A wafer cleaning and wet etching flower basket transfer clamp

Abstract

The utility model discloses a kind of wafer cleaning and wet etching use flower basket transfer fixture, belong to chip fixture technical field, the fixture includes bottom bracket, detachably connected with vertical portion in the inside of bottom bracket, the outer wall of vertical portion is connected with holding portion, and through slot is provided on bottom bracket, the inner wall of through slot of bottom bracket is provided with a plurality of first insertion slot, the outer wall of bottom bracket is provided with a plurality of through bottom bracket and the drainage hole of first insertion slot, the drainage hole of bottom bracket outer wall is penetrated to first insertion slot, when transferring fixture after wet etching ends, only need to slightly incline fixture, residual acid between wafer and insertion slot can be quickly discharged through drainage hole, on the one hand, avoid acid leakage in movement, reduce the security risk to operator and the corrosion to equipment;On the other hand, shorten acid residual time, prevent residual acid continuously acting on wafer surface to cause excessive corrosion, guarantee chip processing quality.

Description

Technical Field

[0001] This utility model belongs to the field of chip fixture technology, specifically, it relates to a basket transfer fixture for chip cleaning and wet etching. Background Technology

[0002] Wet etching is a manufacturing technique that uses a chemical solution to react with the surface of a material, dissolving and removing unwanted material areas to form specific patterns or structures on the substrate. It is widely used in semiconductors, microelectronics, photovoltaics, MEMS (microelectromechanical systems) and other fields.

[0003] Before wet etching of silicon wafers, the wafers must first be cleaned. After cleaning, photoresist is coated on the surface of the wafers. The designed pattern is then transferred onto the photoresist using a photolithography machine. After development and drying, a photoresist mask is formed. The wafers are then placed in an etching solution at a preset temperature, and the reaction is accelerated by stirring (or ultrasound) to etch the material in the exposed areas. During the process, the etching depth and uniformity must be monitored in real time to avoid over-etching.

[0004] During the cleaning, wet etching, and removal of silicon wafers, clamps are needed to hold multiple silicon wafers to facilitate their transfer.

[0005] Chinese utility model patent CN222581134U discloses a transfer positioning fixture for chip production, including an outer frame. The inner sides of the front and rear frames of the outer frame are provided with adjustment grooves, and a positioning mechanism is installed between the inner sides of the adjustment grooves. A partition and a negative pressure exhaust hood are also provided at the bottom of the outer frame.

[0006] While this fixture can hold the silicon wafer more securely, during the wet etching process, the fixture needs to be immersed in acid along with the wafer. After the wet etching is completed, the wafer is removed, and the acid remains inside the fixture. Because there is a relatively sealed space between the wafer and the fixture, the acid can easily leak to the outside during transfer, corroding the surrounding environment and even coming into contact with the skin and causing damage. Utility Model Content

[0007] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0008] To address the problem mentioned in the background art that during wet etching, the fixture needs to be immersed in acid along with the wafer, and after the wet etching is completed, the acid will remain inside the fixture. Since there is a relatively sealed space between the wafer and the fixture, the acid is prone to leaking to the outside during transfer, corroding the surrounding environment and even potentially causing skin damage. The present invention adopts the following technical solution.

[0009] A basket transfer fixture for chip cleaning and wet etching includes a bottom bracket, a vertical part detachably connected inside the bottom bracket, a gripping part connected to the outer wall of the vertical part, a through groove on the bottom bracket, a plurality of first insertion slots on the inner wall of the through groove of the bottom bracket, a wafer being inserted into the interior of each first insertion slot, and a plurality of drain holes penetrating the bottom bracket and the first insertion slots on the outer wall of the bottom bracket.

[0010] Preferably, a downward pressing frame that can move up and down is provided on the vertical part, and a through groove is provided on the downward pressing frame. The inner wall of the through groove of the downward pressing frame is provided with a plurality of first insertion grooves.

[0011] Preferably, the outer wall of the vertical part is provided with a first through groove, the upper end of the lower pressure frame is connected to the two vertical sides of the U-shaped frame, and the horizontal side of the U-shaped frame is inserted into the interior of the first through groove.

[0012] Preferably, a partition plate is connected inside the first through slot, the horizontal side of the U-shaped frame is located above the partition plate, and a return connecting piece is provided between the bottom of the horizontal side of the U-shaped frame and the top of the partition plate.

[0013] Preferably, the outer wall of the vertical part is provided with a second through groove, which communicates with the first through groove. The two sides of the horizontal side of the U-shaped frame are connected with sliding plates that pass through the second through groove, and the outer walls of the two sliding plates are detachably connected with movable parts.

[0014] Preferably, a limiting plate is connected between the two vertical sides of the U-shaped frame, and the limiting plate is located below the partition plate.

[0015] Preferably, the side walls of the bottom bracket and the lower pressure frame are provided with inclined portions.

[0016] Preferably, the ends of the movable part and the gripping part are provided with mounting holes.

[0017] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0018] 1. The drain hole on the outer wall of the bottom bracket penetrates to the first insertion slot. When transferring the fixture after wet etching, only a slight tilt of the fixture is needed to quickly drain the residual acid between the wafer and the insertion slot through the drain hole. This avoids acid leakage during movement, reducing safety hazards to operators and corrosion to equipment. It also shortens the acid residue time, preventing residual acid from continuing to act on the wafer surface and causing excessive corrosion, thus ensuring chip processing quality.

[0019] 2. The fixture features a dual-structure design with a bottom bracket for support and a lower clamping frame for holding. Combined with the first insertion slot penetrating the inner wall of the slot, it precisely positions the wafers and can independently fix multiple wafers in the insertion slot, preventing wafers from shaking, colliding, or falling during movement. At the same time, the lower clamping frame achieves stable lifting and lowering through the sliding cooperation between the U-shaped frame and the vertical part. When clamping, it can closely fit the top of the wafer, further improving the structural stability during movement. It is especially suitable for the needs of batch transfer of multiple wafers in chip cleaning and wet etching scenarios, reducing the risk of wafer breakage.

[0020] 3. The clamping function of the fixture is achieved through the coordinated operation of the return assembly and the moving part. Under normal conditions, the return assembly can keep the lower pressure frame above the bottom bracket, which is convenient for picking up and putting down the wafers. When clamping is required, manual pressing or the robotic arm driving the moving part can drive the U-shaped frame and the lower pressure frame to move down for clamping. After release, the spring automatically returns to its original position. The operation is labor-saving and responsive. At the same time, the gripping part is adapted to manual operation, and the mounting holes at the ends of the moving part and the gripping part can be connected to the robotic arm, which takes into account the flexibility of manual transfer and the efficiency of automated production, and adapts to the needs of different production capacity scenarios.

[0021] 4. In the overall structure of the fixture, the design of the through groove, drainage hole, etc., takes into account the needs of acid contact and solution flow in wet etching scenarios. The positioning of the wafer by the first insertion groove not only improves the stability of movement, but also ensures that the solution contacts the wafer surface evenly during cleaning or etching, avoiding incomplete cleaning or uneven etching caused by wafer displacement. At the same time, the sealing and sliding fit between the components can reduce the corrosion of the transmission structure by acid, ensuring the fixture operates stably for a long time in a corrosive environment, indirectly ensuring the accuracy and consistency of chip processing. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of a basket transfer fixture for chip cleaning and wet etching according to the present invention.

[0023] Figure 2 This is a schematic diagram of the bottom bracket structure in this utility model;

[0024] Figure 3 In this utility model Figure 2 Enlarged structural diagram at point A in the middle;

[0025] Figure 4 This is a schematic diagram of the lower pressure frame structure in this utility model;

[0026] Figure 5 This is a schematic diagram of the exploded structure of the clamp in this utility model;

[0027] Figure 6 In this utility model Figure 5 Enlarged structural diagram at point B.

[0028] The correspondence between the labels and component names in the attached figures is as follows:

[0029] 100. Bottom bracket; 101. Inclined part; 102. Vertical part; 103. Grip part; 104. First insertion groove; 105. Drain hole; 106. First through groove; 107. Divider plate; 108. Second through groove;

[0030] 200. Lower pressure frame; 202. U-shaped frame; 203. Limiting plate; 204. Return assembly; 205. Sliding plate; 206. Moving part; 207. Mounting hole. Detailed Implementation

[0031] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0032] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0033] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments. The present invention provides the following embodiments.

[0034] like Figure 1The diagram shows a preferred embodiment of the present invention: a basket transfer fixture for chip cleaning and wet etching. This embodiment includes a bottom support 100 and a lower pressure frame 200. Inclined portions 101 are provided on the side walls of the bottom support 100 and the lower pressure frame 200. Penetrating grooves are provided on the bottom support 100 and the lower pressure frame 200. Multiple wafers are placed inside the penetrating grooves on the bottom support 100. A vertical portion 102 is detachably connected to the inside of the bottom support 100, and a holding portion 103 is connected to the outer wall of the vertical portion 102. In this embodiment, the bottom support 100 lifts the wafers, and the lower pressure frame 200 moves downwards to hold them above the wafers, thus maintaining the stability of the wafers during movement.

[0035] like Figure 2 as well as Figure 3 As shown, this is a schematic diagram of the drainage component structure in this embodiment. The inner walls of the penetration grooves of the bottom bracket 100 and the lower pressure bracket 200 are provided with a plurality of first insertion slots 104. The wafer is inserted into the interior of each first insertion slot 104. The outer wall of the bottom bracket 100 is provided with a plurality of drainage holes 105 penetrating the bottom bracket 100 and the first insertion slots 104. In this embodiment, the lower pressure bracket 200 moves downward to clamp the wafer. By setting the drainage holes 105, the acid remaining between the wafer and the first insertion slot 104 can be discharged when the fixture is tilted, thereby preventing the acid from leaking out when the fixture is moved after wet etching and increasing the acid drainage speed.

[0036] like Figure 2 as well as Figure 4 As shown, this is a schematic diagram of the lifting component structure in this embodiment. The outer wall of the vertical part 102 is provided with a first through groove 106. The upper end of the lower pressure frame 200 is connected to the two vertical sides of the U-shaped frame 202. The horizontal side of the U-shaped frame 202 is inserted into the interior of the first through groove 106. In this embodiment, the lower pressure frame 200 moves up and down by sliding the U-shaped frame 202 up and down inside the first through groove 106. Thus, when moving the wafer, the U-shaped frame 202 can fall down by gravity to clamp the wafer.

[0037] like Figure 2 , Figure 5 as well as Figure 6As shown, this is a schematic diagram of the clamping assembly structure in this embodiment. A partition plate 107 is connected inside the first through slot 106. The horizontal side of the U-shaped frame 202 is located above the partition plate 107. A return connector 204 is provided between the bottom of the horizontal side of the U-shaped frame 202 and the top of the partition plate 107. A second through slot 108 is provided on the outer wall of the vertical part 102, communicating with the first through slot 106. Sliding plates 205 extending through the second through slot 108 are connected to both sides of the horizontal side of the U-shaped frame 202. Moving parts 206 are detachably connected to the outer walls of the sliding plates 205 on both sides. A limiting plate 203 is connected between the two vertical sides of the frame 202. The limiting plate 203 is located below the partition plate 107. In this embodiment, the lower pressure frame 200 is normally located above the bottom bracket 100 by the return connector 204. When it is necessary to move the wafer, the moving part 206 moves downward to drive the U-shaped frame 202 and the lower pressure frame 200 to move downward. The wafer can be clamped by the lower pressure frame 200 and the bottom bracket 100. When the downward pressure of the moving part 206 is released, the U-shaped frame 202 and the lower pressure frame 200 can be reset by the return connector 204.

[0038] The return-fitting connector 204 can be a soft elastic body made of rubber band material.

[0039] The return assembly 204 can also be replaced with a corrosion-resistant plastic snap-fit ​​part with external teeth. When the return assembly 204 is a corrosion-resistant plastic snap-fit ​​part, the corrosion-resistant plastic snap-fit ​​part is installed vertically inside the second through groove 108 on the vertical part 102. The side of the corrosion-resistant plastic snap-fit ​​part has external tooth protrusions, and the side of the partition plate 107 has internal tooth concave parts. The external tooth protrusions and internal tooth concave parts can be stably connected and snapped together. At this time, there can be two partition plates 107, and these two partition plates 107 respectively To stabilize the partition plate and the adjustable locking partition plate, the stable partition plate is installed inside the first through groove 106, and the adjustable locking partition plate is installed inside the second through groove 108 on the vertical part 102. The adjustable locking partition plate matches the corrosion-resistant plastic locking part. The adjustable locking partition plate can be adjusted up and down or locked in place. These designs enable the downward pressure frame 200 and the U-shaped frame 202 to be adjusted upward or downward inside the first through groove 106 and the second through groove 108.

[0040] like Figure 6 As shown, this is the embodiment of the present invention. Figure 5 The enlarged structural diagram at point B shows that the ends of the moving part 206 and the gripping part 103 are provided with mounting holes 207. In this embodiment, the mounting holes 207 can be used to connect with the robotic arm, which can drive the gripper to move and drive the moving part 206 to move up and down.

[0041] The above description, in conjunction with specific embodiments, provides a further detailed explanation of the present utility model. It should not be construed that the specific implementation of the present utility model is limited to these descriptions. For those skilled in the art, several simple deductions or substitutions can be made without departing from the concept of the present utility model, and all such deductions or substitutions should be considered to fall within the scope of protection defined by the claims submitted by the present utility model.

Claims

1. A basket transfer fixture for chip cleaning and wet etching, comprising a bottom bracket (100), a vertical part (102) detachably connected to the interior of the bottom bracket (100), and a gripping part (103) connected to the outer wall of the vertical part (102), characterized in that, The bottom bracket (100) is provided with a through groove, and the inner wall of the through groove of the bottom bracket (100) is provided with a plurality of first insertion slots (104), and the wafer is inserted into the interior of each first insertion slot (104). The outer wall of the bottom bracket (100) is provided with a plurality of drainage holes (105) that penetrate the bottom bracket (100) and the first insertion groove (104).

2. The basket transfer fixture for chip cleaning and wet etching according to claim 1, characterized in that, The vertical part (102) is provided with a lower pressure frame (200) that can move up and down. The lower pressure frame (200) is provided with a through groove, and the inner wall of the through groove of the lower pressure frame (200) is provided with a plurality of first insertion grooves (104).

3. The basket transfer fixture for chip cleaning and wet etching according to claim 2, characterized in that, The outer wall of the vertical part (102) is provided with a first through groove (106), and the upper end of the lower pressure frame (200) is connected to the two vertical sides of the U-shaped frame (202), and the horizontal side of the U-shaped frame (202) is inserted into the interior of the first through groove (106).

4. The basket transfer fixture for chip cleaning and wet etching according to claim 3, characterized in that, The first through slot (106) is internally connected to a partition plate (107), the horizontal side of the U-shaped frame (202) is located above the partition plate (107), and a return connecting piece (204) is provided between the bottom of the horizontal side of the U-shaped frame (202) and the top of the partition plate (107).

5. The basket transfer fixture for chip cleaning and wet etching according to claim 4, characterized in that, The outer wall of the vertical part (102) is provided with a second through groove (108), which is connected to the first through groove (106). The two sides of the horizontal side of the U-shaped frame (202) are connected with sliding plates (205) that pass through the second through groove (108). The outer walls of the two sliding plates (205) are detachably connected with moving parts (206).

6. The basket transfer fixture for chip cleaning and wet etching according to claim 3, characterized in that, The U-shaped frame (202) is connected to a limiting plate (203) between its two vertical sides, and the limiting plate (203) is located below the partition plate (107).

7. The basket transfer fixture for chip cleaning and wet etching according to claim 1, characterized in that, The side walls of the bottom bracket (100) and the lower pressure bracket (200) are provided with inclined portions (101).

8. The basket transfer fixture for chip cleaning and wet etching according to claim 5, characterized in that, The ends of the moving part (206) and the gripping part (103) are provided with mounting holes (207).

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