Time-of-flight ranging chip and electronic device
By setting vent holes on the substrate and using a filter sealing structure, the pitting problem caused by the adhesion of volatile organic compounds is solved, ensuring the optical performance and measurement accuracy of the time-of-flight ranging chip.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WEIDAO (SHANGHAI) TECHNOLOGY CO LTD
- Filing Date
- 2025-08-05
- Publication Date
- 2026-07-07
AI Technical Summary
During the packaging process of time-of-flight ranging chips, volatile organic compounds adhere to or deposit on the surface of the filter, resulting in an abnormal appearance of pitted spots and affecting measurement accuracy.
First and second vent holes are provided on the substrate, with the vent holes located at the bottom. First and second light-transmitting holes are provided on the encapsulation cover, and the cover is sealed with first and second filters. Volatile organic compounds are discharged through the vent holes during the baking and curing stage to prevent filter deposition.
It effectively removes volatile organic compounds, prevents the filter from developing pits, ensures optical signal strength and measurement accuracy, and improves the optical performance and measurement accuracy of the system.
Smart Images
Figure CN224471843U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of ranging technology, and in particular to time-of-flight ranging chips and electronic devices. Background Technology
[0002] During the packaging process of time-of-flight ranging chips, the adhesive in the packaging material contains volatile organic compounds (such as esters and aromatic hydrocarbons), which are activated and released during the baking and curing stage. As the gases expand due to heat, these organic compounds escape outwards. In this process, some of these organic compounds may adhere to or deposit on the filter surface, resulting in an abnormal "pockmarked" appearance. Utility Model Content
[0003] Therefore, it is necessary to provide a time-of-flight ranging chip and electronic device to address the problem of pitting that easily occurs in the packaging process of traditional time-of-flight ranging chips.
[0004] On the first side, this application provides a time-of-flight ranging chip, comprising:
[0005] The substrate includes a first region and a second region, wherein the first region has a first vent hole and the second region has a second vent hole.
[0006] A data processing chip is located on the substrate, which simultaneously covers a portion of the first region and a portion of the second region, without obstructing the first exhaust port and the second exhaust port.
[0007] The laser is located in a first region on the substrate and does not obstruct the first exhaust port;
[0008] A package cover is disposed on the substrate and the data processing chip. The package cover includes an edge protrusion connected to the edge of the substrate and a middle protrusion connected to the data processing chip.
[0009] Furthermore, the encapsulation cover is divided into a first space and a second space by the central protrusion. The first space has a first light-transmitting hole, and the second space has a second light-transmitting hole. The first light-transmitting hole is arranged opposite to the laser.
[0010] Furthermore, the encapsulation cover includes a first filter located in a first space and a second filter located in a second space, wherein the first light-transmitting hole is sealed by the first filter and the second light-transmitting hole is sealed by the second filter.
[0011] Furthermore, the encapsulation cover is bonded to the substrate and the data processing chip using adhesive.
[0012] Furthermore, the first vent hole penetrates the substrate and is located at the edge of the first region.
[0013] Furthermore, the second vent hole penetrates the substrate and is located at the edge of the second region.
[0014] Furthermore, a driving circuit is disposed on the substrate, and the laser and the data processing chip are electrically connected to the driving circuit.
[0015] Secondly, this application also provides an electronic device, including the aforementioned time-of-flight ranging chip.
[0016] In the aforementioned time-of-flight ranging chip and electronic device, the substrate includes a first region and a second region. The first region has a first vent hole, and the second region has a second vent hole. The data processing chip covers part of the first region and part of the second region, and the laser is located in the first region. The first and second vent holes penetrate the substrate. Thus, when a device is formed by mounting a package on the substrate, the first and second vent holes are essentially located at the bottom of the entire device. In conventional technology, vent holes are opened at the edge of the filter. During this process, some organic matter may adhere to or deposit on the surface of the filter, resulting in an abnormal appearance of "pockmarks." These "pockmarks" on the filter can weaken or reflect light entering and exiting the filter, thereby affecting the effective light reception of the digital processing chip in the second region. Therefore, in this application, the vent holes are located at the bottom. After the volatile organic compounds in the packaging material are excited and released during the baking and curing stage, they can be discharged from the vent holes located on the substrate, thus preventing pockmarks from appearing on the filter. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the substrate structure in one embodiment;
[0018] Figure 2 This is a schematic diagram showing the laser and data processing chip placed on a substrate in one embodiment.
[0019] Figure 3 This is a schematic diagram illustrating the formation of the adhesive in one embodiment;
[0020] Figure 4 This is a schematic diagram of the encapsulation cover configured in one embodiment.
[0021] Explanation of reference numerals in the attached figures:
[0022] 1. Substrate; 11. First region; 12. Second region; 13. First vent hole; 14. Second vent hole; 21. Laser; 22. Data processing chip; 31. Adhesive; 32. Encapsulation cover; 33. First filter; 34. Second filter; 35. First light-transmitting hole; 36. Second light-transmitting hole. Detailed Implementation
[0023] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.
[0024] See below Figures 1-4 This application provides a time-of-flight ranging chip, comprising: a substrate 1; the substrate 1 includes a first region 11 and a second region 12, the first region 11 having a first vent 13 and the second region 12 having a second vent 14; a data processing chip 22, located on the substrate 1, the data processing chip 22 simultaneously covering part of the first region 11 and part of the second region 12, and not obstructing the first vent 13 and the second vent 14; a laser 21, located on the first region 11 of the substrate 1, and not obstructing the first vent 13; and a package cover 32, covering the substrate 1 and the data processing chip 22, the package cover 32 including an edge protrusion connected to the edge of the substrate 1 and a middle protrusion connected to the data processing chip 22.
[0025] In the aforementioned time-of-flight ranging chip, substrate 1 includes a first region 11 and a second region 12. The first region 11 has a first vent 13, and the second region 12 has a second vent 14. Data processing chip 22 simultaneously covers part of the first region 11 and part of the second region 12, with laser 21 located in the first region 11. The first vent 13 and second vent 14 penetrate substrate 1. Thus, when a device is formed by mounting a package cover 32 on substrate 1, the first vent 13 and second vent 14 are essentially located at the bottom of the entire device. In conventional technology, vents are opened at the edge of the filter. During this process, some organic matter may adhere to or deposit on the filter surface, resulting in an abnormal "pockmarked" appearance. However, placing the vents on the package cover 32 causes the light emitted by laser 21 to be weakened when passing through filter 33 in the first region; and the reflected light to be weakened when passing through filter 34 in the second region. The data processing chip 22 receives the weakened light, resulting in response interference or significant lag. This interferes with the internal photoelectric conversion and algorithm model, leading to a decrease in measurement accuracy. Therefore, in this application, the vent is located at the bottom. After the volatile organic compounds in the encapsulation material are excited and released during the baking and curing stage, they can be discharged from the vent located on the substrate, which can prevent the filter from having pits and ensure measurement accuracy.
[0026] like Figure 1As shown, the substrate 1 includes a first region 11 and a second region 12. The first region 11 has a first vent hole 13, and the second region 12 has a second vent hole 14. A data processing chip 22 is disposed on the substrate 1, and a laser 21 is disposed on the substrate 1. The data processing chip 22 covers part of the first region 11 and part of the second region 12, and the laser 21 is located in the first region 11.
[0027] For example, substrate 1 can be a circuit board. A circuit board (also called a printed circuit board, PCB) is used to support and connect electronic components.
[0028] For example, the first region 11 and the second region 12 are adjacent.
[0029] For example, the first vent 13 and the second vent 14 penetrate the substrate 1.
[0030] The edge of the encapsulation cover 32 is a surrounding protrusion, and the middle part is a protrusion. The edge protrusion is bonded to the adhesive 31 on the edge of the substrate 1, and the middle protrusion is bonded to the adhesive 31 on the data processing chip 22. In this way, when the encapsulation cover 32 is placed on the substrate 1, two independent and isolated spaces are formed, namely the first space and the second space.
[0031] In some embodiments, the encapsulation cover is divided into a first space and a second space by a central protrusion. The first space has a first light-transmitting hole 35, and the second space has a second light-transmitting hole 36. The first light-transmitting hole 35 is disposed opposite to the laser 21.
[0032] The first space has a first light-transmitting aperture 35 for emitting light signals. This light signal is emitted by a laser 21 or a light source assembly, passes through the first light-transmitting aperture 35, and reaches the target object or area after traveling a certain distance. By measuring the propagation time of the light signal, the flight time from emission to reception can be measured, thus enabling precise distance measurement. The second space has a second light-transmitting aperture for receiving light signals reflected from the target object. The second light-transmitting aperture is positioned opposite a receiving photodetector, which captures the reflected or scattered light and calculates the time difference between the received light signal and the actual distance to the target.
[0033] In some embodiments, the encapsulation cover includes a first filter 33 located in a first space and a second filter 34 located in a second space. A first light-transmitting hole 35 is sealed by the first filter 33, and a second light-transmitting hole 36 is sealed by the second filter 34. The first filter 33 is located on the side of the encapsulation cover closer to the laser 21, and the second filter 34 is located on the side of the encapsulation cover closer to the data processing chip 22; the first light-transmitting hole 35 is sealed by the first filter 33, and the second light-transmitting hole is sealed by the second filter 34.
[0034] The first filter 33 is located on the side of the encapsulation cover closest to the laser 21. Its purpose is to filter and regulate the optical signal emitted by the laser 21, ensuring that the optical signal is not interfered with by unnecessary stray light or noise during transmission. The design of the first filter 33 takes into account spectral selectivity, so as to ensure that specific wavelengths emitted by the laser 21 can pass through smoothly, while other unwanted wavelengths or optical frequency bands are effectively filtered out, thereby improving the optical performance of the system.
[0035] The second filter 34 is located on the side of the package cover closest to the data processing chip 22. Its function is to filter the light signal reflected from the target object. By using the second filter 34, it is ensured that only the effective light signal reflected by the target object enters the receiver, avoiding interference from stray light from the background environment or other irrelevant light sources. The wavelength selectivity of the second filter 34 matches that of the first filter 33, thereby ensuring the accuracy of the received signal and the stability of the system.
[0036] In some embodiments, the process of forming a first filter 33 and a second filter 34 on the encapsulation cover includes: forming a first groove and a second groove on the encapsulation cover; forming one or more adhesives 31 around the first groove and the second groove; covering the first filter 33 on the adhesive 31 of the first groove and covering the second filter 34 on the adhesive 31 of the second groove; and heat-treating to cure the adhesive 31, so that the first filter 33 is attached to the first groove and the second filter 34 is attached to the second groove.
[0037] First, a first groove and a second groove are formed on the encapsulation cover to ensure that the first filter 33 and the second filter 34 can precisely align with the light transmission aperture, thereby maximizing light transmission efficiency. The depth and shape of the first and second grooves are typically optimized based on the filter thickness and the system's optical performance requirements. One or more adhesive layers 31 are formed around the first and second grooves. These adhesive layers 31 ensure that the filters are securely fixed within the grooves and provide a good seal to prevent external environmental influences such as dust and moisture from entering the system. Then, the first filter 33 is placed over the adhesive layer 31 in the first groove, and the second filter 34 is placed over the adhesive layer 31 in the second groove. A heat treatment process cures the adhesive layer 31, ensuring that the first filter 33 and the second filter 34 are firmly bonded within the first groove and the second filter 34, respectively. The heat treatment not only allows the adhesive layer 31 to reach optimal curing but also enhances the mechanical strength and optical stability of the adhesive layer.
[0038] In some embodiments, the encapsulation cover 32 is bonded to the substrate 1 and the data processing chip 22 by adhesive 31. Adhesive 31 is formed around the edge of the substrate 1 and on the data processing chip 22.
[0039] Exemplarily, an annular adhesive 31 is formed around the edge of the substrate 1. Optionally, the adhesive 31 may be an organic adhesive 31, generally containing volatile organic compounds (such as esters and aromatic hydrocarbons).
[0040] For example, the adhesive 31 formed on the data processing chip 22 may be a strip.
[0041] Heat treatment cures the adhesive 31, allowing the gases released during curing to escape through the first vent 13 and the second vent 14, respectively. Exemplarily, during the curing process of the adhesive 31, volatile organic compounds can escape through the first vent 13 and the second vent 14. Optionally, volatile organic compounds in the first space can escape through the first vent 13, and volatile organic compounds in the second space can escape through the second vent 14.
[0042] In some embodiments, a first vent 13 penetrates the substrate 1 and is located at the edge of the first region 11. In some embodiments, a second vent 14 penetrates the substrate 1 and is located at the edge of the second region 12.
[0043] By placing the first vent 13 and the second vent 14 at the edge of the substrate 1, interference with the laser 21 and the data processing chip 22 can be avoided. The vents can effectively discharge gases generated inside the package due to temperature changes or during operation. By placing the first vent 13 and the second vent 14 at the edge of the first region 11, direct impact on the working areas of the laser 21 and the data processing chip 22 is avoided, ensuring that the optical performance of these critical components is not affected.
[0044] In some embodiments, a driving circuit is disposed on the substrate 1, and the laser 21 and the data processing chip 22 are electrically connected to the driving circuit.
[0045] In some embodiments, a driving circuit is disposed on the substrate 1, and the laser 21 and the data processing chip 22 are electrically connected to the driving circuit. The driving circuit is used to provide the necessary electrical power and control signals to the laser 21 and the data processing chip 22. The design of the driving circuit is precisely matched with the electrical interface of the laser 21 and the data processing chip 22 to realize signal transmission and control. It provides the laser 21 with appropriate operating voltage and current to ensure that it stably emits optical signals within a specified power range. At the same time, the driving circuit is also responsible for providing the required control signals to the data processing chip 22 to ensure the accuracy of data acquisition, processing and transmission.
[0046] In addition, this application also provides an electronic device including the time-of-flight ranging chip provided in any of the above embodiments.
[0047] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0048] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0049] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0050] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0051] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0052] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0053] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the appended claims.
Claims
1. A time-of-flight ranging chip, characterized in that, include: The substrate includes a first region and a second region, wherein the first region has a first vent hole and the second region has a second vent hole. A data processing chip is located on the substrate, which simultaneously covers a portion of the first region and a portion of the second region, without obstructing the first exhaust port and the second exhaust port. The laser is located in a first region on the substrate and does not obstruct the first exhaust port; A package cover is disposed on the substrate and the data processing chip. The package cover includes an edge protrusion connected to the edge of the substrate and a middle protrusion connected to the data processing chip.
2. The time-of-flight ranging chip according to claim 1, characterized in that, The encapsulation cover is divided into a first space and a second space by the central protrusion. The first space has a first light-transmitting hole, and the second space has a second light-transmitting hole. The first light-transmitting hole is positioned opposite to the laser.
3. The time-of-flight ranging chip according to claim 2, characterized in that, The encapsulation cover includes a first filter located in a first space and a second filter located in a second space. The first light-transmitting hole is sealed by the first filter, and the second light-transmitting hole is sealed by the second filter.
4. The time-of-flight ranging chip according to claim 1, characterized in that, The encapsulation cover is bonded to the substrate and the data processing chip with adhesive.
5. The time-of-flight ranging chip according to claim 1, characterized in that, The first vent hole penetrates the substrate and is located at the edge of the first region.
6. The time-of-flight ranging chip according to claim 1, characterized in that, The second vent hole penetrates the substrate and is located at the edge of the second region.
7. The time-of-flight ranging chip according to claim 1, characterized in that, A driving circuit is disposed on the substrate, and the laser and the data processing chip are electrically connected to the driving circuit.
8. An electronic device, characterized in that, Includes the time-of-flight ranging chip as described in any one of claims 1-7.