Semiconductor cleaning apparatus

Abstract

The utility model provides a kind of semiconductor cleaning equipment, including cleaning chamber, placing platform, cleaning agent injection device and using device, sampling device includes second control valve, second pipeline, non-contact flowmeter and liquid storage box, liquid storage box is communicated with first pipeline by second pipeline, non-contact flowmeter is set on second pipeline. By setting sampling device, when cleaning agent injection device is cleaned or not cleaned to semiconductor, second control valve can be opened, cleaning agent is introduced into liquid storage box by second pipeline, when cleaning agent flows through second pipeline, the flow in second pipeline can be measured by non-contact flowmeter, sampling device is always connected with cleaning agent injection device, the flow of cleaning agent can be measured at any time according to needs. And by non-contact flowmeter, second pipeline and liquid storage box, flow detection part is closed structure, cleaning agent is not exposed to cause accidental injury, improve the security of flow detection.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a semiconductor cleaning device. Background Technology

[0002] This section provides only background information relevant to this disclosure and is not necessarily prior art.

[0003] The cleaning process in semiconductor manufacturing uses chemical cleaning agents to remove contaminants.

[0004] The flow rate of the cleaning agent is generally controlled within a set range. To prevent contamination, a non-contact flow meter is used. Among non-contact flow meters, ultrasonic flow meters are commonly used. During initial equipment start-up, shutdown, or replacement operations, manual sampling is performed to verify the flow rate of the non-contact flow meter. However, sampling requires disassembling the equipment, causing the cleaning agent to be exposed, which can easily cause personal injury, and the measurement time is relatively long. Manual sampling is not possible while the equipment is running.

[0005] In addition, to confirm whether there are any abnormalities in the flow rate of the cleaning agent, various imitation films are used. The flow rate of the cleaning agent is indirectly verified by monitoring the wet etching rate of the imitation film through the cleaning agent. However, due to the high integration of the equipment and the load effect, it is difficult to confirm the defects and characteristic changes of the actual product, which leads to inaccurate flow measurement. Utility Model Content

[0006] The purpose of this invention is to at least solve the technical problem that the cleaning agent flow rate of existing semiconductor cleaning equipment cannot be measured during use, and that such measurement is prone to causing danger. This purpose is achieved through the following technical solution:

[0007] This utility model proposes a semiconductor cleaning device, comprising:

[0008] Clean the chamber;

[0009] A placement platform is provided within the cleaning chamber and is used to place semiconductors;

[0010] A cleaning agent spraying device includes a spraying section, a first control valve, a first pipeline, and a cleaning agent supply assembly. The cleaning agent supply assembly is connected to the spraying section through the first pipeline. The spraying section is used to spray cleaning agent onto the semiconductor. The first control valve is disposed on the first pipeline.

[0011] The sampling device includes a second control valve, a second pipeline, a non-contact flow meter, and a liquid storage box. The liquid storage box is connected to the first pipeline through the second pipeline. The non-contact flow meter is installed on the second pipeline and is used to monitor the flow rate of the second pipeline. The second control valve is installed on the second pipeline and is located between the non-contact flow meter and the first pipeline.

[0012] The semiconductor cleaning equipment proposed in this invention incorporates a sampling device. This allows the second control valve to be opened, either during cleaning or when the cleaning agent spraying device is not cleaning the semiconductor. The cleaning agent is then introduced into a storage tank via a second pipeline. The flow rate of the cleaning agent through the second pipeline is measured by a non-contact flow meter. The sampling device is continuously connected to the cleaning agent spraying device, enabling on-demand measurement of the cleaning agent flow rate as needed. Furthermore, the flow detection section is designed as a sealed structure using the non-contact flow meter, the second pipeline, and the storage tank, preventing cleaning agent leakage and potential accidental damage, thus improving the safety of flow detection.

[0013] In addition, the semiconductor cleaning equipment according to this utility model may also have the following additional technical features:

[0014] In some embodiments of this utility model, the sampling device further includes a third control valve and a drain pipe, the drain pipe being connected to the bottom end of the liquid storage box, and the third control valve being disposed on the drain pipe.

[0015] In some embodiments of this utility model, the sampling device further includes an overflow pipe, and the top of the liquid storage box is connected to the drain pipe through the overflow pipe along the height direction of the liquid storage box.

[0016] In some embodiments of this utility model, the sampling device further includes an exhaust pipe that is connected to the top of the liquid storage box along the height direction of the liquid storage box.

[0017] In some embodiments of this utility model, the sampling device further includes a cleaning pipeline and a cleaning fluid supply assembly. The cleaning fluid supply assembly is connected to the storage box through the cleaning pipeline and is used to supply cleaning fluid into the storage box.

[0018] In some embodiments of this utility model, the cleaning pipeline is connected to the top of the liquid storage box along the height direction of the liquid storage box;

[0019] And / or, the sampling device further includes a fourth control valve disposed on the cleaning line.

[0020] In some embodiments of this utility model, the semiconductor cleaning equipment further includes a control device, which is electrically connected to the first control valve, the second control valve, the non-contact flow meter, and the cleaning agent supply assembly.

[0021] In some embodiments of this utility model, the semiconductor cleaning equipment includes multiple placement platforms and multiple cleaning agent spraying devices. The placement platforms and the cleaning agent spraying devices are arranged in a one-to-one correspondence. The second pipeline includes a main pipe and multiple branch pipes. One end of the branch pipe is connected to the first pipeline of one of the cleaning agent spraying devices, and the other end of the branch pipe is connected to the main pipe. The main pipe is connected to the liquid storage box.

[0022] In some embodiments of this utility model, the liquid storage box is cylindrical;

[0023] And / or, the volume of the reservoir is between 100 ml and 2000 ml.

[0024] In some embodiments of this utility model, the liquid storage box has an observation window and multiple liquid level indicators. The observation window is used for users to observe the liquid level in the liquid storage box, and the multiple liquid level indicators are spaced apart along the height direction of the liquid storage box. Attached Figure Description

[0025] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0026] Figure 1 A schematic diagram of the structure of a semiconductor cleaning apparatus according to an embodiment of the present invention is shown.

[0027] Figure 2 A schematic diagram of the cleaning chamber and cleaning agent spraying device according to an embodiment of the present invention is shown.

[0028] The markings in the attached diagram are as follows:

[0029] 100. Semiconductor cleaning equipment;

[0030] 10. Clean the chamber;

[0031] 20. Placement platform;

[0032] 30. Cleaning agent spraying device; 31. Spraying section; 32. First pipeline; 33. First control valve; 34. Cleaning agent supply assembly;

[0033] 40. Sampling device; 41. Second pipeline; 411. Main pipe; 412. Branch pipe; 42. Second control valve; 43. Non-contact flow meter; 44. Liquid storage box; 45. Drainage pipeline; 451. Third control valve; 46. Overflow pipeline; 47. Vent pipeline; 48. Cleaning pipeline; 481. Fourth control valve; 49. Liquid level indicator;

[0034] 50. Semiconductors;

[0035] Figure 1 The X-direction indicates the height direction of the liquid storage box. Detailed Implementation

[0036] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0037] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0038] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0039] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "over," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure is flipped, an element described as "below other elements or features" or "below other elements or features" would subsequently be oriented as "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0040] like Figure 1 and Figure 2 As shown, this utility model proposes a semiconductor cleaning device 100, including a cleaning chamber 10, a placement platform 20, a cleaning agent spraying device 30, and a sampling device 40. The placement platform 20 is disposed in the cleaning chamber 10 and is used to place semiconductors 50. The cleaning agent spraying device 30 includes a spraying part 31, a first control valve 33, a first pipeline 32, and a cleaning agent supply assembly 34. The cleaning agent supply assembly 34 is connected to the spraying part 31 through the first pipeline 32. The spraying part 31 is used to spray cleaning agent onto the semiconductors 50. The first control valve 33 is disposed on the first pipeline 32. The sampling device 40 includes a second control valve 42, a second pipeline 41, a non-contact flow meter 43, and a liquid storage box 44. The liquid storage box 44 is connected to the first pipeline 32 through the second pipeline 41. The non-contact flow meter 43 is disposed on the second pipeline 41 and is used to monitor the flow rate of the second pipeline 41. The second control valve 42 is disposed on the second pipeline 41 and is located between the non-contact flow meter 43 and the first pipeline 32.

[0041] As can be seen, the semiconductor cleaning equipment 100 proposed in this utility model, by setting up a sampling device 40, allows the second control valve 42 to be opened when the cleaning agent spraying device 30 is cleaning the semiconductor 50 or not, so that the cleaning agent is introduced into the storage box 44 through the second pipeline 41. When the cleaning agent flows through the second pipeline 41, the flow rate in the second pipeline 41 can be measured by a non-contact flow meter 43. The sampling device 40 is constantly connected to the cleaning agent spraying device 30, so the flow rate of the cleaning agent can be measured at any time as needed. Furthermore, the flow detection part is made into a closed structure by using the non-contact flow meter 43, the second pipeline 41, and the storage box 44, so that the cleaning agent will not be exposed and cause accidental damage, thus improving the safety of flow detection.

[0042] For example, the cleaning chamber 10 can be a closed or semi-closed structure, with its space generally cylindrical or cubic. The interior is used to house the placement platform 20 and the cleaning agent spraying device 30. The placement platform 20 is located at the bottom of the cleaning chamber 10 and can be a frustum-shaped structure. Its top has a placement surface for placing the semiconductor 50, and a latch, clamp, or groove structure for limiting the semiconductor 50 can also be provided here. The placement platform 20 can also be a rotatable structure, driven by a motor to rotate, thereby rotating the semiconductor 50. This allows the semiconductor 50 to be fully covered and cleaned by the cleaning agent spraying device 30 at a faster speed, improving the cleaning efficiency of the semiconductor 50. The cleaning agent spraying device 30 sprays cleaning agent onto the semiconductor 50 through the spraying section 31 to clean the surface of the semiconductor 50, ensuring a clean and tidy outer surface for subsequent processing. The specific cleaning agent can be selected based on existing wafer cleaning agents. The spraying section 31 can be located directly above the placement platform 20, with a radial spray angle to cover a larger area of ​​the semiconductor 50's outer surface. The spray section 31 can also be configured as a rotatable structure, allowing the semiconductor 50 to be completely covered and cleaned by the spray section 31 at a faster speed during cleaning, thereby improving the cleaning efficiency of the semiconductor 50. The cleaning agent supply assembly 34 may include a first container for containing the cleaning agent and a delivery pump for pumping the cleaning agent. The delivery pump pumps the cleaning agent from the first container along the first pipeline 32 to the spray section 31 for spraying. A first control valve 33 is disposed on the first pipeline 32 and controls the opening and closing of the first pipeline 32 to control the spraying and closing of the cleaning agent. The second pipeline 41 of the sampling device 40 is connected to the first pipeline 32. To ensure that the second pipeline 41 is consistent with the actual flow rate, the connection between the first pipeline 32 and the second pipeline 41 can be set to be T-shaped or Y-shaped, so that the flow rate of the second pipeline 41 is consistent with the flow rate of the portion of the first pipeline 32 located between the second pipeline 41 and the spray section 31, thereby making the flow rate measurement more accurate. The non-contact flow meter 43 can be an ultrasonic flow meter, laser flow meter, or electromagnetic flow meter, etc. It is installed on the second pipe 41 without requiring any openings in the second pipe 41, making the sampling device 40 completely sealed and reducing the risk of cleaning agent leakage. A liquid storage box 44 can be installed at the end of the second pipe 41 opposite to the first pipe 32, i.e., the outlet end of the second pipe 41. The liquid storage box 44 can be cubic or cylindrical, forming an internal space to hold the cleaning agent. The liquid storage box 44 is also a sealed structure, reducing the risk of cleaning agent leakage. When the liquid storage box 44 is full, the accumulated cleaning agent can be safely disposed of.

[0043] In some embodiments of this utility model, the sampling device 40 further includes a third control valve 451 and a drain pipe 45, the drain pipe 45 being connected to the bottom end of the storage box 44, and the third control valve 451 being disposed on the drain pipe 45.

[0044] As can be seen, by setting up a drain pipe 45 to connect to the liquid storage box 44, the cleaning agent accumulated in the liquid storage box 44 can be discharged to the outside of the liquid storage box 44 for safe treatment, so that the liquid storage box 44 can be reused for flow measurement.

[0045] For example, the drain pipe 45 can be connected to the bottom of the storage box 44, so that there are no dead corners in the drainage and all the cleaning agent in the storage box 44 can be discharged from the drain pipe 45. A third control valve 451 needs to be installed on the drain pipe 45, which can be manually or automatically controlled by a control device. When the liquid level in the storage box 44 is high, the third control valve 451 is opened to drain the accumulated liquid, and the third control valve 451 is kept closed at other times.

[0046] In some embodiments of this utility model, the sampling device 40 further includes an overflow pipe 46, and the top of the liquid storage box 44 is connected to the drain pipe 45 through the overflow pipe 46 along the height direction of the liquid storage box 44.

[0047] As can be seen, the top of the liquid storage box 44 is connected to the overflow pipe 46, and the overflow pipe 46 is also connected to the drain pipe 45, so that when the liquid storage box 44 accumulates too much cleaning agent, it can be discharged from the overflow pipe 46, so as to avoid the liquid level of the liquid storage box 44 from suddenly increasing and affecting the flow measurement, or causing the internal pressure of the liquid storage box 44 to be too high and causing danger.

[0048] For example, the overflow line 46 can be connected to the top of the liquid storage box 44 to facilitate the discharge of cleaning agent at the top high liquid level. The overflow line 46 does not need to be equipped with a control valve. The connection position of the overflow line 46 and the drain line 45 can be located downstream of the third control valve 451 so that the third control valve 451 will not obstruct the overflow.

[0049] In some embodiments of this utility model, the sampling device 40 further includes an exhaust pipe 47, which is connected to the top of the liquid storage box 44 along the height direction of the liquid storage box 44.

[0050] It is evident that by setting up the exhaust pipe 47 to discharge the high-pressure gas generated by the evaporation of the cleaning agent in the storage tank, the pressure inside the storage tank is prevented from becoming too high and causing danger.

[0051] For example, the exhaust pipe 47 can be connected to the top of the liquid storage box 44. Specifically, when the liquid storage box 44 is cylindrical, the exhaust pipe 47 can be connected to the end plate of the liquid storage box 44, so that the upward-flowing high-pressure gas can be safely discharged from the exhaust pipe 47.

[0052] In some embodiments of this utility model, the sampling device 40 further includes a cleaning pipeline 48 and a cleaning fluid supply assembly. The cleaning fluid supply assembly is connected to the storage box 44 through the cleaning pipeline 48 and is used to supply cleaning fluid into the storage box 44.

[0053] As can be seen, in order to ensure that the cleaning agent does not accumulate and remain on the inner wall of the equipment, a cleaning liquid supply component can be set up to introduce deionized water into the liquid storage box 44 to clean the liquid storage box 44 and the second pipeline 41. The deionized water can flush the cleaning agent down and discharge it through the drain pipeline 45.

[0054] For example, the cleaning solution may be a liquid such as deionized water that can rinse the cleaning agent, and the cleaning solution supply component may be a container that contains deionized water and a water pump, which supplies the solution to the storage box 44 through the cleaning pipeline 48.

[0055] In some embodiments of this utility model, the cleaning pipeline 48 is connected to the top of the liquid storage box 44 along the height direction of the liquid storage box 44.

[0056] And / or, the sampling device 40 also includes a fourth control valve 481, which is disposed on the cleaning line 48.

[0057] As can be seen, the cleaning pipe 48 can be connected to the top of the liquid storage box 44, so that the cleaning liquid can clean the liquid storage box 44 from top to bottom and be discharged from the drain pipe 45 at the bottom of the liquid storage box 44, resulting in a better cleaning effect.

[0058] For example, the fourth control valve 481 can be closed when cleaning the reservoir 44 is not required, and opened after the cleaning agent in the reservoir 44 has been discharged, so as to fill the reservoir 44 with cleaning fluid for cleaning. Specifically, after the flow measurement is completed, the third control valve 451 is opened to drain all the cleaning agent in the reservoir 44, and then the fourth control valve 481 is opened to fill the reservoir 44 with cleaning fluid to clean the inner wall of the reservoir 44, and then discharged from the drain pipe 45.

[0059] In some embodiments of this utility model, the semiconductor cleaning equipment 100 further includes a control device, which is electrically connected to the first control valve 33, the second control valve 42, the non-contact flow meter 43, and the cleaning agent supply assembly 34, respectively.

[0060] As can be seen, by setting up a control device, the flow measurement and flow correction can be automated. When flow measurement is required, the second control valve 42 is opened. The control device receives the signal from the non-contact flow meter 43 and adjusts the power of the cleaning agent supply component in real time according to the signal, and corrects the actual flow based on the monitored flow.

[0061] For example, a preset time can be set. When the semiconductor cleaning equipment 100 runs for the preset time, the control device controls the second control valve 42 to open, and the non-contact flow meter 43 measures the flow rate of the second pipeline 41. When the measured flow rate is inconsistent with the preset flow rate, the control device controls the power of the cleaning agent supply component to deliver the cleaning agent. When the flow rate is too low, the power can be increased; when the flow rate is too high, the power can be decreased, so that the flow rate returns to normal. A fixed calibration time can be set to measure the flow rate multiple times and adjust it multiple times until the flow rate reaches the preset flow rate. Specifically, the preset flow rate can be set to 1, and the increment of each calibration is 0.01.

[0062] In some embodiments of this utility model, the semiconductor cleaning equipment 100 includes a plurality of placement platforms 20 and a plurality of cleaning agent spraying devices 30. The placement platforms 20 and the cleaning agent spraying devices 30 are arranged in a one-to-one correspondence. The second pipeline 41 includes a main pipe 411 and a plurality of branch pipes 412. One end of the branch pipe 412 is connected to the first pipeline 32 of a cleaning agent spraying device 30, and the other end of the branch pipe 412 is connected to the main pipe 411. The main pipe 411 is connected to the liquid storage box 44.

[0063] As can be seen, by setting up multiple placement platforms 20 and cleaning agent spraying devices, multiple semiconductors 50 can be cleaned simultaneously. Furthermore, multiple branch pipes 412 are connected to the cleaning agent spraying devices to introduce the cleaning agent from the multiple cleaning agent spraying devices into the main pipe 411 and perform measurements.

[0064] For example, multiple branch pipes 412 are connected in parallel through a main pipe 411, and a non-contact flow meter 43 can be installed on each branch pipe 412 for flow measurement.

[0065] In some embodiments of this utility model, the liquid storage box 44 is cylindrical;

[0066] And / or, the volume of the reservoir 44 is between 100 ml and 2000 ml.

[0067] It can be seen that by setting the volume range of the liquid storage box 44, the volume of the liquid storage box 44 is matched with the amount of cleaning agent required for a single flow measurement, so that the volume of the liquid storage box 44 is moderate.

[0068] For example, the reservoir 44 may be made of a corrosion-resistant material.

[0069] In some embodiments of this utility model, the liquid storage box 44 has an observation window and multiple liquid level indicators 49. The observation window is used for users to observe the liquid level in the liquid storage box 44, and the multiple liquid level indicators 49 are spaced apart along the height direction of the liquid storage box 44.

[0070] As can be seen, the liquid level in the storage box 44 can be observed through the observation window and the multiple liquid level indicators 49, thereby controlling the opening and closing of the third control valve 451 to discharge the accumulated cleaning agent.

[0071] For example, the observation window may be transparently disposed on the side wall of the liquid storage box 44, and the liquid level indicator 49 may be spaced apart along the height direction, including high liquid level, error range liquid level, set liquid level and low liquid level.

[0072] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the scope of the claims.

Claims

1. A semiconductor cleaning device, characterized in that, include: Clean the chamber; A placement platform is provided within the cleaning chamber and is used to place semiconductors; A cleaning agent spraying device includes a spraying section, a first control valve, a first pipeline, and a cleaning agent supply assembly. The cleaning agent supply assembly is connected to the spraying section through the first pipeline. The spraying section is used to spray cleaning agent onto the semiconductor. The first control valve is disposed on the first pipeline. The sampling device includes a second control valve, a second pipeline, a non-contact flow meter, and a liquid storage box. The liquid storage box is connected to the first pipeline through the second pipeline. The non-contact flow meter is installed on the second pipeline and is used to monitor the flow rate of the second pipeline. The second control valve is installed on the second pipeline and is located between the non-contact flow meter and the first pipeline.

2. The semiconductor cleaning equipment according to claim 1, characterized in that, The sampling device also includes a third control valve and a drain pipe, the drain pipe being connected to the bottom of the liquid storage box, and the third control valve being disposed on the drain pipe.

3. The semiconductor cleaning equipment according to claim 2, characterized in that, The sampling device also includes an overflow pipe, and the top of the liquid storage box is connected to the drain pipe through the overflow pipe along the height direction of the liquid storage box.

4. The semiconductor cleaning equipment according to claim 1, characterized in that, The sampling device also includes an exhaust pipe that is connected to the top of the liquid storage box along the height direction of the liquid storage box.

5. The semiconductor cleaning equipment according to claim 1, characterized in that, The sampling device also includes a cleaning pipeline and a cleaning fluid supply assembly. The cleaning fluid supply assembly is connected to the storage box through the cleaning pipeline and is used to supply cleaning fluid into the storage box.

6. The semiconductor cleaning equipment according to claim 5, characterized in that, Along the height direction of the liquid storage box, the cleaning pipeline is connected to the top of the liquid storage box; And / or, the sampling device further includes a fourth control valve disposed on the cleaning line.

7. The semiconductor cleaning equipment according to claim 1, characterized in that, The semiconductor cleaning equipment also includes a control device, which is electrically connected to the first control valve, the second control valve, the non-contact flow meter, and the cleaning agent supply assembly.

8. The semiconductor cleaning equipment according to claim 1, characterized in that, The semiconductor cleaning equipment includes multiple placement platforms and multiple cleaning agent spraying devices. The placement platforms and the cleaning agent spraying devices are arranged in a one-to-one correspondence. The second pipeline includes a main pipe and multiple branch pipes. One end of the branch pipe is connected to the first pipeline of one of the cleaning agent spraying devices, and the other end of the branch pipe is connected to the main pipe. The main pipe is connected to the liquid storage box.

9. The semiconductor cleaning equipment according to claim 1, characterized in that, The liquid storage box is cylindrical; And / or, the volume of the reservoir is between 100 ml and 2000 ml.

10. The semiconductor cleaning apparatus according to any one of claims 1 to 9, characterized in that, The liquid storage box has an observation window and multiple liquid level indicators. The observation window is used for users to observe the liquid level in the liquid storage box, and the multiple liquid level indicators are spaced apart along the height direction of the liquid storage box.

Images