Electronic component automatic soldering machine

Abstract

This utility model relates to the field of automation technology, specifically an automated soldering machine for electronic components. It includes a frame, a loading mechanism, a picking mechanism, a fluxing mechanism, a soldering mechanism, and a receiving mechanism mounted on the frame. The loading mechanism is equipped with a loading carrier for fixing electronic components and transporting them to a designated position. The picking mechanism picks up the electronic components from the loading carrier and transmits them between the fluxing mechanism, the soldering mechanism, and the receiving mechanism. The fluxing mechanism applies flux to the parts of the electronic components that require soldering. The soldering mechanism performs the soldering on the electronic components. After soldering, the picking mechanism places the electronic components onto the receiving mechanism for transfer and collection. This utility model achieves full automation of reactor soldering operations through key technologies such as efficient loading, precise picking, reliable fluxing, stable soldering, and automated receiving.

Description

Technical Field

[0001] This utility model relates to the field of automation technology, and in particular to an automated soldering machine for electronic components. Background Technology

[0002] In the existing reactor production process, the soldering process is mainly used to achieve electrical connections between various internal components of the reactor. This is usually done manually using soldering equipment, which is not only inefficient but also susceptible to the quality of the solder joints being affected by the operator's skill level and working condition. The testing stage involves checking various performance indicators of the soldered reactors, such as inductance and resistance values. This is also mostly done manually, placing each reactor one by one onto the testing equipment for testing, which is tedious and prone to omissions.

[0003] Because these processes are carried out independently and lack an effective automated connection mechanism, the entire production process involves a significant amount of manual handling and waiting time, which greatly limits the improvement of production efficiency. It also increases production costs and product quality instability, making it difficult to meet the demands of modern industry for efficient, stable, and large-scale production of reactors. Therefore, new improvements are needed to the existing automation of reactor production. Utility Model Content

[0004] To address the aforementioned issues, this utility model utilizes key technologies such as efficient material feeding, precise material handling, reliable soldering, stable soldering, and automated material collection to achieve full automation of reactor soldering operations. This significantly improves production efficiency, welding quality, and product reliability, providing strong technical support and assurance for the reactor manufacturing industry.

[0005] The technical solution adopted by this utility model is: an automated soldering machine for electronic components, including a frame, a feeding mechanism, a picking mechanism, a fluxing mechanism, a soldering mechanism, and a receiving mechanism mounted on the frame. The feeding mechanism is equipped with a feeding carrier for fixing electronic components and transporting them to a designated position. The picking mechanism is used to pick up electronic components from the feeding carrier and transport them between the fluxing mechanism, the soldering mechanism, and the receiving mechanism. The fluxing mechanism is used to add flux to the parts of the electronic components that need soldering. The soldering mechanism is used to solder the electronic components. After soldering is completed, the picking mechanism places the electronic components to the receiving mechanism for transfer and collection.

[0006] A further improvement to the above scheme is that the feeding mechanism is located on one side of the frame, the receiving mechanism, the fluxing mechanism and the soldering mechanism are arranged sequentially along the first direction of the frame, and the picking mechanism picks up the electronic components and then puts them into the receiving mechanism after passing them through the fluxing mechanism and the soldering mechanism.

[0007] A further improvement to the above solution is that the feeding mechanism includes a feeding transmission module, the feeding carrier is mounted on the feeding transmission module, the feeding transmission module is used to drive the feeding carrier to reciprocate between the feeding station and the picking station, and the picking mechanism is used to grab the electronic components on the feeding carrier at the picking station; the feeding carrier is provided with multiple feeding slots to simultaneously place multiple electronic components.

[0008] A further improvement to the above solution is that the material handling mechanism includes a transmission gantry, a material handling and transfer module, a material handling and lifting module, and a gripping module. The transmission gantry is arranged on both sides of the frame. The material handling and transfer module is arranged on the transmission gantry and is used to drive the material handling and lifting module and the gripping module to move between the feeding mechanism, the soldering mechanism, the soldering mechanism, and the receiving mechanism. The gripping module is arranged on the material handling and lifting module, and multiple gripping modules are arranged to grip multiple electronic components simultaneously.

[0009] A further improvement to the above solution is that the material handling and transfer module is a transmission module combining belt drive and guide rail drive, and the material handling and lifting module is a transmission module combining lead screw and guide rod; the gripping module includes a gripping cylinder and a clamping claw, and the gripping cylinder is used to drive the clamping claw to grip the electronic components.

[0010] A further improvement to the above solution is that the material lifting module is equipped with a flipping module, which is used to drive the gripping module to flip. The gripping module and the flipping module are equipped with protective covers to cope with the high temperature of the soldering mechanism.

[0011] A further improvement to the above solution is that the fluxing mechanism includes a fluxing bracket and a fluxing tank disposed on the fluxing bracket. The fluxing tank is used to contain flux for immersing the soldering position of electronic components in flux.

[0012] A further improvement to the above solution is that the soldering mechanism includes a solder base, a solder tank, a solder scraping module, and a solder dross tank. The solder tank is disposed on the solder base and is equipped with multiple heating elements for heating the solder material in the solder tank. The solder dross tank is located on one side of the solder tank, and the solder scraping module is used to scrape the solder dross in the solder tank toward the solder dross tank.

[0013] A further improvement to the above solution is that the solder scraping module includes a solder scraping bracket, a solder scraping lifting cylinder, a solder scraping driving cylinder, and a solder scraping plate. The solder scraping bracket is disposed on one side of the frame, the solder scraping lifting cylinder is disposed on the solder scraping bracket, the solder scraping driving cylinder is disposed on the solder scraping lifting cylinder, and the solder scraping plate is disposed on the solder scraping driving cylinder, so as to realize lifting and unidirectional reciprocating transmission solder scraping.

[0014] A further improvement to the above solution is that it also includes a slag brushing mechanism, which includes a slag receiving cavity, a slag brush roller, and a slag drive motor. The slag drive motor is used to drive the slag brush roller to rotate in the slag receiving cavity. The material picking mechanism is used to pick up the soldered electronic components and place them on the slag brush roller to brush off the slag, so as to remove the slag present in the soldered part.

[0015] The beneficial effects of this utility model are:

[0016] Compared to existing electronic component soldering methods, this invention achieves full automation of reactor soldering operations through key technologies such as efficient material feeding, precise material handling, reliable fluxing, stable soldering, and automated material collection. This significantly improves production efficiency, soldering quality, and product reliability, providing strong technical support and assurance for the reactor manufacturing industry. By integrating material feeding, fluxing, soldering, and material collection into a single work unit through a modular layout and adopting a linear process flow design, the material transfer distance is effectively shortened. This enables automated continuous operation of the reactor soldering process. The feeding carrier can precisely fix and transport the reactor, while the material handling mechanism quickly and accurately transfers materials between various mechanisms, greatly reducing the time spent on manual operations. Compared to traditional manual soldering methods, production efficiency is significantly improved. The fluxing mechanism evenly replenishes flux to the solderable parts of the reactor, ensuring good wetting during the soldering process. Combined with the precise soldering operation of the soldering mechanism, this results in full, strong, and smooth solder joints, effectively avoiding quality problems such as cold solder joints and incomplete soldering. This significantly improves the quality stability of reactor soldering and ensures the reliability of the product's electrical performance. The entire soldering process is highly automated, reducing reliance on a large amount of manual labor. Only a small number of personnel are needed for equipment monitoring and simple maintenance, greatly reducing labor costs and minimizing the risk of quality fluctuations caused by factors such as human operator fatigue. Attached Figure Description

[0017] Figure 1 This is a three-dimensional schematic diagram of the automated soldering machine for electronic components according to this utility model;

[0018] Figure 2 for Figure 1 A three-dimensional schematic diagram of an automated soldering machine for electronic components from another perspective;

[0019] Figure 3 for Figure 1 A top view of some structures of an automated soldering machine for electronic components.

[0020] Figure 4 for Figure 1 A three-dimensional schematic diagram of some parts of the automated soldering machine for multiple electronic components;

[0021] Figure 5 for Figure 1A three-dimensional schematic diagram of the material handling mechanism of an automated soldering machine for electronic components.

[0022] Figure 6 for Figure 1 A three-dimensional schematic diagram of the material handling mechanism of an automated soldering machine for electronic components from another perspective.

[0023] Explanation of reference numerals in the attached drawings: Frame 1, Feeding mechanism 2, Feeding carrier 21, Feeding transmission module 22, Picking mechanism 3, Transmission gantry 31, Picking and transferring module 32, Picking and lifting module 33, Gripping module 34, Gripping cylinder 341, Clamping claw 342, Tilting module 35, Protective cover 351, Soldering mechanism 4, Soldering bracket 41, Soldering tank 42, Soldering mechanism 5, Solder base 51, Solder tank 52, Heating element 521, Solder scraping module 53, Solder scraping bracket 531, Solder scraping lifting cylinder 532, Solder scraping drive cylinder 533, Solder scraping plate 534, Solder dross tank 54, Receiving mechanism 6, Solder dross brushing mechanism 7, Solder dross receiving cavity 71, Solder dross brush roller 72, Solder dross drive motor 73. Detailed Implementation

[0024] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this utility model.

[0025] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0027] like Figures 1-6As shown in one embodiment of this utility model, an automated soldering machine for electronic components is disclosed. The machine includes a frame 1, a loading mechanism 2, a picking mechanism 3, a fluxing mechanism 4, a soldering mechanism 5, and a receiving mechanism 6, all mounted on the frame 1. The loading mechanism 2 is equipped with a loading carrier 21 for fixing electronic components and transporting them to a designated position. The picking mechanism 3 picks up electronic components from the loading carrier 21 and transmits them between the fluxing mechanism 4, the soldering mechanism 5, and the receiving mechanism 6. The fluxing mechanism 4 applies flux to the parts of the electronic components requiring soldering. The soldering mechanism 5 performs soldering on the electronic components. After soldering, the picking mechanism 3 places the electronic components onto the receiving mechanism 6 for transfer and collection. In this embodiment, through key technologies such as efficient loading, precise picking, reliable fluxing, stable soldering, and automated receiving, the fully automated soldering operation of reactors is achieved, significantly improving production efficiency, welding quality, and product reliability, providing strong technical support and assurance for the reactor manufacturing industry. The loading carrier 21 can accurately fix and transport the reactor, while the unloading mechanism 3 quickly and accurately transfers materials between the various mechanisms, greatly reducing the time spent on manual operations. Compared with traditional manual soldering methods, production efficiency can be significantly improved. The fluxing mechanism 4 can evenly replenish flux to the parts of the reactor that need soldering, ensuring good wetting during the soldering process. Combined with the precise soldering operation of the soldering mechanism 5, it can make the solder joints full, firm, and smooth, effectively avoiding quality problems such as cold solder joints and missing solder joints, greatly improving the quality stability of reactor soldering and ensuring the reliability of product electrical performance. The entire soldering process is highly automated, reducing reliance on a large number of manual laborers. Only a small number of personnel are needed for equipment monitoring and simple maintenance, significantly reducing labor costs and also reducing the risk of quality fluctuations caused by factors such as human fatigue.

[0028] The feeding mechanism 2 is located on one side of the frame 1. The receiving mechanism 6, the fluxing mechanism 4, and the soldering mechanism 5 are arranged sequentially along the first direction of the frame 1. The picking mechanism 3 picks up electronic components and places them into the receiving mechanism 6 after passing them sequentially through the fluxing mechanism 4 and the soldering mechanism 5. In this embodiment, the feeding mechanism 2, located on one side of the frame 1, is responsible for continuously supplying electronic components to be processed for the entire soldering process, ensuring the continuity of production. The receiving mechanism 6, the fluxing mechanism 4, and the soldering mechanism 5 are arranged sequentially along the first direction of the frame 1. The fluxing mechanism 4 can accurately pre-treat the soldering parts of the electronic components, effectively removing surface oxide layers and other impurities, greatly improving the adhesion and soldering quality of the subsequent solder. The soldering mechanism 5, with its high-precision soldering action, can accurately and evenly apply an appropriate amount of solder to the soldering point, enabling a stable and reliable electrical connection at each connection point of the reactor. The picking mechanism 3's process of picking up electronic components and placing them into the receiving mechanism 6 after passing them sequentially through the fluxing mechanism 4 and the soldering mechanism 5 achieves a fully automated operation mode. It significantly improves production efficiency, enabling more reactor soldering processes to be completed per unit time compared to traditional manual soldering methods.

[0029] The loading mechanism 2 includes a loading transmission module 22, on which the loading carrier 21 is mounted. The loading transmission module 22 drives the loading carrier 21 to reciprocate between the loading station and the unloading station. The unloading mechanism 3 is used to pick up electronic components from the loading carrier 21 at the unloading station. The loading carrier 21 is provided with multiple feeding slots to simultaneously hold multiple electronic components. In this embodiment, the loading transmission module 22 drives the loading carrier 21, which has multiple feeding slots, to reciprocate between specific loading and unloading stations, achieving a highly efficient and stable loading process. Multiple feeding slots can simultaneously hold multiple electronic components, greatly increasing the number of components loaded in a single operation, effectively reducing the time spent on frequent loading operations, and improving overall production efficiency. The unloading mechanism 3 accurately picks up electronic components from the loading carrier 21 at the unloading station, with close cooperation, further ensuring that subsequent soldering processes can be carried out in an orderly and uninterrupted manner. This makes the soldering process of reactors smoother and helps to improve the stability of solder quality, reducing the probability of solder defects caused by factors such as untimely feeding or inaccurate material handling.

[0030] The material handling mechanism 3 includes a transmission gantry 31, a material handling and transfer module 32, a material handling and lifting module 33, and a gripping module 34. The transmission gantry 31 is disposed on both sides of the frame 1. The material handling and transfer module 32 is disposed on the transmission gantry 31 and is used to drive the material handling and lifting module 33 and the gripping module 34 between the feeding mechanism 2, the soldering mechanism 4, the soldering mechanism 5, and the receiving mechanism 6. The gripping module 34 is disposed on the material handling and lifting module 33. Multiple gripping modules 34 are provided to simultaneously grip multiple electronic components. Specifically, the material handling and transfer module 32 is a transmission module combining belt drive and guide rail drive, and the material handling and lifting module 33 is a transmission module combining a lead screw and a guide rod. The gripping module 34 includes a gripping cylinder 341 and a clamping claw 342. The gripping cylinder 341 is used to drive the clamping claw 342 to grip the electronic components. In this embodiment, the design of the transmission gantry 31 combined with the material handling and transfer module 32 enables the material handling and lifting module 33 and the gripping module 34 to transmit precisely and efficiently between different mechanisms. The material handling and transfer module 32, combining belt drive and guide rail drive, ensures both smooth transmission and rapid, accurate position transfer, effectively reducing shaking and deviation during transmission. This ensures that the electronic components required for the reactor can accurately reach each workstation, such as fluxing and soldering, improving overall production efficiency. The gripping module 34, driven by the gripping cylinder 341, uses the clamping claw 342 to perform the gripping action. Multiple gripping modules 34 can simultaneously grip multiple electronic components, which is extremely advantageous in reactor soldering production where batch processing of electronic components is often required. This significantly shortens gripping time while ensuring gripping stability, preventing electronic components from falling or shifting during transfer.

[0031] The material handling lifting module 33 is equipped with a flipping module 35, which drives the gripping module 34 to flip. A protective cover 351 is provided around both the gripping module 34 and the flipping module 35 to protect against the high temperature generated by the soldering mechanism 5. In this embodiment, the soldering mechanism 5 generates high temperatures during operation, and the protective cover 351 effectively blocks these high temperatures from affecting the internal modules and the gripped electronic components. On the one hand, this avoids the potential decrease in accuracy of the gripping module 34 due to high temperatures, ensuring the accuracy of each gripping and placement of reactor components and guaranteeing the precision of the solder joints. On the other hand, it also prevents high temperatures from damaging the mechanical structure and electrical components of the flipping module 35, maintaining its stable and reliable operating performance. This significantly reduces the reactor soldering defect rate caused by equipment failure or inaccuracy, improving overall production efficiency and product quality.

[0032] The soldering mechanism 4 includes a soldering support 41 and a soldering tank 42 disposed on the soldering support 41. The soldering tank 42 is used to hold flux for immersion of the electronic component soldering position in the flux. In this embodiment, the soldering support 41 provides stable support for the entire soldering tank 42, ensuring that it maintains accurate positioning during soldering operations. When the electronic component soldering position of the reactor is immersed in the flux contained in the soldering tank 42, the flux can effectively remove impurities such as oxides at the soldering point, greatly improving the wettability and solderability of the solder. This allows the solder to adhere more evenly and firmly to the corresponding soldering points of the reactor, ensuring the stability and reliability of the soldering quality.

[0033] The soldering mechanism 5 includes a solder base 51, a solder tank 52, a solder scraping module 53, and a solder dross tank 54. The solder tank 52 is mounted on the solder base 51 and contains multiple heating elements 521 for heating the solder material within it. The solder dross tank 54 is located on one side of the solder tank 52. The solder scraping module 53 scrapes the solder dross from the solder tank 52 towards the solder dross tank 54. Specifically, the solder scraping module 53 includes a solder scraping bracket 531, a solder scraping lifting cylinder 532, a solder scraping drive cylinder 533, and a solder scraping plate 534. The solder scraping bracket 531 is mounted on one side of the frame 1. The solder scraping lifting cylinder 532 is mounted on the solder scraping bracket 531, the solder scraping drive cylinder 533 is mounted on the solder scraping lifting cylinder 532, and the solder scraping plate 534 is mounted on the solder scraping drive cylinder 533 to achieve lifting and unidirectional reciprocating solder scraping. In this embodiment, the multiple heating elements 521 installed in the solder bath 52 can accurately and efficiently heat the solder, ensuring that the solder is always at a suitable soldering temperature. This is crucial for the formation of high-quality solder joints required for reactor soldering and can effectively avoid problems such as cold solder joints caused by uneven or insufficient temperature. The tin scraper module 53, through the coordinated operation of the tin scraper bracket 531, the tin scraper lifting cylinder 532, the tin scraper drive cylinder 533, and the tin scraper plate 534, can promptly and accurately scrape out the solder dross in the solder bath 52 and guide it to the dross tray 54. During reactor soldering operations, the purity of the solder in the solder bath 52 can be maintained at all times, ensuring that the quality of the solder used in each soldering is uniform, thereby guaranteeing the consistency and stability of each solder joint and greatly improving the overall quality and production efficiency of reactor soldering.

[0034] The system also includes a dross brushing mechanism 7, which comprises a dross collection cavity 71, a dross brush roller 72, and a dross drive motor 73. The dross drive motor 73 drives the dross brush roller 72 to rotate within the dross collection cavity 71. The material handling mechanism 3 picks up the soldered electronic components and places them onto the dross brush roller 72 for dross brushing, thereby removing dross from the soldered parts. In this embodiment, by setting up a dedicated dross collection cavity 71, the dross cleaned up during the dross brushing process can be effectively collected, preventing it from scattering inside the equipment or on the workbench, maintaining a clean working environment, and preventing dross from interfering with or damaging other components. The dross brush roller 72 rotates stably within the dross collection cavity 71 under the drive of the dross drive motor 73, and, in conjunction with the material handling mechanism 3, accurately picks up the soldered electronic components and places them onto the brush roller for dross brushing, efficiently and accurately removing dross from the soldered parts of the reactor. This ensures the quality of the reactor solder connection, improves the stability and reliability of the electrical connection, and reduces the potential electrical faults such as short circuits caused by solder residue.

[0035] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. An automated soldering machine for electronic components, characterized in that: The device includes a frame, a loading mechanism, a picking mechanism, a fluxing mechanism, a soldering mechanism, and a receiving mechanism mounted on the frame. The loading mechanism is equipped with a loading carrier for fixing electronic components and transporting them to a designated position. The picking mechanism is used to grab electronic components from the loading carrier and transport them between the fluxing mechanism, the soldering mechanism, and the receiving mechanism. The fluxing mechanism is used to add flux to the parts of the electronic components that require soldering. The soldering mechanism is used to solder the electronic components. After soldering is completed, the picking mechanism places the electronic components to the receiving mechanism for transfer and collection.

2. The automated soldering machine for electronic components according to claim 1, characterized in that: The feeding mechanism is located on one side of the frame. The receiving mechanism, the soldering aid mechanism, and the soldering mechanism are arranged sequentially along the first direction of the frame. The picking mechanism picks up electronic components and then places them into the receiving mechanism after passing them through the soldering aid mechanism and the soldering mechanism.

3. The automated soldering machine for electronic components according to claim 1, characterized in that: The feeding mechanism includes a feeding transmission module, and the feeding carrier is mounted on the feeding transmission module. The feeding transmission module is used to drive the feeding carrier to reciprocate between the feeding station and the picking station. The picking mechanism is used to grab electronic components on the feeding carrier at the picking station. The feeding carrier is provided with multiple feeding slots to simultaneously place multiple electronic components.

4. The automated soldering machine for electronic components according to claim 1, characterized in that: The material handling mechanism includes a transmission gantry, a material handling and transfer module, a material handling and lifting module, and a gripping module. The transmission gantry is arranged on both sides of the frame. The material handling and transfer module is arranged on the transmission gantry and is used to drive the material handling and lifting module and the gripping module to move between the feeding mechanism, the soldering mechanism, the soldering mechanism, and the receiving mechanism. The gripping module is arranged on the material handling and lifting module. There are multiple gripping modules, which can simultaneously grip multiple electronic components.

5. The automated soldering machine for electronic components according to claim 4, characterized in that: The material handling and transfer module is a transmission module combining belt drive and guide rail drive; the material handling and lifting module is a transmission module combining lead screw and guide rod; the gripping module includes a gripping cylinder and a clamping claw, and the gripping cylinder is used to drive the clamping claw to grip the electronic components.

6. The automated soldering machine for electronic components according to claim 4, characterized in that: The material handling lifting module is equipped with a flipping module, which is used to drive the gripping module to flip. The gripping module and the flipping module are equipped with protective covers to cope with the high temperature of the soldering mechanism.

7. The automated soldering machine for electronic components according to claim 1, characterized in that: The soldering mechanism includes a soldering support and a soldering tank disposed on the soldering support. The soldering tank is used to hold flux for immersion of the soldering position of electronic components in flux.

8. The automated soldering machine for electronic components according to claim 1, characterized in that: The soldering mechanism includes a solder base, a solder tank, a solder scraper module, and a solder dross tank. The solder tank is mounted on the solder base and contains multiple heating elements for heating the solder material. The solder dross tank is located on one side of the solder tank, and the solder scraper module is used to scrape the solder dross from the solder tank toward the solder dross tank.

9. The automated soldering machine for electronic components according to claim 8, characterized in that: The solder scraping module includes a solder scraping bracket, a solder scraping lifting cylinder, a solder scraping driving cylinder, and a solder scraping plate. The solder scraping bracket is located on one side of the frame, the solder scraping lifting cylinder is located on the solder scraping bracket, the solder scraping driving cylinder is located on the solder scraping lifting cylinder, and the solder scraping plate is located on the solder scraping driving cylinder to realize lifting and unidirectional reciprocating transmission solder scraping.

10. The automated soldering machine for electronic components according to any one of claims 1 to 9, characterized in that: It also includes a slag brushing mechanism, which includes a slag receiving cavity, a slag brush roller, and a slag drive motor. The slag drive motor is used to drive the slag brush roller to rotate in the slag receiving cavity. The material picking mechanism is used to pick up the soldered electronic components and place them on the slag brush roller to brush off the slag, so as to remove the slag present in the soldered part.

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