Chip-level packaging structure of mini-led display module

Abstract

The utility model discloses a kind of chip level packaging structures of MiniLED display module, including cooling combination package shell, the cooling combination package shell is wrapped in the outside of MiniLED display module;MiniLED display module package base plate and its top LED chip, the cooling combination package shell includes upper annular plate and lower annular plate, the inside of the lower annular plate is equipped with refrigeration plate, the refrigeration surface of the refrigeration plate is towards the base plate;The chip level packaging structure of this MiniLED display module is wrapped by stratification, accurate heat dissipation, sealing buffer etc. Design, realizes the efficient heat dissipation, firm protection and convenient maintenance of MiniLED display module, significantly improves the working stability of module, service life and assembly efficiency.

Description

Technical Field

[0001] This utility model relates to the technical field of chip-level packaging structure for MiniLED display modules, specifically a chip-level packaging structure for MiniLED display modules. Background Technology

[0002] Mini LED display technology, with its advantages of high brightness, high contrast, fast response, and long lifespan, has been widely used in various fields. However, with the continuous improvement of Mini LED chip integration, the number of chips in a single module has increased significantly, leading to a substantial increase in power density per unit area and a dramatic increase in heat generated during chip operation.

[0003] Existing Mini LED display module packaging structures primarily focus on electrical connection stability and mechanical protection, with insufficient attention to heat dissipation design. Traditional packaging often employs passive heat dissipation methods (such as natural heat dissipation from the metal substrate), resulting in long and inefficient heat dissipation paths that fail to meet the heat dissipation requirements of high-density chips. When the module is exposed to high temperatures for extended periods, the luminous efficiency of the LED chips will significantly decrease, color temperature drift will intensify, and overheating may even lead to chip failure, severely impacting the lifespan and display performance of the display module.

[0004] Therefore, it is necessary to design a chip-level packaging structure for MiniLED display modules. Utility Model Content

[0005] The purpose of this invention is to provide a chip-level packaging structure for a MiniLED display module to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a chip-level packaging structure for a MiniLED display module, including a cooling combined packaging shell, wherein the cooling combined packaging shell is wrapped around the outside of the MiniLED display module;

[0007] The MiniLED display module includes a substrate and an LED chip on top of it. The cooling assembly package includes an upper annular plate and a lower annular plate. A cooling plate is installed inside the lower annular plate, and the cooling surface of the cooling plate faces the substrate.

[0008] By adopting the above technical solution: the cooling combination packaging shell is wrapped around the MiniLED display module, and the cooling plate in the lower ring plate is used, with its cooling surface directly facing the substrate, which can specifically cool the LED chip and the substrate, quickly dissipate the heat generated when the chip is working, avoid high temperature affecting the luminous efficiency and lifespan of the MiniLED display module, and improve heat dissipation efficiency.

[0009] Preferably, the upper annular plate is fitted over the outside of the LED chip, the lower annular plate is fitted over the outside of the substrate, the bottom of the inner wall of the lower annular plate is integrally formed with an annular limiting plate, and the top outer wall of the cooling plate is integrally formed with an annular clamping plate, the annular clamping plate being clamped between the annular limiting plate and the substrate.

[0010] By adopting the above technical solution: the upper annular plate and the lower annular plate are respectively fitted over the LED chip and the substrate to achieve layered wrapping protection of the module; the annular limiting plate and the annular clamping plate cooperate to stably clamp the cooling plate between the substrate and the lower annular plate, preventing the cooling plate from shifting, ensuring effective contact between the cooling surface and the substrate, ensuring heat dissipation stability, and improving the robustness of the structural assembly.

[0011] Preferably, the bottom left and right sides of the upper annular plate are integrally formed with plug-in plates, and the top of the lower annular plate is provided with a plug-in groove for the plug-in plates to be inserted. The plug-in plates and the lower annular plate are fixed together by screws.

[0012] By adopting the above technical solution: the cooperation between the plug plate and the plug slot enables precise docking of the upper ring plate and the lower ring plate, which facilitates rapid assembly; the screw fixation further enhances the tightness of the connection between the two, prevents structural loosening caused by vibration during use, and improves the stability of the overall packaging structure.

[0013] Preferably, the bottom of the plug-in plate has cutouts on both the left and right sides.

[0014] By adopting the above technical solution, the cut at the bottom of the plug-in plate can reduce the contact area when the plug-in plate is inserted into the plug-in slot, reduce the assembly resistance, facilitate quick alignment and insertion, and at the same time alleviate stress concentration during plugging to a certain extent, and protect the structural integrity of the plug-in plate and the lower ring plate.

[0015] Preferably, the outer end of the screw has a rectangular groove.

[0016] By adopting the above technical solution, the rectangular groove at the outer end of the screw is adapted to a rectangular screwdriver, which facilitates quick tightening or loosening of the screw, improves the assembly and disassembly efficiency of the upper and lower annular plates, and facilitates later maintenance or replacement of parts.

[0017] Preferably, a first rubber layer is provided at the junction of the upper annular plate with the MiniLED display module and the lower annular plate; a second rubber layer is provided at the junction of the lower annular plate with the substrate, the annular card plate and the cooling plate.

[0018] By adopting the above technical solution, the first rubber layer and the second rubber layer are respectively filled at the joints of each component, which can buffer the vibration and impact between components and reduce wear caused by friction; at the same time, it can enhance the sealing of the structure, prevent dust, moisture and other contaminants from entering the encapsulation, protect the LED chip and electrical connection structure, and improve the reliability and service life of the MiniLED display module.

[0019] Compared with the prior art, the beneficial effects of this utility model are:

[0020] The chip-level packaging structure of this MiniLED display module achieves efficient heat dissipation, robust protection, and convenient maintenance through layered wrapping, precise heat dissipation, and sealing buffer design, significantly improving the module's working stability, service life, and assembly efficiency.

[0021] High-efficiency heat dissipation: The cooling plate is in direct contact with the substrate, which can effectively dissipate heat, solve the problem of high temperature in the chip, and ensure luminous efficiency.

[0022] Sturdy structure: The cooperation between the annular clamping plate and the annular limiting plate, the plug-in plate and the plug-in slot and the screw ensures that the connection of each component is firm and has strong vibration resistance.

[0023] Comprehensive protection: The first and second rubber layers provide sealing and cushioning, preventing contaminants from entering, reducing component wear, and improving reliability.

[0024] Easy assembly: The design of the cutouts and rectangular grooves reduces the difficulty of disassembly and assembly, facilitates quick assembly and subsequent maintenance, and improves ease of use. Attached Figure Description

[0025] Figure 1 This is a front cross-sectional view of the chip-level packaging structure of the MiniLED display module of this utility model;

[0026] Figure 2 This is an enlarged view of part A in the front cross-sectional view of the chip-level packaging structure of the MiniLED display module of this utility model;

[0027] Figure 3 This is a top view of the chip-level packaging structure of the MiniLED display module of this utility model.

[0028] In the diagram: 100, MiniLED display module; 110, substrate; 120, LED chip; 200, cooling combination packaging shell; 210, upper annular plate; 211, plug-in plate; 212, cutout; 220, lower annular plate; 221, annular limiting plate; 222, plug-in groove; 230, cooling plate; 231, annular retaining plate; 240, screw; 241, rectangular groove; 250, first rubber layer; 260, second rubber layer. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] See Figures 1-3 A chip-level packaging structure for a MiniLED display module includes a cooling combined packaging shell 200, which is wrapped around the MiniLED display module 100.

[0031] The MiniLED display module 100 includes a substrate 110 and an LED chip 120 on top of it. The cooling assembly packaging shell 200 includes an upper annular plate 210 and a lower annular plate 220. A cooling plate 230 is installed inside the lower annular plate 220, and the cooling surface of the cooling plate 230 faces the substrate 110.

[0032] The cooling combination packaging shell 200 is wrapped around the MiniLED display module 100. The cooling plate 230 inside the lower annular plate 220 has its cooling surface directly facing the substrate 110. It can specifically cool the LED chip 120 and the substrate 110, quickly dissipate the heat generated when the chip is working, avoid high temperature affecting the luminous efficiency and lifespan of the MiniLED display module 100, and improve heat dissipation efficiency.

[0033] An upper annular plate 210 is fitted over the LED chip 120, and a lower annular plate 220 is fitted over the substrate 110. An annular limiting plate 221 is integrally formed on the bottom inner wall of the lower annular plate 220, and an annular retaining plate 231 is integrally formed on the top outer wall of the cooling plate 230. The annular retaining plate 231 is secured between the annular limiting plate 221 and the substrate 110. The upper annular plate 210 and the lower annular plate 220 respectively fit over the LED chip 120 and the substrate 110, achieving layered protection for the module. A wire-passing hole is provided on the side wall of the lower annular plate 220 for leading out the power lines of the cooling plate 230. The wiring hole is positioned away from the electrical connection area of ​​the MiniLED display module 100 to prevent line interference; the annular limiting plate 221 and the annular clamping plate 231 cooperate to stably clamp the cooling plate 230 between the substrate 110 and the lower annular plate 220, preventing the cooling plate 230 from shifting, ensuring effective contact between the cooling surface and the substrate 110, ensuring heat dissipation stability, and improving the robustness of the structural assembly.

[0034] The upper annular plate 210 has integrally formed insertion plates 211 on both the left and right sides of its bottom. The lower annular plate 220 has an insertion slot 222 on its top for the insertion plates 211 to be inserted. The insertion plates 211 and the lower annular plate 220 are fixed together by screws 240. The cooperation between the insertion plates 211 and the insertion slots 222 enables precise docking between the upper annular plate 210 and the lower annular plate 220, facilitating rapid assembly. The screws 240 further enhance the tightness of the connection between the two, preventing structural loosening due to vibration during use and improving the stability of the overall packaging structure.

[0035] The bottom of the plug-in board 211 has cutouts 212 on both the left and right sides.

[0036] The cutout 212 at the bottom of the plug plate 211 can reduce the contact area when the plug plate 211 is inserted into the plug slot 222, reduce assembly resistance, facilitate quick alignment and insertion, and at the same time alleviate stress concentration during insertion to a certain extent, and protect the structural integrity of the plug plate 211 and the lower annular plate 220.

[0037] A rectangular groove 241 is provided at the outer end of the screw 240. The rectangular groove 241 is adapted to a rectangular screwdriver, which facilitates quick tightening or loosening of the screw 240, improves the disassembly and assembly efficiency of the upper annular plate 210 and the lower annular plate 220, and facilitates later maintenance or replacement of parts.

[0038] A first rubber layer 250 is provided at the interface between the upper annular plate 210 and the MiniLED display module 100 and the lower annular plate 220; a second rubber layer 260 is provided at the interface between the lower annular plate 220 and the substrate 110, the annular retaining plate 231 and the cooling plate 230. The first rubber layer 250 and the second rubber layer 260 are respectively filled at the interface of each component, which can buffer the vibration and impact between components and reduce wear caused by friction; at the same time, it enhances the sealing performance of the structure, prevents dust, moisture and other contaminants from entering the encapsulation, protects the LED chip 120 and the electrical connection structure, and improves the reliability and service life of the MiniLED display module 100.

[0039] Packaging steps:

[0040] Place the cooling plate 230 into the lower annular plate 220, so that the annular clamping plate 231 is clamped above the annular limiting plate 221, thus completing the initial positioning of the cooling plate 230.

[0041] The substrate 110 of the MiniLED display module 100 is placed inside the lower annular plate 220, so that the bottom of the substrate 110 contacts the annular retaining plate 231, and the cooling plate 230 is fixed by the cooperation of the annular limiting plate 221 and the substrate 110.

[0042] The upper annular plate 210 is placed over the LED chip 120 and aligned with the insertion slot 222 of the lower annular plate 220. The insertion plate 211 is then inserted into the insertion slot 222 to achieve the connection between the upper and lower annular plates.

[0043] Tighten the screw 240 using the tool that fits the rectangular groove 241 to fix the plug plate 211 to the lower annular plate 220, thus completing the assembly of the encapsulation structure.

[0044] During operation, the cooling surface of the cooling plate 230 continuously cools the substrate 110, and the first rubber layer 250 and the second rubber layer 260 play a buffering and sealing role to ensure stable operation of the module.

[0045] For maintenance or replacement of parts, loosen screw 240 to separate upper annular plate 210 and lower annular plate 220, and then operate the internal MiniLED display module 100 or cooling plate 230.

[0046] In summary, the chip-level packaging structure of this MiniLED display module, through layered wrapping, precise heat dissipation, and sealing buffer design, achieves efficient heat dissipation, robust protection, and convenient maintenance for the MiniLED display module 100, significantly improving the module's operational stability, lifespan, and assembly efficiency.

[0047] High-efficiency heat dissipation: The cooling plate 230 is in direct contact with the substrate 110, which can effectively dissipate heat, solve the problem of high temperature of the chip, and ensure luminous efficiency.

[0048] Stable structure: The cooperation between the annular clamping plate 231 and the annular limiting plate 221, the plug-in plate 211 and the plug-in groove 222, and the screw 240 ensures that the connection of each component is firm and has strong vibration resistance.

[0049] Comprehensive protection: The first rubber layer 250 and the second rubber layer 260 provide sealing and cushioning, preventing contaminants from entering, reducing component wear, and improving reliability.

[0050] Easy assembly: The design of the cut 212 and rectangular groove 241 reduces the difficulty of disassembly and assembly, facilitates quick assembly and subsequent maintenance, and improves the ease of use.

[0051] All parts not described in this utility model are the same as or can be implemented using existing technology. Although embodiments of this utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this utility model, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip-level packaging structure for a MiniLED display module, characterized in that, include: A cooling combination packaging shell (200) is wrapped around the MiniLED display module (100); The MiniLED display module (100) includes a substrate (110) and an LED chip (120) on top of it. The cooling combination packaging shell (200) includes an upper annular plate (210) and a lower annular plate (220). A cooling plate (230) is installed inside the lower annular plate (220), and the cooling surface of the cooling plate (230) faces the substrate (110).

2. The chip-level packaging structure of a MiniLED display module according to claim 1, characterized in that: The upper annular plate (210) is fitted over the outside of the LED chip (120), and the lower annular plate (220) is fitted over the outside of the substrate (110). An annular limiting plate (221) is integrally formed on the bottom inner wall of the lower annular plate (220), and an annular retaining plate (231) is integrally formed on the top outer wall of the cooling plate (230). The annular retaining plate (231) is secured between the annular limiting plate (221) and the substrate (110).

3. The chip-level packaging structure of a MiniLED display module according to claim 2, characterized in that: The bottom left and right sides of the upper annular plate (210) are integrally formed with plug plates (211), and the top of the lower annular plate (220) is provided with a plug groove (222) for the plug plate (211) to be inserted. The plug plate (211) and the lower annular plate (220) are fixed together by screws (240).

4. The chip-level packaging structure of a MiniLED display module according to claim 3, characterized in that: The bottom of the plug-in plate (211) has cutouts (212) on both the left and right sides.

5. The chip-level packaging structure of a MiniLED display module according to claim 3, characterized in that: A rectangular groove (241) is provided at the outer end of the screw (240).

6. The chip-level packaging structure of a MiniLED display module according to claim 2, characterized in that: The upper annular plate (210) is provided with a first rubber layer (250) at the junction with the MiniLED display module (100) and the lower annular plate (220); the lower annular plate (220) is provided with a second rubber layer (260) at the junction with the substrate (110), the annular card plate (231) and the cooling plate (230).

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