A temperature measuring device for a heating plate

Abstract

The utility model relates to the technical field of semiconductor manufacturing discloses a kind of temperature measuring device suitable for heating disc, comprising: mounting structure, connecting assembly and temperature measuring piece, by setting several connecting holes on mounting plate, temperature measuring piece is detachably connected on mounting plate by connecting assembly, the temperature measuring end of temperature measuring piece is abutted with the piece to be measured, to be suitable for detecting the temperature parameter of heating disc, mounting plate and connecting assembly provide installation support for temperature measuring piece, so that the temperature measuring end of temperature measuring piece is contacted with the piece to be measured, improve the accuracy of temperature measuring efficiency.The temperature measuring device structure simplifies, convenient operation, can quickly realize the measurement to the temperature distribution of piece to be measured, significantly improve test efficiency, applicable to batch testing or dynamic monitoring scene.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and specifically to a temperature measuring device suitable for heating plates. Background Technology

[0002] As a core component of thin film deposition equipment, the heating plate is mainly used to support the wafer and provide uniform heating during the thin film deposition process. The uniformity of its surface temperature directly affects the quality of thin film deposition and process stability. Therefore, the uniformity of the surface temperature distribution of the heating plate has become one of the important indicators for evaluating its performance.

[0003] In existing technologies, TC wafer temperature measurement systems are typically used to test the surface temperature of wafers. These TC wafer temperature measurement systems mainly consist of a distributed temperature sensor network and a signal transmission system. In practice, multiple miniature temperature sensors are fixed to specific locations on the wafer using a special fabrication process, enabling real-time monitoring and acquisition of temperatures in multiple areas of the wafer surface.

[0004] However, when using a TC wafer temperature measurement system to detect the surface temperature uniformity of a heating plate, the sensors typically need to be directly embedded or bonded to the wafer surface using a special adhesive method, which places high demands on the precision and reliability of the sensor installation process. On the one hand, this type of fixing method involves a certain degree of process complexity, increasing the difficulty of operation during installation; on the other hand, in actual use, if the sensor is damaged or malfunctions, its repair and replacement are cumbersome, affecting the maintainability and detection efficiency of the overall temperature measurement system.

[0005] Therefore, existing technologies still face technical challenges in detecting the surface temperature distribution of heating plates, such as complex structures and difficult maintenance. Utility Model Content

[0006] In view of this, the present invention provides a temperature measuring device suitable for heating plates, so as to solve the problems of complex structure, inconvenient operation and maintenance of existing temperature measuring devices for testing the temperature distribution of heating plates.

[0007] To solve the above-mentioned technical problems, the technical solution of this utility model is as follows:

[0008] This utility model provides a temperature measuring device suitable for heating plates, including: an installation structure, a connecting component, and a temperature measuring element. The installation structure includes an installation plate with a plurality of connecting holes. The connecting component is detachably mounted on the installation plate. The temperature measuring element has a temperature measuring end and is fixedly mounted on the installation plate through the connecting component. The temperature measuring end passes through the connecting holes and protrudes to the other side of the installation plate to facilitate temperature detection.

[0009] It has the following advantages: During temperature measurement, the mounting plate is positioned above the workpiece to be measured (the workpiece is a wafer), which is placed on a heating plate. The heating plate heats the wafer. The temperature measuring element is detachably mounted to the mounting plate via a connecting assembly. The measuring end of the element protrudes to the side of the mounting plate closest to the wafer, and it contacts the wafer surface to detect the temperature of the heated wafer surface. The entire temperature measuring device is independently and separately set from the wafer. The measuring end only contacts the wafer to detect the temperature, allowing for rapid transfer. This enables the device to quickly test different wafers, making it convenient to use and significantly improving testing efficiency. Furthermore, because the temperature measuring elements are detachably connected to the mounting plate via the connecting assembly, each element is independent and detachably connected to the mounting plate. This allows for quick disassembly if any component of the temperature measuring device is damaged, facilitating maintenance and reducing costs.

[0010] According to some embodiments of the present invention, it further includes a housing, wherein a cavity structure is formed within the housing, the cavity structure is for mounting a heating plate, and the mounting plate is located above the heating plate.

[0011] It has the following advantages: a chamber structure is formed inside the housing, and a heating plate is installed inside the chamber structure. The part under test (DUT) can be placed on the heating plate, and the mounting plate is located above the DUT. The DUT is a wafer. During temperature measurement, the heating plate heats the DUT, and the temperature measuring end extends to contact the DUT to achieve temperature testing. This chamber structure can better simulate actual use scenarios, thereby improving detection accuracy.

[0012] According to some embodiments of the present invention, the mounting structure further includes a support column and a fastening connector, and the mounting plate is detachably connected to the support column through the fastening connector.

[0013] It has the following advantages: the support column provides stable support for the mounting plate, and the mounting plate is connected to the support column by fastening connectors, making the installation process of the mounting plate more convenient. It can also be quickly operated when maintaining, replacing or adjusting the temperature measuring device in the later stage, reducing labor costs.

[0014] According to some embodiments of the present invention, a threaded section is provided above the support column, and the fastening connector includes a first nut and a second nut. The threaded section passes through the mounting plate, and the first nut and the second nut are both screwed onto the threaded section and are respectively located on both sides of the mounting plate to fix the mounting plate.

[0015] It has the following advantages: With the first and second nuts respectively positioned on the upper and lower sides of the mounting plate, a clamping and fixing structure is formed, effectively preventing loosening or displacement during use and improving the overall structural stability. Due to the continuously adjustable nature of the threaded connection, the height of the mounting plate relative to the heating plate can be adjusted by rotating the first and second nuts to accommodate wafers of various sizes, thus improving versatility.

[0016] According to some embodiments of the present invention, the support column is disposed within the cavity structure, and multiple support columns are provided. The support columns are distributed around the heating plate to facilitate the fixed installation of the mounting plate.

[0017] It has the following advantages: by distributing multiple support columns around the heating plate, the mounting plate is subjected to more uniform force, which can effectively prevent deformation or tilting caused by uneven local force, and enhance the overall rigidity and structural stability of the temperature measuring device.

[0018] According to some embodiments of the present invention, the mounting plate is provided with a plurality of spray holes, which are evenly distributed.

[0019] It has the following advantages: During testing, gas can be sprayed onto the surface of the heating plate through the spray hole via external ventilation, thereby better simulating the actual usage scenario when the wafer is deposited on the heating plate, thus improving the accuracy of the test.

[0020] According to some embodiments of the present invention, the connecting assembly includes a connecting sleeve, the temperature measuring element is inserted through the connecting sleeve, and the connecting sleeve is threadedly fitted with the connecting hole.

[0021] It has the following advantages: A specific structure for detachable connection between the connecting component and the mounting plate is proposed. The connecting sleeve and the connecting hole adopt a threaded engagement, making the positioning of the temperature measuring element on the mounting plate more secure and facilitating both assembly and disassembly. By pre-inserting the temperature measuring element into the connecting sleeve and then threading the connecting sleeve into the connecting hole, the installation process can be significantly simplified, reducing direct operation on the temperature measuring element body, lowering assembly difficulty and the risk of misoperation, and improving on-site assembly efficiency.

[0022] According to some embodiments of the present invention, the upper end of the connecting sleeve is provided with a limiting flange, and the limiting flange abuts against the mounting plate.

[0023] It has the following advantages: by setting a limiting flange, the connecting sleeve can form a physical limit when inserted into the connecting hole, effectively preventing it from being over-inserted or improperly assembled, ensuring the accurate installation depth of the temperature measuring component on the mounting plate, and improving the stability and consistency of the temperature measuring position.

[0024] According to some embodiments of the present invention, the connecting sleeve is provided with a connecting cavity, the connecting assembly further includes an elastic element, the elastic element is disposed in the connecting cavity, the outer periphery of the temperature measuring element is fixedly provided with a protrusion, one end of the elastic element abuts against the upper end surface of the protrusion, and the other end of the elastic element abuts against the top of the connecting cavity.

[0025] It has the following advantages: By applying a downward elastic preload through the elastic element, the lower end of the temperature measuring element is always kept in close contact with the heating plate, realizing a dynamic clamping function. This effectively eliminates poor contact caused by thermal expansion and contraction, vibration, or installation tolerances, ensuring the accuracy and real-time performance of temperature measurement. Furthermore, since wafers are brittle materials, rigid contact can easily lead to breakage. In this solution, the temperature measuring end can achieve elastic contact with the wafer surface through the design of the elastic element, reducing rigid contact between the temperature measuring end and the wafer surface, reducing the squeezing damage from rigid contact, reducing the risk of wafer breakage, and ensuring test stability.

[0026] According to some embodiments of this utility model, the connecting holes are provided in multiple ways, and the number of the temperature measuring element, the connecting assembly and the connecting holes are the same.

[0027] It has the following advantages: by setting multiple connection holes and installing temperature measuring elements at each hole, the test piece can be tested for uniform temperature, thereby achieving comprehensive monitoring of the temperature distribution of the test piece and meeting the needs for evaluating the uniformity of the thermal field; the multi-point deployment of temperature measuring elements can effectively avoid the local errors that may exist in single-point measurement, making the overall temperature detection results more representative and stable. Attached Figure Description

[0028] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0029] Figure 1 This is a structural diagram of a temperature measuring device provided in some embodiments of the present invention;

[0030] Figure 2 This is a cross-sectional view of a temperature measuring device provided in some embodiments of the present invention;

[0031] Figure 3 for Figure 2 A magnified view of part A in the diagram;

[0032] Figure 4 for Figure 2 A magnified view of part B in the diagram.

[0033] Explanation of reference numerals in the attached figures:

[0034] 1. Installation structure; 11. Mounting plate; 12. Support column; 13. Fastening connector; 111. Spray hole; 112. Connecting hole; 121. Threaded section; 131. First nut; 132. Second nut; 2. Connecting assembly; 21. Connecting sleeve; 22. Elastic element; 211. Connecting cavity; 212. Limiting flange; 3. Temperature measuring element; 31. Protrusion; 32. Temperature measuring end; 4. Heating plate; 5. Housing; 51. Chamber structure. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0036] Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0037] Reference Figures 1-3 As shown, this utility model provides a temperature measuring device suitable for a heating plate, including: a mounting structure 1, a connecting component 2, and a temperature measuring element 3. The mounting structure 1 includes a mounting plate 11, on which a plurality of connecting holes 112 are provided. The connecting component 2 is detachably mounted on the mounting plate 11. The temperature measuring element 3 has a temperature measuring end 32. The temperature measuring element 3 is fixedly mounted on the mounting plate 11 through the connecting component 2. The temperature measuring end 32 passes through the connecting holes 112 and protrudes to the other side of the mounting plate 11 to facilitate temperature detection.

[0038] Specifically, during temperature measurement, the mounting plate 11 is positioned above the wafer to be measured, which is placed on the heating plate 4. The heating plate 4 heats the wafer. The temperature measuring element 3 is detachably mounted to the mounting plate 11 via the connecting assembly 2. The temperature measuring end 32 of the temperature measuring element 3 passes through a connecting hole and protrudes to the side of the mounting plate 11 closest to the wafer. The temperature measuring end 32 abuts against the wafer surface, thereby detecting the temperature of the heated wafer surface. The entire temperature measuring device is independently and separately set from the wafer. The temperature measuring end 32 only abuts against the wafer to detect the temperature, allowing for rapid transfer. This enables the temperature measuring device to quickly detect different wafers, making it convenient to use and significantly improving detection efficiency. Furthermore, since the temperature measuring elements 3 are detachably connected to the mounting plate 11 via the connecting assembly 2, each temperature measuring element 3 is independent and detachably connected to the mounting plate 11. This allows for quick disassembly if any component of the temperature measuring device is damaged, facilitating maintenance and reducing costs. Furthermore, even if the wafer breaks due to high temperatures or other reasons, the installation of a mounting plate can effectively reduce the splashing of fragments and improve safety performance.

[0039] In some embodiments of this utility model, a temperature measuring device suitable for a heating plate further includes a housing 5, a cavity structure 51 formed inside the housing 5, the cavity structure 51 for mounting the heating plate 4, and a mounting plate 11 located above the heating plate 4.

[0040] Specifically, a chamber structure 51 is formed within the housing 5, and a heating plate 4 is provided within the chamber structure 51. The workpiece under test (DUT) can be placed on the heating plate 4, and the mounting plate 11 is located above the DUT. The DUT is a wafer. During temperature measurement, the heating plate 4 heats the DUT, and the temperature measuring end 32 extends to contact the DUT to achieve temperature testing. This chamber structure 51 can better simulate actual usage scenarios to improve detection accuracy.

[0041] In some embodiments of this utility model, the mounting structure 1 further includes a support column 12 and a fastening connector 13, and the mounting plate 11 is detachably connected to the support column 12 through the fastening connector 13.

[0042] Specifically, different specifications of fastening connectors 13 are selected for connection according to different types and sizes of heating plates 4, so as to adjust the gap between the mounting plate 11 and the heating plate 4, thereby adapting to wafers of different thicknesses. This allows for rapid adaptation according to actual needs, avoiding assembly difficulties caused by structural incompatibility and improving the versatility and field adaptability of the temperature measuring device.

[0043] Understandably, the support column 12 provides stable support for the mounting plate 11. The mounting plate 11 is detachably connected to the support column 12 via the fastening connector 13. This detachable connection makes the installation of the mounting plate 11 more convenient, and allows for quick operation during subsequent maintenance, replacement, or adjustment of the temperature measuring device, reducing labor costs. The support column 12 provides good support strength and rigidity, effectively preventing displacement or deformation of the mounting plate 11 due to gravity or thermal expansion and contraction, thus improving the stability of the overall structure and its reliability during long-term use.

[0044] Reference Figure 4 As shown, in some embodiments of this utility model, a threaded section 121 is provided above the support column 12, and the fastening connector 13 includes a first nut 131 and a second nut 132. The threaded section 121 passes through the mounting plate 11, and the first nut 131 and the second nut 132 are both screwed onto the threaded section 121 and are respectively located on both sides of the mounting plate 11 to fix the mounting plate 11. Specifically, by setting the first nut 131 and the second nut 132 on the upper and lower sides of the mounting plate 11 respectively, a clamping and fixing structure can be formed for the mounting plate 11, effectively preventing it from loosening or shifting during use and improving the stability of the overall structure. Since the threaded connection has a continuously adjustable characteristic, the height position of the mounting plate 11 relative to the heating plate 4 can be adjusted by rotating the first nut 131 and the second nut 132 to adapt to wafers of various specifications and improve versatility.

[0045] Understandably, using threaded structures and standard nuts as connection and adjustment components offers good versatility and replaceability, facilitating application in different equipment or operating environments. It also makes replacement convenient during maintenance and debugging. The double-nut structure prevents detachment or positional shift due to a single loose nut, enhancing the reliability of the temperature measuring device and its vibration resistance under long-term operation, thus ensuring the safety of the equipment during operation.

[0046] In some alternative embodiments, the fastening assembly that enables the detachable connection between the mounting plate and the support column can also be other structures. For example, optionally, the fastening assembly includes an upper nut, and a raised step is provided on the outer wall of the top of the support column. The mounting plate overlaps the step and is threaded onto the outer wall of the support column using the fastening assembly. This structure enables detachment, but it is difficult to adjust the height of the mounting plate. Alternatively, the mounting plate has fastening holes, and the top surface of the support column has threaded holes for fixing with bolts, etc.

[0047] In some embodiments of this utility model, multiple support columns 12 are disposed within the chamber structure 51 and are distributed around the periphery of the heating plate 4 to facilitate the fixed installation of the mounting plate 11. Specifically, by distributing multiple support columns 12 around the circumference of the heating plate 4, the mounting plate 11 is subjected to more uniform force, effectively preventing deformation or tilting caused by uneven local force, and enhancing the overall rigidity and structural stability of the temperature measuring device.

[0048] Understandably, when multiple support columns 12 are used together, their height or position can be finely adjusted individually, thereby achieving precise leveling of the mounting plate 11 in multiple dimensions, which helps to achieve precise arrangement and contact of the temperature measuring element 3 at each detection point. The distributed arrangement of the support columns 12 can flexibly adapt to the arrangement requirements of heating plates 4 of different sizes and shapes, improving the versatility and modular design capabilities of the temperature measuring device.

[0049] In some embodiments of this utility model, the mounting plate 11 is provided with a plurality of spray holes 111, which are evenly distributed.

[0050] Specifically, during testing, gas can be sprayed onto the surface of the heating plate 4 through the spray hole 111 via external ventilation, thereby better simulating the actual usage scenario of wafers depositing thin films on the heating plate 4 and improving the accuracy of the test.

[0051] Reference Figure 3 As shown, in some embodiments of this utility model, the connecting component 2 includes a connecting sleeve 21, the temperature measuring element 3 passes through the connecting sleeve 21, and the connecting sleeve 21 is threadedly fitted with the connecting hole 112.

[0052] Specifically, a detachable connection structure between the connecting component 2 and the mounting plate 11 is proposed. The connecting sleeve 21 and the connecting hole 112 are threaded together, making the positioning of the temperature measuring element 3 on the mounting plate 11 more secure and facilitating both assembly and disassembly. By pre-inserting the temperature measuring element 3 into the connecting sleeve 21 and then inserting the entire connecting sleeve 21 into the connecting hole 112, the installation process can be significantly simplified, direct operation of the temperature measuring element 3 body can be reduced, assembly difficulty and the risk of misoperation can be lowered, and on-site assembly efficiency can be improved.

[0053] It is understandable that the connecting sleeve 21, as an intermediate connecting medium, fits against the inner wall of the connecting hole 112 on its outer periphery, which can play a sealing role to a certain extent, reducing the entry of external gas or impurities into the temperature measuring gap. At the same time, it can block the heat conduction path, reduce thermal interference to the mounting plate 11, and improve the system's thermal isolation capability.

[0054] As an independent component, the connecting sleeve 21 can be customized in size and material according to different application scenarios, which helps to improve the versatility and adaptability of this temperature measuring device in equipment in different industries, and facilitates large-scale promotion and application.

[0055] In some embodiments of this utility model, the upper end of the connecting sleeve 21 is provided with a limiting flange 212, which abuts against the mounting plate 11. Specifically, by setting the limiting flange 212, the connecting sleeve 21 can be physically limited when inserted into the connecting hole 112, effectively preventing over-insertion or improper assembly, ensuring the accurate installation depth of the temperature measuring element 3 on the mounting plate 11, and improving the stability and consistency of the temperature measuring position.

[0056] Understandably, the limiting structure provides a clear assembly reference during the installation process. Operators can judge whether the installation is in place by whether the limiting surfaces are in contact, thereby improving assembly accuracy, reducing operational errors, and facilitating standardized batch assembly operations. The contact between the limiting flange 212 and the upper surface of the mounting plate 11 can form a barrier layer to a certain extent, helping to prevent external impurities and airflow from entering the connection hole 112 and the temperature measurement gap area, reducing external interference and improving detection efficiency.

[0057] In some embodiments of this utility model, the connecting sleeve 21 is provided with a connecting cavity 211, and the connecting component 2 further includes an elastic element 22. The elastic element 22 is disposed in the connecting cavity 211, and the outer periphery of the temperature measuring element 3 is fixedly provided with a protrusion 31. One end of the elastic element 22 abuts against the upper end surface of the protrusion 31, and the other end of the elastic element 22 abuts against the top of the connecting cavity 211.

[0058] Specifically, by applying a downward elastic preload through the elastic element 22, the lower end of the temperature measuring element 3 is always kept in close contact with the heating plate 4, achieving a dynamic clamping function. This effectively eliminates poor contact caused by thermal expansion and contraction, vibration, or installation tolerances, ensuring accurate and real-time temperature measurement. Furthermore, since wafers are brittle materials, rigid contact can easily lead to breakage. In this design, the temperature measuring end 32 achieves elastic contact with the wafer surface through the design of the elastic element 22, reducing rigid contact between the temperature measuring end 32 and the wafer surface, reducing the risk of wafer breakage due to compression, and ensuring test stability. It can be understood that by integrating the elastic element 22 into the connecting cavity 211 of the connecting sleeve 21 and forming a limiting fit with the protrusion 31 of the temperature measuring element 3, the temperature measuring element 3 can achieve self-centering and self-positioning during assembly, improving installation efficiency. When it is necessary to replace the temperature measuring element 3, it can be pulled out as a whole, with a clear structure and simple operation. The protrusion 31 and the elastic element 22 form a two-way limiting structure, which makes it difficult for the temperature measuring element 3 to be pushed out of the connecting sleeve 21 when subjected to reverse external force, thereby enhancing the vibration resistance and anti-loosening performance and improving the reliability and safety of the system.

[0059] This elastic limiting structure is applicable to various specifications of temperature measuring components. The connecting cavity 211, elastic element 22 and protrusion 31 are designed as standard interfaces, which facilitates the modular assembly and maintenance of the temperature measuring device, and improves production efficiency and product versatility.

[0060] In some embodiments of this utility model, multiple connection holes 112 are provided, and the number of temperature measuring element 3 and connection component 2 is the same as the number of connection holes 112.

[0061] Specifically, by setting multiple connection holes 112 and installing temperature measuring elements 3 at each hole, uniform temperature testing of the test piece can be performed, thereby achieving comprehensive monitoring of the temperature distribution of the heating plate 4 and meeting the requirements for evaluating the uniformity of the thermal field. The multi-point deployment of temperature measuring elements 3 can effectively avoid the local errors that may exist in single-point measurement, making the overall temperature detection results more representative and stable, and improving the accuracy of measurement and the robustness of the system.

[0062] It should be noted that the connecting hole 112, the temperature measuring element 3 and the connecting assembly 2 correspond one-to-one, the structural design is clear, and it is easy to assemble and maintain. At the same time, the number of temperature measuring elements 3 can be flexibly increased or decreased according to actual use needs, which has good scalability and engineering adaptability.

[0063] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A temperature measuring device suitable for a heating plate, characterized in that, include: The mounting structure (1) includes a mounting plate (11) having a plurality of connection holes (112). The connecting component (2) is detachably mounted on the mounting plate (11); The temperature measuring element (3) has a temperature measuring end (32). The temperature measuring element (3) is fixedly installed on the mounting plate (11) through the connecting assembly (2). The temperature measuring end (32) passes through the connecting hole (112) and protrudes to the other side of the mounting plate (11) to be suitable for temperature detection.

2. The temperature measuring device for a heating plate according to claim 1, characterized in that, It also includes a housing (5) with a chamber structure (51) formed inside the housing (5) for mounting the heating plate (4), and the mounting plate (11) is located above the heating plate (4).

3. The temperature measuring device for a heating plate according to claim 2, characterized in that, The mounting structure (1) further includes a support column (12) and a fastening connector (13), and the mounting plate (11) is detachably connected to the support column (12) through the fastening connector (13).

4. The temperature measuring device for a heating plate according to claim 3, characterized in that, The support column (12) has a threaded section (121) above it. The fastening connector (13) includes a first nut (131) and a second nut (132). The threaded section (121) passes through the mounting plate (11). The first nut (131) and the second nut (132) are both screwed onto the threaded section (121) and are respectively located on both sides of the mounting plate (11) to fix the mounting plate (11).

5. The temperature measuring device suitable for a heating plate according to claim 3 or 4, characterized in that, The support column (12) is located inside the chamber structure (51) and there are multiple support columns (12). The support columns (12) are distributed on the periphery of the heating plate (4) to facilitate the fixed installation of the mounting plate (11).

6. The temperature measuring device for a heating plate according to claim 1, characterized in that, The mounting plate (11) is provided with a plurality of spray holes (111), which are evenly distributed.

7. The temperature measuring device for a heating plate according to claim 1, characterized in that, The connecting assembly (2) includes a connecting sleeve (21), the temperature measuring element (3) passes through the connecting sleeve (21), and the connecting sleeve (21) is threaded into the connecting hole (112).

8. The temperature measuring device for a heating plate according to claim 7, characterized in that, The upper end of the connecting sleeve (21) is provided with a limiting flange (212), which abuts against the mounting plate (11).

9. The temperature measuring device for a heating plate according to claim 8, characterized in that, The connecting sleeve (21) is provided with a connecting cavity (211), and the connecting assembly (2) further includes an elastic element (22). The elastic element (22) is disposed in the connecting cavity (211). The outer periphery of the temperature measuring element (3) is fixedly provided with a protrusion (31). One end of the elastic element (22) abuts against the upper end face of the protrusion (31), and the other end of the elastic element (22) abuts against the top of the connecting cavity (211).

10. The temperature measuring device for a heating plate according to claim 1, characterized in that, The connection hole (112) is provided in multiple ways, and the number of the temperature measuring element (3) and the connection assembly (2) is the same as that of the connection hole (112).

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