Optical module test all-in-one machine platform
By integrating error testing, temperature control, and power supply functions into a single optical module testing platform, the problems of poor compatibility and insufficient temperature adaptability of traditional testing equipment have been solved. This enables efficient and accurate testing of 800G optical modules, reducing costs and improving the reliability of test results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN GOLIGHT TECH
- Filing Date
- 2025-09-08
- Publication Date
- 2026-07-07
AI Technical Summary
Traditional 800G optical module testing equipment suffers from poor compatibility between devices, complex wiring, low testing efficiency, insufficient temperature adaptability, and compatibility issues with multiple types of modules, resulting in high testing costs, long testing times, and high error rates.
Design an integrated testing platform for optical modules, which integrates bit error rate testing, temperature control, and power supply functions. It uses a heat flow meter and a temperature probe cylinder to achieve precise temperature regulation, supports various optical module packaging forms, and adapts to the interface protocols of different modules through an MCB board, enabling integrated and efficient testing.
It enables efficient and accurate optical module testing, shortens preparation time, reduces equipment investment costs, improves the reliability and accuracy of test results, and simplifies the operation process.
Smart Images
Figure CN224473317U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of optical module testing technology, specifically to an integrated platform for optical module testing. Background Technology
[0002] Optical module testing refers to the process of verifying whether an optical transceiver module meets design specifications and industry standards in terms of transmission performance, functional integrity, and environmental adaptability through a series of standardized physical layer and protocol layer testing methods.
[0003] With the explosive growth in demand for high-speed data transmission from fields such as data centers and 5G communications, the performance stability and reliability of 800G optical modules, as a core component of next-generation high-speed optical communication, have become a focus of industry attention. Currently, the testing of 800G optical modules faces the following challenges:
[0004] Challenges in multi-device collaboration: Traditional testing requires the separate deployment of independent instruments such as bit error rate testers, temperature control equipment, and power modules. Poor compatibility between devices and complex wiring can easily lead to low testing efficiency and high error rates.
[0005] Temperature adaptability testing requirements: The optical module needs to maintain stable operation within the commercial-grade temperature range (0℃~70℃). Traditional testing equipment is difficult to accurately simulate this temperature range and complete performance testing simultaneously.
[0006] Multi-module compatibility issues: 800G optical modules exist in various packaging forms such as OSFP and QSFP-DD. The interface protocols and electrical characteristics of different types of modules vary greatly, requiring frequent replacement of test equipment, which increases testing costs and time.
[0007] Therefore, we need to propose an integrated optical module testing platform that integrates the functions of multiple modules to achieve efficient and accurate testing of different types of 800G optical modules. Utility Model Content
[0008] The purpose of this utility model is to provide an integrated platform for testing optical modules, which integrates functions such as bit error rate testing, temperature control, and power supply, avoiding the cumbersome wiring problems of traditional multi-device testing, reducing the equipment footprint, and significantly shortening the test preparation time, thereby solving the problems mentioned in the background art.
[0009] To achieve the above objectives, this utility model provides the following technical solution: an integrated platform for testing optical modules, comprising: a host computer, a control link connected to the host computer, and a power supply link for supplying power to the control link;
[0010] The control link includes:
[0011] The main control board serves as the core control unit.
[0012] Bit error rate test board used for bit error rate testing of high-speed optical modules;
[0013] A heat flow meter that uses a PID control circuit to adjust the operating state of the heating or cooling elements according to the deviation between the set temperature and the actual measured temperature.
[0014] An MCB board that interacts with the main control board, wherein an optical module is plugged into the MCB board;
[0015] A temperature probe cylinder used for real-time monitoring of the temperature of key internal components of the all-in-one machine.
[0016] The power supply link includes:
[0017] A switching power supply that accepts AC220V voltage;
[0018] A DC power module responsible for converting alternating current (AC) into stable direct current (DC).
[0019] Preferably, the switching power supply is electrically connected to the DC power module, the switching power supply is electrically connected to the main control board and the bit error rate test board respectively, the DC power module is electrically connected to the MCB board, and the main control board and the DC power module are connected via an RS232 interface.
[0020] Preferably, the host computer and the main control board are connected via a USB / LAN / RS232 interface, and the bit error rate test board and the optical module are connected via an RF socket.
[0021] Preferably, the main control board is connected to the bit error rate test board via an LVTTL serial port, the main control board is connected to the MCB board via an IO port to obtain the low-speed pin status of the optical module, and the main control board is connected to the thermal flow meter via an RS232 interface.
[0022] Preferably, the main control board is provided with a crystal oscillator circuit, a reset circuit, a download circuit, a power supply circuit, and special pin circuits.
[0023] Preferably, the bit error test board includes a code generator that emits PRBS signals, an encoding circuit that converts PRBS signals into PAM4 signals, and a bit error detector that receives and decodes PAM4 signals and determines whether bit errors exist.
[0024] Preferably, the DC power module includes:
[0025] A transformer that steps up or steps down the input alternating current;
[0026] A rectifier that converts the alternating current output from a transformer into direct current;
[0027] A filter to remove high-frequency noise from the rectified DC power;
[0028] A voltage regulator that uses a voltage regulator chip to adjust the filtered DC power.
[0029] Preferably, the temperature probe cylinder includes a thermistor that converts resistance changes into voltage changes, a thermocouple, and a digital temperature sensor that transmits the measured temperature data to the main control board in digital form.
[0030] Compared with the prior art, the beneficial effects of this utility model are:
[0031] 1. This utility model integrates functions such as error rate testing, temperature control, and power supply into one unit, avoiding the cumbersome wiring problems of traditional multi-device testing, reducing the equipment footprint, and significantly shortening the test preparation time, thus achieving integrated and efficient testing.
[0032] 2. This utility model uses a heat flow meter and a temperature probe cylinder to achieve precise adjustment within the commercial-grade temperature range of 0℃~70℃ (accuracy ±0.5℃), which can simulate the complex temperature environment of optical modules in actual applications and ensure the reliability of test results.
[0033] 3. This utility model supports multiple 800G optical module packaging forms such as OSFP and QSFP-DD. By adapting the interface protocols of different modules through the MCB board, the testing of multiple types of modules can be completed without changing the testing equipment, thus reducing equipment investment costs.
[0034] 4. The DC power supply of this utility model has an output voltage range of 3.0~3.6V, a voltage setting and readback accuracy of 10mV+0.5% and a resolution of 1mV, and a voltage setting and readback accuracy of 10mA±0.5% and a resolution of 10mA, which meets the stringent requirements of optical modules for power supply stability.
[0035] 5. The host computer software of this utility model realizes full parameter visualization setting and real-time monitoring, supports automatic recording and export of test data, simplifies the operation process, and reduces human error. Attached Figure Description
[0036] Figure 1 This is a system block diagram of the present invention. Detailed Implementation
[0037] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0038] Please see Figure 1 This utility model provides a technical solution: an integrated platform for testing optical modules, comprising: a host computer, a control link connected to the host computer, and a power supply link for supplying power to the control link;
[0039] The control link includes:
[0040] The main control board serves as the core control unit.
[0041] A bit error rate test board used for bit error rate testing of high-speed optical modules; the bit error rate test board is set to 800G PAM4 bit error rate test board (BERT).
[0042] A heat flow meter that uses a PID control circuit to adjust the operating state of the heating or cooling elements according to the deviation between the set temperature and the actual measured temperature.
[0043] An MCB board that interacts with the main control board, wherein an optical module is plugged into the MCB board;
[0044] A temperature probe cylinder used for real-time monitoring of the temperature of key internal components of the all-in-one machine.
[0045] The power supply link includes:
[0046] A switching power supply that accepts AC220V voltage;
[0047] A DC power module responsible for converting alternating current (AC) into stable direct current (DC).
[0048] Power supply chain: AC220V input is converted to DC12V by a switching power supply, and then outputs 3.3V (10A) through a DC power module to power the optical module and MCB board; at the same time, multiple power supplies such as 12V / 2A and 12V / 5A are provided to meet the power consumption requirements of different components.
[0049] Control Link: The main control board controls the thermal flow meter and DC power module through the RS232 interface, controls the bit error rate test board through the LVTTL serial port, and interacts with the MCB board through the IO port to obtain the low-speed pin status of the optical module (refer to the OSFP and QSFP-DD protocol specifications).
[0050] The heat flow meter, in conjunction with the temperature probe cylinder, precisely controls the ambient temperature of the test environment within the range of 0℃ to 70℃ (commercial-grade temperature range), and transmits temperature data to the main control board in real time via the temperature probe cylinder.
[0051] The bit error rate test board connects to the optical module via an RF socket, sends test signals, detects the bit error rate at the receiving end, and evaluates the high-speed signal transmission performance of the optical module.
[0052] The host computer communicates with the main control board via USB / LAN / RS232 interfaces to acquire parameters such as temperature, voltage, current, and bit error rate in real time, and to complete the recording and analysis of test data.
[0053] The switching power supply is electrically connected to the DC power module, and the switching power supply is electrically connected to the main control board and the bit error test board respectively. The DC power module is electrically connected to the MCB board, and the main control board and the DC power module are connected via an RS232 interface.
[0054] The host computer and the main control board are connected via USB / LAN / RS232 interfaces, and the bit error rate test board and the optical module are connected via an RF socket.
[0055] A dedicated interface structure designed for OSFP / QSFP-DD optical modules, including an RF socket, low-speed I / O interface and power interface, is provided. Its physical dimensions and electrical characteristics are adapted to the packaging standards of the two modules, and the cage thickness is optimized according to the characteristics of 800G optical modules (different from 400G optical modules).
[0056] The main control board is connected to the bit error test board via an LVTTL serial port, the main control board is connected to the MCB board via an IO port to obtain the low-speed pin status of the optical module, and the main control board is connected to the thermal flow meter via an RS232 interface.
[0057] The main control board is equipped with a crystal oscillator circuit, a reset circuit, a download circuit, a power supply circuit, and special pin circuits.
[0058] A crystal oscillator circuit typically consists of a quartz crystal oscillator and related capacitors. It utilizes the piezoelectric effect to provide a stable clock signal for the microcontroller, enabling the various modules inside the chip to work together in a predetermined timing sequence. For example, STM32 chips often use an 8MHz external crystal oscillator, which is multiplied by an internal phase-locked loop to provide a clock of 72MHz or even higher frequencies for the system.
[0059] The reset circuit ensures that the system can return to its initial state when powered on or in case of an abnormality. A common type is the RC reset circuit, which uses the charging characteristics of a capacitor to achieve the power-on reset function, ensuring that the CPU can start up and execute the program normally.
[0060] Depending on the chip type, the download circuit can use methods such as ISP (In-System Programming), SWD (Serial Wire Debug), or JTAG (Joint Test Action Group) to facilitate developers in burning the written control program into the main control chip.
[0061] The power supply circuit is responsible for converting the external input power (such as DC5V) into the operating voltage required by the chip (such as 3.3V, 1.8V, etc.) through a linear regulator chip (such as AMS1117-3.3V) or a switching regulator chip (such as LM2596), so as to provide stable power to the chip and other circuit modules on the board.
[0062] Special pin circuits are used to prevent microcontroller instability; for example, some pins require pull-up or pull-down resistors to ensure a stable voltage level when no external signal is connected. The main control board connects to other components via RS232, LVTTL serial ports, and low-speed I / O interfaces to transmit and receive data and control signals.
[0063] Taking the RS232 interface as an example, a MAX232 level conversion chip is required to convert the TTL level (generally 0V-3.3V) of the main control board to the RS232 standard level (-12V to +12V) to meet the requirements of long-distance and interference-resistant data transmission. The LVTTL serial port directly uses the TTL level standard for short-distance and high-speed data communication. The low-speed IO interface controls the start / stop and status monitoring of external devices by setting the input / output mode of the pins.
[0064] The bit error test board includes a code generator that emits PRBS signals, an encoding circuit that converts PRBS signals into PAM4 signals, and a bit error detector that receives and decodes PAM4 signals and determines whether bit errors exist.
[0065] The pattern generator circuit at the transmitting end generates a known pseudo-random binary sequence (PRBS) as a test pattern. This is usually implemented by a dedicated programmable logic device (such as an FPGA) or a specific pattern generation chip, which generates pattern signals of different lengths (such as PRBS7, PRBS31, etc.) and rates through internal logic.
[0066] After being processed by the encoding circuit, the signal is converted into a format suitable for PAM4 modulation. The PAM4 modulation circuit uses four-level pulse amplitude modulation technology to encode binary data into four level signals with different amplitudes in order to improve the transmission rate.
[0067] At the receiving end, the error detector circuit first decodes the received PAM4 signal to recover binary data, and then compares it bit by bit with the locally generated error-free PRBS signal to determine whether there are any errors, and counts the number of errors and calculates the bit error rate.
[0068] To ensure signal integrity, error detector circuits often integrate equalization circuits to compensate for signal distortion during transmission and improve signal quality. They also incorporate a fast-locking clock recovery module to extract the clock signal from the received signal, ensuring accurate data sampling to adapt to high-speed, complex testing environments. Furthermore, the test board includes an interface circuit for communication with the main control board, typically employing a high-speed differential signal interface (such as SFP+, QSFP+, etc.) or a high-speed parallel interface to promptly feed test results back to the main control board for analysis and processing.
[0069] The DC power module includes:
[0070] A transformer that steps up or steps down the input alternating current;
[0071] A rectifier that converts the alternating current output from a transformer into direct current;
[0072] A filter to remove high-frequency noise from the rectified DC power;
[0073] A voltage regulator that uses a voltage regulator chip to adjust the filtered DC power.
[0074] A transformer converts the input alternating current (such as 220V AC mains power) into a suitable voltage level. Through the principle of electromagnetic induction, it can step down or step up the voltage according to different winding turns ratios.
[0075] A rectifier uses diodes or other rectifier devices to convert the alternating current (AC) output from a transformer into direct current (DC). Common rectifiers include half-wave rectifiers, full-wave rectifiers, and bridge rectifiers. Bridge rectifiers are often used in integrated machines because they can more effectively utilize the positive and negative half-cycles of the AC power, thus improving rectification efficiency.
[0076] Filters are generally composed of energy storage components such as capacitors and inductors. They are used to remove high-frequency pulsation components from the rectified DC power and make the output voltage smoother. For example, an LC filter circuit can be used to filter out high-frequency noise by utilizing the inductor's opposition to high-frequency current and the capacitor's bypass effect on high-frequency voltage.
[0077] The voltage regulator uses voltage regulator chips (such as the linear voltage regulator chip LM317, the switching voltage regulator chip TL494, etc.) to regulate the filtered DC power to obtain a stable output voltage that meets the accuracy requirements of different components for the power supply voltage.
[0078] For example, main control boards with high power stability requirements need a DC power supply with an output voltage accuracy within ±1%. Depending on the regulation method, DC power modules are divided into linear regulators and switching regulators. Linear regulators regulate the output by consuming excess voltage through power transistors, offering advantages such as low output voltage ripple and high stability, but with relatively low efficiency. Switching regulators, on the other hand, utilize the high-frequency on / off switching of switching elements to regulate the output voltage by controlling the duty cycle, offering advantages such as high efficiency and compact size.
[0079] A heat flow meter operates based on thermocouple circuits, the law of thermal conduction, the thermoelectric effect, and the principle of thin-film temperature distribution. Within a heat flow meter:
[0080] A thermocouple circuit utilizes the thermoelectric effect of two different metallic conductors. When a temperature difference exists between their ends, a thermoelectric potential is generated, which is proportional to the temperature difference. By measuring the thermoelectric potential, the temperature on both sides of a sample or at different parts of a heat flow meter can be accurately sensed.
[0081] The law of thermal conductivity states that in a structure where a sample is placed between two heat sources, one of which is provided with a constant temperature field by a precisely controlled thermocouple, and the other is connected to the environment through a thermal resistance sensor. The circuit monitors the temperature field changes in real time and calculates the thermal conductivity coefficient of the sample by measuring the heat transfer rate and the temperature difference between the two sides of the sample, according to Fourier's law of thermal conductivity.
[0082] Thermoelectric circuits collect and amplify voltage signals generated by heat flow on the surface of materials. These voltages are proportional to the heat flow density, thus enabling indirect measurement of the heat flow density.
[0083] Thin film temperature distribution principle: By placing temperature sensors (such as thermistors) at different locations on the thin film, temperature data at each point is collected, and the heat flux density distribution inside the thin film is obtained through circuit calculation.
[0084] In terms of temperature control, the heat flow meter uses a PID (proportional-integral-derivative) control circuit to adjust the operating state of the heating or cooling elements based on the deviation between the set temperature and the actual measured temperature. For example, when the actual temperature is lower than the set temperature, the PID circuit controls the heating element (such as a heating wire) to increase its power output; conversely, when the temperature is too high, it controls the cooling element (such as a thermoelectric cooler) to start cooling to maintain the temperature stable near the set value, ensuring that the temperature control accuracy can reach ±0.1℃ or even higher.
[0085] MCB boards are used to control and manage specific modules within an all-in-one machine. Their circuit design is determined by the functional requirements of the controlled module. They typically contain a microcontroller or logic circuitry, which analyzes and processes input signals through internal programs or logical relationships, and then outputs corresponding control signals. For example, when controlling the optical module insertion / removal test function, the onboard microcontroller detects signal changes in the optical module insertion detection circuit to determine if the optical module is correctly inserted. If the insertion is normal, the control circuit provides appropriate power to the optical module and configures the relevant communication and control signal pins to ensure normal communication between the optical module and the system.
[0086] The communication interface circuits between the MCB board and other components also use RS232, LVTTL serial ports, or low-speed I / O interfaces to interact with the main control board, receive control commands from the main control board, and provide feedback on the module's operating status information. In some complex module control scenarios, data storage circuits (such as EEPROM, Flash, etc.) may also be integrated to store module configuration parameters, historical operating data, etc., for use during system restarts or troubleshooting.
[0087] The temperature probe cylinder includes a thermistor that converts resistance changes into voltage changes, a thermocouple, and a digital temperature sensor that transmits the measured temperature data to the main control board in digital form.
[0088] Taking a thermistor as an example, its resistance changes significantly with temperature. A Wheatstone bridge circuit is typically used to convert this resistance change into a voltage change. A Wheatstone bridge consists of four resistors, one of which is a thermistor. When the thermistor's resistance changes with temperature, the bridge balance is disrupted, and a temperature-dependent voltage signal is generated at the output. This voltage signal is amplified by an amplifier circuit (such as an operational amplifier circuit consisting of inverting or non-inverting phases) and then converted to a digital signal by an analog-to-digital converter before being input to the main control board or relevant temperature control circuit for processing.
[0089] The thermoelectric potential signal generated by the thermocouple also needs to be processed by circuits such as amplification and cold junction compensation to eliminate the influence of ambient temperature on measurement accuracy before A / D conversion and subsequent data processing.
[0090] Digital temperature sensors integrate temperature measurement, signal processing, and digital output functions, directly communicating via a digital interface (such as I...). 2 (C, SPI, etc.) communicate with the main control board, transmitting the measured temperature data to the main control board in digital form, so that the main control board can obtain temperature information in real time, perform temperature monitoring and abnormal alarm operations, and ensure that the all-in-one machine operates stably within a suitable temperature range.
[0091] When testing the 800G optical module, the interaction between the host computer and the main control board enables the linkage adjustment and real-time monitoring of parameters such as temperature, voltage, and bit error rate, and the test data is transmitted through USB / LAN / RS232 interfaces.
[0092] Specifically, the interaction between the host computer and the main control board is divided into two main categories: instruction interaction (host computer → main control board) and data interaction (main control board → host computer), and reliable communication is achieved by defining standardized protocols.
[0093] Command interaction (host computer → main control board):
[0094] Parameter configuration command: The host computer sends the target parameters (such as target temperature 25℃, operating voltage 3.3V±0.1V, bit error rate threshold 1e-12), the format of which includes command type, device address, parameter value, and check bit.
[0095] Data interaction (main control board → host computer):
[0096] Real-time monitoring data: The main control board uploads raw data (such as temperature 23.5℃, voltage 3.28V, bit error count 12bit / 1000000bit) at a set frequency, including data type, timestamp, value, and status indicator (normal / alarm).
[0097] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. An integrated testing platform for optical modules, characterized in that, include: The host computer, the control link connected to the host computer, and the power supply link that powers the control link; The control link includes: The main control board serves as the core control unit. Bit error rate test board used for bit error rate testing of high-speed optical modules; A heat flow meter that uses a PID control circuit to adjust the operating state of the heating or cooling elements according to the deviation between the set temperature and the actual measured temperature. An MCB board that interacts with the main control board, wherein an optical module is plugged into the MCB board; A temperature probe cylinder used for real-time monitoring of the temperature of key internal components of the all-in-one machine. The power supply link includes: A switching power supply that accepts AC220V voltage; A DC power module responsible for converting alternating current (AC) into stable direct current (DC).
2. The optical module testing platform according to claim 1, characterized in that: The switching power supply is electrically connected to the DC power module, and the switching power supply is electrically connected to the main control board and the bit error test board respectively. The DC power module is electrically connected to the MCB board, and the main control board and the DC power module are connected via an RS232 interface.
3. The optical module testing integrated platform according to claim 1, characterized in that: The host computer and the main control board are connected via USB / LAN / RS232 interfaces, and the bit error rate test board and the optical module are connected via an RF socket.
4. The optical module testing integrated platform according to claim 1, characterized in that: The main control board is connected to the bit error test board via an LVTTL serial port, the main control board is connected to the MCB board via an IO port to obtain the low-speed pin status of the optical module, and the main control board is connected to the thermal flow meter via an RS232 interface.
5. The optical module testing integrated platform according to claim 1, characterized in that: The main control board is equipped with a crystal oscillator circuit, a reset circuit, a download circuit, a power supply circuit, and special pin circuits.
6. The optical module testing integrated platform according to claim 1, characterized in that: The bit error test board includes a code generator that emits PRBS signals, an encoding circuit that converts PRBS signals into PAM4 signals, and a bit error detector that receives and decodes PAM4 signals and determines whether bit errors exist.
7. The optical module testing integrated platform according to claim 1, characterized in that: The DC power module includes: A transformer that steps up or steps down the input alternating current; A rectifier that converts the alternating current output from a transformer into direct current; A filter to remove high-frequency noise from the rectified DC power; A voltage regulator that uses a voltage regulator chip to adjust the filtered DC power.
8. The optical module testing integrated platform according to claim 1, characterized in that: The temperature probe cylinder includes a thermistor that converts resistance changes into voltage changes, a thermocouple, and a digital temperature sensor that transmits the measured temperature data to the main control board in digital form.