Circuit board abrasive belt grinding device

Abstract

The utility model discloses a kind of circuit board abrasive belt grinding device, including grinding mechanism, conveying mechanism and thickness measuring mechanism, grinding mechanism includes adjustable position abrasive belt grinding assembly;Conveying mechanism is set below grinding mechanism, for conveying circuit board to grinding mechanism processing range;Thickness measuring mechanism is set above conveying mechanism, and thickness measuring mechanism includes measuring roller, connecting piece rotationally connected in the both ends of measuring roller, connecting plate and first displacement sensor, two connecting plates are provided with limit slot along vertical direction, two connecting pieces are respectively with two limit slot sliding joint, to make measuring roller can move up and down, first displacement sensor is arranged in measuring roller side, and first displacement sensor is used for measuring the up and down displacement value of measuring roller.The utility model measures the thickness of circuit board automatically using thickness measuring mechanism, improves grinding processing efficiency and processing quality.

Description

Technical Field

[0001] This utility model relates to the field of circuit board manufacturing technology, and in particular to a circuit board sanding belt grinding device. Background Technology

[0002] In the circuit board manufacturing process, depending on design requirements, after processes such as routing, etching, and electroplating, the circuit board surface may need to be ground to maintain its flatness and avoid burrs, bumps, etc., which would affect the quality of the finished circuit board. The circuit board grinding process typically uses abrasive belts to grind the circuit board surface. The height of the abrasive belt is adjustable to accommodate circuit boards of different thicknesses and processing requirements. Before grinding, the position and height of the abrasive belt need to be adjusted according to the thickness of the circuit board and the grinding process requirements before the circuit board is moved to the grinding belt's processing area. Currently, workers use calipers and other tools to measure the circuit board thickness, which is inefficient; moreover, data errors can occur during measurement, recording, and transmission, affecting the processing quality of the grinding process. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a circuit board belt abrasive grinding device that automatically measures the thickness of the circuit board using a thickness measuring mechanism, thereby improving grinding efficiency and processing quality.

[0004] A circuit board belt grinding device according to an embodiment of the present invention includes:

[0005] The grinding mechanism includes an adjustable belt grinding assembly;

[0006] A conveying mechanism, located below the grinding mechanism, is used to convey circuit boards to the processing range of the grinding mechanism.

[0007] The thickness measuring mechanism is located above the conveying mechanism. The thickness measuring mechanism includes a measuring roller, connectors rotatably connected to both ends of the measuring roller, connecting plates, and a first displacement sensor. Limit grooves are provided on the two connecting plates in the vertical direction. The two connectors are slidably engaged with the two limit grooves respectively, so that the measuring roller can move up and down. The first displacement sensor is located on one side of the measuring roller and is used to measure the vertical displacement value of the measuring roller.

[0008] A circuit board belt grinding apparatus according to an embodiment of the present invention has at least the following beneficial effects:

[0009] During processing, the circuit board is placed on the conveying mechanism, which then transports it to the thickness measuring mechanism. The thickness measuring mechanism automatically measures the thickness of the circuit board. The rotatable measuring roller automatically moves up and down according to the thickness of the circuit board, and the vertical displacement of the measuring roller is measured in real time by the first displacement sensor, realizing real-time measurement of the circuit board thickness. The thickness measuring mechanism quickly obtains the thickness measurement value, which facilitates the adjustment of the grinding mechanism on the grinding thickness of the circuit board, the adjustment of the processing technology, the improvement of the processing efficiency of the circuit board grinding, the reduction of data errors caused by manual operation in the measurement, recording, and transmission processes, the improvement of grinding accuracy, and the improvement of the processing quality of the grinding process.

[0010] According to an embodiment of the present invention, a circuit board belt grinding device is provided with a second displacement sensor at the end of the measuring roller away from the first displacement sensor.

[0011] According to an embodiment of the present invention, a circuit board belt grinding device is provided with a first displacement sensor and a second displacement sensor and a second measuring block, and two connectors are respectively connected to the first measuring block and the second measuring block.

[0012] According to an embodiment of the present invention, a circuit board belt grinding device includes a thickness measuring mechanism that further includes an elastic element, a fixing element that is provided on a connecting plate, the fixing element being disposed above or below a limiting groove, and the elastic element being connected between the connecting element and the fixing element.

[0013] According to an embodiment of the present invention, a circuit board belt grinding device has a measuring roller covered with a first colloidal layer along its circumference.

[0014] According to an embodiment of the present invention, a circuit board belt grinding device includes a conveying mechanism comprising a rotating roller for driving the circuit board.

[0015] According to an embodiment of the present invention, a circuit board belt grinding device comprises multiple rotating rollers spaced apart along the circuit board conveying direction.

[0016] According to an embodiment of the present invention, a circuit board belt grinding device is provided in which a measuring roller and one of the rotating rollers are arranged vertically in correspondence.

[0017] According to an embodiment of the present invention, a circuit board belt grinding device has a rotating roller covered with a second colloidal layer in the circumferential direction.

[0018] According to an embodiment of the present invention, a circuit board belt grinding device further includes a grinding mechanism and a position adjustment component. The driving component is connected to the belt grinding component in a transmission manner, and the position adjustment component is connected to the driving component. The position adjustment component is used to adjust the position of the driving component and the belt grinding component.

[0019] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0021] Figure 1 This is a side view of a circuit board belt grinding device according to an embodiment of the present invention;

[0022] Figure 2 This is a schematic diagram of the thickness measuring mechanism and the circuit board of a circuit board abrasive belt grinding device according to an embodiment of the present invention;

[0023] Figure 3 This is a schematic diagram of the connecting plate and connector of a circuit board belt grinding device according to an embodiment of the present invention;

[0024] Figure 4 This is a side view of the thickness measuring mechanism and the circuit board of a circuit board abrasive belt grinding device according to an embodiment of the present invention.

[0025] Figure 5 This is a cross-sectional view of the measuring roller of a circuit board abrasive belt grinding device according to an embodiment of the present invention;

[0026] Figure 6 This is a cross-sectional view of the rotating roller of a circuit board belt grinding device according to an embodiment of the present invention.

[0027] Explanation of reference numerals in the attached figures:

[0028] Grinding mechanism 100; belt abrasive assembly 110; drive component 120; position adjustment assembly 130;

[0029] Conveying mechanism 200; rotating roller 210; second colloidal layer 211;

[0030] Thickness measuring mechanism 300; connecting plate 310; limiting groove 311; fixing part 312; connecting part 320; measuring roller 330; first colloidal layer 331; first displacement sensor 340; first measuring block 341; second displacement sensor 350; second measuring block 351; elastic element 360;

[0031] Control mechanism 400;

[0032] Clamping mechanism 500;

[0033] Rack size 600;

[0034] Circuit board 700. Detailed Implementation

[0035] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0036] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0037] In the description of a utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If the terms "first" and "second" are used, they are merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly specifying the number of indicated technical features or the order of the indicated technical features.

[0038] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0039] Reference Figures 1 to 6This utility model provides a circuit board belt grinding device, including a grinding mechanism 100, a conveying mechanism 200, and a thickness measuring mechanism 300. The grinding mechanism 100, conveying mechanism 200, and thickness measuring mechanism 300 are all mounted on a frame 600. The grinding mechanism 100 includes an adjustable belt grinding component 110, which can adjust the height of the belt grinding component 110 relative to the conveying mechanism 200 to accommodate circuit boards 700 of different thicknesses and different processing requirements. The conveying mechanism 200 is located below the grinding mechanism 100 and is used to transport the circuit board 700 to the processing range of the grinding mechanism 100. The thickness measuring mechanism 300 is located above the conveying mechanism 200, behind the grinding mechanism 100 along the conveying direction of the circuit board 700. The thickness measuring mechanism 300 includes a measuring roller 330, connectors 320 rotatably connected to both ends of the measuring roller 330, connecting plates 310, and a first displacement sensor 340. Limit grooves 340 are provided on the two connecting plates 310 along the vertical direction. 11. Two connectors 320 are slidably engaged with two limiting grooves 311 respectively, so that the measuring roller 330 can move up and down. The first displacement sensor 340 is set on one side of the measuring roller 330. The first displacement sensor 340 is used to measure the vertical displacement value of the measuring roller 330. The first displacement sensor 340 can be a grating displacement sensor, laser displacement sensor, magnetostrictive displacement sensor, inductive displacement sensor or other sensor that can realize displacement measurement. Through the cooperation of the measuring roller 330, connectors 320 and limiting grooves 311, the measuring roller 330 is limited between the two connecting plates 310 and can move up and down. Before the conveying mechanism 200 conveys the circuit board 700 to the processing range of the grinding mechanism 100, the circuit board 700 passes under the measuring roller 330 of the thickness measuring mechanism 300. The circuit board 700 presses the measuring roller 330 to move upward. The first displacement sensor 340 measures the displacement value of the measuring roller 330 to measure the thickness of the circuit board 700.

[0040] The thickness measuring mechanism 300 works in conjunction with the conveying mechanism 200 to place the circuit board 700 to be ground onto the conveying mechanism 200. The conveying mechanism 200 then transports the circuit board 700 to below the thickness measuring mechanism 300, where the thickness measuring mechanism 300 automatically measures the thickness of the circuit board 700. The rotatable measuring roller 330 moves automatically up and down as the thickness of the circuit board 700 changes, and the displacement of the measuring roller 330 is measured in real time by the first displacement sensor 340, thus achieving real-time measurement of the thickness of the circuit board 700. The thickness measuring mechanism 300 quickly obtains the thickness measurement value, thereby adjusting the grinding mechanism 100 to grind the thickness of the circuit board 700 to be ground, adjusting the processing technology, improving the grinding efficiency of the circuit board 700, reducing data errors caused by manual operation during measurement, recording, and transmission, improving the grinding accuracy, and enhancing the processing quality of the grinding process.

[0041] According to some embodiments of this application, refer to Figure 2 and Figure 4 A second displacement sensor 350 is provided at the end of the measuring roller 330 away from the first displacement sensor 340. The displacement at both ends of the measuring roller 330 is measured by the first displacement sensor 340 and the second displacement sensor 350, thereby improving the measurement accuracy.

[0042] Furthermore, referring to Figure 4 The first displacement sensor 340 is equipped with a first measuring block 341, and the second displacement sensor 350 is equipped with a second measuring block 351. Two connecting pieces 320 are respectively connected to the first measuring block 341 and the second measuring block 351. When the connecting piece 320 moves, it drives the first measuring block 341 and the second measuring block 351 to move, and the displacement change is measured in real time by the first displacement sensor 340 and the second displacement sensor 350, further improving the thickness measurement accuracy.

[0043] As a preferred option, refer to Figure 2 The first displacement sensor 340 and the second displacement sensor 350 are magnetostrictive displacement sensors to improve the accuracy of displacement measurement.

[0044] Furthermore, referring to Figure 2 and Figure 4 The thickness measuring mechanism 300 also includes an elastic element 360, and a fixing element 312 is provided on the connecting plate 310. The fixing element 312 is located above or below the limiting groove 311, and the elastic element 360 is connected between the connecting element 320 and the fixing element 312. Specifically, refer to Figure 2 and Figure 3 The fixing member 312 is positioned above the limiting groove 311, and the elastic member 360 is positioned below the fixing member 312. At this time, the elastic member 360 applies a downward elastic force to the connecting member 320, thereby driving the measuring roller 330 downward, allowing the measuring roller 330 to fit tightly against the upper surface of the circuit board 700, further improving measurement accuracy. Specifically, the elastic member 360 is a spring, the connecting member 320 is provided with a protruding pin that passes through and connects to the spring, and the fixing member 312 is provided with a blind hole for connecting the spring.

[0045] Furthermore, referring to Figure 5 The measuring roller 330 is circumferentially covered with a first colloid layer 331; specifically, the surface of the first colloid layer 331 is smooth to reduce the friction between the measuring roller 330 and the upper surface of the circuit board 700 and avoid scratching the circuit board 700.

[0046] According to some embodiments of this application, the conveying mechanism 200 includes a rotating roller 210, which is used to drive the circuit board 700. The rotating roller 210 drives the circuit board 700 to move below the thickness measuring mechanism 300 and the grinding mechanism 100, thereby improving the level of automation.

[0047] Furthermore, multiple rotating rollers 210 are spaced apart along the transmission direction of the circuit board 700 to improve transmission reliability.

[0048] Furthermore, the measuring roller 330 and one of the rotating rollers 210 are arranged vertically in correspondence. Due to the combined effect of the weight of the measuring roller 330 and the thrust of the elastic element 360, a downward pressure is generated on the circuit board 700. The vertical arrangement of the measuring roller 330 and one of the rotating rollers 210 allows the rotating roller 210 to generate a reaction force in the vertical direction, preventing the circuit board 700 from bending, avoiding any impact on the thickness measurement of the circuit board 700, and improving the measurement accuracy.

[0049] Furthermore, the rotating roller 210 is circumferentially coated with a second colloid layer 211. Specifically, the second colloid layer 211 is tough and non-smooth, which enhances the friction on the lower surface of the circuit board 700, improves the transmission reliability of the rotating roller 210 to the circuit board 700, and will not scratch the circuit board 700.

[0050] Understandably, referring to Figure 1 In some other embodiments, the gap between different rotating rollers 210 is smaller than the diameter of the rotating rollers 210 to improve the load-bearing capacity of the conveying mechanism 200.

[0051] According to some embodiments of this application, the grinding mechanism 100 further includes a drive member 120 and a position adjustment component 130. The drive member 120 is driveably connected to the belt grinding assembly 110, and the position adjustment component 130 is connected to the drive member 120. The position adjustment component 130 is used to adjust the position of the drive member 120 and the belt grinding assembly 110. By adjusting the position of the drive member 120 along the height direction using the position adjustment component 130, the position of the belt grinding assembly 110 along the height direction is adjusted, so as to change the grinding thickness of the circuit board 700. Specifically, the belt grinding assembly 110 includes a sanding belt and multiple drive rollers. The sanding belt is wrapped around the outside of the multiple drive rollers, and the drive member 120 is driveably connected to one of the drive rollers to drive the sanding belt to rotate.

[0052] Understandably, referring to Figure 1 In some other embodiments, the frame 600 is further provided with a clamping mechanism 500, with two clamping mechanisms 500 respectively disposed on the front and rear sides of the grinding mechanism 100 along the transmission direction of the circuit board 700. When the conveying mechanism 200 transmits the circuit board 700 to the grinding mechanism 100 along the transmission direction, the clamping mechanism 500 cooperates with the conveying mechanism 200 to clamp the circuit board 700 to be ground, preventing displacement of the circuit board 700 during the grinding process and improving the grinding quality. Specifically, the clamping mechanism 500 includes a clamping drive cylinder and a clamping pad.

[0053] Understandably, referring to Figure 1 In some other embodiments, a control mechanism 400 is also provided on the frame 600. The control mechanism 400 is electrically connected to the thickness measuring mechanism 300, the conveying mechanism 200, the grinding mechanism 100, and the pressing mechanism 500. The thickness measuring mechanism 300 can transmit the real-time measured thickness value of the circuit board 700 to the control mechanism 400 and display it in real time. Using the control mechanism 400, the grinding thickness of the circuit board 700 by the grinding mechanism 100 can be adjusted. The control mechanism 400 can also control the operation of the conveying mechanism 200 and the pressing mechanism 500, improving the ease of operation.

[0054] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0055] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A circuit board belt abrasive grinding device, characterized in that, include: The grinding mechanism (100) includes an adjustable belt grinding assembly (110). A conveying mechanism (200) is disposed below the grinding mechanism (100) and is used to convey the circuit board (700) to the processing range of the grinding mechanism (100); A thickness measuring mechanism (300) is disposed above the conveying mechanism (200). The thickness measuring mechanism (300) includes a measuring roller (330), connectors (320) rotatably connected to both ends of the measuring roller (330), connecting plates (310) and a first displacement sensor (340). Limiting grooves (311) are provided on the two connecting plates (310) along the vertical direction. The two connectors (320) are slidably engaged with the two limiting grooves (311) respectively, so that the measuring roller (330) can move up and down. The first displacement sensor (340) is disposed on one side of the measuring roller (330) and is used to measure the vertical displacement value of the measuring roller (330).

2. The circuit board belt abrasive grinding device according to claim 1, characterized in that, A second displacement sensor (350) is provided at the end of the measuring roller (330) away from the first displacement sensor (340).

3. The circuit board belt abrasive grinding device according to claim 2, characterized in that, The first displacement sensor (340) is provided with a first measuring block (341), and the second displacement sensor (350) is provided with a second measuring block (351). The two connecting pieces (320) are respectively connected to the first measuring block (341) and the second measuring block (351).

4. The circuit board belt abrasive grinding device according to claim 3, characterized in that, The thickness measuring mechanism (300) also includes an elastic element (360), and a fixing element (312) is provided on the connecting plate (310). The fixing element (312) is located above or below the limiting groove (311), and the elastic element (360) is connected between the connecting element (320) and the fixing element (312).

5. The circuit board belt abrasive grinding device according to claim 4, characterized in that, The measuring roller (330) is circumferentially covered with a first colloidal layer (331).

6. The circuit board belt abrasive grinding device according to claim 1, characterized in that, The conveying mechanism (200) includes a rotating roller (210) for driving the circuit board (700).

7. The circuit board belt abrasive grinding device according to claim 6, characterized in that, The plurality of the rotating rollers (210) are spaced apart along the transmission direction of the circuit board (700).

8. The circuit board belt abrasive grinding device according to claim 7, characterized in that, The measuring roller (330) is arranged vertically in correspondence with one of the rotating rollers (210).

9. A circuit board belt abrasive grinding device according to claim 8, characterized in that, The rotating roller (210) is circumferentially covered with a second colloidal layer (211).

10. A circuit board belt abrasive grinding device according to claim 1, characterized in that, The grinding mechanism (100) further includes a drive member (120) and a position adjustment component (130). The drive member (120) is connected to the belt grinding component (110) in a transmission connection. The position adjustment component (130) is connected to the drive member (120) and is used to adjust the position of the drive member (120) and the belt grinding component (110).

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