame 20. This ensures the stability of the storage frame 20 when placing semiconductor materials, while also facilitating the outflow of water accumulated in the bucket 1 during the spin-drying and dehumidification process, thereby enhancing the dehumidification effect of the spin-drying bucket on semiconductor materials.

[0053] like Figures 1-4 As shown, a plurality of the storage frames 20 are arranged around a frame 201 with openings at both the top and bottom;

[0054] A support block 3 is installed at the bottom of the inner part of the barrel 1, and the support block 3 is welded to the inside of the barrel 1 through a support plate 31.

[0055] The support block 3 is located between the bottom of the frame 2 and the bottom of the barrel 1, and serves as the bottom of the sleeve frame 201;

[0056] The frame 2 is welded to the support block 3 at one end near the support block 3.

[0057] By setting up support blocks 3, the frame 2 is supported, which improves the stability of the frame 2 embedded inside the barrel 1 during the dehumidification process, thereby facilitating the dehumidification of the semiconductor material located in the storage frame 20.

[0058] like Figures 1-4 As shown, multiple positioning posts 30 are welded on the support block 3, and the shape formed by connecting the centers of two adjacent positioning posts 30 in sequence is consistent with the shape of the inner cavity of the sleeve frame 201.

[0059] The frame 2 is fitted around the periphery of the multiple positioning posts 30 by the sleeve 201 and contacts the support block 3.

[0060] By setting multiple positioning posts 30 on the support block 3, the frame 2 is initially positioned using the multiple positioning posts 30, which facilitates the subsequent welding of the frame 2 to the support block 3 and to the inside of the barrel 1.

[0061] At the same time, by combining the support block 3 and multiple positioning posts 30, the frame 2 is installed stably, and the bottoms of multiple storage boxes 20 are all on the same horizontal plane and kept horizontal with the bottom surface of the bucket 1, which facilitates the overall installation of the frame 2.

[0062] like Figures 1-6 As shown, the barrel body 1 has multiple drainage holes 11 arranged in a ring around the barrel body 1;

[0063] The inner bottom end of the barrel 1 is provided with a plurality of drainage grooves 111 corresponding to the drainage holes 11, and the plurality of drainage grooves 111 converge at the center of the inner bottom end of the barrel 1.

[0064] The drainage trough 111 is inclined, and the inclined lower end of the drainage trough 111 is connected to the corresponding drainage hole 11.

[0065] By setting a second drain hole 11 and a drain groove 111, and setting the drain groove 111 to be inclined, with the lower end of the inclined groove connected to the corresponding second drain hole 11, it is easier for water to flow out from the bottom of the barrel 1.

[0066] Specifically, the barrel body 1 is made of alloy material.

[0067] like Figures 1-3 As shown, each of the storage frames 20 forming the frame 201 has a marking slot 22 on one side;

[0068] The number of marking slots 22 on each of the storage boxes 20 is different, and the number of marking slots 22 on two adjacent storage boxes 20 increases sequentially.

[0069] By setting the marking slots 22 and increasing the number of marking slots 22 on two adjacent storage boxes 20 in sequence, for some semiconductor materials whose models are not clearly distinguishable, they can be placed according to the model size and the number of marking slots 22, which facilitates the differentiation of semiconductor materials after dehumidification and facilitates the dehumidification operation of multiple types of semiconductor materials.

[0070] During operation, the entire spin drum is placed in a semiconductor material spin dryer. The semiconductor spin dryer is existing technology, and the spin drying principle is also existing technology, so it will not be described in detail here. This application is an improvement on the spin drum in the semiconductor material spin dryer.

[0071] This application installs a frame 2 inside the barrel 1 of an existing semiconductor material spin dryer, sets the frame 2 in the form of multiple storage boxes 20, divides the space inside the barrel 1 into multiple independent spaces, and then places multiple semiconductor materials of different types that need to be dehumidified into the corresponding storage boxes 20 for spin drying and dehumidification operation.

[0072] During the spin-drying process, a large number of semiconductor materials of the same type are wrapped in a bundle and tied tightly. After being tied, the bundles are placed in the corresponding number of storage boxes 20 with marked slots 22 according to the size of the semiconductor material type, so as to facilitate the subsequent spin-drying and dehumidification operation.

[0073] When installing frame 2 inside barrel 1, the entire process is carried out by welding, as detailed below:

[0074] First, the support block 3 is welded to the inner bottom of the barrel 1 via the support plate 31;

[0075] Afterwards, weld the following onto the support block 3 after welding: Figure 4 Multiple positioning posts 30 are distributed;

[0076] Next, the frame 2 is fitted around the outer perimeter of the multiple positioning posts 30 for initial positioning;

[0077] Finally, the frame 2, after initial positioning, is welded to complete the welding of the frame 2 to the support block 3 and the inner wall of the barrel 1, thus completing the entire installation of the frame 2.

[0078] In summary, compared with existing technologies, it has the following beneficial effects:

[0079] 1. By setting a frame 2 inside the barrel 1, the barrel 1 is divided into multiple separate spaces by using multiple storage frames 20 set in the frame 2. Various types of materials that need to be dehumidified are wrapped in cloth and placed in the corresponding storage frames 20. This solves the problem that when current semiconductor material spin dryers remove moisture from the surface of various types of semiconductor materials at the same time, multiple cloths containing different types of semiconductors are squeezed together, resulting in poor dehumidification effect of semiconductor materials.

[0080] Furthermore, multiple through holes 21 are opened at the bottom of the storage frame 20, and the diameter of the through holes 21 is set to be larger than the diameter of the round hole on the storage frame 20. This ensures the stability of the storage frame 20 when placing semiconductor materials, while also facilitating the outflow of water accumulated in the bucket 1 during the spin-drying and dehumidification process, thereby enhancing the dehumidification effect of the spin-drying bucket on semiconductor materials.

[0081] 2. By setting support block 3, the frame 2 is supported, which improves the stability of the frame 2 embedded in the barrel 1 during the dehumidification process, thereby facilitating the dehumidification of the semiconductor material located in the storage frame 20.

[0082] 3. By setting multiple positioning posts 30 on the support block 3, the frame 2 is initially positioned, which facilitates the subsequent welding of the frame 2 to the support block 3 and the welding operation to the inside of the barrel 1.

[0083] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0084] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A spin-drying drum for semiconductor materials, characterized in that, It includes a barrel (1) and a frame (2); The barrel (1) is provided with multiple drainage holes (10); The frame (2) is embedded inside the barrel (1) and welded to the inner wall of the barrel (1); The frame (2) includes multiple integrated storage frames (20), each of which has multiple round holes around its perimeter and multiple through holes (21) at its bottom. The diameter of each of the through holes (21) is larger than the diameter of the circular hole; The bottoms of all the storage frames (20) are located on the same horizontal plane and are level with the bottom surface of the bucket (1).

2. The spin-drying drum for semiconductor materials as described in claim 1, characterized in that, Multiple storage frames (20) are arranged around each other to form a frame (201) with openings at both the top and bottom; A support block (3) is installed at the bottom of the inner part of the barrel (1), and the support block (3) is welded to the inside of the barrel (1) through a support plate (31); The support block (3) is located between the bottom of the frame (2) and the bottom of the barrel (1), and serves as the bottom of the sleeve frame (201); The frame (2) is welded to the support block (3) at one end near the support block (3).

3. A spin-drying drum for semiconductor materials as described in claim 2, characterized in that, Multiple positioning posts (30) are welded on the support block (3), and the shape formed by connecting the centers of two adjacent positioning posts (30) in sequence is consistent with the shape of the inner cavity of the sleeve frame (201). The frame (2) is fitted around the periphery of the multiple positioning posts (30) by a sleeve (201) and contacts the support block (3).

4. A spin-drying drum for semiconductor materials as described in claim 1, characterized in that, The barrel (1) is provided with a plurality of drainage holes (11) arranged in a ring around the barrel (1); The inner bottom end of the barrel (1) is provided with a plurality of drainage grooves (111) corresponding to the drainage holes (11) one by one, and the plurality of drainage grooves (111) converge at the center of the inner bottom end of the barrel (1). The drainage trough (111) is inclined, and the inclined lower end of the drainage trough (111) is connected to the corresponding drainage hole (11).

5. A spin-drying drum for semiconductor materials as described in claim 2, characterized in that, Each of the aforementioned storage frames (20) forming a frame (201) has a marking slot (22) on one side; The number of marking slots (22) on each of the storage boxes (20) is different, and the number of marking slots (22) on two adjacent storage boxes (20) increases sequentially.

6. A spin-drying drum for semiconductor materials as described in claim 1, characterized in that, The barrel body (1) is made of alloy material.

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