Low-cost high-stability conductive glass

Abstract

The utility model relates to a kind of low-cost high-stability conductive glass, belong to functional coated glass field.The conductive glass includes glass substrate, graphite conductive glue grid layer, AZO layer, copper grid layer and tin oxide protective shell, wherein, glass substrate is equipped with vertical and horizontal interlaced square grid-like groove;Graphite conductive glue grid layer is formed by graphite conductive glue filling in the grid-like groove, and its upper surface is flush with glass substrate surface;AZO layer covers graphite conductive glue grid and glass substrate surface;Copper grid layer is set on the AZO layer, and it is square grid structure arranged by vertical and horizontal interlaced copper wire;Tin oxide protective shell is only coated on the surface of copper grid layer.The conductive glass can realize high adhesion, full-coated protection and light-transmitting conductive synergistic optimization.

Description

Technical Field

[0001] This utility model relates to the field of functional coated glass, specifically a low-cost, high-stability conductive glass. Background Technology

[0002] In the field of optoelectronic functional materials, transparent conductive glass is a core component for realizing electrical connections in optoelectronic devices. Currently, mainstream transparent conductive glass uses an ITO thin-film structure, composed of an indium tin oxide layer and a glass substrate. However, it has significant structural defects: the scarcity of indium resources leads to high material costs, and the large difference in thermal expansion coefficients between ITO and glass makes it prone to cracking when the radius of curvature is ≤10mm. Furthermore, ITO is directly exposed to the environment, making its grain boundaries susceptible to corrosion under humid and hot conditions. To address the shortcomings of ITO glass, the industry has attempted to develop copper-based conductive glass, using a copper mesh structure to replace ITO. However, the existing configuration still has many shortcomings: the copper mesh is directly attached to the flat glass surface, resulting in insufficient adhesion; the cross-cut adhesion test result is ≤3B, indicating easy peeling; and the copper wires lack a protective coating layer, leading to a resistance increase of over 50% within 15 days at 85℃ / 85% humidity. Additionally, the lack of a charge diffusion layer in the light-transmitting area results in uneven conductivity, with resistance fluctuations exceeding 20%.

[0003] Based on this, the core challenge facing existing technologies lies in how to construct a multifunctional integrated system on a glass substrate that combines a high-adhesion grid anchoring structure, a copper wire-covered anti-corrosion structure, and a charge diffusion structure in the light-transmitting area, so as to achieve both low cost and high stability of conductive glass. Utility Model Content

[0004] To address the structural defects of existing conductive glasses, a composite copper-based conductive glass is provided, achieving synergistic optimization of high adhesion, full-coverage protection, and light transmission and conductivity.

[0005] To achieve the above objectives, the specific solution adopted by this utility model is as follows:

[0006] A low-cost, high-stability conductive glass, comprising:

[0007] A glass substrate with intersecting square grid-like grooves;

[0008] The graphite conductive adhesive mesh layer is formed by filling the mesh-shaped grooves with graphite conductive adhesive, and its upper surface is flush with the surface of the glass substrate.

[0009] An AZO layer is formed on the graphite conductive adhesive mesh layer and the surface of the glass substrate;

[0010] A copper mesh layer is disposed on the AZO layer and is a square mesh structure composed of crisscrossing copper wires;

[0011] The tin oxide protective shell only covers the surface of the copper mesh layer.

[0012] Furthermore, the cross-section of any one of the square grid grooves is dovetail-shaped, the depth of any one groove is 5-10μm, the width at the opening is 10-15μm, and the width at the bottom is 13-15μm; the distance between two adjacent parallel grooves is 500μm.

[0013] Furthermore, the AZO layer thickness is 100 nm.

[0014] Furthermore, the thickness of the copper wires in the copper mesh layer is 2-3 μm, the width of the copper wires is 5-10 μm, and the spacing between two adjacent parallel copper wires is 300 μm.

[0015] Furthermore, the thickness of the tin oxide protective shell is 10-20 nm.

[0016] Beneficial effects:

[0017] (1) The conductive glass in this invention includes a glass substrate, a graphite conductive adhesive mesh layer, an AZO layer, a copper mesh layer, and a tin oxide (SnO2) protective shell. The dovetail groove on the surface of the glass substrate has a "narrow opening and wide bottom" design (the bottom width is 3-5 μm larger than the opening), forming a mechanical interlocking structure, which significantly increases the interlocking area between the graphite conductive adhesive mesh layer and the substrate, improving adhesion compared to a planar structure. The graphite conductive adhesive fills the dovetail groove and is flush with the surface of the glass substrate, forming an embedded conductive network. This structure reduces the direct contact between the conductive layer and the external environment, and enhances the mechanical stability of the overall structure in conjunction with the dovetail groove. A 100 nm thick AZO layer covers the graphite conductive adhesive mesh layer and the surface of the glass substrate, forming a continuous charge diffusion medium. Its structure can uniformly conduct the charge of the bottom conductive network to the glass surface, optimizing the conductivity uniformity of the light-transmitting area. The copper mesh layer employs a square grid configuration (copper wire thickness 2-3μm, width 5-10μm, spacing 300μm). This structure ensures light transmittance while creating a low-resistance conductive path through the high conductivity of metallic copper. A 10-20nm thick tin oxide protective shell completely covers the surface of the copper mesh, forming a dense physical barrier structure that isolates moisture and oxygen in the air, preventing the copper mesh from being directly exposed to the environment and enhancing its corrosion resistance.

[0018] (2) The resistance of the conductive glass in this invention is 1-2Ω / sq, the transmittance is 84-86%, and the resistance change rate is less than 10% after 15 days of aging test at 85℃ / 85% RH. Attached Figure Description

[0019] Figure 1 This is a cross-sectional view of the conductive glass in this utility model.

[0020] Figure 2 This is a top view of the conductive glass. It should be noted that because the AZO layer is transparent, the graphite conductive adhesive mesh layer is also visible in the top view.

[0021] Reference numerals: 1. Glass substrate, 2. Graphite conductive adhesive mesh layer, 3. AZO layer, 4. Copper mesh layer, 5. Tin oxide protective shell. Detailed Implementation

[0022] The technical solution of this utility model will be clearly and completely described below with reference to specific embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0023] In the description of this utility model, it should be understood that the terms "upper" and "lower" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the scope of protection of this utility model.

[0024] The core structure of the conductive glass in this invention includes five functional units. Figure 1 and Figure 2 (as shown)

[0025] Glass substrate 1: The surface is etched with square grid-like grooves, the cross-section of which is narrow at the opening and wide at the bottom, with a depth of 5-10μm, an opening width of 10-15μm, a bottom width of 13-15μm, and a spacing of 500μm between adjacent grooves;

[0026] Graphite conductive adhesive mesh layer 2: filled in the dovetail groove, with its upper surface flush with the glass substrate 1, forming an embedded conductive network;

[0027] AZO layer 3: A dense thin film with a thickness of 100nm, covering the graphite layer and the surface of glass substrate 1;

[0028] Copper mesh layer 4: A square mesh formed by electroplating, with copper wire width of 5-10μm, thickness of 2-3μm, and spacing of 300μm between adjacent copper wires;

[0029] Tin oxide protective shell 5: 10-20nm thick, completely covering the copper mesh surface.

[0030] The conductive glass in this invention is achieved through the following technical solution:

[0031] (1) A crisscrossing square grid-like groove is formed on the surface of a glass substrate 1 by photolithography combined with etching process. The cross-section of any groove in the square grid-like groove is dovetail-shaped. The depth of any groove is 5-10 μm, the width at the opening is 10-15 μm, and the width at the bottom is 13-15 μm. The distance between two adjacent parallel grooves is 500 μm.

[0032] (2) Graphite conductive adhesive with a graphite content of 30% is filled into square grid-shaped grooves and the part protruding from the glass surface is ground off to form a graphite conductive adhesive grid layer 2 with a resistance of 50-100Ω / sq; this layer can increase the conductivity of the subsequent AZO layer 3, which is beneficial for the subsequent electroplating of copper grid.

[0033] (3) AZO thin film is prepared by spin coating on the surface of graphite conductive adhesive mesh layer 2 and glass substrate 1 using sol-gel process. After annealing at 400℃, a dense AZO layer 3 is obtained. The thickness of AZO layer 3 is 100nm. AZO layer 3 can transfer the resistance of graphite conductive adhesive mesh layer 2 to the surface of glass substrate 1, so that the sheet resistance on the surface of glass substrate 1 is uniformly distributed. At this time, the sheet resistance becomes 45-80Ω / sq.

[0034] (4) A square photoresist template is prepared on the surface of AZO layer 3 by photolithography. Copper wires are electroplated in the template to obtain copper mesh layer 4. The copper mesh layer 4 is a square mesh structure composed of crisscrossing copper wires. The thickness of the copper wires in the copper mesh layer 4 is 2-3 μm and the width of the copper wires is 5-10 μm. The spacing between two adjacent parallel copper wires is 300 μm.

[0035] (5) After removing the photoresist, a tin oxide protective shell 5 with a thickness of 10-20 nm is grown on the surface of the copper mesh layer using self-assembly growth technology. This protective shell only covers the surface of the copper mesh and does not cover the AZO layer 3, thus finally producing conductive glass.

[0036] This invention uses graphite conductive adhesive to replace traditional ITO material, combined with electroplated copper mesh technology, reducing overall material costs by 75%. Simultaneously, the dovetail etching process avoids the use of expensive magnetron sputtering equipment, reducing equipment investment by 40%. The dovetail structure of the glass substrate 1 forms an inverted wedge-shaped mechanical interlock, increasing the contact area between the graphite conductive adhesive and the groove by 40%, improving adhesion to 5B level in the cross-cut adhesion test, and preventing detachment after 100 bends (5mm radius of curvature). The tin oxide protective shell 5 (3.6eV bandgap) forms a dense oxide barrier, with the copper mesh resistance increasing by only 8.7% after 15 days in an 85℃ / 85% RH environment. The 100nm thick AZO layer 3 acts as a charge diffusion medium, uniformly guiding the resistance of the graphite conductive adhesive mesh layer 2 to the surface of the glass substrate 1. Combined with the low resistance characteristics of the copper mesh layer 4, the resistance fluctuation is controlled within 5% when the incident light intensity changes by 20%.

[0037] The conductive glass prepared by this invention has a sheet resistance of 1-2 Ω / sq and a light transmittance of 84-86%. After aging at 85℃ / 85% RH for 15 days, the resistance change rate is less than 10%. Compared with traditional ITO glass and copper-based glass, it achieves significant optimization in terms of cost, mechanical properties, environmental tolerance, and conductivity uniformity.

[0038] The above description is merely a preferred embodiment of this utility model and is not intended to limit the scope of this utility model in any way. All equivalent modifications or alterations made based on the essence of this utility model should be covered within the protection scope of this utility model.

Claims

1. A low-cost, high-stability conductive glass, characterized in that, include: A glass substrate (1) has intersecting square grid-like grooves on it; The graphite conductive adhesive mesh layer (2) is formed by filling the mesh-shaped groove with graphite conductive adhesive, and its upper surface is flush with the surface of the glass substrate (1). An AZO layer (3) is applied to the surface of the graphite conductive adhesive mesh layer (2) and the glass substrate (1); A copper mesh layer (4) is disposed on the AZO layer (3) and is a square mesh structure composed of intersecting copper wires; The tin oxide protective shell (5) only covers the surface of the copper mesh layer (4).

2. The low-cost, high-stability conductive glass according to claim 1, characterized in that, The cross-section of any one of the square grid grooves is dovetail-shaped, the depth of any one groove is 5-10μm, the width at the opening is 10-15μm, and the width at the bottom is 13-15μm; the distance between two adjacent parallel grooves is 500μm.

3. The low-cost, high-stability conductive glass according to claim 1, characterized in that, The thickness of the AZO layer (3) is 100 nm.

4. The low-cost, high-stability conductive glass according to claim 1, characterized in that, The thickness of the copper wires in the copper mesh layer (4) is 2-3 μm, and the width of the copper wires is 5-10 μm; the spacing between two adjacent parallel copper wires is 300 μm.

5. The low-cost, high-stability conductive glass according to claim 1, characterized in that, The thickness of the tin oxide protective shell is 10-20 nm.

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