Unmanned aerial vehicle avionics module and unmanned aerial vehicle
By incorporating heat-conducting components and heat dissipation channels into the avionics module of the UAV, the problem of heat accumulation on the avionics board was solved, achieving effective heat dissipation, avoiding the risk of burnout and increased power consumption, and improving the UAV's endurance.
CN224473620UActive Publication Date: 2026-07-07MEITUAN TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MEITUAN TECH CO LTD
- Filing Date
- 2025-07-11
- Publication Date
- 2026-07-07
AI Technical Summary
Technical Problem
After a long flight, the avionics module of a drone may overheat due to heat buildup, posing a risk of burnout and increasing power consumption, thus affecting flight time.
Method used
A heat dissipation unit is set in the avionics module of the UAV, including heat conduction components and heat dissipation channels. Heat is dissipated through fluid flow. The heat conduction components are in close contact with the avionics board to transfer heat, and the heat is discharged through the heat dissipation channels.
Benefits of technology
It effectively reduces the temperature of the avionics board, avoids the risk of burnout, reduces power consumption, and improves the drone's endurance.
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Smart Images
Figure CN224473620U_ABST
Abstract
This disclosure relates to an avionics module for a drone and the drone itself. The avionics module includes a main housing and a heat dissipation unit. The main housing has a receiving cavity containing an avionics board. The heat dissipation unit, located within the receiving cavity, includes a heat-conducting element and a heat dissipation channel with an air inlet and an air outlet. The heat-conducting element is fixedly connected to the main housing. The avionics board is mounted on the heat-conducting element, and the heat-conducting element at least partially forms the inner wall of the heat dissipation channel. This avionics module dissipates heat from the avionics board in the receiving cavity by providing a heat dissipation unit in the main housing. The avionics board is mounted on the heat-conducting element, which at least partially forms the inner wall of the heat dissipation channel. This allows the fluid flowing in the heat dissipation channel to dissipate heat from the heat-conducting element, indirectly reducing the temperature of the avionics board on the heat-conducting element. This avoids the risk of the avionics board burning due to excessive temperature and also prevents the high temperature of the avionics board from increasing the drone's power consumption and affecting its range.
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