Test apparatus for testing the bonding effect of flash memory

Abstract

The utility model discloses a testing device of testing flash memory bonding effect, include: testing device main part, including base, auxiliary frame, lift air cylinder and clamping groove, the upper end of base is installed with control panel, the output of lift air cylinder is connected with lift seat, the bottom of lift seat is connected with mobile seat, and the junction of lift seat and mobile seat is provided with horizontal movement mechanism, one side of mobile seat is connected with shearing cutter, clamping assembly sets up inside clamping groove, can solve the positioning of chip of fixed size mechanical clamp of bonding test device of prior art usually adopts, in practical application, artificial dependence is strong, and operating personnel need to change clamp frequently according to chip specification, and it is time -consuming and labor -saving, and simultaneously, artificial clamping positioning precision is insufficient, and manual clamping is easy to produce the deviation of position, leads to the contact misalignment of shearing cutter and bonding point, thereby can not reach the problem of test demand.

Description

Technical Field

[0001] This utility model relates to the field of flash memory chip bonding testing technology, and in particular to a testing device for testing the bonding effect of flash memory. Background Technology

[0002] Testing equipment for flash memory bonding is a specialized device used to evaluate the quality of the bonding process during flash memory chip manufacturing. Flash memory bonding is a key step in chip packaging, which connects the chip to components such as the substrate and lead frame through physical or chemical means, while testing equipment is used to verify the reliability of the connection.

[0003] Existing bonding testing devices typically use fixed-size mechanical fixtures to position the chip. In practical applications, this is highly dependent on manual labor, and operators need to frequently change fixtures according to chip specifications, which is time-consuming and labor-intensive. At the same time, manual clamping and positioning accuracy is insufficient, and manual clamping is prone to positional deviations, resulting in inaccurate contact between the shearing blade and the bonding point, thus failing to meet testing requirements. Utility Model Content

[0004] This invention provides a testing device for testing the bonding effect of flash memory. It can solve the problems of existing bonding testing devices, which usually use mechanical fixtures of fixed size to position the chip. In practical applications, these devices are highly dependent on manual labor. Operators need to frequently change the fixtures according to the chip specifications, which is time-consuming and labor-intensive. At the same time, manual clamping and positioning accuracy is insufficient. Manual clamping is prone to positional deviation, which leads to inaccurate contact between the shearing blade and the bonding point, thus failing to meet the testing requirements.

[0005] This utility model provides a testing device for testing flash memory bonding performance, comprising:

[0006] The main body of the testing device includes a base, an auxiliary frame, a lifting cylinder, and a clamping groove. The auxiliary frame is located at the upper end of the base. A control panel is installed at the upper end of the base. The output end of the lifting cylinder is connected to a lifting seat. A movable seat is connected to the bottom of the lifting seat. A lateral moving mechanism is provided at the connection between the lifting seat and the movable seat. A shearing blade is connected to one side of the movable seat.

[0007] A clamping assembly is disposed inside a clamping groove, including a groove formed inside the clamping groove, and a guide hole formed in the middle of the groove. A moving hole is formed inside the clamping groove. A clamping plate is disposed inside the clamping groove, and a protrusion and a moving rod are connected to one side of the clamping plate. A toothed groove is formed at the upper end of the moving rod. A pressure sensor is disposed on the other side of the clamping plate. A connecting box is disposed at the upper end of the base, and a self-locking motor is disposed on the outside of the connecting box. A drive gear is connected to the output end of the self-locking motor. A driven gear is disposed inside the connecting box, and a connecting shaft is disposed in the middle of the driven gear.

[0008] In the testing device for testing flash memory bonding effect according to one embodiment of the present invention, the auxiliary frame and the base are an integral structure, and the output end of the lifting cylinder is fixedly connected to the lifting seat.

[0009] In a test device for testing flash memory bonding effect according to an embodiment of the present invention, the lateral movement mechanism includes a servo motor fixed on one side of the lifting seat, a threaded rod is provided inside the lifting seat, and a threaded seat adapted to the threaded rod is fixedly connected to the top of the moving seat.

[0010] In a test device for testing flash memory bonding effect according to an embodiment of the present invention, the upper end of the movable seat is provided with a guide seat, and the number of guide seats is two sets and symmetrically distributed. The bottom of the lifting seat is provided with a guide groove that matches the guide seat.

[0011] In a test device for testing flash memory bonding effect according to an embodiment of the present invention, a pressure sensor is installed in the middle of the movable base, and the pressure sensor is electrically connected to the control panel. The control panel is provided with control buttons and a display screen on the outside, and a control circuit board and a battery are provided inside the control panel.

[0012] In a test device for testing flash memory bonding effect according to an embodiment of the present invention, an auxiliary hole is provided in the middle of the movable base, and an auxiliary rod adapted to the auxiliary hole is fixedly connected to one side of the shearing blade.

[0013] In the testing device for testing flash memory bonding effect according to one embodiment of the present invention, the groove, guide hole and moving hole are all connected to the clamping groove, and a guide rod adapted to the guide hole is fixedly connected to one side of the protrusion.

[0014] In a test device for testing flash memory bonding effect according to an embodiment of the present invention, the moving hole and the moving rod are adapted to each other, the middle part of the connecting box is provided with a rotating inner cavity that communicates with the moving hole, and the output end of the self-locking motor is fixedly connected to the drive gear.

[0015] In the testing device for testing the bonding effect of flash memory according to one embodiment of the present invention, the driving gear and the driven gear mesh with each other, and the driven gear meshes with the tooth groove. The driven gear is connected to the rotating inner cavity through a connecting shaft. An electromagnet is installed in the middle of the clamping groove, and the electromagnet is electrically connected to the control panel.

[0016] The technical solution provided in this application embodiment can include the following beneficial effects: This application designs a testing device for testing the bonding effect of flash memory, which can solve the problem that the existing bonding testing device usually uses a fixed-size mechanical fixture to position the chip. In practical applications, it is highly dependent on manual labor. Operators need to frequently change the fixture according to the chip specifications, which is time-consuming and labor-intensive. At the same time, the positioning accuracy of manual clamping is insufficient, and manual clamping is prone to positional deviation, which leads to inaccurate contact between the shearing blade and the bonding point, thus failing to meet the testing requirements.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a testing device for testing flash memory bonding effect provided in an embodiment of this application;

[0020] Figure 2 yes Figure 1 A partially disassembled schematic diagram of the test apparatus for testing flash memory bonding performance;

[0021] Figure 3 yes Figure 2 Enlarged view of point A in the middle;

[0022] Figure 4 yes Figure 1 A schematic diagram of the moving base and shearing blade in the testing device for testing flash memory bonding performance;

[0023] Figure 5 This is a side view of the test apparatus used to test the bonding effect of flash memory in section 1;

[0024] Figure 6 yes Figure 5 A schematic diagram of a partial lateral section of the AA structure. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0026] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0027] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0028] like Figures 1 to 6 As shown, this application provides a testing device for testing flash memory bonding performance. The main body 100 of the testing device includes a base 10, an auxiliary frame 20, a lifting cylinder 30, and a clamping groove 80. The auxiliary frame 20 is located at the upper end of the base 10, and a control panel 11 is installed at the upper end of the base 10. The output end of the lifting cylinder 30 is connected to a lifting seat 40, and a movable seat 60 is connected to the bottom of the lifting seat 40. A transverse moving mechanism 50 is provided at the connection between the lifting seat 40 and the movable seat 60. A shearing blade 70 is connected to one side of the movable seat 60. The clamping assembly 90 is disposed inside the clamping groove 80, including a groove 91 formed inside the clamping groove 80. A guide hole 92 is provided in the middle of the groove 91, a moving hole 93 is provided inside the clamping groove 80, a clamping plate 94 is provided inside the clamping groove 80, and a protrusion 95 and a moving rod 97 are connected to one side of the clamping plate 94. A toothed groove 98 is provided at the upper end of the moving rod 97. A pressure sensor 99 is provided on the other side of the clamping plate 94. A connecting box 910 is provided at the upper end of the base 10, and a self-locking motor 911 is provided on the outside of the connecting box 910. A drive gear 912 is connected to the output end of the self-locking motor 911. A driven gear 913 is provided inside the connecting box 910, and a connecting shaft 914 is provided in the middle of the driven gear 913.

[0029] After adopting the above technical solution, since the clamping component 90 is located inside the clamping slot 80, before testing the flash memory chip, it is placed inside the clamping slot 80 and automatically clamped by the clamping component 90. Then, the control panel 11 controls the output end of the lifting cylinder 30 to drive the lifting seat 40, the lateral moving mechanism 50, the moving seat 60, and the shearing blade 70 to descend until one side of the shearing blade 70 contacts the bonding area on the outside of the chip. The control panel 11 controls the output end of the servo motor 51 to drive the threaded rod to rotate along the middle of the threaded seat 52, so that the threaded seat 52 drives the moving seat 60 to move laterally, further squeezing the shearing blade 70 against the bonding area, thus shearing... The blade 70 drives the auxiliary rod 63 to move along the inside of the auxiliary hole 62. At the same time, the pressure sensor 61 detects the pressure. When the bonding area detaches from the pad or breaks, the pressure sensor 61 detects a sudden drop in force. The control circuit board marks the maximum force at this time as the bonding strength, thus completing the bonding strength test of the flash memory chip. This solves the problem that existing bonding testing devices usually use fixed-size mechanical fixtures to position the chip. In practical applications, this is highly dependent on manual operation. Operators need to frequently change fixtures according to chip specifications, which is time-consuming and labor-intensive. At the same time, manual clamping and positioning accuracy is insufficient. Manual clamping is prone to positional deviations, which leads to inaccurate contact between the shearing blade and the bonding point, thus failing to meet the testing requirements.

[0030] It should be noted that when the chip needs to be clamped, it is placed in the center of the clamping groove 80. The output ends of the two sets of self-locking motors 911 are controlled by the control panel 11 to simultaneously drive the drive gear 912 and the driven gear 913 to mesh. Under the support of the connecting shaft 914, the driven gear 913 meshes along the outside of the tooth groove 98, thereby driving the moving rod 97 to move along the inside of the moving hole 93. At the same time, the two sets of clamping plates 94 move relative to each other, so that the clamping plate 94 drives the protrusion 95 to disengage from the inside of the groove 91. At the same time, the guide rod 96 slides along the inside of the guide hole 92 until the pressure sensor 99 presses against the outside of the chip, detecting the clamping force. After reaching the set range value, the feedback is sent to the control circuit board, which then controls the output end of the self-locking motor 911 to self-lock, thereby positioning the clamping plate 94 and further positioning the chip, which facilitates the subsequent bonding strength test and improves the stability of the chip's subsequent testing.

[0031] In an optional embodiment, the auxiliary frame 20 and the base 10 are an integral structure, and the output end of the lifting cylinder 30 is fixedly connected to the lifting seat 40, which facilitates the lifting of the lifting seat 40 and further improves the lifting of the moving seat 60 and the shearing blade 70.

[0032] In an optional embodiment, the lateral movement mechanism 50 includes a servo motor 51 fixed to one side of the lifting seat 40. The lifting seat 40 has a threaded rod inside. The top of the moving seat 60 is fixedly connected to a threaded seat 52 that is compatible with the threaded rod. This mechanism can drive the moving seat 60 and the shearing blade 70 to move laterally, and can test the strength of the chip bonding area.

[0033] In one optional embodiment, the upper end of the movable seat 60 is provided with a guide seat 53, and there are two sets of guide seats 53 symmetrically distributed. The bottom of the lifting seat 40 is provided with a guide groove that matches the guide seat 53, so as to ensure the stability of the shearing blade 70 during the lateral movement.

[0034] In an optional embodiment, a pressure sensor 61 is installed in the middle of the movable seat 60, and the pressure sensor 61 is electrically connected to the control panel 11. The control panel 11 is provided with control buttons and a display screen on the outside, and a control circuit board and a battery are provided inside the control panel 11, which is beneficial for detecting the squeezing force between the shearing blade 70 and the bonding area, and for facilitating the judgment of its bonding strength.

[0035] In one optional embodiment, the movable base 60 has an auxiliary hole 62 in the middle, and an auxiliary rod 63 that matches the auxiliary hole 62 is fixedly connected to one side of the shearing blade 70. This rod can guide the shearing blade 70 during testing and ensure that the shearing blade 70 can perform testing operations smoothly.

[0036] In an optional embodiment, the groove 91, the guide hole 92, and the moving hole 93 are all connected to the clamping groove 80. A guide rod 96 that is adapted to the guide hole 92 is fixedly connected to one side of the protrusion 95, thereby ensuring that the clamping plate 94 can slide along the inside of the guide hole 92 through the guide rod 96 during the movement, so that the clamping plate 94 is stable during operation.

[0037] In one optional embodiment, the movable hole 93 is adapted to the movable rod 97, and the middle part of the connecting box 910 is provided with a rotating inner cavity that communicates with the movable hole 93. The output end of the self-locking motor 911 is fixedly connected to the drive gear 912, which can drive the drive gear 912 and the driven gear 913 to rotate along the rotating inner cavity.

[0038] In an optional embodiment, the driving gear 912 meshes with the driven gear 913, and the driven gear 913 meshes with the tooth groove 98. The driven gear 913 is connected to the rotating inner cavity via a connecting shaft 914. An electromagnet 915 is installed in the middle of the clamping groove 80, and the electromagnet 915 is electrically connected to the control panel 11. This facilitates the adsorption of the chip with a metal protective shell after clamping, further ensuring the stability of the chip. The driven gear 913 can mesh with the tooth groove 98 at the upper end of the moving rod 97, driving the moving rod 97 to move, which in turn drives the clamping plate 94 to move. When the clamping plate 94 needs to be reset, the output end of the driving gear 912 is controlled to rotate in the opposite direction via the control panel 11, thereby driving the clamping plate 94 to move in the opposite direction.

[0039] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0040] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0041] The foregoing disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this application, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0042] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0043] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A testing apparatus for testing flash memory bonding performance, characterized in that, include: The main body of the testing device includes a base, an auxiliary frame, a lifting cylinder, and a clamping groove. The auxiliary frame is located at the upper end of the base. A control panel is installed at the upper end of the base. The output end of the lifting cylinder is connected to a lifting seat. A movable seat is connected to the bottom of the lifting seat. A lateral moving mechanism is provided at the connection between the lifting seat and the movable seat. A shearing blade is connected to one side of the movable seat. A clamping assembly is disposed inside a clamping groove, including a groove formed inside the clamping groove, and a guide hole formed in the middle of the groove. A moving hole is formed inside the clamping groove. A clamping plate is disposed inside the clamping groove, and a protrusion and a moving rod are connected to one side of the clamping plate. A toothed groove is formed at the upper end of the moving rod. A pressure sensor is disposed on the other side of the clamping plate. A connecting box is disposed at the upper end of the base, and a self-locking motor is disposed on the outside of the connecting box. A drive gear is connected to the output end of the self-locking motor. A driven gear is disposed inside the connecting box, and a connecting shaft is disposed in the middle of the driven gear.

2. The testing apparatus for testing flash memory bonding effectiveness according to claim 1, characterized in that, The auxiliary frame and the base are an integral structure, and the output end of the lifting cylinder is fixedly connected to the lifting seat.

3. The testing apparatus for testing flash memory bonding effectiveness according to claim 1, characterized in that, The lateral movement mechanism includes a servo motor fixed to one side of the lifting seat, a threaded rod inside the lifting seat, and a threaded seat that matches the threaded rod fixedly connected to the top of the moving seat.

4. The testing apparatus for testing flash memory bonding effect according to claim 1, characterized in that, The upper end of the movable seat is provided with a guide seat, and there are two sets of guide seats that are symmetrically distributed. The bottom of the lifting seat is provided with a guide groove that matches the guide seat.

5. The testing apparatus for testing flash memory bonding effectiveness according to claim 1, characterized in that, A pressure sensor is installed in the middle of the movable base, and the pressure sensor is electrically connected to the control panel. Control buttons and a display screen are provided on the outside of the control panel, and a control circuit board and a battery are provided inside the control panel.

6. The testing apparatus for testing flash memory bonding effectiveness according to claim 1, characterized in that, The movable base has an auxiliary hole in the middle, and an auxiliary rod that matches the auxiliary hole is fixedly connected to one side of the shearing blade.

7. The testing apparatus for testing flash memory bonding effectiveness according to claim 1, characterized in that, The groove, guide hole, and moving hole are all connected to the clamping groove, and a guide rod that matches the guide hole is fixedly connected to one side of the protrusion.

8. The testing apparatus for testing flash memory bonding effectiveness according to claim 1, characterized in that, The movable hole and the movable rod are adapted to each other. The middle part of the connecting box has a rotating inner cavity that communicates with the movable hole. The output end of the self-locking motor is fixedly connected to the drive gear.

9. The testing apparatus for testing flash memory bonding effect according to claim 8, characterized in that, The driving gear and the driven gear mesh with each other, and the driven gear meshes with the tooth groove. The driven gear is connected to the rotating inner cavity through a connecting shaft. An electromagnet is installed in the middle of the clamping groove, and the electromagnet is electrically connected to the control panel.

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