Memory module dismounting tool

Abstract

This application relates to the field of memory module technology and discloses a memory module installation and removal tool. The tool includes: a pressing plate with its top surface for applying pressure; a connector located on the bottom surface of the pressing plate, used for inserting the top of the memory module into the slot during installation, allowing the memory module to be inserted into the memory module slot by pressing the pressing plate; and a pressure block located on the bottom surface of the pressing plate and on one side of the connector, with a first and second inclined surface at an angle to each other on the side opposite to the pressing plate. The first inclined surface is located between the second inclined surface and the connector, and during memory module removal, the first inclined surface abuts against the top surface of the second segment of a latch, allowing the latch to rotate and open by pressing the pressing plate. The second inclined surface abuts against the top surface of the first segment of the latch after the latch is opened. The memory module installation and removal tool provided by this application assists in both installing and removing memory modules, making the installation and removal of memory modules easier and more convenient.

Description

Technical Field

[0001] This application relates to the field of memory module technology, specifically to a memory module disassembly and assembly tool. Background Technology

[0002] In electronic devices such as computers and servers, memory modules are installed in memory slots on the motherboard. Memory modules are mostly installed and removed manually. When installing a memory module, you insert it firmly into the slot with your fingers; the latches on both sides of the slot will automatically engage and lock the memory module in place. To remove a memory module, you need to pry open the latches and then pull the memory module out.

[0003] Because memory modules are thin and hard, pressing them down during installation can cause pain or even injure your fingers. Also, the clips on the memory module slots are quite tight, making it difficult to open them.

[0004] In response, although different types of memory module installation and removal tools have appeared on the market, due to the different operation methods for installing and removing memory modules, the current auxiliary tools can only assist in the installation or removal of memory modules in one way, and cannot simultaneously provide assistance for both installation and removal. Utility Model Content

[0005] In view of the above problems, this application provides a memory module installation and removal tool that can assist in both installing and removing memory modules, making the installation and removal of memory modules easier and more convenient.

[0006] This application provides a memory module installation / removal tool for assisting in the installation and removal of memory modules in memory slots. The memory slot has rotatable latches at both ends to secure the memory module. Each latch has a continuous first segment and a second segment. In the closed state, the first segment is horizontal, and the second segment is inclined, with the second segment located outside the first segment. The memory module installation / removal tool includes at least one installation / removal component, comprising: a pressing plate with its top surface for applying pressure; and a connector located on the bottom surface of the pressing plate for insertion within the memory module. When storing the memory module, the insertion part is used for inserting the top of the memory module into the slot by pressing the press plate; the pressure block is provided on the bottom surface of the side of the press plate where the insertion part is located. The side of the pressure block away from the press plate has a first inclined surface and a second inclined surface that are at an angle to each other. The first inclined surface is located between the second inclined surface and the insertion part. When removing the memory module, the first inclined surface is used to abut against the top surface of the second section so that the latch can be opened by pressing the press plate. The second inclined surface is used to abut against the top surface of the first section after the latch is opened.

[0007] In one alternative embodiment, a groove is formed between the connector and the clamping block, the groove being used to press against the top of the outer side of the second segment when the memory module is removed.

[0008] In one alternative embodiment, a pressure block is disposed at one end of the bottom surface of a pressing plate, and the pressing plate extends to form a limiting plate at the side where the pressure block is disposed. The limiting plate is used to abut against the latch on the second memory slot after the latch on the first memory slot is opened into place, wherein the first memory slot and the second memory slot are disposed adjacent to each other.

[0009] In one alternative approach, the first and second slopes are transitioned by a rounded corner.

[0010] In one alternative approach, the size of the pressing plate is larger than the size of the plug-in portion along the width direction, wherein the width direction is the direction perpendicular to the plane where the memory module is located when the memory module is installed.

[0011] In one alternative embodiment, the connector has a receiving groove, which includes a horizontal section and a vertical section that are perpendicular to each other. The horizontal section is located on the bottom surface of the pressing plate, and the vertical section is located on the side of the horizontal section away from the pressing plate. The vertical section is located at one end of the horizontal section. The horizontal section is used to accommodate the horizontal edge of the top corner of the memory module, and the vertical section is used to accommodate the vertical edge of the top corner of the memory module.

[0012] In one alternative embodiment, the connector has a guide structure at its interface that gradually decreases in size from the outside in.

[0013] In one alternative embodiment, the inner sidewall of the connector is provided with a flexible clamping member, which is used to deform under the pressure of the memory module after the memory module is inserted into the connector, so as to clamp it on both sides of the memory module.

[0014] In one alternative approach, the flexible clamp is spherical or hemispherical.

[0015] In one alternative approach, the memory module installation and removal tool includes a pair of mounting and dismounting parts, on which the two ends of the top of the memory module are inserted during memory module installation.

[0016] The memory module installation and removal tool provided in this application mainly consists of a pressing plate, a connector, and a pressure block located at the bottom of the pressing plate. While achieving a small overall size, simple structure, and low manufacturing cost, it assists in both memory module installation and removal. During installation, the top of the memory module is inserted into the connector, and then the pressing plate is pressed to easily insert and lock the memory module into the memory slot. This operation is convenient and avoids pain or scratches caused by directly pressing the top of the memory module with fingers. During removal, the first inclined surface of the pressure block abuts against the second section of the latch, and then the pressing plate is pressed again. This allows the latch to be easily and accurately rotated open. During the opening process, the feedback of the force exerted by the second inclined surface of the pressure block abutting against the first section of the latch makes it easy to determine whether the latch is fully open. Therefore, even when the specific state of the latch is not easily observed, it can be opened accurately in one go.

[0017] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0018] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0019] Figure 1 and Figure 2 Side views of two states during the installation of a memory module into a memory slot;

[0020] Figure 3 for Figure 2 Enlarged view at point A;

[0021] Figure 4 This is a side view of the second segment, which features a stepped structure for the buckle.

[0022] Figure 5 A perspective view of the bottom of the disassembly / reassembly component in the memory module disassembly / reassembly tool provided in this application embodiment;

[0023] Figure 6 A perspective view of the memory module installation and removal tool provided in this application embodiment in a memory module installation scenario;

[0024] Figure 7 A side view of the memory module installation and removal tool provided in this application embodiment during a memory module installation scenario;

[0025] Figure 8 A bottom view of the disassembly / removal component in the memory module disassembly / removal tool provided in the embodiments of this application;

[0026] Figure 9 A perspective view of the top of the disassembly / removal component in the memory module disassembly / removal tool provided in this application embodiment;

[0027] Figure 10 A perspective view of the disassembly / removal component in the memory module disassembly / removal tool provided in this application embodiment;

[0028] Figure 11 A bottom view of the disassembly and assembly component in the memory module disassembly and assembly tool provided in this application embodiment, in the context of installing a memory module and its engagement with the memory module;

[0029] Figure 12 Another bottom-view perspective of the disassembly / removal component in the memory module disassembly / removal tool provided in the embodiments of this application;

[0030] Figure 13 and Figure 14 Side views of the disassembly / removal component in the memory module disassembly / removal tool provided in this application embodiment, in two states during the opening of the latch;

[0031] Figure 15 and Figure 16 Side views of the disassembly component in the memory module disassembly tool provided in this application embodiment during the process of opening the second step-structured latch in two states;

[0032] Figure 17 This is a top view of the memory module disassembly and assembly tool provided in this application embodiment, after the disassembly and assembly component opens the slot on the first memory module slot, and the limiting plate body is in contact with the top of the buckle on the adjacent second memory module slot.

[0033] Figure 18 This is a top view of the disassembly / removal component in the memory module disassembly / removal tool provided in the embodiments of this application.

[0034] The reference numerals in the detailed embodiments are as follows:

[0035] 10. Memory module installation and removal tools; 100. Disassembly and assembly parts;

[0036] 110. Pressing plate; 111. Rough structure; 112. Limiting plate;

[0037] 120. Insertion part; 1201. Receiving groove; 121. Horizontal section; 122. Vertical section; 123. Insertion interface; 124. Guide structure; 125. Flexible clamping component; 126. Abutment surface;

[0038] 130. Press block; 131. First inclined plane; 132. Second inclined plane; 133. Rounded corner;

[0039] 140. Groove;

[0040] 200. Memory slot; 210. Clip; 211. First segment; 212. Second segment;

[0041] 300. Memory module; 310. Card slot. Detailed Implementation

[0042] The embodiments of the technical solution of this application will now be described in detail with reference to the accompanying drawings. These embodiments are only used to more clearly illustrate the technical solution of this application and are therefore merely examples, and should not be used to limit the scope of protection of this application.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application; the terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0044] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0045] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0046] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists, A and B exist simultaneously, and B exists. In addition, the character " / " in this document generally indicates that the related objects before and after it have an "or" relationship.

[0047] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more (including two sets), and "multiple pieces" refers to two or more (including two pieces).

[0048] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0049] In the description of the embodiments of this application, unless otherwise expressly specified and limited, technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.

[0050] Existing auxiliary tools, besides only being able to assist in the installation or removal of memory modules, also suffer from problems such as complex structure and high cost. Therefore, to achieve a single auxiliary tool that can both install and remove memory modules, while also being simple in structure and low in cost, this application proposes a memory module installation and removal tool for assisting in the installation and removal of memory modules in memory slots.

[0051] Specifically, please refer to Figure 1 and Figure 2 , Figure 1 and Figure 2 The diagram shows two states during the process of installing the memory module into the memory slot. First, as shown... Figure 1 As shown, the memory slot 200 has latches 210 at both ends that secure the memory module 300. Please further combine... Figure 3 , Figure 3 It shows Figure 2 In the enlarged structure at point A, the latch 210 has a continuous first segment 211 and a second segment 212. In the closed state as shown in the figure, the first segment 211 is horizontal and the second segment 212 is tilted, with the second segment 212 located outside the first segment 211. It should be noted that the latch 210 of memory slots 200 on the market has different shapes; some latches 210 have a second segment 212 that is... Figure 3 The inclined plate-like structure shown, and the second section 212 on some of the buckles 210 are Figure 4 The stepped structure shown is also inclined to facilitate opening under force. Regardless of the type of latch 210, the memory module installation / removal tool 10 provided in this embodiment can assist in opening the latch 210.

[0052] like Figure 1 As shown in the diagram, when installing memory module 300, first align memory module 300 with memory module slot 200, then press memory module 300 down in the direction indicated by the arrow above it to insert it into memory module slot 200. Once memory module 300 is in place, it will automatically rotate and close the latches 210 on both sides in the direction indicated by the arrow above them, thus engaging the latches 210 with the slots 310 on both sides of memory module 300 to lock the memory module 300 in place. Figure 2 The state shown. When removing the memory module, in... Figure 3 Based on the state shown, first move the latch 210 in the direction of the arrow in the figure to open it, and then pull the memory stick 300 out of the memory stick slot 200.

[0053] The above is an introduction to the installation, removal, and locking of memory module 300 in memory module slot 200. The following is a description of the structure and usage of the memory module installation and removal tool provided in this application embodiment.

[0054] Please see Figure 5 The figure shows a three-dimensional view of the bottom of the memory module installation / removal tool 10 provided in this embodiment of the application. As shown in the figure, the memory module installation / removal tool 10 includes at least one installation / removal component 100, which includes a pressing plate 110 and a plug-in portion 120. The top surface of the pressing plate 110 (…) Figure 5 The covered side of the pressing plate 110 is used for applying pressure, which can be done by pressing directly with fingers or by using a pressing tool. The insertion part 120 is provided on the bottom surface of the pressing plate 110. Specifically, the pressing plate 110 and the insertion part 120 can be an integral structure, or they can be assembled and fixed to each other by means of threaded fasteners, snap-fit, etc., which is not limited here.

[0055] Please see Figure 6 and Figure 7 The figures show side views of the perspective view of the assembly / disassembly component 100 and the memory module 300 in their mating state when the memory module 300 is installed. When the memory module 300 is installed, the insertion portion 120 accommodates the top of the memory module 300, forming... Figure 6 and Figure 7 The state shown, in which, by along Figure 7 Apply pressure to the pressing plate 110 in the direction indicated by the middle arrow to insert and press the memory module 300 into the memory module slot 200, thus completing the installation of the memory module 300.

[0056] exist Figure 6 and Figure 7 In the specific embodiment shown, the memory module installation and removal tool 10 includes a pair of installation and removal parts 100. The pair of installation and removal parts 100 have the same structure. When installing the memory module 300, the plug-in parts 120 on the pair of installation and removal parts 100 are respectively inserted into the two ends of the top of the memory module 300. With this setting, the memory module 300 can be inserted into the memory module slot 200 by pressing the pressing plate 110 of one of the installation and removal parts 100 with each hand. Moreover, when force is applied at both ends, it can be ensured that the memory module 300 is subjected to uniform force and is not prone to tilting.

[0057] In addition, Figures 5 to 7 In the specific embodiment shown, the insertion part 120 is provided with a receiving groove 1201. The receiving groove 1201 includes a horizontal section 121 and a vertical section 122 that are perpendicular to each other. The horizontal section 121 is disposed on the bottom surface of the pressing plate 110, and the vertical section 122 is disposed on the side of the horizontal section away from the pressing plate 110. The vertical section 122 is located at one end of the horizontal section 121, thereby making the insertion part 120 form an inverted "L" shaped slot structure. When installing the memory module 300, the horizontal segment 121 is used to insert the horizontal edge of the top corner of the memory module 300, and the vertical segment 122 is used to insert the vertical edge of the top corner of the memory module 300. With this arrangement, not only can the disassembly component 100 be connected to the top of the memory module 300, but also the mutual abutment between the inner wall of the vertical segment 122 and the vertical edge of the top corner of the memory module 300 can prevent the disassembly component 100 from sliding along the edge of the top of the memory module 300 due to the force when pressing the pressing plate 110, thereby ensuring the reliability of the installation operation.

[0058] Of course, in some other embodiments, the memory module installation and removal tool 10 may also include only one installation and removal component 100. Accordingly, the slot in the insertion part 120 of this installation and removal component 100 needs to be through on both sides to ensure that the middle position of the top edge of the memory module 300 can be inserted into the insertion part 120, so that by applying force to the pressing plate 110, the memory module 300 can be pressed and installed in the middle position.

[0059] Compared to the method of installing the memory module 300 by directly pressing the top edge with fingers, this memory module installation / removal tool 10 uses the front of the pressing plate 110 as the force-bearing surface, which effectively increases the force-bearing area. This makes it not only easier to apply force when installing by pressing with fingers, but also provides good protection for the fingers, avoiding pain or even scratches. In addition, by inserting the top of the memory module 300 into the guide connector 120, the accuracy of the direction of force when applying force to the memory module 300 through the pressing plate 110 can be ensured, achieving reliable installation of the memory module 300.

[0060] It should be noted that the text and accompanying figures illustrate the installation method of the memory module 300 being inserted vertically downwards into the memory module slot 200, and the removal method of the memory module 300 being pulled vertically upwards from the memory module slot 200. Descriptions of orientations such as "top," "bottom," "horizontal," and "vertical" are also based on this installation and removal method. However, this explanation is merely to clearly illustrate the principle behind the auxiliary function of the memory module installation and removal tool 10. It does not mean that the memory module installation and removal tool 10 can only provide assistance when the memory module 300 is installed or removed vertically. For installation and removal of the memory module 300 in the memory module slot 200 in a horizontal or other inclined direction, the memory module installation and removal tool 10 can also provide assistance, and the principle is the same as for vertical installation and removal. Simply adjust the angle and force direction of the memory module installation and removal tool 10 according to the angle of the memory module 300 and the clip 210. For installing or removing memory module 300 in memory slot 200 along a horizontal or other inclined direction, the "top", "bottom", "horizontal", "vertical" and other orientations described in the text correspond to changes in the angle of memory module 300.

[0061] To ensure that the user's fingers can apply more pressure to the press plate 110 during installation, such as Figure 8 As shown from the bottom view of the detachable component 100, along the width direction (indicated by the double arrow X in the figure), the dimension D1 of the pressing plate 110 can be set to be larger than the dimension D2 of the insertion part 120, such as... Figure 6 As shown, the width direction is perpendicular to the plane where the memory module 300 is located when it is installed. The purpose of this setting is to widen the pressure plate 110, ensuring that the user's fingers can be fully in contact with the front of the pressure plate 110 when pressing, avoiding pain or even scratches caused by the edges of the pressure plate 110 when the fingers are pressed.

[0062] Considering that during installation, the pressure plate 110 will mostly be pressed with the thumb, and the thumb is the widest of all fingers, to ensure comfort when pressing with the thumb, the width dimension D1 of the pressure plate 110 can be set to be wider than the width of the thumb, for example, 1.6 cm or more. The length dimension D3 of the pressure plate 110 (e.g., ...) Figure 8 (As shown) can be set to about 4cm to ensure that the assembly / disassembly part 100 has a small overall volume.

[0063] In addition, to prevent fingers from slipping and getting injured when applying force to the pressure plate 110, such as... Figure 9As shown in the three-dimensional structure from the top view of the middle assembly 100, the front of the pressing plate 110 can be provided with a rough structure 111. The rough structure 111 can be a multi-ring engraved line as shown in the figure, or it can be a textured surface, a rough rubber pad, etc. Its main purpose is to increase the friction between the finger and the pressing plate 110 and prevent slippage when pressing.

[0064] Since the memory module 300 has storage chips and transistors on both sides, to prevent scratches or damage to the storage chips or transistors during insertion into the connector 120, such as... Figure 5 As shown, the insertion portion 120 may have a guide structure 124 that gradually decreases in size from the outside to the inside at its insertion interface 123. Specifically, the guide structure 124 may be... Figure 5 The arc surface shown can also be a slope. During the process of inserting the memory module 300 into the connector 120, the guide structure 124 can guide the memory module 300. On the one hand, it can ensure that the memory module 300 is inserted smoothly, and on the other hand, it can prevent the memory module 300 from being damaged due to collision or friction with the edge of the connector 123.

[0065] To ensure a reliable connection between the connector 120 and the memory module 300, please refer to [link / reference needed]. Figure 10 The figure shows the internal structure of the insertion part 120 from another bottom view. As shown, the inner sidewall of the insertion part 120 may be provided with flexible clamping members 125. Please refer to further details. Figure 11 The image shows the memory module 300 inserted into the connector 120 from a bottom view. After the memory module 300 is inserted into the connector 120, the flexible clamping member 125 will deform under the pressure of the memory module 300, thereby clamping it on both sides of the memory module 300. This ensures that the disassembly / removal member 100 is firmly connected to the memory module 300, providing stability for the subsequent pressing and installation of the memory module 300.

[0066] The flexible clamping component 125 can be made of materials such as silicone, rubber, or foam, and is fixed to the inner wall of the insertion part 120 by means of adhesive. By using the flexible clamping component 125 to clamp the memory module 300 on both sides, it can be ensured that the memory module 300 will not be damaged.

[0067] Since the flexible clamping members 125 need to be clamped on both sides of the memory module 300 after insertion, the distance between the two flexible clamping members 125 in the undeformed state needs to be less than the thickness of the memory module 300. Specifically, most memory modules 300 have a circuit board thickness of 1.6mm, and some memory modules 300 may have a thicker circuit board. In order to accommodate memory modules 300 of different thicknesses, the distance D4 between the two flexible clamping members 125 in the undeformed state (e.g., ...) is... Figure 8 (As shown in the figure) can be set to less than 1.5mm to ensure that the memory module 300 can be effectively clamped.

[0068] Therefore, in order for the memory module 300 to slide better between the two opposing flexible clamping members 125 and be clamped, as Figure 10 As shown, the flexible clamping member 125 can be hemispherical as shown in the figure, or it can be spherical. The purpose of this setting is to ensure that after the memory stick 300 is inserted into the plug-in part 120, it can smoothly enter the two opposing flexible clamping members 125, and further squeeze the two opposing flexible clamping members 125 to clamp the memory stick 300.

[0069] The above content mainly introduces the auxiliary installation of the Memory Module 300. The following section introduces the auxiliary removal of the Memory Module 300.

[0070] As mentioned above, removing the memory module 300 is particularly difficult, especially when prying open the clip 210. Please refer to the previous section for further details. Figure 5 The assembly / disassembly component 100 may also include a pressure block 130, which is disposed on the bottom surface of the pressing plate 110 and located on one side of the insertion part 120. Similarly, the pressing plate 110, the insertion part 120 and the pressure block 130 may be an integral structure, or they may be assembled and fixed to each other by means of threaded fasteners, snap-fit, etc.

[0071] Please see Figure 12 The figure shows a three-dimensional structure of the disassembly component 100 from another bottom view. As shown in the figure, the pressure block 130 has a first inclined surface 131 and a second inclined surface 132 that are at an angle to each other on the side opposite to the pressing plate 110. The first inclined surface 131 is located between the second inclined surface 132 and the insertion part 120.

[0072] Please see Figure 13 and Figure 14 The diagram shows the side structure of component 100 in two states during the opening of latch 210. When disassembling memory module 300, the first inclined surface 131 first abuts against the second segment 212, forming... Figure 13 In the state shown, when the pressing plate 110 is pressed in the direction indicated by the straight arrow in the diagram, the pressing block 130 will cause the latch 210 to rotate and open along the arc arrow in the diagram. Considering the limited space when removing memory modules in the case, and that the latch 210 may be obstructed by the disassembly / removal component 100 and the user's hand, it is not easy to observe whether the latch 210 is open. Therefore, please refer to... Figure 14 After the buckle 210 is fully opened, it appears as follows: Figure 14 The state shown is from Figure 14As can be seen, after the buckle 210 is fully opened, the second inclined surface 132 abuts against the top surface of the first segment 211. This design allows the user to determine that the buckle 210 is fully opened by the feedback of the force exerted after the first segment 211 abuts against the second inclined surface 132, thus avoiding situations such as the buckle 210 not being fully opened and failing to be disassembled, or being damaged due to excessive manipulation.

[0073] Specifically, the included angle α between the first inclined surface 131 and the second inclined surface 132 can be set to 120°, for example. Of course, α can also be set to other angles, as long as it can ensure that the top surface of the first segment 211 can abut against the second inclined surface 132 after the buckle 210 is fully opened.

[0074] Similarly, for the second paragraph 212, Figure 4 For the step structure of the buckle 210 shown, please refer to [link / reference]. Figure 15 and Figure 16 The disassembly method is the same as described above, so it will not be repeated here.

[0075] During the process of opening the clip 210, the disassembly part 100 and the clip 210 will be from Figure 13 The coordination state changes to Figure 14 The shown engagement state involves the pressure block 130 changing from a state where the first inclined surface 131 abuts against the top surface of the second segment 212 to a state where the second inclined surface 132 abuts against the top surface of the first segment 211. During this process, to ensure a smooth transition and maintain good contact between the pressure block 130 and the top surface of the latch 210, as follows... Figure 12 As shown, the first inclined surface 131 and the second inclined surface 132 can be transitioned by a fillet 133.

[0076] To better disassemble clip 210, such as Figure 12 and Figure 13 As shown, a groove 140 can be formed between the plug-in portion 120 and the pressure block 130. The groove 140 is used to press against the top of the outer side of the second segment 212 when the memory module 300 is removed. Specifically, the surface of the plug-in portion 120 facing the pressure block 130 is the abutment surface 126. The first inclined surface 131 and the abutment surface 126 are configured such that the shape of the space formed between them matches the contour of the outer top of the second segment 212. That is, when the memory module 300 is removed, while the first inclined surface 131 abuts against the second segment 212, the abutment surface 126 can abut against the outer side of the second segment 212, so that the first inclined surface 131 and the abutment surface 126 cooperate with each other and together form a limiting engagement with the second segment 212, ensuring that the disassembly component 100 will not slip off the second segment 212 during the process of pressing to open the latch 210, thus ensuring that the latch 210 can be effectively opened. This configuration is suitable for... Figure 15 and Figure 16 The illustrated embodiments are also applicable.

[0077] Due to the different models or specifications of the buckle 210, the included angle β between the top surface and the outer surface of the second segment 212 (e.g.) Figure 13 The angles shown in the figures are not entirely the same. Taking the buckle 210 with β = 60° as an example, the included angle θ between the first inclined surface 131 and the abutment surface 126 can also be set to 60° to ensure better engagement and locking with the second segment 212 during disassembly. Of course, in some other embodiments, it can also be set to θ = β ± 0.5° or θ = β ± 1°, etc. By setting θ to be slightly greater than β, it can be ensured that the top outer side of the second segment 212 can more smoothly extend into the space between the first inclined surface 131 and the abutment surface 126 and form a locking and locking mechanism.

[0078] To prevent damage to the clip 210 due to excessive prying during the removal of the memory module 300, this application also proposes an implementation method, which can be found in conjunction with [the specific implementation details]. Figure 9 and Figure 11 The pressure block 130 is disposed at one end of the bottom surface of the pressing plate 110, and the pressing plate 110 extends to form a limiting plate 112 at the side where the pressure block 130 is disposed. The limiting plate 112 can be integrally formed with the pressing plate 110 as shown in the figure, or it can be assembled and fixed by means of bonding, threaded fastener connection, snap-fit, etc.

[0079] Please refer to further information. Figure 17 On the motherboard, there are usually multiple memory slots 200. After the latch 210' on the first memory slot 200' is opened into place by the disassembly and assembly component 100, the limiting plate 112 will abut against the latch 210' on the second memory slot 200". Thus, the latch 210' on the second memory slot 200" will restrict the disassembly and assembly component 100 from moving further downward to prevent damage caused by excessively bending the latch 210' on the first memory slot 200'.

[0080] It should be noted that, in Figure 17 In the specific embodiment shown, three or more memory slots 200 are arranged, with the first memory slot 200' in the middle position. Correspondingly, there are second memory slots 200" on both sides. Limiting plates 112 are provided on opposite sides of the pressing plate 110. After the latch 210' on the first memory slot 200' is opened into place, the limiting plates 112 will abut against the latches 210" on the second memory slots 200" on both sides for limiting. When the first memory slot 200' is at the edge position, or when there are only two memory slots 200 arranged, the limiting plate 112 on one side abuts against the latches 210" on the second memory slot 200" for limiting. Of course, in such cases, the limiting plate 112 can also be provided on only one side of the pressing plate 110.

[0081] Considering the small distance between the memory slots 200 and the limited space inside the chassis, to prevent the limiting plate 112 from excessively occupying the space near the memory slots 200 and interfering with other surrounding components, the limiting plate 112 can be set as follows: Figure 17 The shape shown is narrow and pointed.

[0082] Please refer to further information. Figure 18 For most memory slots on the market with multiple slots arranged in a 200 pattern, it is more appropriate to set the protrusion D5 of the limiting plate 112 relative to the pressing plate 110 to 3mm.

[0083] In summary, the memory module installation and removal tool 10 provided in this application mainly consists of a pressing plate 110, a plug-in part 120 and a pressing block 130 disposed at the bottom of the pressing plate 110. While achieving a small overall product size, simple structure, and low manufacturing cost, it can assist in both the installation and removal of the memory module 300. During installation, the top of the memory module 300 is inserted into the plug-in part 120, and then the pressing plate 110 is pressed to easily insert and lock the memory module 300 into the memory module slot 200. This operation is convenient and avoids pain or scratches caused by directly pressing the top of the memory module 300 with fingers. During disassembly, the first inclined surface 131 on the pressure block 130 abuts against the second section 212 on the buckle 210, and then the pressing plate 110 is pressed down in the same way. The buckle 210 can be easily and accurately rotated and opened. During the opening process, the feedback of the force after the second inclined surface 132 on the pressure block 130 abuts against the first section 211 on the buckle 210 can easily determine that the buckle 210 has been opened in place. Thus, even when it is not easy to observe the specific state of the buckle 210, the buckle 210 can be opened in place accurately in one go.

[0084] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way.

Claims

1. A memory module installation and removal tool for assisting in the installation and removal of memory modules in memory module slots, wherein the memory module slots are rotatably provided with latches for securing the memory modules at both ends, each latch having a continuous first segment and a second segment, wherein in the closed state, the first segment is horizontal, the second segment is inclined, and the second segment is located outside the first segment, characterized in that... The memory module disassembly and assembly tool includes at least one disassembly and assembly component, which includes: A pressing plate, the top surface of which is used for applying force to press; A plug-in portion is provided on the bottom surface of the press plate. When installing the memory module, the plug-in portion is used for the top of the memory module to be inserted into it, so that the memory module can be inserted into the memory module slot by pressing the press plate. A pressure block is disposed on the bottom surface of the side of the pressing plate where the insertion part is located. The side of the pressure block away from the pressing plate has a first inclined surface and a second inclined surface that are at an angle to each other. The first inclined surface is located between the second inclined surface and the insertion part. When the memory module is disassembled, the first inclined surface is used to abut against the top surface of the second segment so that the buckle can be rotated open by pressing the pressing plate. The second inclined surface is used to abut against the top surface of the first segment after the buckle is opened.

2. The memory module disassembly and assembly tool according to claim 1, characterized in that, A groove is formed between the plug and the pressure block, and the groove is used to press against the top of the outer side of the second section when the memory module is removed.

3. The memory module disassembly and assembly tool according to claim 1, characterized in that, The pressure block is disposed at one end of the bottom surface of the pressing plate. The pressing plate extends to form a limiting plate on the side where the pressure block is disposed. The limiting plate is used to abut against the buckle on the second memory slot after the buckle on the first memory slot is opened into place. The first memory slot and the second memory slot are disposed adjacent to each other.

4. The memory module disassembly and assembly tool according to claim 1, characterized in that, The first inclined plane and the second inclined plane are connected by a rounded corner.

5. The memory module disassembly and assembly tool according to claim 1, characterized in that, Along the width direction, the size of the pressing plate is larger than the size of the plug-in portion, wherein the width direction is the direction perpendicular to the plane where the memory module is located when the memory module is installed.

6. The memory module disassembly and assembly tool according to claim 1, characterized in that, The insertion part is provided with a receiving groove, which includes a horizontal section and a vertical section that are perpendicular to each other. The horizontal section is located on the bottom surface of the pressing plate, and the vertical section is located on the side of the horizontal section away from the pressing plate, with the vertical section located at one end of the horizontal section. The horizontal section is used to accommodate the horizontal edge of the top corner of the memory module, and the vertical section is used to accommodate the vertical edge of the top corner of the memory module.

7. The memory module disassembly and assembly tool according to claim 1, characterized in that, The connector has a guide structure at its interface where the opening gradually decreases from the outside to the inside.

8. The memory module disassembly and assembly tool according to claim 1, characterized in that, The inner sidewall of the plug-in portion is provided with flexible clamping members. The flexible clamping members are used to deform under the pressure of the memory module after the memory module is inserted into the plug-in portion, so as to clamp the two sides of the memory module.

9. The memory module disassembly and assembly tool according to claim 8, characterized in that, The flexible clamping element is spherical or hemispherical.

10. The memory module disassembly and assembly tool according to any one of claims 1-9, characterized in that, The memory module installation and removal tool includes a pair of installation and removal components. When installing the memory module, the insertion portions on the pair of installation and removal components are respectively inserted into the two ends of the top of the memory module.

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