MOSFET leg trimming device

The MOSFET lead-cutting and shaping device, which uses a cylinder-driven pusher and gear meshing transmission, solves the problem of inaccurate positioning of MOSFETs of different sizes in existing equipment, realizes precise positioning and shaping of leads, and improves shaping efficiency.

CN224475535UActive Publication Date: 2026-07-10SHENZHEN BAOCHENG MICROELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN BAOCHENG MICROELECTRONICS CO LTD
Filing Date
2025-05-09
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

Existing automatic MOSFET cutting and shaping equipment has difficulty ensuring that MOSFETs of different sizes are centered in the shaping groove when processing them. This can easily lead to positional deviation, resulting in limited shaping effect and uneven pin shaping of MOSFETs.

Method used

A MOSFET lead-cutting and shaping device was designed. The device uses a cylinder-driven push block and gear meshing to drive a calibration board to center the MOSFET. The electric push rod and telescopic block work together to achieve precise positioning and ejection of the MOSFET, which facilitates lead shaping.

Benefits of technology

It enables precise positioning and pin shaping of MOSFETs of different sizes, ensuring the accuracy and consistency of the shaping position and improving the shaping efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model discloses a MOSFET lead trimming and shaping device, relating to the field of electronic component processing. It includes a base, a shaping seat fixedly mounted on the top of the base, a shaping groove formed on the top of the shaping seat, a gear rotatably mounted on one side of the shaping seat, a rack meshing with one side of the gear, a driving assembly on one side of the rack, and a connecting block fixedly connected to one side of the rack. This utility model uses a cylinder to drive a pusher block, causing two racks to mesh and transmit power through the gear. The racks drive two calibration plates to approach the MOSFET inside the shaping groove, calibrating the position of MOSFETs of different sizes below the shaping block, centered on the MOSFET in the shaping groove. A first electric push rod drives the pusher plate and the telescopic block to move. After the shaping block completes the shaping, the MOSFET is pushed out of the shaping groove, facilitating the shaping of the next MOSFET.
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