Intelligent turnover box with RFID chip modular mounting structure
By using a modular installation structure and ultrasonic welding process, the problem of unstable RFID chip installation in traditional turnover boxes has been solved, enabling smart turnover boxes that can quickly read and protect chips.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI UNAPU TECHNOLOGY CO LTD
- Filing Date
- 2025-04-03
- Publication Date
- 2026-07-10
AI Technical Summary
The RFID chips in traditional turnover boxes are not securely installed and are easy to fall off. Metal interference can damage the signal, the box structure is damaged, and the chips are easily damaged.
The modular installation structure is adopted, and the cover plate is fixed to the turnover box body through ultrasonic welding process. The RFID chip is sealed in a closed space, and a firm connection is achieved by using guide positioning columns and welding ribs.
It enables rapid, contactless reading of RFID chips, improves installation efficiency, saves labor costs, and protects chips from physical damage.
Smart Images

Figure CN224477271U_ABST