5G industrial gateway intelligent temperature control and heat dissipation integrated device

Abstract

The application discloses a 5G industrial gateway intelligent temperature control and heat dissipation integrated device, and belongs to the field of temperature control and heat dissipation. The device comprises a shell, a mainboard is mounted on the inner wall of the shell, a temperature sensor is mounted on the top of the mainboard, a support is mounted on the top of the mainboard, a plurality of heat dissipation fins are mounted on the top of the support, a frame is mounted on the top of the heat dissipation fins, a fan is mounted in the frame, a cooling liquid tank is mounted on the top of the mainboard, both ends of a pipeline are fixedly connected to the inside of the cooling liquid tank, and a plurality of conduction bins are mounted on the outer edge of the pipeline. The driving water pump can drive the cooling liquid in the cooling liquid tank to continuously flow in the pipeline and the plurality of conduction bins, so that the heat of the mainboard can be adsorbed through the plurality of conduction bins, and the cooling liquid in the pipeline finally flows back to the inside of the cooling liquid tank, thereby realizing circulation and improving the heat dissipation efficiency.

Description

Technical Field

[0001] This application relates to the field of temperature control and heat dissipation technology, and in particular to an integrated intelligent temperature control and heat dissipation device for a 5G industrial gateway. Background Technology

[0002] Gateway devices, also known as network connectors or protocol converters, are computer systems or devices that provide data conversion services between multiple networks. In short, a gateway device is a connector between different networks, and it is a device that "negotiates" when data needs to be transferred from one network to another.

[0003] High-temperature environments accelerate the aging of electronic components, reduce equipment stability, and even cause downtime accidents. Traditional heat dissipation technologies such as natural convection cooling and forced air cooling are no longer sufficient to meet the heat dissipation requirements of high-density integrated equipment. The limited heat dissipation conditions cannot meet the requirements of efficient heat dissipation. Therefore, this application proposes an intelligent temperature control and heat dissipation integrated device for 5G industrial gateways. Utility Model Content

[0004] In view of the shortcomings of the prior art, this utility model provides a 5G industrial gateway intelligent temperature control and heat dissipation integrated device, which overcomes the shortcomings of the prior art and aims to solve the problems in the background art.

[0005] To achieve the above objectives, this application adopts the following technical solution: a 5G industrial gateway intelligent temperature control and heat dissipation integrated device, including a shell, a motherboard installed on the inner wall of the shell, a temperature sensor installed on the top of the motherboard, a bracket installed on the top of the motherboard, multiple heat dissipation fins installed on the top of the bracket, a frame installed on the top of the heat dissipation fins, a fan installed inside the frame, a coolant tank installed on the top of the motherboard, and two ends of a pipe fixedly connected inside the coolant tank, with multiple conduction chambers installed on the outer edge of the pipe.

[0006] In a preferred embodiment, two handles are mounted on the outer side of the housing, and a cover plate is bolted to the top of the housing.

[0007] By adopting the above technical solution, the opening at the top of the casing can be covered by a handle, thereby protecting the electronic components installed inside the casing. The two handles also make it easy for users to pick up and pull the device.

[0008] In a preferred embodiment, a positioning cover is installed on the inner side of the outer shell, a dustproof cotton plate is installed inside the positioning cover, and heat dissipation holes are provided on the inner wall of the outer shell, with the dustproof cotton plate and the heat dissipation holes being positioned correspondingly.

[0009] By adopting the above technical solution, the positioning cover can be used to position the dustproof cotton board, ensuring that the dustproof cotton board can be stably set on the inside of the shell. This allows it to be used to prevent dust from entering the shell by controlling the natural wind that is channeled into the shell through the heat dissipation holes.

[0010] In a preferred embodiment, a plurality of the conductive chambers are mounted on the top of the motherboard, and the conductive chambers are made of copper.

[0011] By adopting the above technical solution, the coolant flowing inside the conduction chamber can transfer the temperature to the motherboard in a timely manner, thereby achieving temperature control and heat dissipation of the motherboard.

[0012] In a preferred embodiment, a water pump is fixedly installed on the outer edge of the pipe, and one side of the water pump is fixedly connected to the coolant tank.

[0013] By adopting the above technical solution, the water pump can be driven to run, thereby driving the coolant inside the coolant tank to flow continuously inside the pipes and multiple conduction chambers, which can then absorb the heat of the motherboard through the multiple conduction chambers.

[0014] In a preferred embodiment, a heat exchanger is installed inside the coolant tank, and the water pump, temperature sensor, and heat exchanger are all electrically connected.

[0015] By adopting the above technical solution, the temperature inside the casing can be monitored using a temperature sensor, thereby enabling timely adjustment of the temperature of the coolant during operation by the heat exchanger, achieving precise control.

[0016] In a preferred embodiment, a controller is mounted on the top of the motherboard, and the controller, heat sink fins, and fan are all electrically connected.

[0017] By adopting the above technical solution, the controller can be used to precisely control the operation of the heat sink fins and fan to achieve air cooling.

[0018] The beneficial effects of this application are:

[0019] This 5G industrial gateway intelligent temperature control and heat dissipation integrated device, by setting up a drive water pump, can drive the coolant inside the coolant tank to continuously flow inside the pipes and multiple conduction chambers. In this way, the heat of the motherboard can be absorbed through the multiple conduction chambers, and the coolant inside the pipes will eventually flow back into the coolant tank, realizing circulation and improving heat dissipation efficiency.

[0020] This 5G industrial gateway intelligent temperature control and heat dissipation integrated device drives the heat dissipation fins and fan to operate, so that the gas generated by the fan dries the cold air generated by the heat dissipation fins, and then the cold air can spread inside the shell for overall heat dissipation inside the shell. It can also be used in conjunction with water cooling to achieve efficient heat dissipation. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this application;

[0022] Figure 2 This is a partial structural diagram of this application;

[0023] Figure 3 This is a schematic diagram of the cross-sectional structure of the outer shell of this application;

[0024] Figure 4 This is a schematic diagram of the internal structure of this application;

[0025] Figure 5 This is a schematic diagram of the coolant tank structure of this application.

[0026] The following components are labeled in the diagram: 1. Outer shell; 2. Cover plate; 3. Handle; 4. Heat dissipation hole; 5. Positioning cover; 6. Dustproof cotton plate; 7. Main board; 8. Temperature sensor; 9. Bracket; 10. Heat dissipation fins; 11. Frame; 12. Fan; 13. Coolant tank; 14. Pipe; 15. Conductive chamber; 16. Water pump; 17. Controller. Detailed Implementation

[0027] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0028] Reference Figure 1-5 A 5G industrial gateway intelligent temperature control and heat dissipation integrated device includes a housing 1, a motherboard 7 installed on the inner wall of the housing 1, a temperature sensor 8 installed on the top of the motherboard 7, a bracket 9 installed on the top of the motherboard 7, multiple heat dissipation fins 10 installed on the top of the bracket 9, a frame 11 installed on the top of the heat dissipation fins 10, a fan 12 installed inside the frame 11, a coolant tank 13 installed on the top of the motherboard 7, and the two ends of a pipe 14 fixedly connected inside the coolant tank 13. Multiple conduction chambers 15 are installed on the outer edge of the pipe 14.

[0029] See Figure 1 and Figure 2Two handles 3 are installed on the outside of the outer casing 1. A cover plate 2 is bolted to the top of the outer casing 1, so that the opening at the top of the outer casing 1 can be covered by the handles 3, thereby protecting the electronic components installed inside the outer casing 1. The two handles 3 also make it easy for the user to pick up and pull the device.

[0030] See Figure 3 A positioning cover 5 is installed on the inner side of the outer casing 1. A dustproof cotton plate 6 is installed inside the positioning cover 5. A heat dissipation hole 4 is opened on the inner wall of the outer casing 1. The positions of the dustproof cotton plate 6 and the heat dissipation hole 4 are corresponding, so that the positioning cover 5 can be used to position the dustproof cotton plate 6, ensuring that the dustproof cotton plate 6 can be stably set on the inner side of the outer casing 1. This can be used to prevent dust from entering the interior of the outer casing 1 by the natural wind that is guided into the interior of the outer casing 1 through the heat dissipation hole 4.

[0031] See Figure 4 and Figure 5 Multiple heat transfer chambers 15 are installed on the top of the motherboard 7. The heat transfer chambers 15 are made of copper, which allows the coolant flowing inside the heat transfer chambers 15 to transfer the temperature to the motherboard 7 in a timely manner, thereby achieving temperature control and heat dissipation of the motherboard 7.

[0032] See Figure 4 A water pump 16 is fixedly installed on the outer edge of the pipe 14. One side of the water pump 16 is fixedly connected to the coolant tank 13, so that the water pump 16 can be driven to run, thereby driving the coolant inside the coolant tank 13 to flow continuously inside the pipe 14 and multiple conduction chambers 15, thereby absorbing the heat of the motherboard 7 through the multiple conduction chambers 15.

[0033] See Figure 4 and Figure 5 The coolant tank 13 is equipped with a heat exchanger. The water pump 16, temperature sensor 8 and heat exchanger are electrically connected, so that the temperature sensor 8 can be used to monitor the temperature inside the housing 1, and then the temperature of the coolant during operation can be adjusted in a timely manner to achieve precise control.

[0034] See Figure 3 - Figure 5 The top of the motherboard 7 is equipped with a controller 17. The controller 17, the heat sink 10 and the fan 12 are electrically connected, so that the controller 17 can be used to precisely control the operation of the heat sink 10 and the fan 12 to achieve air cooling.

[0035] Working principle:

[0036] First, the dustproof cotton plate 6 can be used to prevent dust from entering the natural airflow that flows through the heat dissipation holes 4 into the shell 1. At the same time, the temperature sensor 8 can be used to monitor the temperature inside the shell 1 in real time. Then, the heat exchanger can be driven to operate, which in turn can drive the water pump 16 to operate, causing the coolant inside the coolant tank 13 to flow continuously inside the pipes 14 and multiple conduction chambers 15. The heat from the motherboard 7 can be absorbed through the multiple conduction chambers 15, and the coolant inside the pipes 14 will eventually flow back into the coolant tank 13 to achieve circulation. At the same time, the heat dissipation fins 10 and the fan 12 can be driven to operate, so that the air generated by the fan 12 will dry the cold air generated by the heat dissipation fins 10, and the cold air can spread inside the shell 1 for overall heat dissipation inside the shell 1.

[0037] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0038] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0039] The present invention has been described above with reference to specific embodiments. However, those skilled in the art should understand that these descriptions are exemplary and not intended to limit the scope of protection of the present invention. Those skilled in the art can make various modifications and variations to the present invention based on its spirit and principles, and these modifications and variations are also within the scope of the present invention.

Claims

1. A 5G industrial gateway intelligent temperature control and heat dissipation integrated device, comprising a housing (1), characterized in that, The inner wall of the outer casing (1) is equipped with a main board (7), a temperature sensor (8) is installed on the top of the main board (7), a bracket (9) is installed on the top of the main board (7), a plurality of heat dissipation fins (10) are installed on the top of the bracket (9), a frame (11) is installed on the top of the heat dissipation fins (10), a fan (12) is installed inside the frame (11), a coolant tank (13) is installed on the top of the main board (7), the two ends of a pipe (14) are fixedly connected inside the coolant tank (13), and a plurality of conduction chambers (15) are installed on the outer edge of the pipe (14).

2. The 5G industrial gateway intelligent temperature control and heat dissipation integrated device according to claim 1, characterized in that, Two handles (3) are installed on the outside of the outer casing (1), and a cover plate (2) is bolted to the top of the outer casing (1).

3. The 5G industrial gateway intelligent temperature control and heat dissipation integrated device according to claim 1, characterized in that, A positioning cover (5) is installed on the inner side of the outer shell (1), and a dustproof cotton plate (6) is installed inside the positioning cover (5). A heat dissipation hole (4) is opened on the inner wall of the outer shell (1), and the positions of the dustproof cotton plate (6) and the heat dissipation hole (4) are corresponding.

4. The 5G industrial gateway intelligent temperature control and heat dissipation integrated device according to claim 1, characterized in that, Multiple conductive chambers (15) are mounted on the top of the motherboard (7), and the conductive chambers (15) are made of copper.

5. The 5G industrial gateway intelligent temperature control and heat dissipation integrated device according to claim 1, characterized in that, A water pump (16) is fixedly installed on the outer edge of the pipe (14), and one side of the water pump (16) is fixedly connected to the coolant tank (13).

6. The 5G industrial gateway intelligent temperature control and heat dissipation integrated device according to claim 5, characterized in that, The coolant tank (13) is equipped with a heat exchanger, and the water pump (16), temperature sensor (8) and heat exchanger are electrically connected.

7. The 5G industrial gateway intelligent temperature control and heat dissipation integrated device according to claim 1, characterized in that, A controller (17) is mounted on the top of the motherboard (7), and the controller (17), heat sink (10) and fan (12) are electrically connected.

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