A flexible photoelectric conversion film assembly

By employing a combination design of modular boards, encapsulation film structures, and filler adhesive layers in flexible photoelectric conversion film components, the problem of poor modular waterproof sealing installation effect is solved, achieving efficient waterproof sealing and improved stability.

CN224473661UActive Publication Date: 2026-07-07深圳市烨兴智能空间技术有限公司

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
深圳市烨兴智能空间技术有限公司
Filing Date
2025-07-01
Publication Date
2026-07-07

AI Technical Summary

Technical Problem

The installation devices for some flexible photoelectric conversion film components have poor modular waterproof sealing performance, resulting in poor installation stability.

Method used

The design employs a combination of modular boards, encapsulation film structures, embedded structures, and filler adhesive layers. This includes a primer layer, ETFE protective film, photoelectric conversion film body, encapsulation frame, silicone ring, and self-cleaning coating. Combined with the use of filler adhesive layers and resin adhesive, it forms a highly efficient waterproof and sealed installation.

Benefits of technology

This improved the installation stability of the flexible photoelectric conversion film, achieved a modular and efficient waterproof sealing effect, and enhanced the structural stability and environmental adaptability of the device.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to photoelectric conversion film installation technical field especially is a kind of flexible photoelectric conversion film assembly, including module board, encapsulation film structure, pre-bury structure and filling adhesive layer, module board top is provided with encapsulation film structure, module board top is coated with and is provided with primer layer, ETFE protective film is placed with and is installed in primer layer top, photoelectric conversion film main part is placed with and is installed in ETFE protective film top end, flexible insulation wiring is filled with and is set between the gap of encapsulation frame internal slot hole resin glue, encapsulation frame bottom, silica gel ring outside, module board top is coated with and is set between combined adhesive layer, photoelectric conversion film main part top, encapsulation frame inside is coated with and is set between self-cleaning coating, filling adhesive layer is filled and is set between pre-bury box top, flexible insulation wiring below internal flexible conductive chip outside, in the utility model, device main part can carry out modularization efficient waterproof sealing installation to flexible photoelectric conversion film, for improving the installation stability of flexible photoelectric conversion film.
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Description

Technical Field

[0001] This utility model relates to the field of photoelectric conversion film installation technology, specifically a flexible photoelectric conversion film assembly. Background Technology

[0002] Photovoltaic conversion film is a thin film material that directly converts light energy into electrical energy. It features lightweight, flexibility, and integrability, and has broad application prospects in new energy, smart wearables, building-integrated photovoltaics, and other fields. The installation of photovoltaic conversion film needs to take into account power generation efficiency, structural stability, and environmental adaptability. Taking the installation of the aforementioned flexible photovoltaic conversion film module as an example.

[0003] Some flexible photoelectric conversion film assembly installation devices have poor modular waterproof sealing performance for the flexible photoelectric conversion film, resulting in poor installation stability. Therefore, a flexible photoelectric conversion film assembly is proposed to address the above problems. Utility Model Content

[0004] The purpose of this utility model is to provide a flexible photoelectric conversion film assembly to solve the problem that the installation device of some flexible photoelectric conversion film assemblies has a poor modular waterproof sealing effect on the flexible photoelectric conversion film, resulting in poor installation stability of the flexible photoelectric conversion film.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A flexible photoelectric conversion film assembly includes a module board, an encapsulation film structure, a pre-embedded structure, and a filling adhesive layer. The encapsulation film structure is disposed on the top of the module board, and the pre-embedded structure is disposed in the inner groove of the top of the module board. The pre-embedded structure is disposed on the top of the filling adhesive layer. The encapsulation film structure includes a primer layer, an ETFE protective film, a photoelectric conversion film body, an encapsulation frame, a silicone ring, and a self-cleaning coating. The top of the module board is coated with a primer layer, and the ETFE protective film is installed on top of the primer layer. The photoelectric conversion film body is installed on top of the ETFE protective film, and the top of the photoelectric conversion film body is in contact with the inner wall of the encapsulation frame. A silicone ring is fixedly disposed at the bottom of the encapsulation frame. A self-cleaning coating is coated between the top of the photoelectric conversion film body and the inside of the encapsulation frame.

[0007] Preferably, the pre-embedded structure includes a pre-embedded box, an insulating sheet, a conductor core strip, an insulating buckle, a conductive core component, a conductive pin, and a conductive plug. The pre-embedded box is fixedly installed in the inner groove at the top of the module board. An insulating sheet is fixedly installed inside the pre-embedded box. A conductor core strip is fixedly installed inside the insulating sheet. A conductive core component is fixedly installed inside the insulating buckle. A conductive pin is fixedly installed at the bottom end of the conductive core component. A conductive plug is fixedly installed at the top end of the conductive core component. A rubber ring is slidably placed between the top of the pre-embedded box and the inner wall of the insulating buckle.

[0008] Preferably, the bottom end of the silicone ring is placed in contact with the top end of the module board, and an adhesive layer is coated between the bottom of the encapsulation frame, the outer side of the silicone ring, and the top of the module board.

[0009] Preferably, the top of the insulating buckle is provided with a flexible insulating wire, and the end of the photoelectric conversion film body near the pre-embedded structure is electrically connected with a flexible insulating wire. The flexible insulating wire passes through the slot inside the encapsulation frame and is placed therein. The gap between the flexible insulating wire and the slot inside the encapsulation frame is filled with resin glue.

[0010] Preferably, the internal flexible conductive chip below the flexible insulated wiring is electrically connected to the top of the conductive plug, and a filler layer is potted between the top of the pre-embedded box and the outside of the internal flexible conductive chip below the flexible insulated wiring.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] In this invention, a primer layer is coated on the top of the module board, an ETFE protective film is installed on top of the primer layer, and a photoelectric conversion film body is installed on top of the ETFE protective film. Resin glue is used to fill the gap between the flexible insulating wiring and the slots inside the encapsulation frame. A bonding adhesive layer is coated between the bottom of the encapsulation frame, the outside of the silicone ring, and the top of the module board. A self-cleaning coating is coated between the top of the photoelectric conversion film body and the inside of the encapsulation frame. A filling adhesive layer is potted between the top of the embedded box and the outside of the flexible conductive chip inside the flexible insulating wiring. Through the above configuration, the main body of the device can perform modular, efficient, waterproof, and sealed installation of the flexible photoelectric conversion film, thereby improving the installation stability of the flexible photoelectric conversion film. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This is a cross-sectional structural diagram of the module board of this utility model;

[0015] Figure 3 This utility model Figure 2 A magnified structural diagram at point A.

[0016] In the diagram: 1. Module board; 2. Encapsulation film structure; 21. Primer layer; 22. ETFE protective film; 23. Photoelectric conversion film body; 24. Encapsulation frame; 25. Silicone ring; 26. Adhesive layer; 27. Self-cleaning coating; 28. Flexible insulated wiring; 3. Embedded structure; 31. Embedded box; 32. Insulating sheet; 33. Conductor core strip; 34. Insulating buckle; 35. Conductive core component; 36. Conductive pin; 37. Conductive plug; 4. Filler adhesive layer. Detailed Implementation

[0017] The technical solutions of the utility model embodiments will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the utility model, and not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the utility model.

[0018] In the embodiments of the utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the position or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations of the utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Similarly, words such as "an," "a," or "the" do not indicate a quantity limitation, but rather indicate the presence of at least one. Words such as "comprising" or "including" mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, without excluding other elements or objects.

[0019] Furthermore, in the embodiments of the utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. For those skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0020] Please see Figure 1-3 This utility model provides a technical solution:

[0021] A flexible photoelectric conversion film assembly includes a module board 1, an encapsulation film structure 2, a pre-embedded structure 3, and a filling adhesive layer 4. The encapsulation film structure 2 is disposed on the top of the module board 1, the pre-embedded structure 3 is disposed in the inner groove of the top of the module board 1, and the filling adhesive layer 4 is disposed on the top of the pre-embedded structure 3. The encapsulation film structure 2 includes a primer layer 21, an ETFE protective film 22, a photoelectric conversion film body 23, an encapsulation frame 24, a silicone ring 25, and a self-cleaning coating 27. The top of the module board 1 is coated with the primer layer 21, the ETFE protective film 22 is installed on the top of the primer layer 21, the photoelectric conversion film body 23 is installed on the top of the ETFE protective film 22, the top of the photoelectric conversion film body 23 is in contact with the inner wall of the encapsulation frame 24, the silicone ring 25 is fixedly disposed at the bottom of the encapsulation frame 24, and a self-cleaning coating 27 is coated between the top of the photoelectric conversion film body 23 and the inside of the encapsulation frame 24.

[0022] The pre-embedded structure 3 includes a pre-embedded box 31, an insulating sheet 32, a conductor core strip 33, an insulating buckle 34, a conductive core 35, a conductive pin 36, and a conductive plug 37. The pre-embedded box 31 is fixedly installed in the inner groove at the top of the module plate 1. The insulating sheet 32 ​​is fixedly installed inside the pre-embedded box 31. The conductor core strip 33 is fixedly installed inside the insulating sheet 32. The conductive core 35 is fixedly installed inside the insulating buckle 34. The conductive pin 36 is fixedly installed at the bottom of the conductive core 35. The conductive plug 37 is fixedly installed at the top of the conductive core 35. The rubber rings on the top of the pre-embedded box 31 and the inner wall of the insulating buckle 34 are slidably placed. Through the above arrangement, a pre-embedded plug-in type pre-embedded structure 3 is formed.

[0023] The bottom of the silicone ring 25 is placed in contact with the top of the module plate 1. An adhesive layer 26 is coated between the bottom of the encapsulation frame 24, the outside of the silicone ring 25, and the top of the module plate 1. Through the above arrangement, the adhesive layer 26 forms a cured and sealed treatment between the module plate 1 and the encapsulation film structure 2.

[0024] A flexible insulating wire 28 is provided on the top of the insulating buckle 34. The flexible insulating wire 28 is electrically connected to one end of the photoelectric conversion film body 23 near the pre-embedded structure 3. The flexible insulating wire 28 passes through the internal slot of the encapsulation frame 24. The gap between the flexible insulating wire 28 and the internal slot of the encapsulation frame 24 is filled with resin glue. Through the above arrangement, the resin glue provides waterproof sealing treatment for the gap between the flexible insulating wire 28 and the encapsulation frame 24.

[0025] The flexible conductive chip inside the flexible insulated wiring 28 is electrically connected to the top of the conductive plug 37. A filling adhesive layer 4 is potted between the top of the pre-embedded box 31 and the outside of the flexible conductive chip inside the flexible insulated wiring 28. Through the above arrangement, a waterproof filling and sealing effect is formed on the gap between the flexible insulated wiring 28 and the conductive plug 37.

[0026] Workflow: This utility model provides a modular installation assembly for a flexible photoelectric conversion film module. The main body of the device can perform modular, efficient, waterproof, and sealed installation of the flexible photoelectric conversion film to improve the installation stability of the flexible photoelectric conversion film.

[0027] The encapsulation film structure 2 and the pre-embedded structure 3 are installed above the module plate 1. A primer layer 21 is coated on the top of the module plate 1. An ETFE protective film 22 is installed on top of the primer layer 21. A photoelectric conversion film body 23 is installed on top of the ETFE protective film 22. A flexible insulating wire 28 passes through a slot inside the encapsulation frame 24. The top of the photoelectric conversion film body 23 is in contact with the inner wall of the encapsulation frame 24. Resin adhesive is used to fill the gap between the flexible insulating wire 28 and the slot inside the encapsulation frame 24. The bottom of the silicone ring 25 is in contact with the top of the module plate 1. A bonding adhesive layer 26 is applied between the bottom of the encapsulation frame 24, the outer side of the silicone ring 25, and the top of the module plate 1. A self-cleaning coating 27 is applied between the top of the photoelectric conversion film body 23 and the inside of the encapsulation frame 24. After the internal adhesive layer of the encapsulation film structure 2 dries, a seal is formed over the photoelectric conversion film body 23. The flexible conductive chip inside the flexible insulated wiring 28 is electrically connected to the top of the conductive plug 37. A filling adhesive layer 4 is potted between the top of the pre-embedded box 31 and the outside of the flexible conductive chip inside the flexible insulated wiring 28. After the filling adhesive layer 4 dries, it forms a waterproof filling and sealing effect on the gap between the flexible insulated wiring 28 and the conductive plug 37. The filling adhesive layer 4 is a circuit potting adhesive with good thermal conductivity. The photoelectric conversion film body 23, flexible insulated wiring 28, conductive plug 37, conductive core 35, conductive pin 36 and conductor core strip 33 are electrically connected. The conductor core strip 33 is electrically connected to the external circuit equipment through an external sealing bundle to store the photoelectric power generation of the photoelectric conversion film body 23. The photoelectric power generation of the photoelectric conversion film body 23 and the subsequent circuit equipment are existing technology equipment and will not be described in detail in this article.

[0028] Although embodiments of the utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A flexible photoelectric conversion film assembly, comprising a module board (1), an encapsulation film structure (2), a pre-embedded structure (3), and a filling adhesive layer (4), characterized in that: The module board (1) is provided with an encapsulation film structure (2) on the top. The module board (1) is provided with a pre-embedded structure (3) in the inner groove on the top. The pre-embedded structure (3) is provided with a filling adhesive layer (4) on the top. The encapsulation film structure (2) includes a primer layer (21), an ETFE protective film (22), a photoelectric conversion film body (23), an encapsulation frame (24), a silicone ring (25), and a self-cleaning coating (27). The module board (1) is coated with a primer layer (21). An ETFE protective film (22) is installed on the top of the primer layer (21). A photoelectric conversion film body (23) is installed on the top of the ETFE protective film (22). The top of the photoelectric conversion film body (23) is in contact with the inner wall of the encapsulation frame (24). A silicone ring (25) is fixedly provided at the bottom of the encapsulation frame (24). A self-cleaning coating (27) is applied between the top of the photoelectric conversion film body (23) and the inside of the encapsulation frame (24).

2. The flexible photoelectric conversion film assembly according to claim 1, characterized in that: The pre-embedded structure (3) includes a pre-embedded box (31), an insulating sheet (32), a conductor core strip (33), an insulating buckle (34), a conductive core (35), a conductive pin (36), and a conductive plug (37). The pre-embedded box (31) is fixedly installed in the inner groove at the top of the module plate (1). An insulating sheet (32) is fixedly installed inside the pre-embedded box (31). A conductor core strip (33) is fixedly installed inside the insulating sheet (32). A conductive core (35) is fixedly installed inside the insulating buckle (34). A conductive pin (36) is fixedly installed at the bottom end of the conductive core (35). A conductive plug (37) is fixedly installed at the top end of the conductive core (35). A rubber ring is slidably placed between the top of the pre-embedded box (31) and the inner wall of the insulating buckle (34).

3. The flexible photoelectric conversion film assembly according to claim 1, characterized in that: The bottom of the silicone ring (25) is placed in contact with the top of the module plate (1), and an adhesive layer (26) is coated between the bottom of the encapsulation frame (24), the outside of the silicone ring (25), and the top of the module plate (1).

4. The flexible photoelectric conversion film assembly according to claim 2, characterized in that: The top of the insulating buckle (34) is provided with a flexible insulating wire (28). The photoelectric conversion film body (23) is electrically connected to the flexible insulating wire (28) at one end near the pre-embedded structure (3). The flexible insulating wire (28) passes through the internal slot of the encapsulation frame (24). The gap between the flexible insulating wire (28) and the internal slot of the encapsulation frame (24) is filled with resin glue.

5. The flexible photoelectric conversion film assembly according to claim 4, characterized in that: The flexible conductive chip inside the flexible insulating wire (28) is electrically connected to the top of the conductive plug (37). A filling adhesive layer (4) is potted between the top of the pre-embedded box (31) and the outside of the flexible conductive chip inside the flexible insulating wire (28).