A chip protection film breakage detection device
By designing a chip protective film damage detection device, which utilizes a transmission belt and powder to detect chip surface damage, and combines lighting and a high-definition camera, the problem of low detection efficiency in existing technologies is solved, achieving efficient and automated damage detection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU K-HIRAGAWA ELECTRONIC TECHNOLOGY CO LTD
- Filing Date
- 2025-05-22
- Publication Date
- 2026-07-07
AI Technical Summary
In existing technologies, inspecting the surface of a chip's protective film for defects such as damage, scratches, bubbles, or foreign matter requires visual inspection or the use of magnifying glasses or microscopes. This necessitates individually removing the chip for observation, resulting in low detection efficiency.
A chip protective film damage detection device was designed. The chip is carried through a sealed box by a transmission belt. Powder is evenly spread on the chip surface. Combined with a light and a high-definition camera to capture the differences on the chip surface, the device automatically locates the damaged position and quickly extracts the chip through a limiting sleeve.
It achieves efficient and automated chip protective film damage detection, reducing manual observation time and improving detection accuracy and efficiency.
Smart Images

Figure CN224471561U_ABST